WO2009114973A1 - Intelligent label that may use chips, and flip-chip module production equipment - Google Patents

Intelligent label that may use chips, and flip-chip module production equipment Download PDF

Info

Publication number
WO2009114973A1
WO2009114973A1 PCT/CN2008/071566 CN2008071566W WO2009114973A1 WO 2009114973 A1 WO2009114973 A1 WO 2009114973A1 CN 2008071566 W CN2008071566 W CN 2008071566W WO 2009114973 A1 WO2009114973 A1 WO 2009114973A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
module production
flip
vision system
production apparatus
Prior art date
Application number
PCT/CN2008/071566
Other languages
French (fr)
Chinese (zh)
Inventor
张晓冬
Original Assignee
北京德鑫泉科技发展有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京德鑫泉科技发展有限公司 filed Critical 北京德鑫泉科技发展有限公司
Publication of WO2009114973A1 publication Critical patent/WO2009114973A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process

Definitions

  • the present invention relates to a smart label and flip chip (FCP) module production apparatus, specifically a smart label and flip chip (FCP) module production apparatus that can process chips of chips in a chip cassette.
  • FCP smart label and flip chip
  • a chip holding box refers to a container for placing a chip.
  • This type of chip is currently only applied when manually binding smart tags. It cannot be applied in intelligently produced smart label devices.
  • Manually proofing the chip holding box is not fixed, hand-held or placed on the operating surface, manually take out the chip in the chip holding box, manually fill it on the antenna or FCP substrate, and its product positioning accuracy is low ( ⁇ , ⁇
  • the shift is usually between 0.2-lmm and the rotation is between 1-30 degrees.
  • the pass rate is low, and the best is only about 95%.
  • the reading and writing distance of the product is close.
  • the chip pick-up mechanism for smart label and flip chip (FCP) module production equipment is an automated component dedicated to removing a single chip from a wafer tray.
  • Existing smart label and flip chip (FCP) module production equipment can only be used.
  • the chip is obtained from the wafer tray and then bound to the smart label, but cannot be processed for a single, loose chip, which often causes waste of the raw material of the chip, and the price of the material is very expensive, so the production cost is relatively increased. , production flexibility is not enough.
  • the object of the present invention is to provide a smart tag and flip chip module production device capable of using a chip with simple structure, strong practicability, advanced technology, high production yield, stable quality, reduced production cost and improved economic efficiency.
  • the moving mechanism can be used to process the chip from the chip holding cassette, especially when proofing, thereby realizing a high-precision proofing process with high yield.
  • the invention can use the smart label of the chip and the flip chip module production equipment, including a motion mechanism, a chip picking mechanism, and a worktable, and the worktable is provided with at least one chip holding box.
  • the present invention can use a smart tag of a chip and a flip chip module production apparatus, which also includes a lower vision system.
  • the invention can use the smart label of the chip and the flip chip module production device, wherein the portion directly under the chip at the bottom of the chip holding box is transparent, and the lower vision system directly sees through the transparent portion of the bottom of the chip holding box The offset and rotation of the chip into the chip holding box.
  • the invention can use the smart label of the chip and the flip chip module production device, wherein the lower vision system is installed outside the chip holding box, and the chip picking mechanism moves the chip from the chip holding box to move the chip to the place. Above the vision system, the lower vision system directly sees the offset and rotation of the chips in the chip containment box.
  • the present invention can use a smart tag of a chip and a flip chip module producing apparatus, which further includes the wafer picking device, and the chip holding box and the wafer picking device are arranged in parallel.
  • the invention can use the smart label of the chip and the flip chip module production device, wherein the number of the chip holding boxes is 2—32, 2—32 chip holding boxes are placed on a rotating mechanism for circulation.
  • the invention can use the smart label of the chip and the flip chip module production apparatus, wherein the rotating mechanism comprises a rack mounted on the worktable, the rack is provided with a conveyor belt transmission device, and the conveyor belt transmission device comprises a driving wheel
  • the driven wheel and the motor that drives the driving wheel, the driving wheel and the driven wheel are provided with a ring-shaped conveyor belt, and the conveyor belt is made of a transparent material or a portion under the chip is a transparent material or a part under the chip is excavated.
  • the left and right sides of the conveyor belt are respectively provided with a baffle, and the lower vision system is located in the ring shape of the conveyor belt.
  • the rotating mechanism comprises three positions of taking the chip position, manually holding the chip and the redundant position.
  • the invention can use the smart label of the chip and the flip chip module production device, wherein the rotating mechanism comprises a vertical shaft mounted on the working table in a vertical direction by a bearing seat, and the lower part of the vertical shaft is provided with a driven gear and a driven gear. Engaged with the driving gear, the driving gear is dragged by the motor, the upper part of the vertical shaft protrudes above the working table, the top end of the vertical shaft is mounted with a turntable in a horizontal direction, and the chip holding box is placed on the turntable The vision system is located below the turntable.
  • the invention can use the smart label of the chip and the flip chip module production device. Since at least one chip holding box is arranged on the worktable, the chip can be processed by the machine processing chip, and the high precision can be used.
  • the motion mechanism processes the chip from the chip holding box, and performs automatic proofing. The effect is good.
  • the positioning accuracy of the chip relative to the antenna or the FCP substrate is good.
  • the ⁇ , ⁇ offset can reach 0.005-0.040mm or ⁇ 0.01mm, and the rotation Between 0.1-0.8 degrees or ⁇ 0.018 degrees, the product has a long read-write distance and a high pass rate: about 98-99.9%.
  • the invention adds a chip holding box for holding a chip on the existing smart label and flip chip module production equipment, so that the device picks up the chip from the chip holding box and binds to the smart label, thereby expanding
  • the existing smart label and flip chip module production equipment production capacity improve the utilization of raw materials, its simple structure, strong practicality, advanced technology, high production yield, stable quality, can reduce production costs, improve economy benefit.
  • Figure 1 is a front elevational view showing the structure of an embodiment of the structure of the present invention.
  • Figure 2 is a perspective view showing the structure of the embodiment of Figure 1;
  • Figure 3 is a perspective view showing the structure of the rotating mechanism of Figure 1;
  • FIG. 4 is a perspective view showing the structure of a chip holding box of the structure of the present invention.
  • Figure 5 is a perspective view showing the structure of still another embodiment of the rotating mechanism of the present invention.
  • Fig. 6 is a perspective view showing the structure of the rotating mechanism of Fig. 5.
  • the production apparatus of the present invention comprises a motion mechanism 1, an upper vision system 2, a chip suction mechanism 3, a lower vision system 4, a work table 9, and a wafer pick-up device 7 is disposed on the work table 9, A chip holding box 5 and an antenna 8 are provided on the table 9.
  • a dispensing system 15 and a chip chip pick-up mechanism 3 and an upper vision system 2 are mounted on the kinematic mechanism 1.
  • the chip holding cassette 5 is arranged in parallel with the wafer take-up device 7, and the chip 14 is placed on both the chip holding cassette 5 and the wafer take-up unit 7.
  • the bottom portion of the chip holding box 5 is transparent under the chip, and the lower vision system 4 is mounted outside the chip holding box 5. After the chip picking mechanism 3 sucks the chip from the chip holding box 5, the chip is moved to Above the lower vision system 4, the lower vision system 4 directly sees the offset and rotation of the chips in the chip holding cassette 5.
  • the number of the chip holding cassettes 5 is three, and the three chip holding cassettes 5 are placed on the rotating mechanism 16 for circulation.
  • the number of chip holding boxes 5 can also be two or four to one.
  • the rotating mechanism 16 includes a frame 17 mounted on the table 9, and the frame 17 is provided with a conveyor belt transmission device including a driving wheel 18, a driven wheel 24 and a motor 11 for driving the driving wheel 18, a driving wheel 18 and the driven wheel 24 are provided with an endless conveyor belt 6 which is made of a transparent material.
  • the left and right sides of the conveyor belt 6 are respectively provided with a bar 13 which is located at the middle of the ring of the conveyor belt 6.
  • the rotating mechanism 16 includes three positions: a take-up position, a manual chip holding box, and a redundant position.
  • the motor 11 can adjust the feed amount of the chip holding cassette 5, and the chip holding cassette 5 is fixed by the stopper 13. In use, when the motor 11 is dragged by the conveyor belt 6, the chip holding cassette 5 on the conveyor belt 6 can be moved.
  • the lower vision system 4 described above may also be below the antenna 8.
  • the rotating mechanism 16 may also include a vertical shaft 19 mounted on the table 9 in a vertical direction by a bearing housing 20, and the lower portion of the vertical shaft 19 is provided with a driven gear 21, a driven gear 21 and an active
  • the gear 22 is meshed, the driving gear 22 is dragged by the vertical shaft motor 23, the upper portion of the vertical shaft 19 projects above the table 9, the top end of the vertical shaft 19 is mounted with a turntable 18 in the horizontal direction, and 24 chips are placed on the turntable 18
  • the cassette 5 is placed and the lower vision system 4 is located below the turntable 18. In use, when the vertical shaft motor 23 is rotated by the driving gear 22 and the driven gear 21, the chip holding cassette 5 on the turntable 18 can be moved.
  • the invention can use the smart label of the chip and the flip chip module production equipment.
  • the device is picked up from the chip holding box and bound to the smart label, thereby expanding the present Some smart label and flip chip module production equipment production capacity has increased the utilization of raw materials.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Labeling Devices (AREA)

Abstract

An intelligent label that may use chips and flip-chip module production equipment are disclosed. The equipment comprises a motion mechanism (1), a chip suction mechanism (3) and a workbench (9) on which at least one chip container (5) is located. The equipment uses high-accuracy robot and vision technology to process chips from the chip container (5). This process can also be used during sampling, thereby enabling a high-accuracy sampling process.

Description

可使用芯片的智能标签及倒装芯片模块生产设备  Chip-based smart label and flip chip module production equipment
技术领域 Technical field
本发明涉及一种智能标签及倒装芯片 （FCP) 模块生产设备， 具体说是可以处理芯片盛 放盒中的芯片的可使用芯片的智能标签及倒装芯片 （FCP) 模块生产设备。  The present invention relates to a smart label and flip chip (FCP) module production apparatus, specifically a smart label and flip chip (FCP) module production apparatus that can process chips of chips in a chip cassette.
背景技术  Background technique
芯片盛放盒指的是一种用来放置芯片的容器。 在智能标签生产过程中， 常有散落或零散 的芯片出现， 或者手工生产中将取下来的芯片摆放于芯片盛放盒中， 这种形式的芯片目前只 在手工绑定智能标签时应用， 在自动化生产的智能标签设备中不能应用。 手工打样的芯片盛 放盒不固定,手持或将其放在操作台面上，手工将芯片盛放盒内芯片取出,手工填装在天线或者 FCP基底上， 其产品定位精度低 （Χ,Υ偏移量通常在 0.2-lmm,旋转在 1-30度之间） ， 合格 率低， 最好也只能到 95%左右， 产品的读写距离近。  A chip holding box refers to a container for placing a chip. In the production process of smart labels, there are often scattered or scattered chips, or the chips that are taken out in manual production are placed in the chip holding box. This type of chip is currently only applied when manually binding smart tags. It cannot be applied in intelligently produced smart label devices. Manually proofing the chip holding box is not fixed, hand-held or placed on the operating surface, manually take out the chip in the chip holding box, manually fill it on the antenna or FCP substrate, and its product positioning accuracy is low (Χ, Υ The shift is usually between 0.2-lmm and the rotation is between 1-30 degrees. The pass rate is low, and the best is only about 95%. The reading and writing distance of the product is close.
智能标签及倒装芯片 （FCP) 模块生产设备的芯片吸取机构是一个专门用来从晶圆盘上 取出单个芯片的自动化部件， 现有的智能标签及倒装芯片 （FCP) 模块生产设备只能从晶圆 盘上获得芯片， 然后绑定在智能标签上， 而对于单个的、 散放的芯片却不能处理， 常常造成 芯片原材料的浪费， 而这种材料价格又非常昂贵， 所以生产成本相对提高， 生产灵活性不够。  The chip pick-up mechanism for smart label and flip chip (FCP) module production equipment is an automated component dedicated to removing a single chip from a wafer tray. Existing smart label and flip chip (FCP) module production equipment can only be used. The chip is obtained from the wafer tray and then bound to the smart label, but cannot be processed for a single, loose chip, which often causes waste of the raw material of the chip, and the price of the material is very expensive, so the production cost is relatively increased. , production flexibility is not enough.
发明内容  Summary of the invention
本发明的目的是提供一种结构简单， 实用性强， 技术先进， 生产成品率高， 质量稳定， 可降低生产成本， 提高经济效益的可使用芯片的智能标签及倒装芯片模块生产设备， 其可以 用运动机构处理从芯片盛放盒来的芯片， 打样时尤其如此， 从而实现高精度的高合格率的打 样流程。  The object of the present invention is to provide a smart tag and flip chip module production device capable of using a chip with simple structure, strong practicability, advanced technology, high production yield, stable quality, reduced production cost and improved economic efficiency. The moving mechanism can be used to process the chip from the chip holding cassette, especially when proofing, thereby realizing a high-precision proofing process with high yield.
本发明可使用芯片的智能标签及倒装芯片模块生产设备，包括运动机构，芯片吸取机构， 工作台， 所述工作台上设有至少一个芯片盛放盒。  The invention can use the smart label of the chip and the flip chip module production equipment, including a motion mechanism, a chip picking mechanism, and a worktable, and the worktable is provided with at least one chip holding box.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中是还包括下视觉系统。 本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中所述芯片盛放盒底部的芯 片正下方部分是透明的， 所述下视觉系统直接透过芯片盛放盒底部的透明部分看到芯片盛放 盒中的芯片的偏移和旋转。  The present invention can use a smart tag of a chip and a flip chip module production apparatus, which also includes a lower vision system. The invention can use the smart label of the chip and the flip chip module production device, wherein the portion directly under the chip at the bottom of the chip holding box is transparent, and the lower vision system directly sees through the transparent portion of the bottom of the chip holding box The offset and rotation of the chip into the chip holding box.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中所述下视觉系统安装在芯 片盛放盒之外， 芯片吸取机构将芯片从芯片盛放盒吸取起来后， 将芯片移动到所述下视觉系 统上方， 所述下视觉系统直接看到芯片盛放盒中的芯片的偏移和旋转。  The invention can use the smart label of the chip and the flip chip module production device, wherein the lower vision system is installed outside the chip holding box, and the chip picking mechanism moves the chip from the chip holding box to move the chip to the place. Above the vision system, the lower vision system directly sees the offset and rotation of the chips in the chip containment box.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中还包括所述晶圆取片装 置， 所述芯片盛放盒和晶圆取片装置并行布置。  The present invention can use a smart tag of a chip and a flip chip module producing apparatus, which further includes the wafer picking device, and the chip holding box and the wafer picking device are arranged in parallel.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中所述芯片盛放盒的数量为 2—32个， 2— 32个芯片盛放盒放在一个旋转机构上进行循环。 The invention can use the smart label of the chip and the flip chip module production device, wherein the number of the chip holding boxes is 2—32, 2—32 chip holding boxes are placed on a rotating mechanism for circulation.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中所述旋转机构包括安装在 所述工作台上的机架， 机架上设有输送带传动装置， 输送带传动装置包括主动轮、 从动轮和 拖动主动轮的电机， 主动轮和从动轮上套装有环形的输送带， 输送带采用透明材料制成或在 芯片下的部分为透明材料或在芯片下的部分被挖除， 输送带的左右两侧分别设有挡条， 所述 下视觉系统位于输送带的环形中， 该旋转机构包括取片位、 人工上芯片盛放盒位和冗余位三 个工位。  The invention can use the smart label of the chip and the flip chip module production apparatus, wherein the rotating mechanism comprises a rack mounted on the worktable, the rack is provided with a conveyor belt transmission device, and the conveyor belt transmission device comprises a driving wheel The driven wheel and the motor that drives the driving wheel, the driving wheel and the driven wheel are provided with a ring-shaped conveyor belt, and the conveyor belt is made of a transparent material or a portion under the chip is a transparent material or a part under the chip is excavated. The left and right sides of the conveyor belt are respectively provided with a baffle, and the lower vision system is located in the ring shape of the conveyor belt. The rotating mechanism comprises three positions of taking the chip position, manually holding the chip and the redundant position.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 其中所述旋转机构包括采用轴 承座沿垂直方向安装在所述工作台上的立轴， 立轴的下部套装有从动齿轮， 从动齿轮与主动 齿轮相啮合， 主动齿轮由电机拖动， 所述立轴的上部伸出到所述工作台的上方， 立轴的顶端 沿水平方向安装有转盘， 转盘上放置有所述芯片盛放盒， 所述下视觉系统位于转盘的下方。  The invention can use the smart label of the chip and the flip chip module production device, wherein the rotating mechanism comprises a vertical shaft mounted on the working table in a vertical direction by a bearing seat, and the lower part of the vertical shaft is provided with a driven gear and a driven gear. Engaged with the driving gear, the driving gear is dragged by the motor, the upper part of the vertical shaft protrudes above the working table, the top end of the vertical shaft is mounted with a turntable in a horizontal direction, and the chip holding box is placed on the turntable The vision system is located below the turntable.
本发明可使用芯片的智能标签及倒装芯片模块生产设备， 由于在工作台上设有至少有一 个芯片盛放盒， 故可采用机器处理芯片盛放盒形式的芯片， 并可以用高精度的运动机构处理 从芯片盛放盒来的芯片， 进行自动打样， 效果好， 芯片相对于天线或者 FCP基底的定位精度 好， 其 Χ,Υ偏移量可达 0.005-0.040mm或 ± 0.01mm， 旋转在 0.1-0.8度或 ± 0.018度之间， 产 品的读写距离远， 合格率高： 大约有 98-99.9%。 本发明通过在现有的智能标签及倒装芯片模 块生产设备上加装用于盛放芯片的芯片盛放盒， 使设备从芯片盛放盒内拾取芯片并绑定到智 能标签上， 从而扩充了现有的智能标签及倒装芯片模块生产设备的生产能力， 提高了原材料 的利用率， 其结构简单， 实用性强， 技术先进， 生产成品率高， 质量稳定， 可降低生产成本， 提高经济效益。  The invention can use the smart label of the chip and the flip chip module production device. Since at least one chip holding box is arranged on the worktable, the chip can be processed by the machine processing chip, and the high precision can be used. The motion mechanism processes the chip from the chip holding box, and performs automatic proofing. The effect is good. The positioning accuracy of the chip relative to the antenna or the FCP substrate is good. The Υ, Υ offset can reach 0.005-0.040mm or ± 0.01mm, and the rotation Between 0.1-0.8 degrees or ±0.018 degrees, the product has a long read-write distance and a high pass rate: about 98-99.9%. The invention adds a chip holding box for holding a chip on the existing smart label and flip chip module production equipment, so that the device picks up the chip from the chip holding box and binds to the smart label, thereby expanding The existing smart label and flip chip module production equipment production capacity, improve the utilization of raw materials, its simple structure, strong practicality, advanced technology, high production yield, stable quality, can reduce production costs, improve economy benefit.
下面结合附图对本发明的可使用芯片的智能标签及倒装芯片模块生产设备作进一步说 明。  The smart tag and flip chip module production apparatus of the present invention which can use the chip will be further described below with reference to the accompanying drawings.
附图说明  DRAWINGS
图 1为本发明结构的一种实施方式的结构示意图的主视图；  Figure 1 is a front elevational view showing the structure of an embodiment of the structure of the present invention;
图 2为图 1的实施方式的结构示意图的立体图；  Figure 2 is a perspective view showing the structure of the embodiment of Figure 1;
图 3为图 1中的旋转机构的结构示意图的立体图；  Figure 3 is a perspective view showing the structure of the rotating mechanism of Figure 1;
图 4为本发明结构的芯片盛放盒的结构示意图的立体图；  4 is a perspective view showing the structure of a chip holding box of the structure of the present invention;
图 5为本发明结构的旋转机构的又一种实施方式的结构示意图的立体图；  Figure 5 is a perspective view showing the structure of still another embodiment of the rotating mechanism of the present invention;
图 6为图 5中的旋转机构的结构示意图的立体图。  Fig. 6 is a perspective view showing the structure of the rotating mechanism of Fig. 5.
具体实施方式  detailed description
参看图 1和图 2， 本发明的生产设备， 包括运动机构 1， 上视觉系统 2， 芯片吸取机构 3， 下视觉系统 4， 工作台 9， 工作台 9上设有晶圆取片装置 7， 工作台 9上设有芯片盛放盒 5以 及天线 8。 在运动机构 1上安装有点胶系统 15和芯片芯片吸取机构 3以及上视觉系统 2。 芯 片盛放盒 5与晶圆取片装置 7并行布置， 芯片盛放盒 5和晶圆取片装置 7上都放有芯片 14。 上述芯片盛放盒 5底部位于芯片正下方部分是透明的， 下视觉系统 4安装在芯片盛放盒 5之外， 芯片吸取机构 3将芯片从芯片盛放盒 5吸取起来后， 将芯片移动到下视觉系统 4上 方， 下视觉系统 4直接看到芯片盛放盒 5中的芯片的偏移和旋转。 Referring to Figures 1 and 2, the production apparatus of the present invention comprises a motion mechanism 1, an upper vision system 2, a chip suction mechanism 3, a lower vision system 4, a work table 9, and a wafer pick-up device 7 is disposed on the work table 9, A chip holding box 5 and an antenna 8 are provided on the table 9. A dispensing system 15 and a chip chip pick-up mechanism 3 and an upper vision system 2 are mounted on the kinematic mechanism 1. The chip holding cassette 5 is arranged in parallel with the wafer take-up device 7, and the chip 14 is placed on both the chip holding cassette 5 and the wafer take-up unit 7. The bottom portion of the chip holding box 5 is transparent under the chip, and the lower vision system 4 is mounted outside the chip holding box 5. After the chip picking mechanism 3 sucks the chip from the chip holding box 5, the chip is moved to Above the lower vision system 4, the lower vision system 4 directly sees the offset and rotation of the chips in the chip holding cassette 5.
参看图 3和图 4， 芯片盛放盒 5的数量为 3个， 3个芯片盛放盒 5放在旋转机构 16上进 行循环。 芯片盛放盒 5的数量也可以为 2个或 4一 32个。  Referring to Figures 3 and 4, the number of the chip holding cassettes 5 is three, and the three chip holding cassettes 5 are placed on the rotating mechanism 16 for circulation. The number of chip holding boxes 5 can also be two or four to one.
旋转机构 16包括安装在工作台 9上的机架 17， 机架 17上设有输送带传动装置， 输送带 传动装置包括主动轮 18、从动轮 24和拖动主动轮 18的电机 11， 主动轮 18和从动轮 24上套 装有环形的输送带 6， 输送带 6采用透明材料制成， 输送带 6的左右两侧分别设有挡条 13， 下视觉系统 4位于输送带 6的环形中部， 该旋转机构 16包括取片位、人工上芯片盛放盒位和 冗余位三个工位。 电机 11可以调节芯片盛放盒 5的进给量， 芯片盛放盒 5通过挡条 13固定 位置。 在使用时， 当电机 11拖动输送带 6转动时， 就可以移动输送带 6上的芯片盛放盒 5。  The rotating mechanism 16 includes a frame 17 mounted on the table 9, and the frame 17 is provided with a conveyor belt transmission device including a driving wheel 18, a driven wheel 24 and a motor 11 for driving the driving wheel 18, a driving wheel 18 and the driven wheel 24 are provided with an endless conveyor belt 6 which is made of a transparent material. The left and right sides of the conveyor belt 6 are respectively provided with a bar 13 which is located at the middle of the ring of the conveyor belt 6. The rotating mechanism 16 includes three positions: a take-up position, a manual chip holding box, and a redundant position. The motor 11 can adjust the feed amount of the chip holding cassette 5, and the chip holding cassette 5 is fixed by the stopper 13. In use, when the motor 11 is dragged by the conveyor belt 6, the chip holding cassette 5 on the conveyor belt 6 can be moved.
上述下视觉系统 4也可以在天线 8的下方。  The lower vision system 4 described above may also be below the antenna 8.
参看图 5和图 6， 旋转机构 16也可以是包括采用轴承座 20沿垂直方向安装在所述工作 台 9上的立轴 19， 立轴 19的下部套装有从动齿轮 21， 从动齿轮 21与主动齿轮 22相啮合， 主动齿轮 22由立轴电机 23拖动， 立轴 19的上部伸出到所述工作台 9的上方， 立轴 19的顶 端沿水平方向安装有转盘 18， 转盘 18上放置有 24个芯片盛放盒 5， 下视觉系统 4位于转盘 18的下方。 在使用时， 当立轴电机 23通过主动齿轮 22和从动齿轮 21拖动输送带 6转动时， 就可以移动转盘 18上的芯片盛放盒 5。  Referring to Figures 5 and 6, the rotating mechanism 16 may also include a vertical shaft 19 mounted on the table 9 in a vertical direction by a bearing housing 20, and the lower portion of the vertical shaft 19 is provided with a driven gear 21, a driven gear 21 and an active The gear 22 is meshed, the driving gear 22 is dragged by the vertical shaft motor 23, the upper portion of the vertical shaft 19 projects above the table 9, the top end of the vertical shaft 19 is mounted with a turntable 18 in the horizontal direction, and 24 chips are placed on the turntable 18 The cassette 5 is placed and the lower vision system 4 is located below the turntable 18. In use, when the vertical shaft motor 23 is rotated by the driving gear 22 and the driven gear 21, the chip holding cassette 5 on the turntable 18 can be moved.
工业实用性  Industrial applicability
本发明可使用芯片的智能标签及倒装芯片模块生产设备。通过在现有的智能标签及倒装 芯片模块生产设备上加装用于盛放芯片的芯片盛放盒， 使设备从芯片盛放盒内拾取芯片并绑 定到智能标签上， 从而扩充了现有的智能标签及倒装芯片模块生产设备的生产能力， 提高了 原材料的利用率。  The invention can use the smart label of the chip and the flip chip module production equipment. By adding a chip holding box for holding chips on the existing smart label and flip chip module production equipment, the device is picked up from the chip holding box and bound to the smart label, thereby expanding the present Some smart label and flip chip module production equipment production capacity has increased the utilization of raw materials.

Claims

1.一种可使用芯片的智能标签及倒装芯片模块生产设备， 包括运动机构（1 ) ， 芯片吸取 机构 （3 ) ， 工作台 （9) ， 其特征是所述工作台 （9) 上设有至少一个芯片盛放盒 （5 ) 。 A smart tag and flip chip module production apparatus capable of using a chip, comprising a motion mechanism (1), a chip suction mechanism (3), and a work table (9), characterized in that the work table (9) is provided There is at least one chip holding box (5).
2.根据权利要求 1所述的可使用芯片的智能标签及倒装芯片模块生产设备， 其特征是还 包括下视觉系统 （4) 。  The chip-enabled smart tag and flip chip module production apparatus according to claim 1, further comprising a lower vision system (4).
3.根据权利要求 2所述的可使用芯片的智能标签及倒装芯片模块生产设备， 其特征是所 述芯片盛放盒 （5 ) 底部位于芯片正下方部分是透明的， 所述下视觉系统 （4) 直接透过芯片 盛放盒 （5 ) 底部的透明部分看到芯片盛放盒中的芯片的偏移和旋转。  The chip-enabled smart tag and flip chip module production apparatus according to claim 2, wherein the bottom portion of the chip housing (5) is transparent under the chip, the lower vision system (4) The offset and rotation of the chip in the chip holding box are seen directly through the transparent portion of the bottom of the chip holding box (5).
4.根据权利要求 2所述的智能标签及倒装芯片模块生产设备， 其特征是： 所述下视觉系 统 （4) 安装在芯片盛放盒 （5 ) 之外， 芯片吸取机构 （3 ) 将芯片从芯片盛放盒 （5 ) 吸取起 来后， 将芯片移动到所述下视觉系统 （4) 上方， 所述下视觉系统 （4) 直接看到芯片盛放盒 The smart label and flip chip module production apparatus according to claim 2, wherein: the lower vision system (4) is installed outside the chip holding box (5), and the chip picking mechanism (3) After the chip is sucked from the chip holding box (5), the chip is moved over the lower vision system (4), and the lower vision system (4) directly sees the chip holding box.
( 5 ) 中的芯片的偏移和旋转。 Offset and rotation of the chip in (5).
5.根据权利要求 3或 4所述的可使用芯片的智能标签及倒装芯片模块生产设备， 其特征 是还包括所述晶圆取片装置 （7) ， 所述芯片盛放盒 （5 ) 与晶圆取片装置 （7) 并行布置。  The chip-enabled smart label and flip chip module production apparatus according to claim 3 or 4, further comprising the wafer picking device (7), the chip holding box (5) Arranged in parallel with the wafer take-up device (7).
6.根据权利要求 5所述的可使用芯片的智能标签及倒装芯片模块生产设备， 其特征是所 述芯片盛放盒 （5 ) 的数量为 2— 32个， 2— 32个芯片盛放盒 （5 ) 放在一个旋转机构 （16) 上进行循环。  The chip-enabled smart tag and flip chip module production apparatus according to claim 5, wherein the number of the chip holding boxes (5) is 2 to 32, and 2 to 32 chips are placed. The box (5) is placed on a rotating mechanism (16) for circulation.
7.根据权利要求 6所述的可使用芯片的智能标签及倒装芯片模块生产设备， 其特征是所 述旋转机构 （16)包括安装在所述工作台 （9) 上的机架 （17) ， 机架 （17) 上设有输送带传 动装置， 输送带传动装置包括主动轮（18)、从动轮（24)和拖动主动轮（18)的电机（11 )， 主动轮 （18) 和从动轮 （24) 上套装有环形的输送带 （6) ， 输送带 （6) 采用透明材料制成 或在芯片下的部分为透明材料或在芯片下的部分被挖除， 输送带（6)的左右两侧分别设有挡 条 （13 ) ， 所述下视觉系统 （4) 位于输送带 （6) 的环形中。  7. A chip-enabled smart tag and flip chip module production apparatus according to claim 6, wherein said rotating mechanism (16) comprises a frame (17) mounted on said table (9) A conveyor belt transmission is arranged on the frame (17), and the conveyor belt transmission comprises a driving wheel (18), a driven wheel (24) and a motor (11) for dragging the driving wheel (18), a driving wheel (18) and The driven wheel (24) is provided with a ring-shaped conveyor belt (6), which is made of a transparent material or a part of the under-chip is transparent material or is removed under the chip, the conveyor belt (6) The left and right sides are respectively provided with a baffle (13), and the lower vision system (4) is located in the ring shape of the conveyor belt (6).
8.根据权利要求 6所述的可使用芯片的智能标签及倒装芯片模块生产设备， 其特征是所 述旋转机构（16)包括采用轴承座（20)沿垂直方向安装在所述工作台 （9)上的立轴（19)， 立轴 （19) 的下部套装有从动齿轮 （21 ) ， 从动齿轮 （21 ) 与主动齿轮 （22) 相啮合， 主动 齿轮 （22) 由立轴电机 （23 ) 拖动， 所述立轴 （19) 的上部伸出到所述工作台 （9) 的上方， 立轴（19) 的顶端沿水平方向安装有转盘（18 ) ， 转盘（18)上放置有所述芯片盛放盒（5 ) ， 所述下视觉系统 （4) 位于转盘 （18) 的下方。  8. The chip-enabled smart tag and flip chip module production apparatus according to claim 6, wherein said rotating mechanism (16) comprises a mounting portion (20) mounted on said table in a vertical direction ( 9) The upper vertical shaft (19), the lower part of the vertical shaft (19) is provided with a driven gear (21), the driven gear (21) meshes with the driving gear (22), and the driving gear (22) is composed of a vertical shaft motor (23) Dragging, an upper portion of the vertical shaft (19) protrudes above the table (9), and a top end of the vertical shaft (19) is mounted with a turntable (18) in a horizontal direction, and the chip is placed on the turntable (18) The box (5) is placed, and the lower vision system (4) is located below the turntable (18).
PCT/CN2008/071566 2008-03-21 2008-07-07 Intelligent label that may use chips, and flip-chip module production equipment WO2009114973A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2008101024582A CN101409240B (en) 2008-03-21 2008-03-21 Intelligent label capable of using chip and equipment for producing flip-chip module
CN200810102458.2 2008-03-21

Publications (1)

Publication Number Publication Date
WO2009114973A1 true WO2009114973A1 (en) 2009-09-24

Family

ID=40572166

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/071566 WO2009114973A1 (en) 2008-03-21 2008-07-07 Intelligent label that may use chips, and flip-chip module production equipment

Country Status (2)

Country Link
CN (1) CN101409240B (en)
WO (1) WO2009114973A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109300807A (en) * 2018-09-10 2019-02-01 佛山市南海区鑫来智能电子有限公司 A kind of chip Beverage bottle cover

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034717A (en) * 2010-09-21 2011-04-27 深圳市卡的智能科技有限公司 Packaging method for radio frequency card
CN102528800A (en) * 2012-01-18 2012-07-04 苏州光宝康电子有限公司 Novel rotary manipulator
CN102602700B (en) * 2012-03-12 2014-07-16 北京德鑫泉物联网科技股份有限公司 Array-type handling device and handling method
CN105470173B (en) * 2015-12-15 2018-08-14 上海微电子装备（集团）股份有限公司 A kind of chip bonding system and method
CN108511329B (en) * 2018-06-15 2024-03-15 德阳帛汉电子有限公司 Chip cleaning device
CN109103134B (en) * 2018-09-01 2021-07-30 余晓飞 Chip label streamlined preparation equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017743A1 (en) * 2001-08-14 2003-02-27 Datacon Semiconductor Equipment Gmbh Method and device for modifying the position of electronic components
US20050007252A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for authenticating devices during assembly
CN1674046A (en) * 2004-03-23 2005-09-28 艾迪讯科技股份有限公司 Radio frequency identification electronic label chip packaging method
US20060010685A1 (en) * 2004-07-15 2006-01-19 Fujitsu Limited RFID tag and method of manufacturing RFID tag
CN1901148A (en) * 2005-07-20 2007-01-24 富士通株式会社 IC chip mounting method
WO2007048927A1 (en) * 2005-10-28 2007-05-03 Oberthur Technologies Method for producing a number of chip cards
US20070221738A1 (en) * 2006-03-27 2007-09-27 Volker Brod Method and device for producing RFID smart labels or smart label inlays

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101051357B (en) * 2007-05-11 2011-05-11 北京德鑫泉物联网科技股份有限公司 Intelligent filling head with vision, spot gluing and filling function
CN101051358A (en) * 2007-05-23 2007-10-10 北京德鑫泉科技发展有限公司 Intelligent label and its glueing method and device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003017743A1 (en) * 2001-08-14 2003-02-27 Datacon Semiconductor Equipment Gmbh Method and device for modifying the position of electronic components
US20050007252A1 (en) * 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for authenticating devices during assembly
CN1674046A (en) * 2004-03-23 2005-09-28 艾迪讯科技股份有限公司 Radio frequency identification electronic label chip packaging method
US20060010685A1 (en) * 2004-07-15 2006-01-19 Fujitsu Limited RFID tag and method of manufacturing RFID tag
CN1901148A (en) * 2005-07-20 2007-01-24 富士通株式会社 IC chip mounting method
WO2007048927A1 (en) * 2005-10-28 2007-05-03 Oberthur Technologies Method for producing a number of chip cards
US20070221738A1 (en) * 2006-03-27 2007-09-27 Volker Brod Method and device for producing RFID smart labels or smart label inlays

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109300807A (en) * 2018-09-10 2019-02-01 佛山市南海区鑫来智能电子有限公司 A kind of chip Beverage bottle cover
CN109300807B (en) * 2018-09-10 2023-11-14 佛山市南海区鑫来智能电子有限公司 Chip glue dripping device

Also Published As

Publication number Publication date
CN101409240B (en) 2010-09-08
CN101409240A (en) 2009-04-15

Similar Documents

Publication Publication Date Title
WO2009114973A1 (en) Intelligent label that may use chips, and flip-chip module production equipment
CN104084697B (en) Stainless steel chip laser cutting equipment
CN104157594B (en) With multiple bonding apparatus for being used to transmit the rotation transferring arm that electronic device is bonded
CN201872395U (en) Full-automatic film sticking machine
CN107211566B (en) Apparatus and method for component assembly
KR20110107809A (en) Component mounting device and method
CN102463727A (en) Fully automatic film sticking machine
CN102854594A (en) Placement machine
CN215880376U (en) Novel laser cutting equipment
TW201236954A (en) Conveying tray
CN101587826A (en) Crystal solidifying apparatus
CN101712130B (en) Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer
CN102024733A (en) Conveying mechanism and processing device
CN106428748B (en) Full-automatic mobile phone glass kind film machine
JP2012094654A (en) Apparatus and method for mounting electronic component
CN216736442U (en) Chip multi-model material box pouring equipment
CN214099584U (en) IC pin processing and packaging equipment
CN102700984A (en) Circular disc feeding device
CN113681221B (en) Turntable type automatic welding production line and welding process of semiconductor refrigeration device
CN108928624A (en) Gasket feeding device, glass disk body post-processor structure, glass heat bender
CN105984599A (en) Packaging system and method
SG152128A1 (en) Chip transporting method and the device thereof
JP2014099435A (en) Cutting device
JP2012099680A (en) Die feeding device
CN105914164A (en) Machining apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08773121

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC

122 Ep: pct application non-entry in european phase

Ref document number: 08773121

Country of ref document: EP

Kind code of ref document: A1