WO2009100288A2 - Electrode orientation and parallelism adjustment mechanism for plasma processing systems - Google Patents
Electrode orientation and parallelism adjustment mechanism for plasma processing systems Download PDFInfo
- Publication number
- WO2009100288A2 WO2009100288A2 PCT/US2009/033318 US2009033318W WO2009100288A2 WO 2009100288 A2 WO2009100288 A2 WO 2009100288A2 US 2009033318 W US2009033318 W US 2009033318W WO 2009100288 A2 WO2009100288 A2 WO 2009100288A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- support plate
- electrode
- rotation
- coupled
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
Definitions
- the shrinking feature sizes and the implementation of new materials in the next generation of device fabrication have put new requirements on plasma processing equipment.
- the smaller device features, larger substrate size, and new processing techniques (involving multi-step recipes, such as for dual-damascene etch) have increased the challenge to maintain good uniformity across the wafer for better device yields.
- the electrode opposite to the substrate electrode is generally called the upper electrode.
- the upper electrode could be grounded, or have one or more radio frequency (RF) power sources attached to it.
- the substrate electrode is generally called the lower electrode.
- a mechanical arrangement for a lower electrode in a capacitively coupled plasma processing chamber may involve cantilevering the assembly that includes the lower electrode from a side of the chamber.
- This cantilevered lower electrode can be a fixed distance from the upper electrode or can be designed for a variable distance from the upper electrode. In either case, parallelism of one electrode surface to the other is generally a critical mechanical parameter that can affect the process performance on the wafer.
- capacitively coupled RF plasma reactors forgo the feature of precise parallelism adjustment between electrodes and rely on tight manufacturing tolerances of the assembly components to keep parallelism within acceptable limits. This approach typically adds cost to those components and may limit the ultimate parallelism specification that can be achieved.
- Other arrangements include slots or clearance holes in mating parts allowing free play to adjust parallelism during assembly. This approach is time consuming and usually requires repetitive processes to achieve the correct configuration.
- the approach may also require the plasma processing system to be disassembled to some extent to adjust the necessary components.
- Other methods attempt to provide a means for adjustment, but may have no direct means to correlate the amount of adjustment to the actual effect on at least one of the electrodes. As a result, such methods may also require iterative processes to dial in parallelism. Some of these methods are also vulnerable to shifting of the adjustment over time due to vibrations, such as shipping loads.
- An embodiment of the invention relates to a mechanism for adjusting an orientation of an electrode in a plasma processing chamber.
- the plasma processing chamber may be utilized to process at least a substrate, which may be inserted into the plasma processing chamber in an insertion direction.
- the mechanism may include a support plate disposed outside a chamber wall of the plasma processing chamber and pivoted relative to the chamber wall.
- the support plate may have a first thread.
- the mechanism may also include an adjustment screw having a second thread that engages the first thread. Turning the adjustment screw may cause translation of a portion of the support plate relative to the adjustment screw. The translation of the portion of the support plate may cause rotation of the support plate relative to the chamber wall, thereby rotating the electrode with respect to an axis that is orthogonal to the insertion direction.
- FIG. 1A shows a partial perspective view of a plasma processing chamber including an adjustment mechanism for adjusting the orientation of a lower electrode in the plasma processing chamber in accordance with one or more embodiments of the present invention.
- Fig. 1 B shows a partial side view of the plasma processing chamber illustrating a first rotation (or the pitch) of the lower electrode in accordance with one or more embodiments of the present invention.
- Fig. 1C shows a partial rear view of the plasma processing chamber illustrating a second rotation (or the roll) of the lower electrode in accordance with one or more embodiments of the present invention.
- Fig. 1D shows a partial side view of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. 1 E shows a partial perspective view of a pitch adjustment user interface of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. 1F shows a partial exploded view of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. 1G shows a perspective view of a roll adjustment cam of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. 1 H shows a partial perspective view of a roll adjustment user interface of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- FIG. 1I another view of Fig. 1A, shows a partial perspective view of the plasma processing chamber including an adjustment mechanism for adjusting the orientation of the lower electrode in the plasma processing chamber in accordance with one or more embodiments of the present invention.
- FIG. 1J another view of Fig. 1B, shows a partial side view of the plasma processing chamber illustrating the first rotation (or the pitch) of the lower electrode in accordance with one or more embodiments of the present invention.
- FIG. 1K another view of Fig. 1C, shows a partial rear view of the plasma processing chamber illustrating the second rotation (or the roll) of the lower electrode in accordance with one or more embodiments of the present invention.
- FIG. 1L another view of Fig. 1D, shows a partial side view of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. 1 M another view of Fig. 1 E, shows a partial perspective view of the pitch adjustment user interface of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- FIG. 1N another view of Fig. 1F, shows a partial exploded view of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. 1O another view of Fig. 1G, shows a perspective view of the roll adjustment cam of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- Fig. IP another view of Fig. 1H, shows a partial perspective view of the roll adjustment user interface of the adjustment mechanism in accordance with one or more embodiments of the present invention.
- One or more embodiments of the invention relate to a mechanism for adjusting electrode-to-electrode parallelism in a plasma processing system.
- the mechanism may separately adjust the orientation/rotation of the lower electrode in the pitch (front to back) and roll (side to side) directions.
- the mechanism may include low-cost, simple parts that collectively accomplish the high-precision adjustment for parallelism with a low combined cost.
- the mechanism may allow electrode orientation/parallelism adjustment to take place while the system is under vacuum, at atmosphere, and/or in-situ, since the user interfaces of the mechanism are disposed outside the plasma processing chamber.
- the mechanism may also allow the adjustment to be made with minimum or no disassembly of the plasma processing system.
- the mechanism may enable precise electrode orientation/parallelism adjustment.
- the mechanism may also include calibrated index marks to give clear feedback of the amount of adjustment, thereby eliminating the need for iterative adjusting and measuring.
- the mechanism may also enable locking electrode orientation/parallelism settings. Once an adjusted electrode orientation/parallelism setting is securely locked down, the setting should stay unchanged through normal vibrations and shipping loads. [0028] By utilizing low-cost parts and allowing fast adjustment-locking of parallelism to a precise level, the mechanism may reducing the need for tight manufacturing tolerances on major components and may cost-effectively optimize process performance with regard to electrode parallelism.
- One or more embodiments of the invention relate to a plasma processing system that includes the electrode orientation/parallelism adjustment mechanism discussed above and further discussed in the examples below.
- FIG. 1 A shows a partial perspective view of a plasma processing chamber 198 including a mechanism 100 for adjusting the orientation of a lower electrode 110 in accordance with one or more embodiments of the present invention.
- the electrode-to-electrode parallelism between an upper electrode 198 and lower electrode 110 may be ensured by adjusting the orientation of lower electrode 110.
- Mechanism 100 may include a tunnel support plate 102 (support plate 102) coupled with lower electrode 110 through a cantilever 114 and a bias housing 112.
- 100 may also include a pitch adjustment screw 106 for adjusting the pitch of lower electrode
- Mechanism 100 may also include a roll adjustment cam 104 for adjusting the roll of lower electrode 110; the roll of lower electrode 110 is illustrated in the example of Fig. 1C.
- FIG. 1B shows a partial side view of plasma processing chamber 198 illustrating a first rotation 192 (pitch 192) in accordance with one or more embodiments of the present invention.
- Mechanism 100 may facilitate the adjustment of first rotation 192 (pitch 192) of lower electrode 110 with respect to a pitch axis 118.
- Pitch axis 118 is substantially orthogonal to a substrate insertion direction 116, in which a substrate may be inserted into plasma processing chamber 198.
- Fig. 1C shows a partial rear view of plasma processing chamber 198 illustrating a second rotation 194 (roll 194) in accordance with one or more embodiments of the present invention.
- Mechanism 100 may facilitate the adjustment of second rotation 194 (roll 194) of lower electrode 110 with respect to a roll axis 120.
- Roll axis 120 is substantially parallel to substrate insertion direction 116
- Fig. ID shows a partial side view of mechanism 100 in accordance with one or more embodiments of the present invention.
- support plate 102 may be disposed outside a chamber wall 126 of plasma processing chamber 198 (shown in the example of Fig. 1A).
- Support plate 102 may be pivoted relative to chamber wall 126, for example, by pivot 122 and/or another pivot mechanism at a portion 138, e.g., the upper portion, of support plate 102.
- the support plate may have a thread 146 that may engage a thread 128 of pitch adjustment screw 106. Accordingly, turning pitch adjustment screw 106 may cause the translation of a portion 140 (e.g., the lower portion) of support plate 102 relative to pitch adjustment screw 106 in an outward direction 142 or an inward direction 144.
- the translation of portion 140 of support plate 102 may cause rotation of support plate 102 with respect to chamber wall 126.
- support plate 102 Since support plate 102 is coupled with lower electrode 110, the rotation of support plate 102 following direction 142 or 144 may substantially cause rotation of lower electrode 110 with respect to pitch axis 118.
- the precision of threads 146 and 128 may enable the amount of rotation 192 of lower electrode 110 to be stably and precisely adjusted.
- Mechanism 100 may also include a lift plate 124 disposed between chamber wall
- Mechanism 100 may also include one or more bearings, such as bearings 134 and 136, coupled with lift plate 124 and chamber wall 126.
- the one or more bearings may facilitate and/or guide the movement of support plate 102 relative to chamber wall 126 (e.g., translation in direction 142 or 144, and/or translation in a direction perpendicular to direction 142 or 144), for smooth and precise adjustment of rotation 192 of lower electrode 110.
- Mechanism 100 may also include a clamping mechanism, for example, including a split clamp 132 and a clamp screw 130, for locking/fastening pitch adjustment screw 106 to support plate 102, thereby preventing pitch adjustment screw 106 from rotation and translation.
- Fig. IE shows a partial perspective view of a user interface 182 of mechanism
- User interface 182 may include at least one pitch adjustment index 150 implemented on support plate 102 for providing visual feedback concerning pitch adjustment to a user.
- User interface 182 may also include an indicator 148 implemented on pitch adjustment screw 106 for cooperating with pitch adjustment index 150 to indicate the amount of pitch adjustment.
- a pitch adjustment index may be implemented on pitch adjustment screw 106, and/or an indicator may be implemented on support plate 102.
- Mechanism 100 may also include a pitch adjustment clamp screw 106 A coupled with and at least partially inserted into pitch adjustment screw 106.
- Pitch adjustment clamp screw 106 A may secure pitch adjustment screw 106 to support plate 102.
- a tool slot 186 may be implemented on a pitch adjustment clamp screw 106A for facilitating the user to rigidly lock/clamp pitch adjustment screw 106 and/or the entire mechanism 100 once the pitch adjustment has been completed.
- pitch adjustment screw 106 may be coupled with an automatic control mechanism for controlling the pitch adjustment and/or calibration in an automatic fashion.
- the automatic control mechanism may include, for example, a sensor, a control logic unit, and a motor (e.g., a high-resolution step motor).
- FIG. IF shows a partial exploded view of mechanism 100 in accordance with one or more embodiments of the present invention.
- Mechanism 100 may include a roll adjustment bar 154 coupled with roll adjustment cam 104 and may be actuated by roll adjustment cam 104.
- Roll adjustment bar 154 may be coupled with support plate 102 by pitch adjustment screw 106. Accordingly, through roll adjustment bar 154, roll adjustment cam 104 may actuate translation of portion 140 of support plate 102.
- support plate 102 may rotate relative to chamber wall 126 with respect to pivot 122 (shown in the example of Fig. ID), thereby causing rotation 194 (roll 194) of lower electrode 110 shown in the example of Fig. 1C.
- Mechanism 100 may also include a roll adjustment lock-down screw 158 coupled with roll adjustment cam 104.
- Roll adjustment lock-down screw 158 may lock roll adjustment cam 104 relative to roll adjustment bar 154 and may simultaneously lock roll adjustment bar 154 relative to lift plate 124, thereby preventing (further) rotation 194 (roll 194) of lower electrode 110.
- Roll adjustment lock-down screw 158 may be utilized, for example, after roll adjustment for lower electrode 110 has been completed.
- Mechanism 100 may also include a washer 162 (e.g., a precision, hardened washer) coupled with lift plate 124 for receiving pitch adjustment screw 106.
- Washer 162 may protect lift plate 124 from being damaged by pitch adjustment screw 106. Washer 162 may also provide low friction to facilitate smooth movement of pitch adjustment screw 106, thereby further smoothing and stabilizing the operation of mechanism 100.
- Fig. IG shows a perspective view of roll adjustment cam 104 in accordance with one or more embodiments of the present invention.
- Roll adjustment cam 104 may include a portion 172 disposed in an eccentric/offset arrangement with respect to a portion 174 of roll adjustment cam 104, for enabling roll adjustment cam 104 to actuate roll adjustment bar 154 (shown in the example of Fig. IF).
- Roll adjustment cam 104 may be replaced with other replacement roll adjustment cams with different eccentric/offset arrangements for particular actuation effects that suit particular roll adjustment needs.
- Fig. 1H shows a partial perspective view of a user interface 184 mechanism 100 for adjusting roll 194 of lower electrode 110 in accordance with one or more embodiments of the present invention.
- User interface 184 may include at least one roll adjustment index 178 implemented on lift plate 124 for providing visual feedback concerning roll adjustment to a user.
- User interface 184 may also include an indicator 180 implemented on roll adjustment cam 104 for cooperating with roll adjustment index 178 to indicate the amount of roll adjustment.
- a roll adjustment index may be implemented on roll adjustment cam 104, and/or an indicator may be implemented on lift plate 124.
- a tool slot 176 may be implemented on roll adjustment cam 104 for facilitating the user to perform the roll adjustment, for example, utilizing a screw driver.
- roll adjustment cam 104 and/or pitch adjustment screw 106 may be coupled with an automatic control mechanism for controlling pitch and/or roll adjustment and/or calibration in an automatic fashion.
- the automatic control mechanism may include, for example, a sensor, a control logic unit, and a motor (e.g., a high-resolution step motor).
- embodiments of the invention may allow fast adjustment and locking of parallelism to a precise level. Accordingly, embodiments of the invention may reduce the need for costly tight manufacturing tolerances on major components.
- embodiments of the invention may cost- effectively optimize process performance with regard to electrode parallelism.
- Embodiments of the invention may enable precise electrode orientation/parallelism adjustment. Embodiments of the invention may also include calibrated index marks to give clear feedback of the amount of adjustment. Advantageously, the need for iterative adjusting and measuring required in the prior art may be eliminated. [0050] Embodiments of the invention may allow the adjustment of electrode orientation and/or parallelism to take place while a plasma processing system is under vacuum, atmosphere, and/or in-situ, since the user interfaces are disposed outside the plasma processing chamber. Embodiments of the invention may also allow the adjustment to be made with minimum or no disassembly of the plasma processing system. Advantageously, system down time may be minimized, and productivity may not be compromised, while the needs for electrode orientation and/or parallelism adjustment are satisfied.
- Embodiments of the invention may also enable locking the settings of electrode orientation/parallelism.
- An adjusted electrode orientation/parallelism setting may stay unchanged through normal vibrations and shipping loads.
- the resources e.g., labor, time, etc.
- the re-adjustment of electrode orientation/parallelism may be minimized.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200980104604.8A CN101940067B (en) | 2008-02-08 | 2009-02-06 | A Mechanism for Adjusting Electrode Azimuth and Parallelism of Plasma Processing System |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2740508P | 2008-02-08 | 2008-02-08 | |
| US2737208P | 2008-02-08 | 2008-02-08 | |
| US61/027,372 | 2008-02-08 | ||
| US61/027,405 | 2008-02-08 | ||
| US12/167,987 | 2008-07-03 | ||
| US12/167,987 US8257548B2 (en) | 2008-02-08 | 2008-07-03 | Electrode orientation and parallelism adjustment mechanism for plasma processing systems |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2009100288A2 true WO2009100288A2 (en) | 2009-08-13 |
| WO2009100288A3 WO2009100288A3 (en) | 2009-10-15 |
Family
ID=40937785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2009/033318 Ceased WO2009100288A2 (en) | 2008-02-08 | 2009-02-06 | Electrode orientation and parallelism adjustment mechanism for plasma processing systems |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8257548B2 (en) |
| KR (1) | KR101565182B1 (en) |
| CN (1) | CN101940067B (en) |
| SG (1) | SG188139A1 (en) |
| TW (1) | TWI496512B (en) |
| WO (1) | WO2009100288A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8394233B2 (en) | 2008-02-08 | 2013-03-12 | Lam Research Corporation | Electrode orientation and parallelism adjustment mechanism for plasma processing systems |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6789777B2 (en) | 2002-12-02 | 2004-09-14 | Caterpillar Inc | Piezo solenoid actuator and valve using same |
| CN101351076B (en) * | 2008-09-16 | 2011-08-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Apparatus for processing plasma |
| US8895452B2 (en) * | 2012-05-31 | 2014-11-25 | Lam Research Corporation | Substrate support providing gap height and planarization adjustment in plasma processing chamber |
| US9088085B2 (en) * | 2012-09-21 | 2015-07-21 | Novellus Systems, Inc. | High temperature electrode connections |
| CN103841681A (en) * | 2013-04-16 | 2014-06-04 | 杜志刚 | Plasma nitrogen high pressure gas heating device |
| US10049862B2 (en) * | 2015-04-17 | 2018-08-14 | Lam Research Corporation | Chamber with vertical support stem for symmetric conductance and RF delivery |
| CN104900473B (en) * | 2015-04-24 | 2017-04-05 | 北京精诚铂阳光电设备有限公司 | Parallelism adjusting device and CVD growth film device |
| US10533251B2 (en) | 2015-12-31 | 2020-01-14 | Lam Research Corporation | Actuator to dynamically adjust showerhead tilt in a semiconductor processing apparatus |
| US10190216B1 (en) | 2017-07-25 | 2019-01-29 | Lam Research Corporation | Showerhead tilt mechanism |
| US11670490B2 (en) * | 2017-09-29 | 2023-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit fabrication system with adjustable gas injector |
| CN114446748B (en) * | 2020-10-30 | 2024-05-10 | 中微半导体设备(上海)股份有限公司 | Plasma processing device and working method thereof |
| US12400834B2 (en) * | 2021-05-07 | 2025-08-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cantilever with etch chamber flow design |
Family Cites Families (17)
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| US3602998A (en) * | 1968-12-03 | 1971-09-07 | Olympus Optical Co | Micrometer head |
| US4044622A (en) | 1975-02-18 | 1977-08-30 | Matthews John C | Anti-ejection system for control rod drives |
| JPH06120169A (en) | 1992-10-07 | 1994-04-28 | Hitachi Ltd | Plasma generator |
| US5636549A (en) | 1993-12-22 | 1997-06-10 | Hughes Electronics | Wire wound threaded elements including lead screws, roller not assemblies and process |
| WO1996000354A1 (en) | 1994-06-23 | 1996-01-04 | Polaroid Corporation | Nut for limiting harmonic error |
| US5811021A (en) | 1995-02-28 | 1998-09-22 | Hughes Electronics Corporation | Plasma assisted chemical transport method and apparatus |
| KR100400044B1 (en) * | 2001-07-16 | 2003-09-29 | 삼성전자주식회사 | Shower head of wafer treatment apparatus having gap controller |
| JP4744035B2 (en) | 2001-09-03 | 2011-08-10 | ラム リサーチ コーポレーション | Plasma processing equipment |
| US6774373B2 (en) * | 2002-07-29 | 2004-08-10 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
| TWI228773B (en) * | 2003-12-23 | 2005-03-01 | Ind Tech Res Inst | Method for positioning plasma electrodes with small clearance and transport of wafer and device therefore |
| JP2005325944A (en) | 2004-05-14 | 2005-11-24 | Hama International:Kk | Lead screw type moving device and moving body thereof |
| US20060054090A1 (en) * | 2004-09-15 | 2006-03-16 | Applied Materials, Inc. | PECVD susceptor support construction |
| KR100782380B1 (en) * | 2005-01-24 | 2007-12-07 | 삼성전자주식회사 | Semiconductor manufacturing device |
| US20070102290A1 (en) | 2005-11-10 | 2007-05-10 | The Circle For The Promotion Of Science And Engineering | Novel material development apparatus and novel material development method using arc plasma |
| US7858898B2 (en) * | 2007-01-26 | 2010-12-28 | Lam Research Corporation | Bevel etcher with gap control |
| US8257548B2 (en) | 2008-02-08 | 2012-09-04 | Lam Research Corporation | Electrode orientation and parallelism adjustment mechanism for plasma processing systems |
| US8438712B2 (en) | 2008-02-08 | 2013-05-14 | Lam Research Corporation | Floating collar clamping device for auto-aligning nut and screw in linear motion leadscrew and nut assembly |
-
2008
- 2008-07-03 US US12/167,987 patent/US8257548B2/en active Active
-
2009
- 2009-02-05 TW TW098103702A patent/TWI496512B/en active
- 2009-02-06 SG SG2013010194A patent/SG188139A1/en unknown
- 2009-02-06 CN CN200980104604.8A patent/CN101940067B/en active Active
- 2009-02-06 WO PCT/US2009/033318 patent/WO2009100288A2/en not_active Ceased
- 2009-02-06 KR KR1020107017615A patent/KR101565182B1/en active Active
-
2012
- 2012-08-01 US US13/563,931 patent/US8394233B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8394233B2 (en) | 2008-02-08 | 2013-03-12 | Lam Research Corporation | Electrode orientation and parallelism adjustment mechanism for plasma processing systems |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090199766A1 (en) | 2009-08-13 |
| US8257548B2 (en) | 2012-09-04 |
| US8394233B2 (en) | 2013-03-12 |
| TW200948215A (en) | 2009-11-16 |
| SG188139A1 (en) | 2013-03-28 |
| WO2009100288A3 (en) | 2009-10-15 |
| KR20100120655A (en) | 2010-11-16 |
| US20120291954A1 (en) | 2012-11-22 |
| KR101565182B1 (en) | 2015-11-02 |
| CN101940067A (en) | 2011-01-05 |
| CN101940067B (en) | 2013-04-03 |
| TWI496512B (en) | 2015-08-11 |
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