WO2009078203A1 - 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法 - Google Patents

多層粘着シート及び多層粘着シートを用いた電子部品の製造方法 Download PDF

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Publication number
WO2009078203A1
WO2009078203A1 PCT/JP2008/065557 JP2008065557W WO2009078203A1 WO 2009078203 A1 WO2009078203 A1 WO 2009078203A1 JP 2008065557 W JP2008065557 W JP 2008065557W WO 2009078203 A1 WO2009078203 A1 WO 2009078203A1
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WIPO (PCT)
Prior art keywords
sensitive adhesive
adhesive sheet
pressure
multilayered
multilayered pressure
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PCT/JP2008/065557
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English (en)
French (fr)
Inventor
Takeshi Saito
Taro Inada
Tomomichi Takatsu
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Denki Kagaku Kogyo Kabushiki Kaisha
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Publication of WO2009078203A1 publication Critical patent/WO2009078203A1/ja

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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法を提供する。  基材フィルムと、該基材フィルムの一方の面に積層してなる粘着剤層と、さらに該粘着剤層に積層されたダイアタッチフィルムと、を備え、該基材フィルムがプロピレン系共重合体で形成されている多層粘着シート及びそれを用いた電子部品の製造方法。本発明の多層粘着シートは、ダイシング時のダイシングテープ、及びダイアタッチフィルム由来の切削屑がなく、ダイシング時のチップ保持に優れ、更にダイシング時にリングフレームから外れにくく、ピックアップ作業時にチップの剥離が容易という効果を奏するため、多層粘着シートは、ダイシング後にチップ裏面にダイアタッチフィルム層を付けた状態でピックアップし、リードフレーム等にマウントして接着させる電子部品の製造方法に好適に用いられる。
PCT/JP2008/065557 2007-12-19 2008-08-29 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法 WO2009078203A1 (ja)

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JP2007-327283 2007-12-19
JP2007327283A JP2011044444A (ja) 2007-12-19 2007-12-19 多層粘着シート及び多層粘着シートを用いた電子部品の製造方法。

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065252A1 (ja) * 2009-11-30 2011-06-03 電気化学工業株式会社 粘着シート及び電子部品
JP2011233632A (ja) * 2010-04-26 2011-11-17 Denki Kagaku Kogyo Kk 粘着シート及び電子部品の製造方法
JP2012039053A (ja) * 2010-07-14 2012-02-23 Denki Kagaku Kogyo Kk 多層粘着シート及び電子部品の製造方法
WO2012157615A1 (ja) * 2011-05-19 2012-11-22 電気化学工業株式会社 粘着シートおよび電子部品の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5742501B2 (ja) * 2011-06-17 2015-07-01 日立化成株式会社 接着剤層付き半導体チップの製造方法及び半導体装置の製造方法
JP6373251B2 (ja) * 2013-02-22 2018-08-15 デンカ株式会社 粘着シートを用いた電子部品の製造方法

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JPH09326380A (ja) * 1996-06-06 1997-12-16 Toagosei Co Ltd 基材表面上のパーティクルの除去方法
JPH10240439A (ja) * 1997-02-28 1998-09-11 Canon Inc マウスパッド作成用記録媒体、これを含むマウスパッド作成用キット及びこれを用いたマウスパッドの作成方法
JP2003013019A (ja) * 2001-06-27 2003-01-15 Nitto Denko Corp ダイシング用粘着シート
JP2006225566A (ja) * 2005-02-18 2006-08-31 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及びそれを使用した半導体装置
JP2007291147A (ja) * 2005-04-19 2007-11-08 Denki Kagaku Kogyo Kk 粘着剤、それを用いた粘着シート、粘着シートを用いた電子部品製造方法。

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326380A (ja) * 1996-06-06 1997-12-16 Toagosei Co Ltd 基材表面上のパーティクルの除去方法
JPH10240439A (ja) * 1997-02-28 1998-09-11 Canon Inc マウスパッド作成用記録媒体、これを含むマウスパッド作成用キット及びこれを用いたマウスパッドの作成方法
JP2003013019A (ja) * 2001-06-27 2003-01-15 Nitto Denko Corp ダイシング用粘着シート
JP2006225566A (ja) * 2005-02-18 2006-08-31 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及びそれを使用した半導体装置
JP2007291147A (ja) * 2005-04-19 2007-11-08 Denki Kagaku Kogyo Kk 粘着剤、それを用いた粘着シート、粘着シートを用いた電子部品製造方法。

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011065252A1 (ja) * 2009-11-30 2011-06-03 電気化学工業株式会社 粘着シート及び電子部品
JPWO2011065252A1 (ja) * 2009-11-30 2013-04-11 電気化学工業株式会社 粘着シート及び電子部品
JP2011233632A (ja) * 2010-04-26 2011-11-17 Denki Kagaku Kogyo Kk 粘着シート及び電子部品の製造方法
JP2012039053A (ja) * 2010-07-14 2012-02-23 Denki Kagaku Kogyo Kk 多層粘着シート及び電子部品の製造方法
WO2012157615A1 (ja) * 2011-05-19 2012-11-22 電気化学工業株式会社 粘着シートおよび電子部品の製造方法
JP5890405B2 (ja) * 2011-05-19 2016-03-22 デンカ株式会社 粘着シートおよび電子部品の製造方法

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