WO2009047892A1 - 電子部品実装システムおよび電子部品実装システムにおける操作指示方法 - Google Patents

電子部品実装システムおよび電子部品実装システムにおける操作指示方法 Download PDF

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Publication number
WO2009047892A1
WO2009047892A1 PCT/JP2008/002830 JP2008002830W WO2009047892A1 WO 2009047892 A1 WO2009047892 A1 WO 2009047892A1 JP 2008002830 W JP2008002830 W JP 2008002830W WO 2009047892 A1 WO2009047892 A1 WO 2009047892A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component mounting
mounting system
window
operation instruction
Prior art date
Application number
PCT/JP2008/002830
Other languages
English (en)
French (fr)
Inventor
Kazuhiko Itose
Kenichiro Ishimoto
Yoshiaki Awata
Hideki Sumi
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to DE112008002673T priority Critical patent/DE112008002673T5/de
Priority to US12/679,065 priority patent/US8844124B2/en
Priority to CN200880111037.4A priority patent/CN101822135B/zh
Publication of WO2009047892A1 publication Critical patent/WO2009047892A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Digital Computer Display Output (AREA)

Abstract

　本発明の課題は、操作指示画面を必要十分な情報量で表示パネルに表示させて正確な操作指示を行うことができる電子部品実装システムおよび電子部品実装システムにおける操作指示方法を提供することである。 　複数の装置を直列に連結して構成された電子部品実装システムにおいて、複数の装置のうち、マシンオペレータの操作対象となっている操作対象装置（Ｍ＊）に属する表示パネル（２０）に操作指示画面を構成する主画面を表示させ、操作対象装置（Ｍ＊）の両側に隣接する２つの隣接装置（Ｍ（Ｌ），Ｍ（Ｒ））に属する表示パネル（２０）に、それぞれ操作指示画面の副画面（１），副画面（２）を予め設定された表示フォーマットに基づいて表示させる。これにより、単位装置の装置幅が小さく、表示パネル（２０）のサイズが制約される場合にあっても、操作指示画面を必要十分な情報量で表示パネル（２０）に表示させて正確な操作指示を行うことができる。
PCT/JP2008/002830 2007-10-09 2008-10-07 電子部品実装システムおよび電子部品実装システムにおける操作指示方法 WO2009047892A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112008002673T DE112008002673T5 (de) 2007-10-09 2008-10-07 Bestückungssystem für elektronische Bauteile und Verfahren für eine Bedienungsanleitung zur Verwendung damit
US12/679,065 US8844124B2 (en) 2007-10-09 2008-10-07 Operation instruction display technique for an electronic component mounting system
CN200880111037.4A CN101822135B (zh) 2007-10-09 2008-10-07 电子元件安装系统和电子元件安装系统中的操作指示方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007263077A JP4803152B2 (ja) 2007-10-09 2007-10-09 電子部品実装システムおよび電子部品実装システムにおける操作指示方法
JP2007-263077 2007-10-09

Publications (1)

Publication Number Publication Date
WO2009047892A1 true WO2009047892A1 (ja) 2009-04-16

Family

ID=40549045

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002830 WO2009047892A1 (ja) 2007-10-09 2008-10-07 電子部品実装システムおよび電子部品実装システムにおける操作指示方法

Country Status (6)

Country Link
US (1) US8844124B2 (ja)
JP (1) JP4803152B2 (ja)
KR (1) KR20100069671A (ja)
CN (1) CN101822135B (ja)
DE (1) DE112008002673T5 (ja)
WO (1) WO2009047892A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023079696A1 (ja) * 2021-11-05 2023-05-11 株式会社Fuji 表示装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5229177B2 (ja) 2009-10-08 2013-07-03 パナソニック株式会社 部品実装システム
JP5866513B2 (ja) * 2011-12-12 2016-02-17 パナソニックＩｐマネジメント株式会社 部品実装用装置及び部品実装用装置の入力管理方法
JP5909643B2 (ja) * 2012-04-13 2016-04-27 パナソニックＩｐマネジメント株式会社 テープフィーダおよびテープフィーダにおける設定情報の表示方法
WO2015049722A1 (ja) * 2013-10-01 2015-04-09 富士機械製造株式会社 対基板作業システム
CN106105417B (zh) * 2014-03-17 2019-02-05 株式会社富士 面板装置及作业机
JP6523436B2 (ja) * 2015-04-16 2019-05-29 株式会社Ｆｕｊｉ 基板生産機および基板生産ライン
JP6647096B2 (ja) * 2016-03-18 2020-02-14 株式会社Ｆｕｊｉ 装置とプロジェクタを備えるシステム
JP6492292B2 (ja) * 2016-09-28 2019-04-03 パナソニックＩｐマネジメント株式会社 部品実装ラインにおけるプログラムのバージョンアップ方法
JP7130721B2 (ja) * 2020-12-15 2022-09-05 株式会社Fuji 基板作業システム

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JP2004335888A (ja) * 2003-05-09 2004-11-25 Fuji Mach Mfg Co Ltd 回路部品実装機用モニタ装置
JP2005158993A (ja) * 2003-11-26 2005-06-16 Juki Corp 電子部品実装装置
JP2006339244A (ja) * 2005-05-31 2006-12-14 Yamaha Motor Co Ltd 実装ライン

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US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
JP3301880B2 (ja) * 1995-01-17 2002-07-15 松下電器産業株式会社 部品装着方法及び装置
US5553376A (en) * 1995-02-15 1996-09-10 Motorola, Inc. Method of and apparatus for changing a production setup
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JP4320204B2 (ja) 2002-07-19 2009-08-26 富士機械製造株式会社 対基板作業システム
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004335888A (ja) * 2003-05-09 2004-11-25 Fuji Mach Mfg Co Ltd 回路部品実装機用モニタ装置
JP2005158993A (ja) * 2003-11-26 2005-06-16 Juki Corp 電子部品実装装置
JP2006339244A (ja) * 2005-05-31 2006-12-14 Yamaha Motor Co Ltd 実装ライン

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023079696A1 (ja) * 2021-11-05 2023-05-11 株式会社Fuji 表示装置

Also Published As

Publication number Publication date
US8844124B2 (en) 2014-09-30
US20100212151A1 (en) 2010-08-26
JP2009094270A (ja) 2009-04-30
KR20100069671A (ko) 2010-06-24
JP4803152B2 (ja) 2011-10-26
CN101822135A (zh) 2010-09-01
DE112008002673T5 (de) 2010-11-04
CN101822135B (zh) 2011-11-30

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