WO2009000104A1 - The package structure of led - Google Patents

The package structure of led Download PDF

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Publication number
WO2009000104A1
WO2009000104A1 PCT/CN2007/001980 CN2007001980W WO2009000104A1 WO 2009000104 A1 WO2009000104 A1 WO 2009000104A1 CN 2007001980 W CN2007001980 W CN 2007001980W WO 2009000104 A1 WO2009000104 A1 WO 2009000104A1
Authority
WO
WIPO (PCT)
Prior art keywords
package structure
led
substrate
light
led die
Prior art date
Application number
PCT/CN2007/001980
Other languages
French (fr)
Chinese (zh)
Inventor
Jenshyan Chen
Original Assignee
Jenshyan Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenshyan Chen filed Critical Jenshyan Chen
Priority to PCT/CN2007/001980 priority Critical patent/WO2009000104A1/en
Publication of WO2009000104A1 publication Critical patent/WO2009000104A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to an LED package structure, and more particularly to an LED package structure having a plurality of LED chips integrated therein.
  • light-emitting diodes have become an emerging light source with many advantages such as power saving, shock resistance, fast response, suitable mass production, and the like. Therefore, it has become common to use light-emitting diodes as indicators, and lighting products using light-emitting diodes as light sources have also become a trend.
  • the electronic products are often required by a plurality of light-emitting diodes each emitting light of different wavelengths.
  • each of the light-emitting diodes must be separated by a certain distance to prevent the emitted light from interfering with each other, thereby enabling the electronic product to simultaneously emit light of different wavelengths.
  • such an arrangement will result in an increase in the volume of the electronic product, a reduction in design flexibility and a range of use. Accordingly, it is desirable to provide a light emitting diode package structure having a plurality of light emitting diode dies integrated to solve the above problems. '
  • Another object of the present invention is to provide a light emitting diode package structure having a plurality of light emitting diode dies integrated therein.
  • the LED package structure of the present invention comprises a stage, a substrate, a first LED die and a second LED die.
  • the stage includes a blocking portion, a top surface and a bottom a surface, the stage forming a first recess on the top surface, the stage forming a second recess on the bottom surface, the first recess and the second recess connection.
  • the substrate is embedded in the second recess.
  • the first LED die and the second LED die are both disposed on the substrate and separated by the blocking portion.
  • the stage can be a low temperature co-fired ceramic plate, a printed circuit board or a metal core circuit board.
  • An adhesive may be filled between the substrate and the second recess to increase the adhesion between the substrate and the second recess.
  • the diameter of the first recessed portion is smaller than the diameter of the second recessed portion, such that the second recessed portion has a top portion, and the substrate is coupled to the top portion.
  • the substrate can also be electrically connected to the top.
  • a circuit contact is disposed on the substrate, and a circuit contact is also disposed on the top. When the substrate is connected to the top, a circuit contact on the substrate is the top The upper circuit contacts are electrically connected.
  • the substrate may be silicon, metal or a low temperature co-fired ceramic.
  • the first LED die or the second LED die is a half-conductor LED or a semiconductor laser.
  • the first LED die can emit a first wavelength of light
  • the second LED die can emit a second wavelength of light
  • the first wavelength of light is different from The second wavelength of light.
  • the LED package structure may further comprise a package material.
  • the encapsulating material may include a phosphor and cover the first LED chip, the second LED die, and the blocking portion.
  • the LED package structure includes a first phosphor region and a second phosphor region.
  • the first phosphor region is located above the first LED chip, and the first phosphor region is configured to convert a third wavelength of light emitted by the first LED die into a first Four wavelength light.
  • the second phosphor region is located above the second LED chip, and the second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die into a first Six wavelengths of light.
  • the LED package structure may further comprise an encapsulation material. The encapsulating material covers the first phosphor powder region and the second phosphor powder region at the same time, and the phosphor powder of the first phosphor powder region is different from the second phosphor powder region.
  • the LED package structure can simultaneously emit light of different wavelengths.
  • a lens may be disposed on the packaging material, and a reflective layer may also be disposed on the first recess.
  • the LED package structure of the present invention is configured to integrate the plurality of LED dies in the same package region by disposing the blocking portion between the first LED die and the second LED die. Reduces package area and provides the ability to simultaneously emit light of different wavelengths.
  • FIG. 1A is a plan view of a light emitting diode package structure according to a preferred embodiment of the present invention.
  • FIG. 1B is a cross-sectional view taken along line X-X of FIG.
  • 1C is a cross-sectional view showing an LED package structure of an embodiment
  • 1D is a cross-sectional view of an LED package structure of an embodiment
  • FIG. 2 is a cross-sectional view showing a light emitting diode package structure of another preferred embodiment. Summary of the invention
  • FIG. 1A is a top plan view of a light emitting diode package structure 1 in accordance with a preferred embodiment of the present invention.
  • Fig. 1B is a cross-sectional view taken along line X-X of Fig. 1A.
  • the LED package structure 1 of the present invention comprises a stage 12, a substrate 14, a first LED die 16 and a second LED die 18.
  • the stage 12 includes a blocking portion 122, a top surface 124 and a bottom surface 126.
  • the stage 12 defines a first recess 128 on the top surface 124.
  • the stage 12 is at the bottom.
  • a second recess 130 is formed on the surface 126.
  • the first recessed portion 128 is connected to the second recessed portion 130.
  • the substrate 14 is embedded in the second recess 130.
  • the first LED die 16 and the second LED die 18 are disposed on the substrate 14 and are separated by the blocking portion 122.
  • the stage 12 can be a low temperature co-fired ceramic plate, a printed circuit board, a metal core circuit board or other material that can interface with the substrate 14.
  • the substrate 14 can be silicon, metal, low temperature co-fired ceramic or other material that can carry light emitting diode dies.
  • An adhesive may be filled between the substrate 14 and the second recess 130 to increase the adhesion between the substrate 14 and the second recess 130.
  • the first LED die 16 or the second LED die 18 is a semiconductor light emitting diode or a semiconductor laser.
  • the diameter of the first recessed portion 128 connected to the second recessed portion 130 is smaller than the diameter of the second recessed portion 130 connected to the first recessed portion 128, so that the first recessed portion
  • the second recess 130 has a top portion 1302.
  • the substrate 14 is coupled to the top portion 1302.
  • the top portion 1302 has the function of engaging the substrate 14 , and may also increase the adhesion area between the substrate 14 and the second recess portion 130 , that is, increase the attachment between the substrate 14 and the second recess 130 . Focus on.
  • FIG. 1C is a cross-sectional view of an LED package structure 3 of an embodiment.
  • the first LED pellets 16 and the second LED die 18 of the LED package structure 3 are directly wired to the substrate 14.
  • the stage 12 has a circuit 132 (shown in phantom) and a plurality of circuit contacts (not shown) are formed on the top 1302.
  • the circuit contacts are electrically connected to the substrate 14 by embedding the substrate 14 in the second recess 130 and abutting the top portion 1302.
  • the first LED die 16 can emit a first wavelength.
  • the second LED die 18 can emit a second wavelength of light.
  • the first wavelength of light is different from the second wavelength of light. Therefore, the LED package structure 1 can emit light of different colors.
  • the LED package structure 1 further includes an encapsulation material 20 .
  • the encapsulating material 20 may include a phosphor powder and cover the first LED die 16 , the second LED die 18 , and the blocking portion 122 .
  • the encapsulating material 20 containing the phosphor may convert light emitted by the first LED die 16 and the second LED die 18.
  • FIG. 1D is a cross-sectional view of an LED package structure 5 of an embodiment.
  • the LED package structure 5 further includes a lens 22 as compared to the preferred embodiment.
  • the lens 22 is disposed on the encapsulating material 20.
  • the LED package structure 5 further includes a reflective layer 24.
  • the reflective layer 24 is located on the first recess 128. Therefore, the light emitting diode package structure 5 can increase the light collecting efficiency.
  • it is necessary that the lens 22 is not attached to the encapsulating material 20.
  • FIG. 2 is a cross-sectional view of a light emitting diode package structure 7 according to another preferred embodiment.
  • the LED package structure 7 includes a first phosphor region and a second phosphor region (not shown).
  • the first phosphor region is located above the first LED die 16.
  • the second phosphor region is located above the second LED die 18.
  • the first phosphor region is configured to convert a third wavelength of light emitted by the first LED die 16 into a fourth wavelength of light.
  • the second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die 18 into a sixth wavelength light.
  • the LED package structure 7 can further include an encapsulation material 20'.
  • the encapsulating material 20' covers both the first phosphor powder region and the second phosphor powder region. And the phosphor powder of the first phosphor region is different from the phosphor powder of the second phosphor region. Therefore, even if the third wavelength light emitted by the first LED die 16 is the same as the fifth wavelength light emitted by the second LED die 18, due to the first phosphor region The phosphor powder differs from the phosphor powder in the second phosphor powder region, and the light emitting diode package structure 7 can simultaneously emit light of different colors.
  • the encapsulation material 20' can independently cover the first LED die 16 and the second LED die 18. Therefore, in an embodiment, the encapsulating material 20' on the first phosphor region may include a phosphor for converting the fourth wavelength light into a seventh wavelength light. Similarly, the encapsulating material 20' on the second phosphor region may include a phosphor for reconverting the sixth wavelength light into an eighth wavelength light. Thereby, even if the fourth wavelength light is the same as the sixth wavelength light, the LED package structure 7 can simultaneously emit different colors of light by adjusting the phosphor powder of the encapsulation material 20'.
  • the encapsulating material 20 ′ of the LED package structure 7 does not cover the blocking portion 122 , so the light emitted by the first LED die 16 and the second LED die 18 are emitted. The light does not interfere with each other. Thereby, the LED package structure 7 can simultaneously emit bright and different colors of light.
  • the encapsulation material 20 of the LED package structure 1 still covers the blocking portion 122, so the light emitted by the first LED die 16 and the light emitted by the second LED die 18 There is a partial blend, which in turn produces a softer effect. Thereby, the LED package structure 1 can emit light of a softer and different color.
  • the light emitting diode package structure of the present invention can of course emit light of a single color, and the description will not be repeated.
  • the LED package structure of the present invention is configured to integrate the plurality of LED dies in the same package region by disposing the blocking portion between the first LED die and the second LED die. Medium, thereby reducing the package area while providing the ability to simultaneously emit light of different wavelengths.

Abstract

A package structure of a LED (1) is provided. The package structure of a LED (1) comprises a carrier (12), a substrate (14), a first LED (16) and a second LED (18). The carrier (12) comprises a partition (122), a top surface (124) and a bottom surface (126). A first concave part (128) is formed in the top surface (124). A second concave part (130) is formed in the bottom surface (126). The first concave part (128) contacts the second concave part (130). The substrate (14) embeds into the second concave part (130). The first LED (16) and the second LED (18) are disposed on the substrate (14). The partition (122) separates the first LED (16) and the second LED (18).

Description

发光二极管封装结构 技术领域  LED package structure
本发明涉及一种发光二极管封装结构，特别涉及一种具有整合数个发光 二极管晶粒的发光二极管封装结构。  The present invention relates to an LED package structure, and more particularly to an LED package structure having a plurality of LED chips integrated therein.
技术背景 technical background
随着半导体发光组件发展，发光二极管已为一种新兴的光源，具有省电、 耐震、 反应快、适合量产等等， 许多优点。 因此， 以发光二极管作为指示器 已属常见， 并且以发光二极管作为光源的照明产品， 亦已渐成趋势。 为使具 有发光二极管的电子产品能提供更多元化的功能，例如同时发射不同颜色的 光线，所述电子产品多以数个各自发射不同的波长光线的发光二极管来达成 此需求。然而， 各个发光二极管必相距一定的距离以避免发射出来的光线相 互干涉，进而能使所述电子产品能同时发射出不同波长的光线。不可避免地， 这种设置结构将造成所述电子产品的体积增加， 降低设计弹性以及使用范 围。 因此，需要提供一种具有整合数个发光二极管晶粒的发光二极管封装结 构以解决上述问题。 '  With the development of semiconductor light-emitting components, light-emitting diodes have become an emerging light source with many advantages such as power saving, shock resistance, fast response, suitable mass production, and the like. Therefore, it has become common to use light-emitting diodes as indicators, and lighting products using light-emitting diodes as light sources have also become a trend. In order to enable electronic products with light-emitting diodes to provide more diverse functions, such as simultaneously emitting light of different colors, the electronic products are often required by a plurality of light-emitting diodes each emitting light of different wavelengths. However, each of the light-emitting diodes must be separated by a certain distance to prevent the emitted light from interfering with each other, thereby enabling the electronic product to simultaneously emit light of different wavelengths. Inevitably, such an arrangement will result in an increase in the volume of the electronic product, a reduction in design flexibility and a range of use. Accordingly, it is desirable to provide a light emitting diode package structure having a plurality of light emitting diode dies integrated to solve the above problems. '
发明概要 Summary of invention
本发明的一目的是提供一种发光二极管封装结构。  It is an object of the present invention to provide an LED package structure.
本发明的另一目的是提供一种具有整合数个发光二极管晶粒的发光二 极管封装结构。  Another object of the present invention is to provide a light emitting diode package structure having a plurality of light emitting diode dies integrated therein.
本发明的发光二极管封装结构包含一载台、一基板、 一第一发光二极管 晶粒以及一第二发光二极管晶粒。所述载台包含一阻隔部、一顶表面和一底 表面， 所述载台在所述顶表面上形成一第一凹陷部， 所述载台在所述底表面 上形成一第二凹陷部， 所述第一凹陷部与所述第二凹陷部相连接。所述基板 嵌入所述第二凹陷部。所述第一发光二极管晶粒以及所述第二发光二极管晶 粒均设置在所述基板上， 并且被所述阻隔部所分隔。 The LED package structure of the present invention comprises a stage, a substrate, a first LED die and a second LED die. The stage includes a blocking portion, a top surface and a bottom a surface, the stage forming a first recess on the top surface, the stage forming a second recess on the bottom surface, the first recess and the second recess connection. The substrate is embedded in the second recess. The first LED die and the second LED die are both disposed on the substrate and separated by the blocking portion.
所述载台可为一低温共烧陶瓷板、 一印刷电路板或一金属核心电路板。 所述基板与所述第二凹陷部的间可填充一黏胶， 以增加所述基板与所述第二 凹陷的间的附着力。所述第一凹陷部的直径小于所述第二凹陷部的直径， 致 使所述第二凹陷部具有一顶部， 所述基板与所述顶部连接。所述基板也可与 所述顶部电连接。在一实施例中， 所述基板上设有电路接点， 并且所述顶部 上也对应设有电路接点， 当所述基板与所述顶部连接时， 所述基板上的电路 接点即与所述顶部上的电路接点电连接。 此外， 所述基板可为硅、金属或低 温共烧陶瓷。所述第一发光二极管晶粒或所述第二发光二极管晶粒是一半导 体发光二极管或一半导体激光。  The stage can be a low temperature co-fired ceramic plate, a printed circuit board or a metal core circuit board. An adhesive may be filled between the substrate and the second recess to increase the adhesion between the substrate and the second recess. The diameter of the first recessed portion is smaller than the diameter of the second recessed portion, such that the second recessed portion has a top portion, and the substrate is coupled to the top portion. The substrate can also be electrically connected to the top. In an embodiment, a circuit contact is disposed on the substrate, and a circuit contact is also disposed on the top. When the substrate is connected to the top, a circuit contact on the substrate is the top The upper circuit contacts are electrically connected. Further, the substrate may be silicon, metal or a low temperature co-fired ceramic. The first LED die or the second LED die is a half-conductor LED or a semiconductor laser.
根据本发明的发光二极管封装结构，所述第一发光二极管晶粒可发射一 第一波长光线， 所述第二发光二极管晶粒可发射一第二波长光线， 所述第一 波长光线异于所述第二波长光线。所述发光二极管封装结构可进一歩包含一 封装材料。所述封装材料可包含一萤光粉并同时覆盖所述第一发光二极管晶 粒、 所述第二发光二极管晶粒以及所述阻隔部。  According to the LED package structure of the present invention, the first LED die can emit a first wavelength of light, and the second LED die can emit a second wavelength of light, the first wavelength of light is different from The second wavelength of light. The LED package structure may further comprise a package material. The encapsulating material may include a phosphor and cover the first LED chip, the second LED die, and the blocking portion.
在一实施例中，所述发光二极管封装结构包含一第一萤光粉区域以及一 第二萤光粉区域。 所述第一萤光粉区域位于所述第一发光二极管晶粒之上， 所述第一萤光粉区域用以将所述第一发光二极管晶粒发射的一第三波长光 线转换为一第四波长光线。所述第二萤光粉区域位于所述第二发光二极管晶 粒之上，所述第二萤光粉区域用以将所述第二发光二极管晶粒发射的一第五 波长光线转换为一第六波长光线。此外， 所述发光二极管封装结构可进一步 包含一封装材料。所述封装材料同时覆盖在所述第一萤光粉区域与所述第二 萤光粉区域上，且所述第一萤光粉区域的萤光粉不同于所述第二萤光粉区域 的萤光粉。 借此， 所述发光二极管封装结构可同时发射不同波长的光线。 另外， 根据本发明的发光二极管封装结构， 为增加集光效率， 可在所述 封装材料上设有一透镜， 并且也可在所述第一凹陷部上设有一反射层。 In one embodiment, the LED package structure includes a first phosphor region and a second phosphor region. The first phosphor region is located above the first LED chip, and the first phosphor region is configured to convert a third wavelength of light emitted by the first LED die into a first Four wavelength light. The second phosphor region is located above the second LED chip, and the second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die into a first Six wavelengths of light. In addition, the LED package structure may further comprise an encapsulation material. The encapsulating material covers the first phosphor powder region and the second phosphor powder region at the same time, and the phosphor powder of the first phosphor powder region is different from the second phosphor powder region. Fluorescent powder. Thereby, the LED package structure can simultaneously emit light of different wavelengths. In addition, according to the LED package structure of the present invention, in order to increase the light collecting efficiency, a lens may be disposed on the packaging material, and a reflective layer may also be disposed on the first recess.
因此，本发明的发光二极管封装结构通过在所述第一发光二极管晶粒以 及所述第二发光二极管晶粒间设置所述阻隔部以达到整合数个发光二极管 晶粒在同一封装区域中，进而缩减封装区域并提供可同时发射不同波长光线 的能力。 附图说明  Therefore, the LED package structure of the present invention is configured to integrate the plurality of LED dies in the same package region by disposing the blocking portion between the first LED die and the second LED die. Reduces package area and provides the ability to simultaneously emit light of different wavelengths. DRAWINGS
为了让本发明的上述和其它目的、特征和优点能更明显易懂， 下面将结 合附图对本发明的较佳实施例详细说明：  The above and other objects, features and advantages of the present invention will become more apparent from
图 1A是根据本发明的一较佳实施例的发光二极管封装结构的俯视图； 图 1B是沿图一 A中 X-X线的剖面图；  1A is a plan view of a light emitting diode package structure according to a preferred embodiment of the present invention; and FIG. 1B is a cross-sectional view taken along line X-X of FIG.
图 1C是一实施例的发光二极管封装结构的剖面图；  1C is a cross-sectional view showing an LED package structure of an embodiment;
图 1D是一实施例的发光二极管封装结构的剖面图； 以及  1D is a cross-sectional view of an LED package structure of an embodiment;
图 2是另一较佳实施例的发光二极管封装结构的剖面图。 发明内容  2 is a cross-sectional view showing a light emitting diode package structure of another preferred embodiment. Summary of the invention
请参阅图 1A及图 1B， 图 1A是根据本发明的一较佳实施例的发光二极 管封装结构 1的俯视图。 图 1B是沿图 1A中 X-X线的剖面图。  1A and 1B, FIG. 1A is a top plan view of a light emitting diode package structure 1 in accordance with a preferred embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line X-X of Fig. 1A.
本发明的发光二极管封装结构 1包含一载台 12、 一基板 14、 一第一发 光二极管晶粒 16以及一第二发光二极管晶粒 18。所述载台 12包含一阻隔部 122、 一顶表面 124和一底表面 126， 所述载台 12在所述顶表面 124上形成 一第一凹陷部 128，所述载台 12在所述底表面 126上形成一第二凹陷部 130， 所述第一凹陷部 128与所述第二凹陷部 130相连接。 所述基板 14嵌入所述 第二凹陷部 130。所述第一发光二极管晶粒 16以及所述第二发光二极管晶粒 18均设置在所述基板 14上， 并且被所述阻隔部 122所分隔。 所述载台 12 可为一低温共烧陶瓷板、一印刷电路板、一金属核心电路板或其它可与所述 基板 14衔接的材料。所述基板 14可为硅、 金属、 低温共烧陶瓷或其它可承 载发光二极管晶粒的材料。 所述基板 14与所述第二凹陷部 130的间可填充 一黏胶， 以增加所述基板 14与所述第二凹陷 130的间的附着力。 所述第一 发光二极管晶粒 16或所述第二发光二极管晶粒 18是一半导体发光二极管或 一半导体激光。 The LED package structure 1 of the present invention comprises a stage 12, a substrate 14, a first LED die 16 and a second LED die 18. The stage 12 includes a blocking portion 122, a top surface 124 and a bottom surface 126. The stage 12 defines a first recess 128 on the top surface 124. The stage 12 is at the bottom. A second recess 130 is formed on the surface 126. The first recessed portion 128 is connected to the second recessed portion 130. The substrate 14 is embedded in the second recess 130. The first LED die 16 and the second LED die 18 are disposed on the substrate 14 and are separated by the blocking portion 122. The stage 12 can be a low temperature co-fired ceramic plate, a printed circuit board, a metal core circuit board or other material that can interface with the substrate 14. The substrate 14 can be silicon, metal, low temperature co-fired ceramic or other material that can carry light emitting diode dies. An adhesive may be filled between the substrate 14 and the second recess 130 to increase the adhesion between the substrate 14 and the second recess 130. The first LED die 16 or the second LED die 18 is a semiconductor light emitting diode or a semiconductor laser.
如图 1B所示， 所述第一凹陷部 128与所述第二凹陷部 130相连接的直 径小于所述第二凹陷部 130与所述第一凹陷部 128相连接的直径，使得所述 第二凹陷部 130具有一顶部 1302。所述基板 14与所述顶部 1302连接。所述 顶部 1302具有卡合所述基板 14的功能， 也可增加所述基板 14与所述第二 凹陷部 130附着面积， 亦即增加所述基板 14与所述第二凹陷 130的间的附 着力。  As shown in FIG. 1B, the diameter of the first recessed portion 128 connected to the second recessed portion 130 is smaller than the diameter of the second recessed portion 130 connected to the first recessed portion 128, so that the first recessed portion The second recess 130 has a top portion 1302. The substrate 14 is coupled to the top portion 1302. The top portion 1302 has the function of engaging the substrate 14 , and may also increase the adhesion area between the substrate 14 and the second recess portion 130 , that is, increase the attachment between the substrate 14 and the second recess 130 . Focus on.
请参阅图 1C， 图 1C是一实施例的发光二极管封装结构 3的剖面图。与 所述较佳实施例比较，所述发光二极管封装结构 3的所述第一发光二极管晶 粒 16以及所述第二发光二极管晶粒 18直接打线至所述基板 14上。 所述载 台 12具有一电路 132(以虚线表示)并在所述顶部 1302上形成有数个电路接 点 (未示出)。 通过将所述基板 14嵌入所述第二凹陷部 130并紧抵所述顶部 1302, 所述该等电路接点与所述基板 14电连接。  Referring to FIG. 1C, FIG. 1C is a cross-sectional view of an LED package structure 3 of an embodiment. In comparison with the preferred embodiment, the first LED pellets 16 and the second LED die 18 of the LED package structure 3 are directly wired to the substrate 14. The stage 12 has a circuit 132 (shown in phantom) and a plurality of circuit contacts (not shown) are formed on the top 1302. The circuit contacts are electrically connected to the substrate 14 by embedding the substrate 14 in the second recess 130 and abutting the top portion 1302.
根据所述较佳实施例， 所述第一发光二极管晶粒 16可发射一第一波长 光线， 所述第二发光二极管晶粒 18可发射一第二波长光线。 所述第一波长 光线异于所述第二波长光线。 因此， 所述发光二极管封装结构 1可发射不同 颜色的光线。 请参阅图 1B， 所述发光二极管封装结构 1进一步包含一封装 材料 20。 所述封装材料 20可包含一萤光粉并同时覆盖所述第一发光二极管 晶粒 16、 所述第二发光二极管晶粒 18以及所述阻隔部 122。 含所述萤光粉 的所述封装材料 20可转换由所述第一发光二极管晶粒 16以及所述第二发光 二极管晶粒 18发射的光线。 According to the preferred embodiment, the first LED die 16 can emit a first wavelength. The second LED die 18 can emit a second wavelength of light. The first wavelength of light is different from the second wavelength of light. Therefore, the LED package structure 1 can emit light of different colors. Referring to FIG. 1B , the LED package structure 1 further includes an encapsulation material 20 . The encapsulating material 20 may include a phosphor powder and cover the first LED die 16 , the second LED die 18 , and the blocking portion 122 . The encapsulating material 20 containing the phosphor may convert light emitted by the first LED die 16 and the second LED die 18.
请参阅图 1D， 图 1D是一实施例的发光二极管封装结构 5的剖面图。与 所述较佳实施例比较，所述发光二极管封装结构 5进一步包含一透镜 22。所 述透镜 22设置在所述封装材料 20上。并且， 所述发光二极管封装结构 5进 一步包含一反射层 24。 所述反射层 24位于所述第一凹陷部 128上。 因此， 所述发光二极管封装结构 5可增加集光效率。 补充说明， 所述透镜 22不以 与所述封装材料 20贴合为必要。  Referring to FIG. 1D, FIG. 1D is a cross-sectional view of an LED package structure 5 of an embodiment. The LED package structure 5 further includes a lens 22 as compared to the preferred embodiment. The lens 22 is disposed on the encapsulating material 20. Moreover, the LED package structure 5 further includes a reflective layer 24. The reflective layer 24 is located on the first recess 128. Therefore, the light emitting diode package structure 5 can increase the light collecting efficiency. In addition, it is necessary that the lens 22 is not attached to the encapsulating material 20.
请参阅图 2，图 2是另一较佳实施例的发光二极管封装结构 7的剖面图。 与所述的较佳实施例的发光二极管封装结构 1相比，所述发光二极管封装结 构 7包含一第一萤光粉区域以及一第二萤光粉区域 (未示图)。 所述第一萤光 粉区域位于所述第一发光二极管晶粒 16之上。 所述第二萤光粉区域位于所 述第二发光二极管晶粒 18之上。 所述第一萤光粉区域用以将所述第一发光 二极管晶粒 16发射的一第三波长光线转换为一第四波长光线。 所述第二萤 光粉区域用以将所述第二发光二极管晶粒 18发射的一第五波长光线转换为 一第六波长光线。所述发光二极管封装结构 7可进一步包含一封装材料 20'。 所述封装材料 20'同时覆盖在所述第一萤光粉区域与所述第二萤光粉区域. 上， 且所述第一萤光粉区域的萤光粉不同于所述第二萤光粉区域的萤光粉。 因此， 纵使所述第一发光二极管晶粒 16发射的所述第三波长光线与所述第 二发光二极管晶粒 18发射的所述第五波长光线相同， 由于所述第一萤光粉 区域的萤光粉不同在所述第二萤光粉区域的萤光粉，所述发光二极管封装结 构 7可同时发射不同颜色的光线。 Please refer to FIG. 2. FIG. 2 is a cross-sectional view of a light emitting diode package structure 7 according to another preferred embodiment. Compared with the LED package structure 1 of the preferred embodiment, the LED package structure 7 includes a first phosphor region and a second phosphor region (not shown). The first phosphor region is located above the first LED die 16. The second phosphor region is located above the second LED die 18. The first phosphor region is configured to convert a third wavelength of light emitted by the first LED die 16 into a fourth wavelength of light. The second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die 18 into a sixth wavelength light. The LED package structure 7 can further include an encapsulation material 20'. The encapsulating material 20' covers both the first phosphor powder region and the second phosphor powder region. And the phosphor powder of the first phosphor region is different from the phosphor powder of the second phosphor region. Therefore, even if the third wavelength light emitted by the first LED die 16 is the same as the fifth wavelength light emitted by the second LED die 18, due to the first phosphor region The phosphor powder differs from the phosphor powder in the second phosphor powder region, and the light emitting diode package structure 7 can simultaneously emit light of different colors.
另外，根据所述发光二极管封装结构 7，所述封装材料 20'可独立覆盖所 述第一发光二极管晶粒 16以及所述第二发光二极管晶粒 18。 因此， 在一实 施例中， 所述第一萤光粉区域上的所述封装材料 20'可包含一萤光粉， 用以 再转换所述第四波长光线为一第七波长光线。 同样地， 所述第二萤光粉区域 上的所述封装材料 20'可包含一萤光粉， 用以再转换所述第六波长光线为一 第八波长光线。借此， 纵使所述第四波长光线与所述第六波长光线相同， 所 述发光二极管封装结构 7仍可通过整调所述封装材料 20'的萤光粉而同时发 射不同颜色的光线。  In addition, according to the LED package structure 7, the encapsulation material 20' can independently cover the first LED die 16 and the second LED die 18. Therefore, in an embodiment, the encapsulating material 20' on the first phosphor region may include a phosphor for converting the fourth wavelength light into a seventh wavelength light. Similarly, the encapsulating material 20' on the second phosphor region may include a phosphor for reconverting the sixth wavelength light into an eighth wavelength light. Thereby, even if the fourth wavelength light is the same as the sixth wavelength light, the LED package structure 7 can simultaneously emit different colors of light by adjusting the phosphor powder of the encapsulation material 20'.
补充说明， 所述发光二极管封装结构 7的所述封装材料 20'并未覆盖所 述阻隔部 122，因此所述第一发光二极管晶粒 16发射的光线与所述第二发光 二极管晶粒 18发射的光线互不干涉。 借此， 所述发光二极管封装结构 7可 同时发射鲜明的且不同颜色的光线。相反的， 所述发光二极管封装结构 1的 所述封装材料 20尚覆盖所述阻隔部 122， 因此所述第一发光二极管晶粒 16 发射的光线与所述第二发光二极管晶粒 18发射的光线有部分混合， 进而产 生较柔和的效果。借此， 所述发光二极管封装结构 1可发射较柔和的且不同 颜色的光线。另外， 本发明的发光二极管封装结构当然可发射单一颜色的光 线， 不再重复说明。 综上所述，本发明的发光二极管封装结构通过在所述第一发光二极管晶 粒以及所述第二发光二极管晶粒间设置所述阻隔部以达到整合数个发光二 极管晶粒在同一封装区域中，进而缩减封装区域并同时提供可同时发射不同 波长光线的能力。 In addition, the encapsulating material 20 ′ of the LED package structure 7 does not cover the blocking portion 122 , so the light emitted by the first LED die 16 and the second LED die 18 are emitted. The light does not interfere with each other. Thereby, the LED package structure 7 can simultaneously emit bright and different colors of light. In contrast, the encapsulation material 20 of the LED package structure 1 still covers the blocking portion 122, so the light emitted by the first LED die 16 and the light emitted by the second LED die 18 There is a partial blend, which in turn produces a softer effect. Thereby, the LED package structure 1 can emit light of a softer and different color. In addition, the light emitting diode package structure of the present invention can of course emit light of a single color, and the description will not be repeated. In summary, the LED package structure of the present invention is configured to integrate the plurality of LED dies in the same package region by disposing the blocking portion between the first LED die and the second LED die. Medium, thereby reducing the package area while providing the ability to simultaneously emit light of different wavelengths.
以上已对本发明的较佳实施例进行了具体说明，但本发明并不限于所述 实施例，熟悉本领域的技术人员在不违背本发明精神的前提下还可作出种种 的等同的变型或替换，这些等同的变型或替换均包含在本申请权利要求所限 定的范围内。  The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the embodiments, and various equivalent modifications or substitutions can be made by those skilled in the art without departing from the spirit of the invention. Such equivalent modifications or alternatives are intended to be included within the scope of the claims.

Claims

权利要求 、 一种发光二极管封装结构， 其特征在于， 包含： The present invention provides an LED package structure, comprising:
一载台， 所述载台包含一阻隔部、 一顶表面和一底表面， 所逑载 台在所述顶表面上形成一第一凹陷部， 所述载台在所述底表面 上形成一第二凹陷部， 所述第一凹陷部与所述第二凹陷部相连 接；  a stage comprising a blocking portion, a top surface and a bottom surface, wherein the loading platform forms a first recess on the top surface, and the stage forms a bottom surface on the bottom surface a second recessed portion, wherein the first recessed portion is connected to the second recessed portion;
一基板， 所述基板嵌入所述第二凹陷部；  a substrate, the substrate is embedded in the second recess;
一第一发光二极管晶粒， 设置在所述基板上； 以及  a first LED die disposed on the substrate;
一第二发光二极管晶粒， 设置在所述基板上； '  a second LED die disposed on the substrate;
其中， 所述第一发光二极管晶粒与所述第二发光二极管晶粒被所述阻 隔部所分隔。  The first LED die and the second LED die are separated by the blocking portion.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 所述载台是一 低温共烧陶瓷板、 一印刷电路板或一金属核心电路板。 The LED package structure according to claim 1, wherein: the stage is a low temperature co-fired ceramic plate, a printed circuit board or a metal core circuit board.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 一黏胶填充在 所述基板与所述第二凹陷部之间。 The LED package structure according to claim 1, wherein: an adhesive is filled between the substrate and the second recess.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 所述第一凹陷 部的直径小于所述第二凹陷部的直径， 致使所述第二凹陷部具有一顶 部， 所述基板与所述顶部连接。 The light emitting diode package structure according to claim 1, wherein: the diameter of the first recessed portion is smaller than the diameter of the second recessed portion, so that the second recessed portion has a top portion, the substrate and the substrate The top is connected.
、 如权利要求 4所述的发光二极管封装结构， 其特 ¾E在于： 所述基板与所 述顶部电连接。 The LED package structure of claim 4, wherein the substrate is electrically connected to the top.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 所述第一发光 二极管晶粒可发射一第一波长光线， 所述第二发光二极管晶粒可发射 一第二波长光线， 所述第一波长光线异于所述第二波长光线。 The LED package structure of claim 1 , wherein: the first LED die emits a first wavelength of light, and the second LED die emits a second wavelength of light. The first wavelength of light is different from the second wavelength of light.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 进一步包含一 第一萤光粉区域位于所述第一发光二极管晶粒之上， 所述第一萤光粉 区域用以将所述第一发光二极管晶粒发射的一第三波长光线转换为一 第四波长光线。 The LED package structure of claim 1 further comprising: a first phosphor region located above said first LED die, said first phosphor region being used to A third wavelength light emitted by the first LED die is converted into a fourth wavelength light.
、 如权利要求 7所述的发光二极管封装结构， 其特征在于： 进一步包含一 第二萤光粉区域位于所述第二发光二极管晶粒之上， 所述第二萤光粉 区域用以将所述第二发光二极管晶粒发射的一第五波长光线转换为一 第六波长光线。 The LED package structure according to claim 7, further comprising: a second phosphor region is disposed on the second LED chip, and the second phosphor region is configured to convert a fifth wavelength light emitted by the second LED die into a sixth wavelength Light.
如权利要求 8所述的发光二极管封装结构， 其特征在于： 进一步包含一 封装材料， 所述封装材料同时覆盖在所述第一萤光粉区域与所述第二 萤光粉区域上， 且所述第一萤光粉区域的萤光粉不同于所述第二萤光 粉区域的萤光粉。  The LED package structure of claim 8 further comprising: a package material, wherein the package material covers both the first phosphor region and the second phosphor region, and The phosphor of the first phosphor region is different from the phosphor of the second phosphor region.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 进一步包含一 封装材料， 所述封装材料同时覆盖所述第一发光二极管晶粒、 .所述第 二发光二极管晶粒以及所述阻隔部。 The LED package structure of claim 1 further comprising: an encapsulation material, the encapsulation material simultaneously covering the first LED die, the second LED die, and the Barrier.
、 如权利要求 10项所述的发光二极管封装结构， 其特征在于： 所述封装 材料包含一萤光粉。 The LED package structure of claim 10, wherein: the encapsulating material comprises a phosphor.
、 如权利要求 11所述的发光二极管封装结构， 其特征在于： 进一步包含 一透镜， 所述透镜设置在所述封装材料上。 . The LED package structure of claim 11, further comprising: a lens disposed on the encapsulation material. .
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 进一步包含一 反射层， 所述反射层位于所述第一凹陷部上。 The LED package structure according to claim 1, further comprising: a reflective layer, wherein the reflective layer is located on the first recess.
、 如权利要求 1所述的发光二极管封装结构，其特征在于：所述基板为硅、 金属或低温共烧陶瓷。 The LED package structure according to claim 1, wherein the substrate is silicon, metal or low temperature co-fired ceramic.
、 如权利要求 1所述的发光二极管封装结构， 其特征在于： 所述第一发光 二极管晶粒是一半导体发光二极管或一半导体激光。 The LED package structure of claim 1, wherein: the first LED die is a semiconductor light emitting diode or a semiconductor laser.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011076020A1 (en) * 2009-12-21 2011-06-30 Chen Chiuhuo Non-dripping suck-back nozzle

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1447984A (en) * 2000-08-24 2003-10-08 奥斯兰姆奥普托半导体有限责任公司 Component comprising large number of light-emitting-diode chips
US20040173810A1 (en) * 2003-03-03 2004-09-09 Ming-Der Lin Light emitting diode package structure
CN1832167A (en) * 2005-03-07 2006-09-13 西铁城电子股份有限公司 Light emitting device and illumination apparatus using said light emitting device
CN1874014A (en) * 2005-05-31 2006-12-06 新灯源科技有限公司 Semiconductor luminous element packing structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1447984A (en) * 2000-08-24 2003-10-08 奥斯兰姆奥普托半导体有限责任公司 Component comprising large number of light-emitting-diode chips
US20040173810A1 (en) * 2003-03-03 2004-09-09 Ming-Der Lin Light emitting diode package structure
CN1832167A (en) * 2005-03-07 2006-09-13 西铁城电子股份有限公司 Light emitting device and illumination apparatus using said light emitting device
CN1874014A (en) * 2005-05-31 2006-12-06 新灯源科技有限公司 Semiconductor luminous element packing structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011076020A1 (en) * 2009-12-21 2011-06-30 Chen Chiuhuo Non-dripping suck-back nozzle

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