WO2008152956A1 - 光硬化型粘接着剤組成物 - Google Patents

光硬化型粘接着剤組成物 Download PDF

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Publication number
WO2008152956A1
WO2008152956A1 PCT/JP2008/060273 JP2008060273W WO2008152956A1 WO 2008152956 A1 WO2008152956 A1 WO 2008152956A1 JP 2008060273 W JP2008060273 W JP 2008060273W WO 2008152956 A1 WO2008152956 A1 WO 2008152956A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
adhesive composition
photocurable pressure
light
irradiation
Prior art date
Application number
PCT/JP2008/060273
Other languages
English (en)
French (fr)
Inventor
Hiroji Fukui
Original Assignee
Sekisui Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co., Ltd. filed Critical Sekisui Chemical Co., Ltd.
Priority to CN2008800202504A priority Critical patent/CN101679829B/zh
Priority to JP2008527642A priority patent/JP5339907B2/ja
Priority to US12/663,151 priority patent/US8217096B2/en
Priority to DE112008001404T priority patent/DE112008001404T5/de
Priority to KR1020097025925A priority patent/KR101157720B1/ko
Publication of WO2008152956A1 publication Critical patent/WO2008152956A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　光が照射される前には充分な粘着力を有し、光が照射された後には可使時間を充分に確保でき、かつ室温での硬化完了時間が短く、加えて、接着が困難な被着体に対する接着力が高く、かつ耐久性に優れた硬化物を与える光硬化型粘接着剤組成物を提供する。 　塩基の作用により架橋する架橋性化合物（Ａ）と、光の照射により活性化し、塩基を発生する光塩基発生剤（Ｂ）と、粘着性付与成分（Ｃ）とを含む光硬化型粘接着剤組成物。
PCT/JP2008/060273 2007-06-14 2008-06-04 光硬化型粘接着剤組成物 WO2008152956A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800202504A CN101679829B (zh) 2007-06-14 2008-06-04 光固化型粘合剂组合物
JP2008527642A JP5339907B2 (ja) 2007-06-14 2008-06-04 光硬化型粘接着剤組成物
US12/663,151 US8217096B2 (en) 2007-06-14 2008-06-04 Photocurable pressure-sensitive adhesive composition
DE112008001404T DE112008001404T5 (de) 2007-06-14 2008-06-04 Photohärtbare Haftklebstoffzusammensetzung
KR1020097025925A KR101157720B1 (ko) 2007-06-14 2008-06-04 광 경화형 점접착제 조성물

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-157826 2007-06-14
JP2007157826 2007-06-14
JP2008126162 2008-05-13
JP2008-126162 2008-05-13

Publications (1)

Publication Number Publication Date
WO2008152956A1 true WO2008152956A1 (ja) 2008-12-18

Family

ID=40129562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060273 WO2008152956A1 (ja) 2007-06-14 2008-06-04 光硬化型粘接着剤組成物

Country Status (6)

Country Link
US (1) US8217096B2 (ja)
JP (1) JP5339907B2 (ja)
KR (1) KR101157720B1 (ja)
CN (1) CN101679829B (ja)
DE (1) DE112008001404T5 (ja)
WO (1) WO2008152956A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011057939A (ja) * 2009-09-14 2011-03-24 Sekisui Chem Co Ltd 後硬化テープ及び接合部材の接合方法
WO2011118488A1 (ja) * 2010-03-24 2011-09-29 積水化学工業株式会社 接着剤組成物及び接着テープ
WO2020003041A2 (en) 2018-06-27 2020-01-02 3M Innovative Properties Company Uv-curable composition and adhesive film, adhesive tape and bonding member containing the same
JP2020152829A (ja) * 2019-03-20 2020-09-24 エルジー・ケム・リミテッド 接着剤組成物、及びせん断接着力と剥離強度の比の値を増加させる方法

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US8871317B2 (en) 2010-09-09 2014-10-28 Teknor Apex Company Curable adhesive system, method of assembly of distinct components therewith
CN101967343A (zh) * 2010-10-22 2011-02-09 广州市博兴化工科技有限公司 一种光固化色漆
DE102011053865A1 (de) 2011-09-22 2013-03-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Hydrolysierbare und polymerisierbare Silane mit einstellbarer räumlicher Verteilung der funktionellen Gruppen sowie deren Verwendung
CN102634286B (zh) * 2012-05-17 2013-08-14 深圳市飞世尔实业有限公司 一种光热双重固化型异方性导电膜的制备方法
WO2015022825A1 (ja) * 2013-08-12 2015-02-19 日本合成化学工業株式会社 接着剤組成物、偏光板用接着剤組成物、偏光板用接着剤、およびそれを用いてなる偏光板
JP6409784B2 (ja) * 2013-12-13 2018-10-24 セメダイン株式会社 接着性を有する光硬化性組成物
WO2016063978A1 (ja) * 2014-10-24 2016-04-28 セメダイン株式会社 光硬化性組成物
CN104592923B (zh) * 2015-01-07 2016-05-11 烟台信友新材料股份有限公司 一种紫外光引发的可延迟固化的单组份环氧胶黏剂及制备方法
US10815404B2 (en) * 2015-08-18 2020-10-27 3M Innovative Properties Company Impact-resistant polyester pressure-sensitive adhesive
JP6890118B2 (ja) 2015-08-18 2021-06-18 スリーエム イノベイティブ プロパティズ カンパニー ポリエステル組成物
WO2017065188A1 (ja) * 2015-10-13 2017-04-20 リンテック株式会社 粘着シート
WO2018052007A1 (ja) * 2016-09-16 2018-03-22 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
EP3549964A4 (en) * 2016-11-30 2020-09-02 Hitachi Chemical Company, Ltd. TWO-PART CURABLE URETHANE COMPOSITION
CN107880833A (zh) * 2017-12-05 2018-04-06 烟台德邦科技有限公司 一种uv热双固化环氧胶粘剂及其制备方法
CN110171131A (zh) * 2018-06-29 2019-08-27 浙江大学 一种用于光控3d打印的生物材料
EP3747925A1 (en) * 2019-06-07 2020-12-09 Henkel AG & Co. KGaA Radiation-curable composition by anionic polymerization
KR102426261B1 (ko) * 2019-09-26 2022-07-29 주식회사 엘지화학 다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프
CN114874730B (zh) * 2022-05-07 2024-01-09 浙江海泰新材料有限公司 一种阻燃uv固化丙烯酸酯压敏胶
CN114854335B (zh) * 2022-05-07 2024-01-09 浙江海泰新材料有限公司 一种uv光固化丙烯酸酯组合物及其应用
CN115772379B (zh) * 2022-12-29 2024-08-09 韦尔通科技股份有限公司 一种uv延迟固化双组份聚氨酯胶黏剂及其制备方法
CN115806795B (zh) * 2022-12-29 2023-08-29 韦尔通科技股份有限公司 一种初始粘接强度高且游离异氰酸酯含量低的uv延迟固化反应型聚氨酯热熔胶及制备方法
CN116004173A (zh) * 2022-12-29 2023-04-25 韦尔通科技股份有限公司 一种高初始粘接强度的uv延迟固化反应型聚氨酯热熔胶及其制备方法和应用

Citations (3)

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JP2005536620A (ja) * 2002-08-20 2005-12-02 テサ・アクチエンゲゼルシヤフト 紫外線で開始される熱架橋結合されたアクリレート感圧接着剤物質
JP2006282657A (ja) * 2005-03-11 2006-10-19 Sekisui Chem Co Ltd 塩基増殖剤及び塩基反応性硬化性組成物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011057939A (ja) * 2009-09-14 2011-03-24 Sekisui Chem Co Ltd 後硬化テープ及び接合部材の接合方法
WO2011118488A1 (ja) * 2010-03-24 2011-09-29 積水化学工業株式会社 接着剤組成物及び接着テープ
JPWO2011118488A1 (ja) * 2010-03-24 2013-07-04 積水化学工業株式会社 接着剤組成物及び接着テープ
WO2020003041A2 (en) 2018-06-27 2020-01-02 3M Innovative Properties Company Uv-curable composition and adhesive film, adhesive tape and bonding member containing the same
US11479621B2 (en) 2018-06-27 2022-10-25 3M Innovative Properties Company UV-curable composition and adhesive film, adhesive tape and bonding member containing the same
JP2020152829A (ja) * 2019-03-20 2020-09-24 エルジー・ケム・リミテッド 接着剤組成物、及びせん断接着力と剥離強度の比の値を増加させる方法
JP7276821B2 (ja) 2019-03-20 2023-05-18 エルジー・ケム・リミテッド 接着剤組成物、及びせん断接着力と剥離強度の比の値を増加させる方法

Also Published As

Publication number Publication date
JPWO2008152956A1 (ja) 2010-08-26
KR101157720B1 (ko) 2012-06-20
CN101679829B (zh) 2013-10-30
JP5339907B2 (ja) 2013-11-13
DE112008001404T5 (de) 2010-04-22
US8217096B2 (en) 2012-07-10
US20100184880A1 (en) 2010-07-22
CN101679829A (zh) 2010-03-24
KR20100018556A (ko) 2010-02-17

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