WO2008146602A1 - Radiation detector, method for manufacturing radiation detector, and method for producing supporting substrate - Google Patents

Radiation detector, method for manufacturing radiation detector, and method for producing supporting substrate Download PDF

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Publication number
WO2008146602A1
WO2008146602A1 PCT/JP2008/058834 JP2008058834W WO2008146602A1 WO 2008146602 A1 WO2008146602 A1 WO 2008146602A1 JP 2008058834 W JP2008058834 W JP 2008058834W WO 2008146602 A1 WO2008146602 A1 WO 2008146602A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiation detector
supporting substrate
organic semiconductor
transparent electrodes
radiation
Prior art date
Application number
PCT/JP2008/058834
Other languages
French (fr)
Japanese (ja)
Inventor
Satoshi Masuda
Tomoo Izumi
Original Assignee
Konica Minolta Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Holdings, Inc. filed Critical Konica Minolta Holdings, Inc.
Priority to US12/600,668 priority Critical patent/US20100163737A1/en
Priority to JP2009516244A priority patent/JP4894921B2/en
Publication of WO2008146602A1 publication Critical patent/WO2008146602A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14632—Wafer-level processed structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1464—Back illuminated imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/32—Transforming X-rays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/30—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/211—Fullerenes, e.g. C60
    • H10K85/215—Fullerenes, e.g. C60 comprising substituents, e.g. PCBM

Abstract

Disclosed is a radiation detector characterized by comprising a scintillator layer formed on one side of a supporting substrate and composed of a phosphor converting radiation into visible light, a plurality of transparent electrodes formed in a matrix on the other side of the supporting substrate, a photoelectric conversion layer formed on the transparent electrodes and containing an organic semiconductor material, and an upper electrode formed on the organic semiconductor layer. This radiation detector is further characterized in that collector elements for focusing visible light emitted from the scintillator layer irradiated with radiation on the organic semiconductor layer are embedded in a matrix in the supporting substrate at positions facing the transparent electrodes.
PCT/JP2008/058834 2007-05-24 2008-05-14 Radiation detector, method for manufacturing radiation detector, and method for producing supporting substrate WO2008146602A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/600,668 US20100163737A1 (en) 2007-05-24 2008-05-14 Radiation detector, method of manufacturing radiation detector, and method of manufacturing supporting substrate
JP2009516244A JP4894921B2 (en) 2007-05-24 2008-05-14 Radiation detector, method for manufacturing radiation detector, and method for manufacturing support substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-137602 2007-05-24
JP2007137602 2007-05-24

Publications (1)

Publication Number Publication Date
WO2008146602A1 true WO2008146602A1 (en) 2008-12-04

Family

ID=40074869

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058834 WO2008146602A1 (en) 2007-05-24 2008-05-14 Radiation detector, method for manufacturing radiation detector, and method for producing supporting substrate

Country Status (3)

Country Link
US (1) US20100163737A1 (en)
JP (1) JP4894921B2 (en)
WO (1) WO2008146602A1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038912A (en) * 2009-08-12 2011-02-24 Konica Minolta Medical & Graphic Inc Radiation image detector
JP2011172909A (en) * 2010-01-29 2011-09-08 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for radiographic image capturing apparatus
JP2011172904A (en) * 2010-01-29 2011-09-08 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for radiographic image capturing apparatus
JP2011172910A (en) * 2010-01-29 2011-09-08 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for radiographic image capturing apparatus
JP2011183146A (en) * 2010-02-15 2011-09-22 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for the apparatus
JP2011194216A (en) * 2010-02-23 2011-10-06 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method of radiographic image capturing apparatus
WO2011136244A1 (en) * 2010-04-30 2011-11-03 富士フイルム株式会社 Radiation imaging device
JP2011221000A (en) * 2010-03-26 2011-11-04 Fujifilm Corp Managing method for radiation detector, radiographic imaging apparatus and radiographic imaging system
JP2012030049A (en) * 2010-06-30 2012-02-16 Fujifilm Corp Radiation image photographing system and power supply method of radiographic apparatus
KR20140045504A (en) * 2011-06-22 2014-04-16 지멘스 악티엔게젤샤프트 Weak light detection using an organic, photosensitive component
US8798236B2 (en) 2010-01-29 2014-08-05 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
US8798235B2 (en) 2010-01-29 2014-08-05 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
US8929510B2 (en) 2010-06-30 2015-01-06 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
US9168016B2 (en) 2010-01-29 2015-10-27 Fujifilm Corporation Radiographic image capturing apparatus, radiographic image capturing system, and method of supplying electric power to radiographic image capturing apparatus
JP2016524152A (en) * 2013-06-27 2016-08-12 ヴァリアン メディカル システムズ インコーポレイテッド X-ray imager with a CMOS sensor embedded in a TFT flat panel

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TWI424574B (en) * 2009-07-28 2014-01-21 Prime View Int Co Ltd Digital x ray detecting panel and method for manufacturing the same
DE102010043749A1 (en) * 2010-11-11 2012-05-16 Siemens Aktiengesellschaft Hybrid organic photodiode
JP2012141291A (en) * 2010-12-16 2012-07-26 Fujifilm Corp Radiation imaging device
JP5604323B2 (en) * 2011-01-31 2014-10-08 富士フイルム株式会社 Radiation image detection device
CN102790067B (en) * 2012-07-26 2014-12-10 北京京东方光电科技有限公司 Sensor and manufacturing method thereof
DE102015006839A1 (en) * 2015-06-02 2016-12-08 Karlsruher Institut für Technologie Optoelectronic structure for the detection of electromagnetic radiation
JP7102114B2 (en) * 2016-11-11 2022-07-19 キヤノン株式会社 Photoelectric conversion element, image sensor and image sensor
JP7449264B2 (en) * 2021-08-18 2024-03-13 株式会社東芝 radiation detector

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JP2004096079A (en) * 2002-07-11 2004-03-25 Sharp Corp Photoelectric converter, image reader, and manufacturing method of photoelectric converter
JP2004340737A (en) * 2003-05-15 2004-12-02 Toshiba Corp Radiation detector and its manufacturing method
JP2005032793A (en) * 2003-07-08 2005-02-03 Matsushita Electric Ind Co Ltd Organic photoelectric converter
JP2006080457A (en) * 2004-09-13 2006-03-23 Sony Corp Imaging device and its manufacturing method

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JPS61196570A (en) * 1985-02-25 1986-08-30 Hitachi Zosen Corp Amorphous silicon x-ray sensor
JPS61196572A (en) * 1985-02-25 1986-08-30 Hitachi Zosen Corp Amorphous silicon x-ray sensor
JPH0745140B2 (en) * 1988-06-07 1995-05-17 松下電器産業株式会社 Lens array manufacturing method
JP3685446B2 (en) * 1993-12-27 2005-08-17 キヤノン株式会社 Photoelectric conversion device
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6630675B2 (en) * 2000-07-26 2003-10-07 Siemens Medical Solutions Usa, Inc. X-ray scintillator compositions for X-ray imaging applications
DE10244178A1 (en) * 2002-09-23 2004-04-08 Siemens Ag X-ray detector used in computer tomography comprises a luminescent layer for producing electromagnetic radiation, an electrically conducting bottom electrode, a photodetector layer, and an electrically conducting top electrode
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2004096079A (en) * 2002-07-11 2004-03-25 Sharp Corp Photoelectric converter, image reader, and manufacturing method of photoelectric converter
JP2004340737A (en) * 2003-05-15 2004-12-02 Toshiba Corp Radiation detector and its manufacturing method
JP2005032793A (en) * 2003-07-08 2005-02-03 Matsushita Electric Ind Co Ltd Organic photoelectric converter
JP2006080457A (en) * 2004-09-13 2006-03-23 Sony Corp Imaging device and its manufacturing method

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011038912A (en) * 2009-08-12 2011-02-24 Konica Minolta Medical & Graphic Inc Radiation image detector
US9168016B2 (en) 2010-01-29 2015-10-27 Fujifilm Corporation Radiographic image capturing apparatus, radiographic image capturing system, and method of supplying electric power to radiographic image capturing apparatus
JP2011172909A (en) * 2010-01-29 2011-09-08 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for radiographic image capturing apparatus
JP2011172904A (en) * 2010-01-29 2011-09-08 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for radiographic image capturing apparatus
JP2011172910A (en) * 2010-01-29 2011-09-08 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for radiographic image capturing apparatus
US10201065B2 (en) 2010-01-29 2019-02-05 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
US8798236B2 (en) 2010-01-29 2014-08-05 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
US8798235B2 (en) 2010-01-29 2014-08-05 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
JP2011183146A (en) * 2010-02-15 2011-09-22 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method for the apparatus
JP2011194216A (en) * 2010-02-23 2011-10-06 Fujifilm Corp Radiographic image capturing apparatus, radiographic image capturing system, and power supply method of radiographic image capturing apparatus
JP2011221000A (en) * 2010-03-26 2011-11-04 Fujifilm Corp Managing method for radiation detector, radiographic imaging apparatus and radiographic imaging system
WO2011136244A1 (en) * 2010-04-30 2011-11-03 富士フイルム株式会社 Radiation imaging device
JP2012030049A (en) * 2010-06-30 2012-02-16 Fujifilm Corp Radiation image photographing system and power supply method of radiographic apparatus
US8929510B2 (en) 2010-06-30 2015-01-06 Fujifilm Corporation Radiographic image capturing apparatus and radiographic image capturing system
KR20140045504A (en) * 2011-06-22 2014-04-16 지멘스 악티엔게젤샤프트 Weak light detection using an organic, photosensitive component
KR102001694B1 (en) * 2011-06-22 2019-07-18 지멘스 악티엔게젤샤프트 Weak light detection using an organic, photosensitive component
JP2016524152A (en) * 2013-06-27 2016-08-12 ヴァリアン メディカル システムズ インコーポレイテッド X-ray imager with a CMOS sensor embedded in a TFT flat panel

Also Published As

Publication number Publication date
US20100163737A1 (en) 2010-07-01
JP4894921B2 (en) 2012-03-14
JPWO2008146602A1 (en) 2010-08-19

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