WO2008142916A1 - 測定システム、測定方法及びプログラム - Google Patents

測定システム、測定方法及びプログラム Download PDF

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Publication number
WO2008142916A1
WO2008142916A1 PCT/JP2008/056564 JP2008056564W WO2008142916A1 WO 2008142916 A1 WO2008142916 A1 WO 2008142916A1 JP 2008056564 W JP2008056564 W JP 2008056564W WO 2008142916 A1 WO2008142916 A1 WO 2008142916A1
Authority
WO
WIPO (PCT)
Prior art keywords
profile
section
prediction
measurement
tolerance
Prior art date
Application number
PCT/JP2008/056564
Other languages
English (en)
French (fr)
Inventor
Yuki Aritsuka
Morihisa Hoga
Original Assignee
Dai Nippon Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co., Ltd. filed Critical Dai Nippon Printing Co., Ltd.
Priority to US12/600,527 priority Critical patent/US8543352B2/en
Publication of WO2008142916A1 publication Critical patent/WO2008142916A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0055—Manufacturing logistics
    • B81C99/0065—Process control; Yield prediction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0147—Film patterning
    • B81C2201/015—Imprinting
    • B81C2201/0153—Imprinting techniques not provided for in B81C2201/0152
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0198—Manufacture or treatment of microstructural devices or systems in or on a substrate for making a masking layer

Abstract

　測定対象物（１０）の設計形状を規定する第１及び第２形状因子の公差を格納する外部記憶部（２６）と、測定対象物（１０）の第１形状因子の測定データを得る測定器（１４）と、第１形状因子の測定データと外部記憶部（２６）から読み出した第１形状因子の公差とを比較する比較部（３２）と、測定データから予測形状を構成して図形として成立するか検証する検証部（３４）と、検証部（３４）が構成した予測形状から第２形状因子の予測データを計算する計算部（３６）と、計算部（３６）が計算した予測データを外部記憶部（２６）から読み出した第２形状因子の公差と比較して測定形状を判定する判定部（３８）とを備える。
PCT/JP2008/056564 2007-05-22 2008-04-02 測定システム、測定方法及びプログラム WO2008142916A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/600,527 US8543352B2 (en) 2007-05-22 2008-04-02 System for measuring a shape, method for measuring a shape, and computer program product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007135633A JP5412713B2 (ja) 2007-05-22 2007-05-22 測定システム、測定方法及びプログラム
JP2007-135633 2007-05-22

Publications (1)

Publication Number Publication Date
WO2008142916A1 true WO2008142916A1 (ja) 2008-11-27

Family

ID=40031632

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056564 WO2008142916A1 (ja) 2007-05-22 2008-04-02 測定システム、測定方法及びプログラム

Country Status (3)

Country Link
US (1) US8543352B2 (ja)
JP (1) JP5412713B2 (ja)
WO (1) WO2008142916A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016043692A (ja) * 2014-08-19 2016-04-04 信越化学工業株式会社 インプリント・リソグラフィ用角形基板及びその製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2369615A4 (en) 2008-12-17 2012-06-06 Asahi Glass Co Ltd LOW EXPANSION GLASS SUBSTRATE FOR REFLECTIVE TYPE MASK AND TREATMENT METHOD THEREOF
JP6019685B2 (ja) * 2012-04-10 2016-11-02 大日本印刷株式会社 ナノインプリント方法及びナノインプリント装置
EP2836991A1 (en) * 2012-04-13 2015-02-18 Thomson Licensing Method to render global 6 dof motion effect with multiple local force-feedback
US11300407B2 (en) * 2015-08-07 2022-04-12 Spm Automation (Canada) Inc. Method of evaluating flatness of a two-dimensional surface area
JP2022165816A (ja) * 2021-04-20 2022-11-01 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031511A (ja) * 2000-07-14 2002-01-31 Minolta Co Ltd ３次元デジタイザ
WO2007037032A1 (ja) * 2005-09-27 2007-04-05 Tokyo Seimitsu Co., Ltd. 輪郭形状測定機、輪郭形状測定機の幾何基本形状算出方法及びそのためのプログラム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04133061A (ja) 1990-09-25 1992-05-07 Dainippon Printing Co Ltd ペリクル付フォトマスク検査方法
JPH0743173A (ja) * 1993-07-29 1995-02-10 Mitsutoyo Corp 測定データ照合装置
US6373573B1 (en) * 2000-03-13 2002-04-16 Lj Laboratories L.L.C. Apparatus for measuring optical characteristics of a substrate and pigments applied thereto
JP3439327B2 (ja) * 1997-07-03 2003-08-25 株式会社ミツトヨ 三次元測定機のデータ処理装置
JP3668381B2 (ja) * 1998-10-23 2005-07-06 株式会社ミツトヨ 測定データ評価システム
EP1539020A4 (en) * 2002-07-03 2005-12-21 Univ Connecticut ADVANCED THERMOPLASTICS FOR ORTHODONTICS
TW200500811A (en) * 2002-12-13 2005-01-01 Molecular Imprints Inc Magnification correction employing out-of-plane distortion of a substrate
WO2006134793A1 (ja) * 2005-06-14 2006-12-21 Brother Kogyo Kabushiki Kaisha 投影装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031511A (ja) * 2000-07-14 2002-01-31 Minolta Co Ltd ３次元デジタイザ
WO2007037032A1 (ja) * 2005-09-27 2007-04-05 Tokyo Seimitsu Co., Ltd. 輪郭形状測定機、輪郭形状測定機の幾何基本形状算出方法及びそのためのプログラム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016043692A (ja) * 2014-08-19 2016-04-04 信越化学工業株式会社 インプリント・リソグラフィ用角形基板及びその製造方法
US11904521B2 (en) 2014-08-19 2024-02-20 Shin-Etsu Chemical Co., Ltd. Rectangular substrate for imprint lithography and making method

Also Published As

Publication number Publication date
JP2008292196A (ja) 2008-12-04
US20100169042A1 (en) 2010-07-01
JP5412713B2 (ja) 2014-02-12
US8543352B2 (en) 2013-09-24

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