WO2008111247A1 - 感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板 - Google Patents

感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板 Download PDF

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Publication number
WO2008111247A1
WO2008111247A1 PCT/JP2007/067753 JP2007067753W WO2008111247A1 WO 2008111247 A1 WO2008111247 A1 WO 2008111247A1 JP 2007067753 W JP2007067753 W JP 2007067753W WO 2008111247 A1 WO2008111247 A1 WO 2008111247A1
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive
formation
print substrate
permanent pattern
photosensitive composition
Prior art date
Application number
PCT/JP2007/067753
Other languages
English (en)
French (fr)
Inventor
Masayuki Iwasaki
Hiroshi Kamikawa
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007062117A external-priority patent/JP4620700B2/ja
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Priority to US12/530,547 priority Critical patent/US20100112474A1/en
Publication of WO2008111247A1 publication Critical patent/WO2008111247A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Optical Filters (AREA)

Abstract

アルカリ可溶性感光性樹脂と、重合性化合物と、光重合開始剤、及び光開始剤系化合物のいずれかと、熱架橋性樹脂と、着色剤とを含み、 前記着色剤が、１分子中にハロゲン原子を５質量％～５０質量％含有し、かつ黄色を呈する顔料と、１分子中にハロゲン原子を含有せず、かつ青色を呈する顔料とを、１：１～１：４の混合比（質量比）で含有し、それらの顔料の配合によって緑色を呈し、全固形分中のハロゲン含有量が９００ｐｐｍ以下である感光性組成物。
PCT/JP2007/067753 2007-03-12 2007-09-12 感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板 WO2008111247A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/530,547 US20100112474A1 (en) 2007-03-12 2007-09-12 Photosensitive composition, photosensitive film, method for forming a permanent pattern, and printed board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007062117A JP4620700B2 (ja) 2006-03-17 2007-03-12 感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板
JP2007-062117 2007-03-12

Publications (1)

Publication Number Publication Date
WO2008111247A1 true WO2008111247A1 (ja) 2008-09-18

Family

ID=39759192

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/067753 WO2008111247A1 (ja) 2007-03-12 2007-09-12 感光性組成物、感光性フィルム、永久パターンの形成方法、及びプリント基板

Country Status (5)

Country Link
US (1) US20100112474A1 (ja)
KR (1) KR20100014419A (ja)
CN (1) CN101627338A (ja)
TW (1) TW200837500A (ja)
WO (1) WO2008111247A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013047818A (ja) * 2012-10-01 2013-03-07 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP2013047816A (ja) * 2012-10-01 2013-03-07 Taiyo Holdings Co Ltd プリント配線板用光硬化性樹脂組成物
JP2013047817A (ja) * 2012-10-01 2013-03-07 Taiyo Holdings Co Ltd ソルダーレジスト用光硬化性樹脂組成物

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5505066B2 (ja) * 2010-04-28 2014-05-28 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示素子の層間絶縁膜、保護膜及びスペーサーならびにそれらの形成方法
TWI550338B (zh) * 2010-08-30 2016-09-21 富士軟片股份有限公司 感光性樹脂組成物、肟基磺酸酯化合物、硬化膜之形成方法、硬化膜、有機ｅｌ顯示裝置、及液晶顯示裝置
EP2447773B1 (en) * 2010-11-02 2013-07-10 Fujifilm Corporation Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure
JP6123152B2 (ja) * 2010-12-08 2017-05-10 味の素株式会社 樹脂組成物
KR101477207B1 (ko) * 2012-08-28 2014-12-29 주식회사 케이씨씨 신뢰성이 우수한 경화성 수지 조성물
KR102172686B1 (ko) * 2014-03-20 2020-11-02 동우 화인켐 주식회사 착색 감광성 수지 조성물, 이를 포함하는 컬러필터 및 표시장치
KR101609234B1 (ko) * 2015-01-13 2016-04-05 동우 화인켐 주식회사 감광성 수지 조성물, 이로부터 형성된 광경화 패턴 및 이를 포함하는 화상 표시 장치
KR20160091646A (ko) * 2015-01-26 2016-08-03 동우 화인켐 주식회사 감광성 수지 조성물, 이로부터 형성된 광경화 패턴 및 이를 포함하는 화상 표시 장치
JP6846102B2 (ja) * 2015-07-14 2021-03-24 ローム・アンド・ハース電子材料株式会社 光感応性樹脂組成物
JP6527052B2 (ja) * 2015-08-28 2019-06-05 富士フイルム株式会社 転写フィルム、静電容量型入力装置の電極保護膜、積層体、積層体の製造方法および静電容量型入力装置
KR102031215B1 (ko) * 2016-01-14 2019-10-11 동우 화인켐 주식회사 감광성 수지 조성물, 이로 형성되는 광경화 패턴 및 이를 포함하는 화상 표시 장치
CN111279804B (zh) * 2017-12-20 2023-10-24 住友电气工业株式会社 制造印刷电路板和层压结构的方法
WO2020196393A1 (ja) * 2019-03-28 2020-10-01 富士フイルム株式会社 着色組成物、硬化膜、構造体、カラーフィルタおよび表示装置
JP7395009B2 (ja) * 2020-09-29 2023-12-08 富士フイルム株式会社 インクジェット用イエローインク、画像記録方法、及び画像記録物

Citations (6)

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JP2000232264A (ja) * 1998-12-09 2000-08-22 Goo Chemical Co Ltd フォトソルダーレジストインク
JP2000290564A (ja) * 1999-04-09 2000-10-17 Tamura Kaken Co Ltd レジストインキ組成物及びプリント配線板
WO2002048794A1 (fr) * 2000-12-13 2002-06-20 Goo Chemical Co., Ltd. Encre resistant au soudage
JP2006243543A (ja) * 2005-03-04 2006-09-14 Fuji Photo Film Co Ltd 永久パターン形成方法
WO2006129564A1 (ja) * 2005-06-03 2006-12-07 Fujifilm Corporation パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト

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US5489621A (en) * 1993-05-12 1996-02-06 Fuji Photo Film Co., Ltd. Process for forming colored partial picture element and light-shielding light-sensitive resin composition used therefor
EP0893737A3 (en) * 1997-07-24 1999-11-24 JSR Corporation Radiation sensitive composition
US6646022B2 (en) * 2000-07-05 2003-11-11 Mitsubishi Rayon Co., Ltd. Photocuring resin compositions, photocuring sheets and molded article using the same, and processes of production thereof
JP4322757B2 (ja) * 2004-09-06 2009-09-02 富士フイルム株式会社 パターン形成材料及びパターン形成方法
JP2007011321A (ja) * 2005-06-03 2007-01-18 Fujifilm Holdings Corp パターン形成材料、並びにパターン形成材料の製造方法及びパターン形成方法
CN101542392B (zh) * 2007-03-29 2013-08-14 太阳控股株式会社 光固化性树脂组合物、干膜、固化物以及印刷线路板

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
JP2000232264A (ja) * 1998-12-09 2000-08-22 Goo Chemical Co Ltd フォトソルダーレジストインク
JP2000290564A (ja) * 1999-04-09 2000-10-17 Tamura Kaken Co Ltd レジストインキ組成物及びプリント配線板
WO2002048794A1 (fr) * 2000-12-13 2002-06-20 Goo Chemical Co., Ltd. Encre resistant au soudage
JP2006243543A (ja) * 2005-03-04 2006-09-14 Fuji Photo Film Co Ltd 永久パターン形成方法
WO2006129564A1 (ja) * 2005-06-03 2006-12-07 Fujifilm Corporation パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007003807A (ja) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd 感光性樹脂組成物および該組成物を用いたソルダーレジスト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013047818A (ja) * 2012-10-01 2013-03-07 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP2013047816A (ja) * 2012-10-01 2013-03-07 Taiyo Holdings Co Ltd プリント配線板用光硬化性樹脂組成物
JP2013047817A (ja) * 2012-10-01 2013-03-07 Taiyo Holdings Co Ltd ソルダーレジスト用光硬化性樹脂組成物

Also Published As

Publication number Publication date
US20100112474A1 (en) 2010-05-06
CN101627338A (zh) 2010-01-13
TW200837500A (en) 2008-09-16
KR20100014419A (ko) 2010-02-10

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