WO2008024476A3 - Method and apparatus for semiconductor wafer alignment - Google Patents

Method and apparatus for semiconductor wafer alignment

Info

Publication number
WO2008024476A3
WO2008024476A3 PCT/US2007/018752 US2007018752W WO2008024476A3 WO 2008024476 A3 WO2008024476 A3 WO 2008024476A3 US 2007018752 W US2007018752 W US 2007018752W WO 2008024476 A3 WO2008024476 A3 WO 2008024476A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
wafer
platform
image
alignment
includes
Prior art date
Application number
PCT/US2007/018752
Other languages
French (fr)
Other versions
WO2008024476A2 (en )
Inventor
David Michael
James Clark
Gang Liu
Original Assignee
Cognex Corp
David Michael
James Clark
Gang Liu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras
    • G06T7/73Determining position or orientation of objects or cameras using feature-based methods

Abstract

The invention provides, in some aspects, a wafer alignment system comprising an image acquisition device, an illumination source, a rotatable wafer platform, and an image processor that includes functionality for mapping coordinates in an image of an article (such as a wafer) on the platform to a 'world' frame of reference at each of a plurality of angles of rotation of the platform.
PCT/US2007/018752 2006-08-23 2007-08-23 Method and apparatus for semiconductor wafer alignment WO2008024476A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11508551 US8162584B2 (en) 2006-08-23 2006-08-23 Method and apparatus for semiconductor wafer alignment
US11/508,551 2006-08-23

Publications (2)

Publication Number Publication Date
WO2008024476A2 true WO2008024476A2 (en) 2008-02-28
WO2008024476A3 true true WO2008024476A3 (en) 2008-11-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/018752 WO2008024476A3 (en) 2006-08-23 2007-08-23 Method and apparatus for semiconductor wafer alignment

Country Status (2)

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US (1) US8162584B2 (en)
WO (1) WO2008024476A3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8422127B2 (en) * 2005-03-17 2013-04-16 Hamamatsu Photonics K.K. Microscopic image capturing device
US8644591B2 (en) * 2011-12-08 2014-02-04 Metal Industries Research & Development Centre Alignment method for assembling substrates without fiducial mark

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