WO2008024461A2 - Systems and methods for operating and monitoring abatement systems - Google Patents
Systems and methods for operating and monitoring abatement systems Download PDFInfo
- Publication number
- WO2008024461A2 WO2008024461A2 PCT/US2007/018714 US2007018714W WO2008024461A2 WO 2008024461 A2 WO2008024461 A2 WO 2008024461A2 US 2007018714 W US2007018714 W US 2007018714W WO 2008024461 A2 WO2008024461 A2 WO 2008024461A2
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- WIPO (PCT)
- Prior art keywords
- abatement
- effluent
- systems
- abatement systems
- channels
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/30—Controlling by gas-analysis apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/202—Single element halogens
- B01D2257/2027—Fluorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/204—Inorganic halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/204—Inorganic halogen compounds
- B01D2257/2047—Hydrofluoric acid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/20—Halogens or halogen compounds
- B01D2257/206—Organic halogen compounds
- B01D2257/2066—Fluorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2258/00—Sources of waste gases
- B01D2258/02—Other waste gases
- B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
Definitions
- the present invention relates to semiconductor device manufacturing, and more specifically to methods and systems for abatement systems having back-up functionality.
- the gaseous effluents from the manufacturing of semiconductor materials, devices, products and memory articles involve a wide variety of chemical compounds used and produced in the process facility. These compounds include inorganic and organic compounds, breakdown products of photo-resist and other reagents, and a wide variety of other gases that must be removed from the waste gas before being vented from the process facility into the atmosphere.
- Semiconductor manufacturing processes utilize a variety of chemicals, many of which have extremely low human tolerance levels. During processing (e.g.
- PFCs perfluorocompounds
- PFCs perfluorocompounds
- the abatement system may convert gases produced by the processing of substrates and flat panel display/LCD to less environmentally harmful versions to be emitted to the environment.
- the abatement systems may be coupled to semiconductor manufacturing tools, and typically may abate the process gases from the tool as they are produced. While the abatement systems have a flow capacity capable of handling process gases from a tool, they may go down for various reasons including, for example, scheduled and unscheduled maintenance, etc. Accordingly a need exists for a system that allows the continued abatement of process gases from a tool when an abatement system coupled with the tool is down.
- a system for abating effluent from a process tool.
- the system comprises one or more process tools; one or more abatement systems; and an interface manifold adapted to establish effluent fluid communication between the one or more process tools and the one or more abatement systems, wherein the interface manifold is configured to selectively direct one or more effluents from between the one or more process tools to the one or more abatement systems in response to a control signal.
- an apparatus for abating effluent from a process tool.
- the apparatus comprises one or more first channels; one or more second channels; and a plurality of valves operatively coupled to the first and second channels, wherein the one or more first channels allow fluid communication from one or more process tools to one or more first abatement systems and the one or more second channels allow fluid communication from one or more process tools to one or more second abatement systems, and wherein at least one valve of the plurality of valves is operable to select between the one or more first and second channels to flow at least one effluent stream.
- a method for abating effluent from a process tool.
- the method includes the steps of (1) flowing effluent output by one or more process tools through an interface manifold to one or more abatement systems; (2) receiving an indicia representative of a status of a first abatement system of the one or more abatement systems, wherein the status indicates the first abatement system is unavailable to process effluent; and (3) directing effluent via the interface manifold to a second abatement system of the one or more abatement systems in response to receiving the indicia.
- FIG. 1 is a schematic diagram of a system for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention.
- FIG. 2 is a schematic diagram of a system for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention.
- FIG. 3 is a schematic diagram of an exemplary system for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention .
- FIG. 4 is a schematic diagram of an exemplary system having a back-up configuration for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention.
- FIG. 5 is a schematic diagram of an exemplary system having an application specific configuration for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention.
- FIG. 6 is a schematic diagram of an exemplary system having a load balancing configuration for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention.
- FIG. 7 is a schematic diagram of an exemplary system having a redundant configuration for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention.
- FIG. 8 is a flowchart illustrating an exemplary method for operating and monitoring one or more abatement systems in accordance with an embodiment of the present invention .
- the present invention provides systems and methods for controlling the flow of effluent streams from electronic device manufacturing tools to abatement systems.
- the invention enables automated re-direction of the effluent streams in the case of scheduled or unscheduled events that impact the system's ability to abate the effluent streams.
- the present invention is adapted to automatically redirect an effluent stream from the primary to the back-up abatement system in response to, for example, an alarm indicating that the primary abatement system is going offline.
- the present invention provides an interface manifold that may include a series of valves (e.g., electronically controlled valves) adapted to open, close, and/or switch channels between one or more electronic device processing tools and one or more abatement systems.
- the interface manifold may be coupled to and operated by a controller that receives information from the processing tools and abatement systems. For example, in response to information indicating a primary system has malfunctioned, the controller may open valves in channels between the processing tools and a back-up abatement system while concurrently closing valves in channels between the processing tools and the primary system.
- a system 100 is provided.
- the system may include at least one process tool 102 coupled to at least two abatement system 104 via an interface manifold 106, which allows fluid communication between the process tool 102 and the abatement system 104.
- the system may include at least two process tools 102 coupled to at least one abatement system 104 via the interface manifold 106.
- N process tools 102a, 102b, 102c and N abatement systems 104a, 104b, 104c are shown. Any number of process tools 102 and abatement systems 104 may be included ⁇ e.g., 1, 2, . . ., n) .
- Each process tool 102 may include one or more process chambers 108.
- the process tools 102a-c may include, for example, chemical vapor deposition chambers, physical vapor deposition chambers, chemical mechanical polishing chambers, etc.
- the processes that may be performed in the chambers include, for example, diffusion, etch PFC processes and epitaxy.
- the byproduct chemicals to be abated from these processes may include, for example, hydrides of antimony, arsenic, boron, germanium, nitrogen, phosphorous, silicon, selenium, silane, silane mixtures with phosphine, argon, hydrogen, organosilanes, halosilanes, halogens, organometallics and other organic compounds.
- halogens e.g., fluorine (F 2 ) and other fluorinated compounds
- F 2 fluorine
- PFCs perfluorinated compounds
- Examples of some of the most commonly used PFCs include CF 4 , C 2 F 6 , SF 6 , C 3 F 8 , C 4 H 8 , C 4 H 8 O, NF 3 , CHF 3 , CH 3 F, CH 2 F 2 .
- a channel 110 may extend from each chamber 108 to allow the flow of one or more effluents to exit the process tool 102a.
- process tool 102a may include a single chamber and a single corresponding channel, while process tool 102b may include two chambers and corresponding channels.
- the effluent may flow from the process tools 102 through the channels 110 and into the interface manifold 106.
- the interface manifold 106 may include one or more valves (not shown) that act as gates on the channels 110 to permit or prevent the flow of effluent into the interface manifold 106.
- the interface manifold 106 may also include one or more valves (FIG. 2) to selectively direct the effluents from the different channels 110 into the abatement systems 104.
- a controller 112 may selectively manipulate the operation of the valves in the interface manifold 106. Alternatively, or additionally, the controller 112 may selectively manipulate the operation of a plurality of pumps (not shown) , which aid in moving the effluent through the system 100.
- the controller 112 may be hardwired or wirelessly coupled to the interface manifold 106. In some embodiments, the controller 112 may be an integral part of and contained in the interface manifold 106 while in other embodiments, the controller 112 may be apart and separate from the interface manifold 106.
- the controller 112 may be coupled to and/or otherwise communicate with and/or control operation of one or more of the process tools 102a-c and abatement systems 104a-c as described further below.
- the controller 112 may be a microcomputer, microprocessor, logic circuit, a combination of hardware and software, or the like.
- the controller 112 may include various communications facilities including input/output ports, a keyboard, a mouse, a display, a network adapter, etc.
- the controller 112 may receive signals from sensors (described below) attached to, for example, the process tools 102a-c, abatement systems 104a-c, channels 110, the interface manifold 106, inlets (described below), and the like, and based on these signals may selectively determine which of the abatement systems 104a-c to direct a particular effluent flow.
- the controller 112 may also cause the valves in the interface manifold 106 to carry out the selection. The determination may be based on a plurality of factors. These factors may be for example, scheduled and unscheduled events that may cause a particular abatement system to be unable to abate effluent.
- Possible configurations for the scheduled and unscheduled events may include for example, to create a back-up configuration (FIG. 4), as an abatement application specific distribution system for different types of tools/processes (FIG. 5), as an automated load balancing system among similar or different types/capacities of abatement units (FIG. 6) , as a redundant configuration (FIG. 7) etc.
- processing operations associated with electronic device manufacturing produce effluent that may include, for example, mostly fluorine, silicon tetrafluoride (SiF 4 ), hydrogen fluoride (HF), carbonyl fluoride (COF 2 ), CF 4 and C 2 F 6 .
- Abatement systems may use, for example, thermal, wet scrubbing, dry scrubbing, catalytic, plasma and/or similar means for the treatment of the effluent gases, as well as processes for converting the effluent gases to less toxic forms.
- Exemplary abatement systems 104a-c may include, e.g., the CDO Abatement System, having an input flow rate capacity of 300 liters per minute, and the Marathon Abatement System, having an input flow rate capacity of 1100 liters per minute, both manufactured by Applied Materials of Santa Clara, California.
- the input flow rate capacity of each abatement system may be such that it may accommodate effluent from multiple tools.
- the abatement systems 104a-c may include one or more inlets, as shown in FIG 3, for receiving the effluent from the interface manifold 106.
- the abatement systems 104a-c may include 1, 2, 3. . .n inlets.
- the inlets may be divided between those dedicated to effluent flows from specific tools and those used as back-up for another abatement system. For example, an unscheduled event may result in half of the inlets from the first abatement system 104a receiving effluent flows from the first tool 102a and the other half of the inlets from the first abatement system 104a receiving effluent flows from a second tool 102b.
- a first abatement system 104a may receive effluent flows from a first process tool 102a through inlets 1, 2, and 3 of the first abatement system 104a
- a second abatement system 104b may receive effluent flows from a second process tool 102b through inlets 1, 2, and 3 of the second abatement system 104b. If the second abatement system 104b becomes unavailable, the effluent flows from the second process tool 102b may be directed, via the interface manifold 206, to inlets 4, 5, and 6 of the first abatement system 104a.
- the purpose of the inlets may change depending on the circumstance.
- the inlets, and hence the abatement systems 104a- c may be monitored by one or more sensors (not shown) .
- some sensors may be used to monitor the effluent flow rate, the pressure at the inlets, the temperature of the systems, the effluent composition, etc.
- the sensors may send one or more signals to the controller 112 indicative of the status of the abatement system 104a-c, such that an appropriate action may be taken.
- the one or more sensors may be coupled to the process tools 102a-c, or coupled to both the abatement systems 104a-c and the process tools 102a-c to provide information to the controller 112.
- FIG. 2 an example system 200 is provided.
- the system 200 includes two process tools 202a and 202b coupled to two abatement systems 204a and 204b via an interface manifold 206, which allows fluid communication between the process tools 202a-b and the abatement systems 204a-b.
- each process tool 202a-b includes three process chambers 208 (A, B, C and D, E, F, respectively) .
- a corresponding channel 210 (A, B, C and D, E, F) may extend from each chamber 208 to allow the flow of one or more effluents to exit the process tool 202a- b.
- Each of the two abatement systems 204a-b includes six inlets (1, 2, 3, 4, 5, 6) .
- the three (A, B, C) channels 208 of the first process tool 202a may be in fluid communication, via the interface manifold 206, with inlets 1, 2, 3 of the first abatement system 204a.
- the effluent from the first process tool 202a may flow through channels A, B, C to inlets 4, 5, 6 of the second abatement system 204b.
- the three (D, E, F) channels 208 of the second process tool 202b may be in fluid communication, via the interface manifold 206, with inlets 1, 2, 3 of the second abatement system 204b. If the second abatement system 204b is unavailable, the effluent from the second process tool 202b may flow through channels D, E, F to inlets 4, 5, 6 of the first abatement system 204a.
- FIG. 3 a schematic illustration of an exemplary embodiment of a system 300 is provided.
- the system 300 is similar to the system 200 shown in Figure 2, in that it includes two process tools 302a-b coupled to two abatement systems 304a-b via an interface manifold 306 (dashed line) .
- the system 300 shown herein includes additional details of an exemplary interface manifold 306.
- the interface manifold 306 may include one or more valves 307 to selectively direct the effluents from the different channels 308 of the process tools into the abatement systems 304a-b.
- Exemplary valves suitable for use may include gate valves, needle valves, bellow valves, or ball valves, or other types of valves.
- ball valves may be used.
- ball valves may include the Series SMC9 valves manufactured by SVF Flow Controls of Santa Fe Springs, CA, the CFDM3L/3T5900 Series valves manufactured by J-Flow of Norwood, OH, the Triad Series 30L-92061 & 30T-92061 valves manufactured by Triad Process Equipment of Milford, MI, and the multiport series manufactured by Flow-Tek of Houston, TX.
- the three (A, B, C) channels 308 of the first process tool 302a may be in fluid communication, via the interface manifold 306, with inlets 1, 2, 3 of the first abatement system 304a.
- the first abatement system 304a may include one or more sensors (not shown) . The sensor may send a signal to the controller 310 indicating that the first abatement system 304a is unavailable to abate effluent.
- the process tools may include sensors, which send signals to the controller indicating a status of the abatement system.
- the controller 310 operates the valves 307 in the interface manifold 306 to direct the effluent flow to inlets 4, 5, 6 of the second abatement system 304b instead of inlets 1, 2, 3 of the unavailable first abatement system 304a.
- the valves 307 may be manipulated automatically or manually.
- the three (D, E, F) channels 308 of the second process tool 302b may be in fluid communication, via the interface manifold 306, with inlets 1,2,3 of the second abatement system 304b.
- sensors may detect the unavailability of the second abatement system 304b and may send a signal indicative of this status to the controller 310.
- the controller 310 may operate the valves 307 to direct the effluent flow to inlets 4, 5, 6 of the first abatement system 304a instead of inlets 1, 2, 3 of the unavailable second abatement system 304b.
- the system 300 may also include a house exhaust scrubber 312, which may serve as an additional level of back-up abatement.
- the valves may be actuated to direct the effluent, via the interface manifold and controller, into the house exhaust scrubber 312 for abatement.
- FIG. 4 an exemplary embodiment of a system 400 adapted to function in a back-up configuration is depicted.
- the example system 400 includes two process tools 402a and 402b coupled to two abatement systems 404a and 404b via an interface manifold 406 (dashed line) , which selectively enables fluid communication between the process tools 402a-b and the abatement systems 404a-b.
- the effluent from both process tools 402a-b is directed to only the primary abatement system 404a, as indicated by the bold line, while the secondary abatement system 404b remains dormant.
- the controller 412 may receive a signal indicating the shutdown status, and operates the valves 407 of the interface manifold 406 to redirect the effluent flow from both process tools 402a-b to only the secondary abatement system 404b, as indicated by the unbolded lines.
- a secondary abatement system 404b as a back-up to the primary abatement system 404a improves environmental compliance by allowing the continual flow of effluent into an abatement system and thereby does not necessitate bypassing a down abatement system and flowing the effluent directly to the house exhaust.
- FIG. 5 an exemplary embodiment of a system 500 adapted to function in a abatement application specific distribution configuration for different types of tools/processes is depicted.
- the system 500 includes two process tools 502a and 502b coupled to two abatement systems 504a and 504b via an interface manifold 506 (dashed line) , which selectively enables fluid communication between the process tools 502a-b and the abatement systems 504a-b.
- An exemplary case of an application specific system may be one in which the effluents from substrate processing in the process tools 502a-b are directed, via the interface manifold 506, to a first abatement system 504a, as indicated by the bold lines, while effluents from cleaning the process tools 502a-b are directed to a second abatement system 504b, as indicated by the unbold lines.
- the dotted channel lines and valves 507 provide the ability to redirect the effluent flows. It may be desirable to direct the different effluents to different abatement systems 504a-b, as the effluents may have, for example, different corrosive and combustive properties.
- the cleaning effluent may be more corrosive and combustive than the process effluent, and therefore wear the abatement system 504b faster than the process effluent.
- prediction of needed maintenance e.g., replacement of consumable parts
- the timing of the replacement of the system processing the more corrosive cleaning effluent may be more accurately predicted from known rates of corrosion.
- FIG. 6 an exemplary embodiment of a system 600 adapted to function in a automated load balancing configuration among similar or different types/capacities of abatement units is depicted.
- the example system 600 includes two process tools 602a and 602b coupled to three abatement systems 604a, 604b and 604c via an interface manifold 606 (dashed line) , which allows fluid communication between the process tools 602a-b and the abatement systems 604a-c.
- the first and third abatement systems 604a and 604c are Marathon abatement systems, each having a flow rate capacity of 1100 liters per minute
- the second abatement system 604b is a CDO abatement system having a flow rate capacity of 300 liters per minute. Because the second abatement system 604b has a flow rate capacity so much lower than the first and third abatement systems 604a and 604c, it may be desirable to only run the first and third abatement systems 604a and 604c, in particular situations .
- An example of such a particular situation may be when between more than 1300 liters per minute and less than 2000 liters per minute of effluent is abated.
- first and second abatement systems 604a-b When between more than 1000 liters per minute and less than 1300 liters per minute of effluent is going to be abated, only the first and second abatement systems 604a-b may be used. When between more than 300 liters per minute and less than 1000 liters per minute of effluent is to be abated, only the second abatement system 604b may be used. When between more than 0 liters per minute and less than 300 liters per minute of effluent is to be abated, only the first abatement system 604a may be used. When between more than 2000 liters per minute and less than 2300 liters per minute of effluent is to be abated, all three of the abatement systems 604a-c may be used.
- the system 700 includes two process tools 702a and 702b coupled to two abatement systems 704a and 704b via an interface manifold 706 (dashed line) , which selectively enables fluid communication between the process tools 702a-b and the abatement systems 704a-b
- An exemplary case of a redundant system may be one in which the effluents from a first process tool 702a are directed to a first abatement system 704a and the effluents from a second process tool 702b are directed to a second abatement system 704b, as indicated by the bold lines. If either of the abatement systems 704a, b become unable to abate effluents, a signal may be sent to the controller 712 indicating the down status of the abatement system, for example the first abatement system 704a.
- the controller 712 may operate the valves 707 to direct the effluent flow from the first process tool 702a to the second abatement system 704b, as indicated by the unbold lines.
- FIG. 8 a flowchart illustrating an exemplary method of the effluent flow configuration shown in Figure 2 for abating effluent from a process tool is depicted. However, the method may be applied to any of the exemplary configurations described herein.
- step SlOO an effluent output by one or more process tools 202a-b (FIG. 2) is flowed through an interface manifold 206 (FIG. 2) to one or more abatement systems 204a-b (FIG. 2) .
- step S102 an indicia is received representing a status of a first abatement system 204a of the one or more abatement systems.
- the status may indicate that the first abatement system 204a is unavailable to process effluent.
- step S104 the effluent is directed, via the interface manifold 206, to a second abatement system 204b in response to receiving the indicia.
- alternate methods for various configurations are described in U.S. Patent Application Serial No. 60/823,294, filed August 23, 2006, entitled "SYSTEM FOR MONITORING MULTIPLE ABATEMENT SYSTEMS AND METHOD OF USING THE SAME" (Attorney Docket No. 10470) .
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- Oil, Petroleum & Natural Gas (AREA)
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- Environmental & Geological Engineering (AREA)
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Abstract
Description
Claims
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009525639A JP2010501334A (en) | 2006-08-23 | 2007-08-23 | System and method for operating and monitoring an abatement system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82329206P | 2006-08-23 | 2006-08-23 | |
| US60/823,292 | 2006-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008024461A2 true WO2008024461A2 (en) | 2008-02-28 |
| WO2008024461A3 WO2008024461A3 (en) | 2008-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/018714 Ceased WO2008024461A2 (en) | 2006-08-23 | 2007-08-23 | Systems and methods for operating and monitoring abatement systems |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20080047586A1 (en) |
| JP (1) | JP2010501334A (en) |
| KR (1) | KR20090063219A (en) |
| TW (1) | TW200832097A (en) |
| WO (1) | WO2008024461A2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090149996A1 (en) * | 2007-12-05 | 2009-06-11 | Applied Materials, Inc. | Multiple inlet abatement system |
| US9921591B2 (en) * | 2012-03-26 | 2018-03-20 | Siemens Schweiz Ag | System and method for HVAC interlocks |
| JP6942918B2 (en) * | 2016-04-13 | 2021-09-29 | コブハム・ミッション・システムズ・ダベンポート・エルエスエス・インコーポレイテッド | Onboard Inert Gas Generation System Predictive Health Monitoring |
| JP7299098B2 (en) * | 2018-08-06 | 2023-06-27 | エドワーズ株式会社 | Abatement system, abatement device, and system controller |
| US12554238B2 (en) * | 2023-09-08 | 2026-02-17 | Directlytek Technology Co., Ltd. | Device and method for alternately controlling the operation state of two treatment equipment |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2872637B2 (en) * | 1995-07-10 | 1999-03-17 | アプライド マテリアルズ インコーポレイテッド | Microwave plasma based applicator |
| US5649985A (en) * | 1995-11-29 | 1997-07-22 | Kanken Techno Co., Ltd. | Apparatus for removing harmful substances of exhaust gas discharged from semiconductor manufacturing process |
| USH1701H (en) * | 1996-03-15 | 1998-01-06 | Motorola, Inc. | Method and apparatus for using molten aluminum to abate PFC gases from a semiconductor facility |
| TW342436B (en) * | 1996-08-14 | 1998-10-11 | Nippon Oxygen Co Ltd | Combustion type harm removal apparatus (1) |
| US6322756B1 (en) * | 1996-12-31 | 2001-11-27 | Advanced Technology And Materials, Inc. | Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases |
| US6338312B2 (en) * | 1998-04-15 | 2002-01-15 | Advanced Technology Materials, Inc. | Integrated ion implant scrubber system |
| US6759018B1 (en) * | 1997-05-16 | 2004-07-06 | Advanced Technology Materials, Inc. | Method for point-of-use treatment of effluent gas streams |
| US6261524B1 (en) * | 1999-01-12 | 2001-07-17 | Advanced Technology Materials, Inc. | Advanced apparatus for abatement of gaseous pollutants |
| US6491884B1 (en) * | 1999-11-26 | 2002-12-10 | Advanced Technology Materials, Inc. | In-situ air oxidation treatment of MOCVD process effluent |
| US6824748B2 (en) * | 2001-06-01 | 2004-11-30 | Applied Materials, Inc. | Heated catalytic treatment of an effluent gas from a substrate fabrication process |
| US7160521B2 (en) * | 2001-07-11 | 2007-01-09 | Applied Materials, Inc. | Treatment of effluent from a substrate processing chamber |
| US6805728B2 (en) * | 2002-12-09 | 2004-10-19 | Advanced Technology Materials, Inc. | Method and apparatus for the abatement of toxic gas components from a semiconductor manufacturing process effluent stream |
| US6813943B2 (en) * | 2003-03-19 | 2004-11-09 | Mks Instruments, Inc. | Method and apparatus for conditioning a gas flow to improve a rate of pressure change measurement |
| US6843830B2 (en) * | 2003-04-15 | 2005-01-18 | Advanced Technology Materials, Inc. | Abatement system targeting a by-pass effluent stream of a semiconductor process tool |
| US20040216610A1 (en) * | 2003-05-01 | 2004-11-04 | Glenn Tom | Gas processing system comprising a water curtain for preventing solids deposition of interior walls thereof |
| US20050089455A1 (en) * | 2003-10-24 | 2005-04-28 | Marganski Paul J. | Gas-using facility including portable dry scrubber system and/or over-pressure control arrangement |
| US7018448B2 (en) * | 2003-10-28 | 2006-03-28 | Advanced Technology Materials, Inc. | Gas cabinet including integrated effluent scrubber |
| US7736599B2 (en) * | 2004-11-12 | 2010-06-15 | Applied Materials, Inc. | Reactor design to reduce particle deposition during process abatement |
| CN101300411B (en) * | 2005-10-31 | 2012-10-03 | 应用材料公司 | Process abatement reactor |
| US7522974B2 (en) * | 2006-08-23 | 2009-04-21 | Applied Materials, Inc. | Interface for operating and monitoring abatement systems |
-
2007
- 2007-08-23 KR KR1020097005876A patent/KR20090063219A/en not_active Withdrawn
- 2007-08-23 US US11/844,268 patent/US20080047586A1/en not_active Abandoned
- 2007-08-23 JP JP2009525639A patent/JP2010501334A/en not_active Withdrawn
- 2007-08-23 TW TW096131307A patent/TW200832097A/en unknown
- 2007-08-23 WO PCT/US2007/018714 patent/WO2008024461A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008024461A3 (en) | 2008-08-07 |
| JP2010501334A (en) | 2010-01-21 |
| US20080047586A1 (en) | 2008-02-28 |
| TW200832097A (en) | 2008-08-01 |
| KR20090063219A (en) | 2009-06-17 |
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