WO2007118133A3 - Implantable co-fired electrical feedthroughs - Google Patents

Implantable co-fired electrical feedthroughs Download PDF

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Publication number
WO2007118133A3
WO2007118133A3 PCT/US2007/066034 US2007066034W WO2007118133A3 WO 2007118133 A3 WO2007118133 A3 WO 2007118133A3 US 2007066034 W US2007066034 W US 2007066034W WO 2007118133 A3 WO2007118133 A3 WO 2007118133A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive material
implantable
electrical feedthroughs
fired electrical
coupled
Prior art date
Application number
PCT/US2007/066034
Other languages
French (fr)
Other versions
WO2007118133A2 (en
Inventor
Jeremy W Burdon
Joyce K Yamamoto
Lea A Nygren
William D Wolf
Original Assignee
Medtronic Inc
Jeremy W Burdon
Joyce K Yamamoto
Lea A Nygren
William D Wolf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic Inc, Jeremy W Burdon, Joyce K Yamamoto, Lea A Nygren, William D Wolf filed Critical Medtronic Inc
Priority to EP07760160A priority Critical patent/EP2010282A2/en
Publication of WO2007118133A2 publication Critical patent/WO2007118133A2/en
Publication of WO2007118133A3 publication Critical patent/WO2007118133A3/en

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Electrotherapy Devices (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.
PCT/US2007/066034 2006-04-05 2007-04-05 Implantable co-fired electrical feedthroughs WO2007118133A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07760160A EP2010282A2 (en) 2006-04-05 2007-04-05 Implantable co-fired electrical feedthroughs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/278,773 2006-04-05
US11/278,773 US20070236861A1 (en) 2006-04-05 2006-04-05 Implantable co-fired electrical feedthroughs

Publications (2)

Publication Number Publication Date
WO2007118133A2 WO2007118133A2 (en) 2007-10-18
WO2007118133A3 true WO2007118133A3 (en) 2008-01-31

Family

ID=38268837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/066034 WO2007118133A2 (en) 2006-04-05 2007-04-05 Implantable co-fired electrical feedthroughs

Country Status (3)

Country Link
US (1) US20070236861A1 (en)
EP (1) EP2010282A2 (en)
WO (1) WO2007118133A2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8983618B2 (en) * 2008-10-31 2015-03-17 Medtronic, Inc. Co-fired multi-layer antenna for implantable medical devices and method for forming the same
US20100109966A1 (en) * 2008-10-31 2010-05-06 Mateychuk Duane N Multi-Layer Miniature Antenna For Implantable Medical Devices and Method for Forming the Same
US9399143B2 (en) * 2008-10-31 2016-07-26 Medtronic, Inc. Antenna for implantable medical devices formed on extension of RF circuit substrate and method for forming the same
US8497804B2 (en) * 2008-10-31 2013-07-30 Medtronic, Inc. High dielectric substrate antenna for implantable miniaturized wireless communications and method for forming the same
US8050771B2 (en) * 2008-12-29 2011-11-01 Medtronic, Inc. Phased array cofire antenna structure and method for operating the same
US8626310B2 (en) * 2008-12-31 2014-01-07 Medtronic, Inc. External RF telemetry module for implantable medical devices
WO2010141100A1 (en) 2009-06-04 2010-12-09 Morgan Advanced Ceramics, Inc. Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same
US8725263B2 (en) 2009-07-31 2014-05-13 Medtronic, Inc. Co-fired electrical feedthroughs for implantable medical devices having a shielded RF conductive path and impedance matching
US8386047B2 (en) 2010-07-15 2013-02-26 Advanced Bionics Implantable hermetic feedthrough
US8552311B2 (en) 2010-07-15 2013-10-08 Advanced Bionics Electrical feedthrough assembly
US8515540B2 (en) 2011-02-24 2013-08-20 Cochlear Limited Feedthrough having a non-linear conductor
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US8670829B2 (en) 2011-08-02 2014-03-11 Medtronic, Inc. Insulator for a feedthrough
US8588916B2 (en) 2011-08-02 2013-11-19 Medtronic, Inc. Feedthrough configured for interconnect
US9008779B2 (en) 2011-08-02 2015-04-14 Medtronic, Inc. Insulator for a feedthrough
US8841558B2 (en) 2011-08-02 2014-09-23 Medtronic Inc. Hermetic feedthrough
US8872035B2 (en) 2011-08-02 2014-10-28 Medtronic, Inc. Hermetic feedthrough
US9627833B2 (en) 2011-08-02 2017-04-18 Medtronic, Inc. Electrical leads for a feedthrough
US9724524B2 (en) 2011-08-02 2017-08-08 Medtronic, Inc. Interconnection of conductor to feedthrough
US9889306B2 (en) 2012-01-16 2018-02-13 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US10881867B2 (en) 2012-01-16 2021-01-05 Greatbatch Ltd. Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device
US10046166B2 (en) 2012-01-16 2018-08-14 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US10420949B2 (en) 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
EP2628504A1 (en) 2012-01-16 2013-08-21 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
WO2014049089A1 (en) 2012-09-28 2014-04-03 Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement Implantable devices
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US8805537B1 (en) 2013-03-13 2014-08-12 Medtronic, Inc. Hybrid packing for implantable device
US9387332B2 (en) 2013-10-08 2016-07-12 Medtronic, Inc. Implantable medical devices having hollow sleeve cofire ceramic structures and methods of fabricating the same
US9502754B2 (en) * 2014-01-24 2016-11-22 Medtronic, Inc. Implantable medical devices having cofire ceramic modules and methods of fabricating the same
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
EP3449973B1 (en) 2017-08-30 2022-12-21 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly
GB2597106A (en) * 2020-07-16 2022-01-19 Morgan Advanced Ceramics Inc Feedthrough comprising interconnect pads

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573173A (en) * 1992-11-02 1996-11-12 U.S. Philips Corporation Vacuum tube comprising a ceramic element and a method of interconnecting a ceramic element and a conductive element
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US6414835B1 (en) * 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2556503B1 (en) * 1983-12-08 1986-12-12 Eurofarad ALUMINA INTERCONNECTION SUBSTRATE FOR ELECTRONIC COMPONENT
US5434358A (en) * 1993-12-13 1995-07-18 E-Systems, Inc. High density hermetic electrical feedthroughs
US5782891A (en) * 1994-06-16 1998-07-21 Medtronic, Inc. Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body
US5750926A (en) * 1995-08-16 1998-05-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed electrical feedthrough for use with implantable electronic devices
US5620476A (en) * 1995-11-13 1997-04-15 Pacesetter, Inc. Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly
US6146743A (en) * 1997-02-21 2000-11-14 Medtronic, Inc. Barrier metallization in ceramic substrate for implantable medical devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573173A (en) * 1992-11-02 1996-11-12 U.S. Philips Corporation Vacuum tube comprising a ceramic element and a method of interconnecting a ceramic element and a conductive element
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US6414835B1 (en) * 2000-03-01 2002-07-02 Medtronic, Inc. Capacitive filtered feedthrough array for an implantable medical device

Also Published As

Publication number Publication date
EP2010282A2 (en) 2009-01-07
WO2007118133A2 (en) 2007-10-18
US20070236861A1 (en) 2007-10-11

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