WO2007115916A1 - Dispositif de détection - Google Patents

Dispositif de détection Download PDF

Info

Publication number
WO2007115916A1
WO2007115916A1 PCT/EP2007/052711 EP2007052711W WO2007115916A1 WO 2007115916 A1 WO2007115916 A1 WO 2007115916A1 EP 2007052711 W EP2007052711 W EP 2007052711W WO 2007115916 A1 WO2007115916 A1 WO 2007115916A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
sensor device
force
bending point
sensor element
Prior art date
Application number
PCT/EP2007/052711
Other languages
German (de)
English (en)
Inventor
Frieder Haag
Sascha Goetzl
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to EP07727187A priority Critical patent/EP2008071A1/fr
Priority to JP2009504666A priority patent/JP2009533660A/ja
Publication of WO2007115916A1 publication Critical patent/WO2007115916A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/04—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
    • G01L1/044—Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs of leaf springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks

Definitions

  • the invention relates to a sensor device for detecting a pressure or a force with at least one sensor element which is made of a semiconductor substrate and is sensitive to bending and which is largely molded into a housing.
  • Such sensor devices are used for a wide variety of applications in the field of consumer electronics, for example in touch-sensitive screens of PDAs and smartphones or in laptops which are equipped with a touch-sensitive surface as a mouse replacement.
  • the force / pressure sensors that are used here for measuring value acquisition must also be very robust, since in the typical applications of the touch-sensitive surfaces in question, the so-called touchpads, Forces of up to approx. 5 N occur. In addition, the force / pressure sensors used here should be overload-proof against breakage or similar up to approx. 50 N.
  • German patent application 10 2005 03 69 55 describes a sensor device of the type mentioned at the outset, which both fulfills the above-mentioned requirements for measurement accuracy and is sufficiently robust.
  • This known sensor device comprises a pressure sensor chip, which is produced from a semiconductor substrate using surface micromechanical methods and is largely molded into a housing.
  • the micromechanical structure of the pressure sensor chip comprises a membrane that spans and seals off a cavern.
  • the upper housing part of the known sensor device formed above the membrane should be movable at least within certain limits and have a force shunt to the membrane, so that a force acting on the upper housing part is at least partially transmitted to the membrane.
  • the pressure sensor chip used here is a micromechanical component that is relatively complex to manufacture.
  • the manufacturing requirements for the housing of the pressure sensor chip, in particular for the upper housing part, are also relatively high, so that the known sensor device as a whole is relatively expensive in view of the constantly falling prices for products from the field of consumer electronics.
  • the present invention proposes a particularly cost-effective further development of the known sensor device, which is distinguished by a very simple, robust and easy-to-use structure and at the same time enables measurement value acquisition with the accuracy required for applications in consumer electronics.
  • the housing has at least one predetermined bending point, on which the pressure to be recorded or the force to be recorded acts.
  • Sensor element is arranged in the area of this predetermined bending point, so that it is bent together with the housing and, in the event of a bending, provides an output signal corresponding to the force causing the bending.
  • the forces to be detected generally cause the housing of the known sensor device to bend.
  • the construction of the known sensor device can be greatly simplified if one detects this bending of the housing directly or indirectly.
  • the pressure sensor chip with its relatively complicated micromechanical structure can be replaced by a very simple sensor element sensitive to bending, such as one or more strain gauges.
  • any sensor element that is sensitive to bending can be used as a sensor element - including a pressure sensor chip.
  • a sensor element - including a pressure sensor chip for a particularly simple and inexpensive variant, the use of silicon strips with piezo-sensitive resistors as the sensor element is proposed.
  • thermoset in particular from an epoxy
  • the sensor device according to the invention can be easily mounted on a circuit board for connection to an evaluation unit.
  • the circuit board is then oriented perpendicular to the direction of force, so that it can at least partially absorb the forces to be detected.
  • the housing of the sensor device according to the invention is preferably mounted on the printed circuit board in such a way that it is supported in at least one area outside the predetermined bending point and can be bent against the printed circuit board via the predetermined bending point.
  • the mechanical and electrical connections between the sensor device and the circuit board should be stressed as little as possible. The can be easily achieved by supporting the housing in at least two areas if these areas are selected so that a force applied at the predetermined bending point does not cause any torque on the assembled housing.
  • FIG. 1a shows a section through a first sensor device 10
  • Ib shows a top view of this first sensor device 10.
  • FIG. 2a shows a section through a second sensor device 20
  • the sensor device 10 shown in FIGS. 1a and b serves to detect a pressure or a force which acts essentially vertically on the housing 1 from above, which is indicated by the arrow 2 in Fig. Ia.
  • the sensor device 10 comprises a sensor element 3 which is sensitive to bending and which is produced from a semiconductor substrate.
  • the sensor element 3 is a simple silicon strip with piezo-sensitive resistors.
  • the silicon strip and with it the piezo-sensitive resistors are arranged in such a way that their resistance value changes when they bend in the direction of the force 2.
  • the sensor element 3 is molded into the housing 1.
  • a thermoset or an epoxy, for example, is suitable as the molding compound. Depending on the application, other materials can also be used as molding compound.
  • the housing 1 has a predetermined bending point 4.
  • the housing 1 is deliberately weakened in the area of the predetermined bending point 4, for example by the wall being made thinner or having been provided with a notch.
  • the predetermined bending point 4 must be arranged and aligned so that it can absorb the force to be detected.
  • the sensor element 3 extends over the area of the predetermined bending point 4 and is accordingly bent together with the housing 1 when a force, as indicated by the arrow 2, acts on the sensor device 10.
  • the sensor element 10 shown here also comprises an ASIC 5, which is connected to the sensor element 3 via bond wires 6 and is arranged together with the latter on a lead frame 7.
  • the ASIC 5 is also molded into the housing 1 but positioned in such a way that deformation due to a force acting on the housing 1 is largely avoided.
  • the sensor device 10 comprises pins 8, via which both mechanical assembly on a printed circuit board takes place and electrical connections are made.
  • the right end of the housing 1, where the predetermined bending point 4 is located is not supported, so that this end is bent against the printed circuit board when a corresponding force is applied.
  • a nose-like projection 9 is also formed on this right housing end as the preferred point of application for the force to be detected.
  • a so-called two-point bend is realized with the variant of a sensor device 10 according to the invention shown in FIGS. 1a and b. Accordingly, in this embodiment, both the mechanical and the electrical connection between sensor device 10 and printed circuit board have to counteract a torque which is caused by a force acting according to arrow 2.
  • FIGS. 2a and b show a sensor device 20 in which this problem does not occur because a so-called three-point bend is implemented here.
  • two predetermined bending points 24 are formed on the housing 21.
  • the sensor element 23 extends over both predetermined bending points 24. It is - as in the case of Sensor device 10 - arranged together with an ASIC 25 on a lead frame 26 and molded into the housing 21.
  • the ASIC 25 is located in the left half of the housing, which sits directly on a circuit board when assembled.
  • the right half of the housing is only fixed on the end of the circuit board. Because of the special shape of the housing of the sensor device 20, even in the assembled state, there remains an intermediate space between the printed circuit board and the central area 30 of the right half of the housing, in which the two predetermined bending points 24 are arranged.
  • a nose-like projection 29, which is formed centrally between the two predetermined bending points 24 on the housing 21, represents the preferred force application point for the measurement value acquisition.
  • the central region 30 of the housing 21 and thus also the sensor element 23 bent towards the circuit board With a corresponding force action from the direction of the arrow 22, the central region 30 of the housing 21 and thus also the sensor element 23 bent towards the circuit board.
  • the force acting is absorbed evenly by the circuit board, so that none of the connection points between the sensor device 20 and the circuit board experiences any torque.
  • the present invention also includes variants with which, for example, a four-point bend is realized.
  • all variants of a sensor device according to the invention can be carried out with or without special shaping of a point of application for the forces to be detected.
  • other housing shapes such as QFN housings, are also suitable for the sensor device according to the invention.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un dispositif de détection particulièrement économique pour détecter une pression ou une force, caractérisé par une construction très simple, robuste et facile à mettre en oevre et permettant en même temps une acquisition de la valeur mesurée avec la précision requise dans le domaine de l'électronique grand public. Pour ce faire, le dispositif de détection comprend au moins élément (3) de détection fabriqué à partir d'un substrat semiconducteur et sensible à la flexion qui est pour l'essentiel moulé dans un boîtier (1). Le boîtier (1) présente en outre au moins un point (4) de flexion voulue sur lequel agit la pression à détecter ou la force à détecter. Comme l'élément (3) de détection est disposé dans la zone du point (4) de flexion voulu, il fléchit en même temps que le boîtier (1) et délivre alors un signal de sortie correspondant.
PCT/EP2007/052711 2006-04-10 2007-03-21 Dispositif de détection WO2007115916A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07727187A EP2008071A1 (fr) 2006-04-10 2007-03-21 Dispositif de detection
JP2009504666A JP2009533660A (ja) 2006-04-10 2007-03-21 センサ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006016813.5 2006-04-10
DE102006016813A DE102006016813A1 (de) 2006-04-10 2006-04-10 Sensorvorrichtung

Publications (1)

Publication Number Publication Date
WO2007115916A1 true WO2007115916A1 (fr) 2007-10-18

Family

ID=38180548

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/052711 WO2007115916A1 (fr) 2006-04-10 2007-03-21 Dispositif de détection

Country Status (5)

Country Link
EP (1) EP2008071A1 (fr)
JP (1) JP2009533660A (fr)
KR (1) KR20090005318A (fr)
DE (1) DE102006016813A1 (fr)
WO (1) WO2007115916A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10190925B2 (en) * 2016-07-18 2019-01-29 Honeywell International Inc. Low cost overmolded leadframe force sensor with multiple mounting positions
DE102018209592A1 (de) * 2018-06-14 2019-12-19 Hoffmann + Krippner Gmbh Vorrichtung zur Messung einer Kraft
KR20200046282A (ko) 2018-10-24 2020-05-07 삼성전자주식회사 집적 회로 장치 및 고 대역폭 메모리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0098507A2 (fr) * 1982-07-02 1984-01-18 Siemens Aktiengesellschaft Capteur de force ou de déplacement à circuit intégré
JPS6191937A (ja) * 1984-10-12 1986-05-10 Sanken Electric Co Ltd 樹脂封止型半導体装置の製造方法
WO1997024915A2 (fr) * 1995-12-24 1997-07-17 Dan Haronian Systemes micro-electromecaniques (mems)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0098507A2 (fr) * 1982-07-02 1984-01-18 Siemens Aktiengesellschaft Capteur de force ou de déplacement à circuit intégré
JPS6191937A (ja) * 1984-10-12 1986-05-10 Sanken Electric Co Ltd 樹脂封止型半導体装置の製造方法
WO1997024915A2 (fr) * 1995-12-24 1997-07-17 Dan Haronian Systemes micro-electromecaniques (mems)

Also Published As

Publication number Publication date
DE102006016813A1 (de) 2007-10-11
EP2008071A1 (fr) 2008-12-31
JP2009533660A (ja) 2009-09-17
KR20090005318A (ko) 2009-01-13

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