WO2007092591A3 - Multi-layered probes - Google Patents

Multi-layered probes Download PDF

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Publication number
WO2007092591A3
WO2007092591A3 PCT/US2007/003473 US2007003473W WO2007092591A3 WO 2007092591 A3 WO2007092591 A3 WO 2007092591A3 US 2007003473 W US2007003473 W US 2007003473W WO 2007092591 A3 WO2007092591 A3 WO 2007092591A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
probe
substrate
tip
post structure
multi
Prior art date
Application number
PCT/US2007/003473
Other languages
French (fr)
Other versions
WO2007092591A2 (en )
Inventor
Edward T Laurent
Edward L Malantonio
Richard D Sadler
Bahadir Tunaboylu
Brian Mchugh
Dov Chartarifsky
Original Assignee
Sv Probe Pte Ltd
Edward T Laurent
Edward L Malantonio
Richard D Sadler
Bahadir Tunaboylu
Brian Mchugh
Dov Chartarifsky
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06727Cantilever beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

A probe for a probe card assembly is provided. The probe has a post structure (202) supported by a substrate (208), a plurality of stacked beam elements (320, 522, 524) disposed on the post structure, and a tip attached (506) to a surface of a top beam element, of the plurality of stacked beam elements, that opposes the substrate. The tip is configured to be electrically connected to a semiconductor device to be tested. The probe may be bent so that the tip is further away from the substrate than the height the post structure. The effective maximum force exerted by the tips of a multi-beamed probe against, for example, DUT pads may be increased when compared to prior probes.
PCT/US2007/003473 2006-02-08 2007-02-08 Multi-layered probes WO2007092591A3 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US77155406 true 2006-02-08 2006-02-08
US60/771,554 2006-02-08
US11703875 US20070200576A1 (en) 2006-02-08 2007-02-07 Multi-layered probes
US11/703,875 2007-02-07

Publications (2)

Publication Number Publication Date
WO2007092591A2 true WO2007092591A2 (en) 2007-08-16
WO2007092591A3 true true WO2007092591A3 (en) 2007-11-15

Family

ID=38345818

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/003473 WO2007092591A3 (en) 2006-02-08 2007-02-08 Multi-layered probes

Country Status (1)

Country Link
WO (1) WO2007092591A3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7772859B2 (en) 2005-08-01 2010-08-10 Touchdown Technologies, Inc. Probe for testing semiconductor devices with features that increase stress tolerance
US7589542B2 (en) * 2007-04-12 2009-09-15 Touchdown Technologies Inc. Hybrid probe for testing semiconductor devices

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030218244A1 (en) * 2002-03-18 2003-11-27 Lahiri Syamal Kumar Miniaturized contact spring
US20040142583A1 (en) * 1998-12-02 2004-07-22 Formfactor, Inc. Spring interconnect structures
US20050179458A1 (en) * 2003-02-04 2005-08-18 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
JP2005300501A (en) * 2004-04-16 2005-10-27 Ritsumeikan Method for manufacturing multiprobe
WO2006026346A1 (en) * 2004-08-26 2006-03-09 Sv Probe Pte Ltd. Stacked tip cantilever electrical connector
WO2007015712A1 (en) * 2005-08-01 2007-02-08 Touchdown Technologies, Inc. Post and tip design for a probe contact
WO2007015713A1 (en) * 2005-08-01 2007-02-08 Touchdown Technologies, Inc. Torsion spring probe contactor design
WO2007041585A1 (en) * 2005-09-30 2007-04-12 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040142583A1 (en) * 1998-12-02 2004-07-22 Formfactor, Inc. Spring interconnect structures
US20030218244A1 (en) * 2002-03-18 2003-11-27 Lahiri Syamal Kumar Miniaturized contact spring
US20050179458A1 (en) * 2003-02-04 2005-08-18 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
JP2005300501A (en) * 2004-04-16 2005-10-27 Ritsumeikan Method for manufacturing multiprobe
WO2006026346A1 (en) * 2004-08-26 2006-03-09 Sv Probe Pte Ltd. Stacked tip cantilever electrical connector
WO2007015712A1 (en) * 2005-08-01 2007-02-08 Touchdown Technologies, Inc. Post and tip design for a probe contact
WO2007015713A1 (en) * 2005-08-01 2007-02-08 Touchdown Technologies, Inc. Torsion spring probe contactor design
WO2007041585A1 (en) * 2005-09-30 2007-04-12 Sv Probe Pte Ltd Cantilever probe structure for a probe card assembly

Also Published As

Publication number Publication date Type
WO2007092591A2 (en) 2007-08-16 application

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