WO2007089599A3 - Led illumination assembly with compliant foil construction - Google Patents

Led illumination assembly with compliant foil construction Download PDF

Info

Publication number
WO2007089599A3
WO2007089599A3 PCT/US2007/002195 US2007002195W WO2007089599A3 WO 2007089599 A3 WO2007089599 A3 WO 2007089599A3 US 2007002195 W US2007002195 W US 2007002195W WO 2007089599 A3 WO2007089599 A3 WO 2007089599A3
Authority
WO
WIPO (PCT)
Prior art keywords
illumination assembly
led illumination
compliant foil
foil construction
insulating layer
Prior art date
Application number
PCT/US2007/002195
Other languages
French (fr)
Other versions
WO2007089599A2 (en
Inventor
John C Schultz
Andrew J Ouderkirk
Joel S Peiffer
Nelson B O'bryan Jr
John A Wheatley
Cameron T Murray
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to EP07762789A priority Critical patent/EP1996860A2/en
Priority to CN200780004037XA priority patent/CN101379344B/en
Priority to KR1020087018759A priority patent/KR101347486B1/en
Priority to JP2008553272A priority patent/JP2009525614A/en
Publication of WO2007089599A2 publication Critical patent/WO2007089599A2/en
Publication of WO2007089599A3 publication Critical patent/WO2007089599A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

An illumination assembly (10) includes a compliant substrate (30) comprising a first and second electrically conductive foil (32,36) separated by an electrically insulating layer (40). The insulating layer includes a polymer material (43) loaded with particles (42) that enhance thermal conductivity of the insulating layer. A plurality of LED dies (20) are disposed on the first conductive foil (32).
PCT/US2007/002195 2006-01-31 2007-01-26 Led illumination assembly with compliant foil construction WO2007089599A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07762789A EP1996860A2 (en) 2006-01-31 2007-01-26 Led illumination assembly with compliant foil construction
CN200780004037XA CN101379344B (en) 2006-01-31 2007-01-26 LED illumination assembly with compliant foil construction
KR1020087018759A KR101347486B1 (en) 2006-01-31 2007-01-26 LED Illumination Assembly With Compliant Foil Construction
JP2008553272A JP2009525614A (en) 2006-01-31 2007-01-26 LED lighting assembly having compliant foil structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74319506P 2006-01-31 2006-01-31
US60/743,195 2006-01-31

Publications (2)

Publication Number Publication Date
WO2007089599A2 WO2007089599A2 (en) 2007-08-09
WO2007089599A3 true WO2007089599A3 (en) 2007-12-13

Family

ID=38137663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/002195 WO2007089599A2 (en) 2006-01-31 2007-01-26 Led illumination assembly with compliant foil construction

Country Status (7)

Country Link
US (1) US7572031B2 (en)
EP (1) EP1996860A2 (en)
JP (1) JP2009525614A (en)
KR (1) KR101347486B1 (en)
CN (1) CN101379344B (en)
TW (1) TW200734750A (en)
WO (1) WO2007089599A2 (en)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9951438B2 (en) 2006-03-07 2018-04-24 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
KR20080006304A (en) * 2006-07-12 2008-01-16 삼성전자주식회사 Organic light emitting diode display and method for manufacturing thereof
DE102007004303A1 (en) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Thin-film semiconductor device and device composite
EP2091684A1 (en) * 2006-11-07 2009-08-26 Perkinelmer Optoelectronics GmbH & Co. Kg Method for bonding metal surfaces by applying a first oxidised metal layer and a second oxidised metal layer object having cavities or structure of a light emitting diode produced through the last method
KR101672553B1 (en) 2007-06-25 2016-11-03 큐디 비젼, 인크. Compositions and methods including depositing nanomaterial
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
DE102007043904A1 (en) * 2007-09-14 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Luminous device
DE102007043903A1 (en) * 2007-09-14 2009-03-26 Osram Gesellschaft mit beschränkter Haftung Luminous device
DE102007046520A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Light-emitting surface element and method for producing a light-emitting surface element
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
JP2011524064A (en) 2008-05-06 2011-08-25 キユーデイー・ビジヨン・インコーポレーテツド Solid state lighting device containing quantum confined semiconductor nanoparticles
US8022626B2 (en) 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
DE102009019412A1 (en) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Method for producing a printed circuit board with LEDs and printed reflector surface and printed circuit board, produced by the method
CN102598313B (en) 2009-08-14 2016-03-23 Qd视光有限公司 Luminescent device, for the optical element of luminescent device and method
KR101081069B1 (en) * 2009-12-21 2011-11-07 엘지이노텍 주식회사 Light emitting device and light unit using the same
JP5555038B2 (en) * 2010-04-13 2014-07-23 デクセリアルズ株式会社 Light-reflective anisotropic conductive adhesive and light-emitting device
US9797580B2 (en) * 2010-05-24 2017-10-24 Abl Ip Holding Llc LED light fixture
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
CN103189470B (en) 2010-11-03 2015-05-20 3M创新有限公司 Polymer etchant and method of using same
WO2012061182A1 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device with wire bond free die
GB2484152B (en) * 2010-12-03 2015-03-25 Zeta Specialist Lighting Methods of manufacturing electrical devices such as electric lamps
KR20130128445A (en) 2010-12-29 2013-11-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Remote phosphor led constructions
KR20140004695A (en) 2010-12-29 2014-01-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Led color combiner
JP2013157592A (en) * 2012-01-05 2013-08-15 Canon Components Inc Flexible circuit board for mounting light emitting element
US9232634B2 (en) 2011-01-17 2016-01-05 Canon Components, Inc. Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus
JP5175956B2 (en) * 2011-07-06 2013-04-03 シャープ株式会社 Light emitting device and display device
JP5228089B2 (en) * 2011-07-06 2013-07-03 シャープ株式会社 Light emitting device and display device
US8322906B2 (en) 2011-08-08 2012-12-04 XtraLight Manufacturing Partnership Ltd Versatile lighting units
CN102612254A (en) * 2011-08-10 2012-07-25 田茂福 Heat radiation type LED (Light-Emitting Diode) flexible circuit board
JP2014531109A (en) * 2011-08-29 2014-11-20 コーニンクレッカ フィリップス エヌ ヴェ A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer.
DE102011086168B4 (en) 2011-11-11 2023-05-04 Pictiva Displays International Limited Organic light-emitting component and method for producing an organic optoelectronic component
US9929325B2 (en) 2012-06-05 2018-03-27 Samsung Electronics Co., Ltd. Lighting device including quantum dots
US20140055991A1 (en) * 2012-08-23 2014-02-27 Forrest Starnes McCanless Printed Circuit Boards with Deformations
JP6150050B2 (en) * 2012-12-07 2017-06-21 東芝ライテック株式会社 Light emitting device and lighting device
CN103855142B (en) * 2012-12-04 2017-12-29 东芝照明技术株式会社 Light-emitting device and lighting device
US9091400B2 (en) * 2013-01-30 2015-07-28 Luxo-Led Co., Limited Multi-color light emitting diode device
KR102026120B1 (en) * 2013-04-17 2019-11-04 엘지이노텍 주식회사 lighting emitting device
US9644829B2 (en) 2013-04-25 2017-05-09 Xtralight Manufacturing, Ltd. Systems and methods for providing a field repairable light fixture with a housing that dissipates heat
JP6255747B2 (en) 2013-07-01 2018-01-10 日亜化学工業株式会社 Light emitting device
US9335034B2 (en) 2013-09-27 2016-05-10 Osram Sylvania Inc Flexible circuit board for electronic applications, light source containing same, and method of making
US10032753B2 (en) * 2014-06-20 2018-07-24 Grote Industries, Llc Flexible lighting device having both visible and infrared light-emitting diodes
US20170248288A1 (en) * 2014-08-08 2017-08-31 Koninklijke Philips N.V. Led device with flexible thermal interface
JP2017152450A (en) * 2016-02-22 2017-08-31 大日本印刷株式会社 LED display device
CN110178450B (en) * 2016-11-30 2022-04-15 塔科图特科有限责任公司 Illumination structure and related manufacturing method
US10317614B1 (en) * 2017-03-14 2019-06-11 Automatad Assembly Corporation SSL lighting apparatus
US10174912B1 (en) * 2017-05-01 2019-01-08 R Iverpoint Medical, Llc Focused LED headlamp with iris assembly
US10767840B2 (en) 2017-05-01 2020-09-08 Riverpoint Medical, Llc Focused LED headlamp with iris assembly
JP6898203B2 (en) * 2017-10-27 2021-07-07 株式会社 日立パワーデバイス Power semiconductor module
US10655823B1 (en) 2019-02-04 2020-05-19 Automated Assembly Corporation SSL lighting apparatus
TWI784175B (en) * 2019-06-14 2022-11-21 培英半導體有限公司 Method for forming optical wall by laser engraving an opening and optical wall structure
EP3799539B1 (en) 2019-09-27 2022-03-16 Siemens Aktiengesellschaft Circuit carrier, package and method for its production
US10995931B1 (en) 2020-08-06 2021-05-04 Automated Assembly Corporation SSL lighting apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030153099A1 (en) * 2000-08-31 2003-08-14 Tongbi Jiang Method of making a flexible substrate with a filler material
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
WO2005099323A2 (en) * 2004-04-07 2005-10-20 P.M.C. Projekt Management Consult Gmbh Light-emitting diode arrangement and method for the production thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437596A (en) 1990-06-01 1992-02-07 Toshiba Corp Printed wiring board device
JP2001506393A (en) * 1994-09-06 2001-05-15 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ Electroluminescent device having an electrode layer provided with a transparent structure made of a conductive polymer
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6383005B2 (en) * 1999-12-07 2002-05-07 Urex Precision, Inc. Integrated circuit socket with contact pad
US6799902B2 (en) * 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
US6777870B2 (en) * 2001-06-29 2004-08-17 Intel Corporation Array of thermally conductive elements in an oled display
US6577492B2 (en) * 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
US20030063465A1 (en) * 2001-09-28 2003-04-03 Mcmillan Richard K. Etched metal light reflector for vehicle feature illumination
US6657297B1 (en) * 2002-08-15 2003-12-02 The Bergquist Company Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
CN1601768A (en) * 2003-09-22 2005-03-30 福建省苍乐电子企业有限公司 LED structure
US7997771B2 (en) * 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7303315B2 (en) * 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030153099A1 (en) * 2000-08-31 2003-08-14 Tongbi Jiang Method of making a flexible substrate with a filler material
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
WO2005099323A2 (en) * 2004-04-07 2005-10-20 P.M.C. Projekt Management Consult Gmbh Light-emitting diode arrangement and method for the production thereof

Also Published As

Publication number Publication date
KR101347486B1 (en) 2014-01-02
JP2009525614A (en) 2009-07-09
TW200734750A (en) 2007-09-16
CN101379344A (en) 2009-03-04
CN101379344B (en) 2013-08-28
WO2007089599A2 (en) 2007-08-09
US20070177380A1 (en) 2007-08-02
KR20080091784A (en) 2008-10-14
US7572031B2 (en) 2009-08-11
EP1996860A2 (en) 2008-12-03

Similar Documents

Publication Publication Date Title
WO2007089599A3 (en) Led illumination assembly with compliant foil construction
WO2007109474A3 (en) Illumination assembly with enhanced thermal conductivity
JP2009525614A5 (en)
WO2009051376A3 (en) Light emitting device and method for fabricating the same
WO2006052330A3 (en) Illumination assembly with circuitized strips
WO2009021741A3 (en) Organic electronic components
EP1926145A3 (en) Self-aligned through vias for chip stacking
WO2012061183A3 (en) Flexible led device for thermal management and method of making
WO2009014376A3 (en) Light emitting device package and method of manufacturing the same
WO2008051596A3 (en) Solid state light sheet and encapsulated bare die semiconductor circuits
WO2007004115A3 (en) Organic electronic device and method for manufacture thereof
WO2007056169A3 (en) Electrical connector on a flexible carrier
WO2011031417A3 (en) Electronic device submounts with thermally conductive vias and light emitting devices including the same
WO2005045947A3 (en) Segmented organic light emitting device
WO2011094303A3 (en) hBN INSULATOR LAYERS AND ASSOCIATED METHODS
WO2007130358A3 (en) Plastic led bulb
TW200644725A (en) Transparent electric conductor
WO2009028860A3 (en) Light emitting device and method for fabricating the same
WO2012040019A3 (en) Flexible distributed led-based light source and method for making the same
TW200725880A (en) Semiconductor piezoresistive sensor and operation method thereof
EP1826834A3 (en) Light emitting device package and method of manufacturing the same
TW200718299A (en) Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method
WO2010128021A3 (en) Solar cell, solar module comprising said solar cell and method for producing the same and for producing a contact foil
EP2180532A3 (en) Semiconductor light emitting device
TW200607083A (en) Display device and method of manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2008553272

Country of ref document: JP

Ref document number: 1020087018759

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 200780004037.X

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2007762789

Country of ref document: EP