WO2007023422A3 - Inspection method and inspection device for substrates - Google Patents

Inspection method and inspection device for substrates Download PDF

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Publication number
WO2007023422A3
WO2007023422A3 PCT/IB2006/052825 IB2006052825W WO2007023422A3 WO 2007023422 A3 WO2007023422 A3 WO 2007023422A3 IB 2006052825 W IB2006052825 W IB 2006052825W WO 2007023422 A3 WO2007023422 A3 WO 2007023422A3
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
substrate
substrates
wafer interconnects
contacting
Prior art date
Application number
PCT/IB2006/052825
Other languages
French (fr)
Other versions
WO2007023422A2 (en
Inventor
Ralf Dorscheid
Gereon Vogtmeier
Roger Steadman
Original Assignee
Philips Intellectual Property
Koninkl Philips Electronics Nv
Ralf Dorscheid
Gereon Vogtmeier
Roger Steadman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Intellectual Property, Koninkl Philips Electronics Nv, Ralf Dorscheid, Gereon Vogtmeier, Roger Steadman filed Critical Philips Intellectual Property
Publication of WO2007023422A2 publication Critical patent/WO2007023422A2/en
Publication of WO2007023422A3 publication Critical patent/WO2007023422A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes

Abstract

An inspection method for through- wafer interconnects of a through- wafer interconnects substrate (105) the substrate having a front-side and a back-side on which back-side at least one contact (218) is formed, comprises the steps of placing a multi-contact foil (108) on the back-side and contacting the multi-contact foil (108) with a contacting substrate (109). An inspection device (107) for a through-wafer interconnects substrate (105) comprising a multi-contact foil (108) contactable to a through-wafer interconnects substrate (105) and contacted to a contacting substrate (105).
PCT/IB2006/052825 2005-08-26 2006-08-16 Inspection method and inspection device for substrates WO2007023422A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05107847 2005-08-26
EP05107847.5 2005-08-26

Publications (2)

Publication Number Publication Date
WO2007023422A2 WO2007023422A2 (en) 2007-03-01
WO2007023422A3 true WO2007023422A3 (en) 2007-05-31

Family

ID=37715236

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/052825 WO2007023422A2 (en) 2005-08-26 2006-08-16 Inspection method and inspection device for substrates

Country Status (1)

Country Link
WO (1) WO2007023422A2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230348A2 (en) * 1986-01-07 1987-07-29 Hewlett-Packard Company Test probe
US20040211589A1 (en) * 2003-04-24 2004-10-28 Industrial Technology Research Institute High conducting thin-film nanoprobe card and its fabrication method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230348A2 (en) * 1986-01-07 1987-07-29 Hewlett-Packard Company Test probe
US20040211589A1 (en) * 2003-04-24 2004-10-28 Industrial Technology Research Institute High conducting thin-film nanoprobe card and its fabrication method

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CHENG C H ET AL: "Electrical through-wafer interconnects with sub-picoFarad parasitic capacitance", MICROELECTROMECHANICAL SYSTEMS CONFERENCE, 2001 24-26 AUGUST 2001, PISCATAWAY, NJ, USA,IEEE, 24 August 2001 (2001-08-24), pages 18 - 21, XP010585414, ISBN: 0-7803-7224-7 *
DENG CHUN ET AL: "A MEMS based interposer for nano-wafer level packaging test", ELECTRONICS PACKAGING TECHNOLOGY, 2003 5TH CONFERENCE (EPTC 2003) DEC. 10-12, 2003, PISCATAWAY, NJ, USA,IEEE, 10 December 2003 (2003-12-10), pages 405 - 409, XP010687384, ISBN: 0-7803-8205-6 *
KONDOH Y ET AL: "UNIVERSAL MEMBRANE PROBE FOR KNOWN GOOD DIE", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING, INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, US, vol. 17, no. 4, 1 October 1994 (1994-10-01), pages 323 - 329, XP000497394, ISSN: 1063-1674 *

Also Published As

Publication number Publication date
WO2007023422A2 (en) 2007-03-01

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