WO2007016196A3 - Directed purge for contact free drying of wafers - Google Patents

Directed purge for contact free drying of wafers Download PDF

Info

Publication number
WO2007016196A3
WO2007016196A3 PCT/US2006/029103 US2006029103W WO2007016196A3 WO 2007016196 A3 WO2007016196 A3 WO 2007016196A3 US 2006029103 W US2006029103 W US 2006029103W WO 2007016196 A3 WO2007016196 A3 WO 2007016196A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafers
substrate
contact free
free drying
processing
Prior art date
Application number
PCT/US2006/029103
Other languages
French (fr)
Other versions
WO2007016196A2 (en
Inventor
Victor Mimken
Yongqiang Lu
Original Assignee
Applied Materials Inc
Victor Mimken
Yongqiang Lu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Victor Mimken, Yongqiang Lu filed Critical Applied Materials Inc
Priority to EP06788607A priority Critical patent/EP1915775A2/en
Publication of WO2007016196A2 publication Critical patent/WO2007016196A2/en
Publication of WO2007016196A3 publication Critical patent/WO2007016196A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Abstract

The present invention generally provides a method and apparatus for processing a substrate in a wet processing chamber. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus comprises a gas delivery assembly disposed outside the chamber. The gas delivery assembly directs a gas towards areas where a substrate support contacts the substrate.
PCT/US2006/029103 2005-07-27 2006-07-26 Directed purge for contact free drying of wafers WO2007016196A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06788607A EP1915775A2 (en) 2005-07-27 2006-07-26 Directed purge for contact free drying of wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70325905P 2005-07-27 2005-07-27
US60/703,259 2005-07-27

Publications (2)

Publication Number Publication Date
WO2007016196A2 WO2007016196A2 (en) 2007-02-08
WO2007016196A3 true WO2007016196A3 (en) 2007-04-19

Family

ID=37709152

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/029103 WO2007016196A2 (en) 2005-07-27 2006-07-26 Directed purge for contact free drying of wafers

Country Status (4)

Country Link
EP (1) EP1915775A2 (en)
KR (1) KR100942333B1 (en)
TW (1) TW200709290A (en)
WO (1) WO2007016196A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9728428B2 (en) 2013-07-01 2017-08-08 Applied Materials, Inc. Single use rinse in a linear Marangoni drier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6726848B2 (en) * 2001-12-07 2004-04-27 Scp Global Technologies, Inc. Apparatus and method for single substrate processing
US6843855B2 (en) * 2002-03-12 2005-01-18 Applied Materials, Inc. Methods for drying wafer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6726848B2 (en) * 2001-12-07 2004-04-27 Scp Global Technologies, Inc. Apparatus and method for single substrate processing
US6843855B2 (en) * 2002-03-12 2005-01-18 Applied Materials, Inc. Methods for drying wafer

Also Published As

Publication number Publication date
TW200709290A (en) 2007-03-01
EP1915775A2 (en) 2008-04-30
WO2007016196A2 (en) 2007-02-08
KR100942333B1 (en) 2010-02-12
KR20080029008A (en) 2008-04-02

Similar Documents

Publication Publication Date Title
WO2008020267A3 (en) Etch method in the manufacture of an integrated circuit
AU2001290171A1 (en) High pressure processing chamber for semiconductor substrate
PL1952427T3 (en) Apparatus and method for wet-chemical processing of flat, thin substrates in a continuous method
EP1583156A3 (en) Ultraviolet sensor and method for manufacturing the same
EP2009681A3 (en) Methods for high temperature etching a high-k material gate structure
TW200729390A (en) Method for making semiconductor wafer
EP1733422A4 (en) Plasma chamber having plasma source coil and method for etching the wafer using the same
TW200737555A (en) Light-emitting device and method for manufacturing the same
TW200711029A (en) Substrate processing apparatus and substrate stage used therein
AU2003292678A1 (en) Plasma generator, ozone generator, substrate processing apparatus, and method for manufacturing semiconductor device
TWI317675B (en) Processing chamber for processing a semiconductor wafer during hign pressure processing
WO2007027436A3 (en) Processing thin wafers
TW200802667A (en) Vacuum processing chamber suitable for etching high aspect ratio features and components of same
TW200644140A (en) Substrate processing apparatus
WO2007027458A3 (en) Batch deposition tool and compressed boat
TW200636809A (en) Gas baffle and distributor for semiconductor processing chamber
NO20083168L (en) Apparatus, system and method for surface treatment of substrates
TWI346989B (en) Batch type of semiconductor manufacturing device,and loading/unloading method and apparatus of semiconductor substrate
EP1898456A4 (en) Plasma nitriding method, method for manufacturing semiconductor device and plasma processing apparatus
SG132602A1 (en) Apparatus and methods for slurry cleaning of etch chambers
TW200708172A (en) Substrate stage mechanism and substrate processing apparatus
TW200741953A (en) Substrate processing device and manufacturing method of semiconductor device
TW200632575A (en) Stage device and exposure apparatus
TW200607874A (en) Sputtering device with gas injection assembly
EP1501961A4 (en) High pressure processing chamber for multiple semiconductor substrates

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087004561

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2006788607

Country of ref document: EP