WO2006126218A1 - Vacuum system for wafer handling - Google Patents
Vacuum system for wafer handling Download PDFInfo
- Publication number
- WO2006126218A1 WO2006126218A1 PCT/IT2005/000301 IT2005000301W WO2006126218A1 WO 2006126218 A1 WO2006126218 A1 WO 2006126218A1 IT 2005000301 W IT2005000301 W IT 2005000301W WO 2006126218 A1 WO2006126218 A1 WO 2006126218A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- suction
- suction pipe
- valve
- tool
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IT2005/000301 WO2006126218A1 (en) | 2005-05-26 | 2005-05-26 | Vacuum system for wafer handling |
JP2008513010A JP2008542037A (en) | 2005-05-26 | 2005-05-26 | Wafer handling vacuum system |
US11/912,753 US20080199281A1 (en) | 2005-05-26 | 2005-05-26 | Vacuum System For Wafer Handling |
CNA2005800499080A CN101199048A (en) | 2005-05-26 | 2005-05-26 | For crystal plate operation |
EP05761366A EP1883959A1 (en) | 2005-05-26 | 2005-05-26 | Vacuum system for wafer handling |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IT2005/000301 WO2006126218A1 (en) | 2005-05-26 | 2005-05-26 | Vacuum system for wafer handling |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006126218A1 true WO2006126218A1 (en) | 2006-11-30 |
Family
ID=34972607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IT2005/000301 WO2006126218A1 (en) | 2005-05-26 | 2005-05-26 | Vacuum system for wafer handling |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080199281A1 (en) |
EP (1) | EP1883959A1 (en) |
JP (1) | JP2008542037A (en) |
CN (1) | CN101199048A (en) |
WO (1) | WO2006126218A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102233548A (en) * | 2010-04-29 | 2011-11-09 | 中芯国际集成电路制造(上海)有限公司 | Vacuum chuck |
CN105280516A (en) * | 2014-05-27 | 2016-01-27 | 海太半导体(无锡)有限公司 | Scraper pressure control system for semiconductor packaging |
CN110902392A (en) * | 2019-12-31 | 2020-03-24 | 常熟中信建材有限公司 | A sucker structure for transferring glass safely |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008001314A1 (en) * | 2008-04-22 | 2009-10-29 | Robert Bosch Gmbh | Device for moving and positioning an object in space |
DE102010049192B4 (en) * | 2010-10-21 | 2014-07-03 | Multivac Sepp Haggenmüller Gmbh & Co. Kg | Gripper system and method for gripping and lifting objects |
DE102010052396A1 (en) | 2010-11-24 | 2012-05-24 | Kuka Roboter Gmbh | Method and device for controlling a peripheral component of a robot system |
CN102509716B (en) * | 2011-12-02 | 2013-10-16 | 无锡先导自动化设备股份有限公司 | Silicon chip taking and placing device |
JP6426415B2 (en) * | 2014-09-19 | 2018-11-21 | 株式会社イシダ | Mass measuring device |
US11420831B2 (en) * | 2018-12-11 | 2022-08-23 | Nike, Inc. | Item pick-up system |
JP6949893B2 (en) * | 2019-03-07 | 2021-10-13 | Ckd株式会社 | Adsorption buffer |
WO2020246268A1 (en) * | 2019-06-04 | 2020-12-10 | 東京エレクトロン株式会社 | Substrate temperature control device and substrate temperature control method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000048234A1 (en) * | 1999-02-12 | 2000-08-17 | Lpe S.P.A. | Device and method for handling substrates by means of a self-levelling vacuum system in epitaxial induction reactors |
WO2003030222A2 (en) * | 2001-09-27 | 2003-04-10 | Lpe Spa | Tool for handling wafers and epitaxial growth station |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4767257A (en) * | 1985-12-23 | 1988-08-30 | Mitsubishi Denki Kabushiki Kaisha | Industrial robot |
JP4582484B2 (en) * | 2006-12-20 | 2010-11-17 | Smc株式会社 | Vacuum adsorption device |
-
2005
- 2005-05-26 WO PCT/IT2005/000301 patent/WO2006126218A1/en not_active Application Discontinuation
- 2005-05-26 EP EP05761366A patent/EP1883959A1/en not_active Withdrawn
- 2005-05-26 CN CNA2005800499080A patent/CN101199048A/en active Pending
- 2005-05-26 US US11/912,753 patent/US20080199281A1/en not_active Abandoned
- 2005-05-26 JP JP2008513010A patent/JP2008542037A/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000048234A1 (en) * | 1999-02-12 | 2000-08-17 | Lpe S.P.A. | Device and method for handling substrates by means of a self-levelling vacuum system in epitaxial induction reactors |
WO2003030222A2 (en) * | 2001-09-27 | 2003-04-10 | Lpe Spa | Tool for handling wafers and epitaxial growth station |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102233548A (en) * | 2010-04-29 | 2011-11-09 | 中芯国际集成电路制造(上海)有限公司 | Vacuum chuck |
CN105280516A (en) * | 2014-05-27 | 2016-01-27 | 海太半导体(无锡)有限公司 | Scraper pressure control system for semiconductor packaging |
CN110902392A (en) * | 2019-12-31 | 2020-03-24 | 常熟中信建材有限公司 | A sucker structure for transferring glass safely |
Also Published As
Publication number | Publication date |
---|---|
EP1883959A1 (en) | 2008-02-06 |
US20080199281A1 (en) | 2008-08-21 |
CN101199048A (en) | 2008-06-11 |
JP2008542037A (en) | 2008-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1883959A1 (en) | Vacuum system for wafer handling | |
US8288288B1 (en) | Transferring heat in loadlocks | |
US7155319B2 (en) | Closed loop control on liquid delivery system ECP slim cell | |
US6068014A (en) | Pressure-reducing valve | |
CN101985745B (en) | Chemical vapor deposition (CVD) apparatus and substrate processing apparatus | |
US7658200B2 (en) | Semiconductor manufacturing apparatus and control method thereof | |
US6131307A (en) | Method and device for controlling pressure and flow rate | |
US20090250000A1 (en) | Vacuum processing apparatus | |
KR20010021330A (en) | Vacuum Operation Apparatus | |
TW201810421A (en) | Vacuum processing apparatus, vacuum processing method and storage medium stably performing pressure control in a wide pressure range when carrying out a vacuum treatment on an object to be processed in a processing container | |
CN114688446A (en) | Pressure adjusting device and substrate processing apparatus provided with same | |
US6701972B2 (en) | Vacuum load lock, system including vacuum load lock, and associated methods | |
KR100315134B1 (en) | Heat treatment device and valve device used therein | |
KR101728933B1 (en) | Process chamber pressure control system and method | |
JP2010520529A (en) | Fluid flow control device | |
KR20080031856A (en) | Vacuum system for wafer handling | |
JP4663110B2 (en) | Processing equipment | |
EP1430516B1 (en) | Tool for handling wafers and epitaxial growth station | |
JPH09189290A (en) | Vacuum processing device | |
JPH0969515A (en) | Vacuum processing system for semiconductor production system | |
KR101803016B1 (en) | Gas Flow Control Apparatus | |
KR0129789Y1 (en) | Automatic control device for chamber pressure | |
JP2006287110A (en) | Method for manufacturing semiconductor device | |
CN111102365A (en) | Fluid regulator | |
KR200248852Y1 (en) | Apparatus for controlling a chamber gas pressure in a semiconductor processing unit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
DPE2 | Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 11912753 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2005761366 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 8906/DELNP/2007 Country of ref document: IN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008513010 Country of ref document: JP Ref document number: 200580049908.0 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020077027595 Country of ref document: KR |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: DE |
|
ENP | Entry into the national phase |
Ref document number: 2007148909 Country of ref document: RU Kind code of ref document: A |
|
WWP | Wipo information: published in national office |
Ref document number: 2005761366 Country of ref document: EP |