WO2006104842A3 - Apparatus for servicing a plasma processing system with a robot - Google Patents

Apparatus for servicing a plasma processing system with a robot Download PDF

Info

Publication number
WO2006104842A3
WO2006104842A3 PCT/US2006/010577 US2006010577W WO2006104842A3 WO 2006104842 A3 WO2006104842 A3 WO 2006104842A3 US 2006010577 W US2006010577 W US 2006010577W WO 2006104842 A3 WO2006104842 A3 WO 2006104842A3
Authority
WO
WIPO (PCT)
Prior art keywords
robot
platform
processing system
docking
plasma processing
Prior art date
Application number
PCT/US2006/010577
Other languages
French (fr)
Other versions
WO2006104842B1 (en
WO2006104842A2 (en
Inventor
Andrew D Bailey Iii
Original Assignee
Lam Res Corp
Andrew D Bailey Iii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp, Andrew D Bailey Iii filed Critical Lam Res Corp
Priority to KR1020107024451A priority Critical patent/KR101311471B1/en
Priority to CN2006800105223A priority patent/CN101175612B/en
Priority to JP2008504174A priority patent/JP2008535256A/en
Priority to KR1020077024136A priority patent/KR101337850B1/en
Publication of WO2006104842A2 publication Critical patent/WO2006104842A2/en
Publication of WO2006104842A3 publication Critical patent/WO2006104842A3/en
Publication of WO2006104842B1 publication Critical patent/WO2006104842B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J5/00—Manipulators mounted on wheels or on carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/49723—Repairing with disassembling including reconditioning of part

Abstract

A robot apparatus for executing a set of service procedures on a plasma processing system including a docking port is disclosed. The apparatus includes a platform and a docking probe coupled to the platform, wherein the docking probe is configured to dock with the docking port. The apparatus also includes a robot arm coupled to the platform, and further configured to substantially perform the set of service procedures, and a tool coupled to the robot arm. The apparatus further includes a computer coupled to the platform, wherein the computer is further configured to execute the set of service procedures, and wherein when the docking probe is docked to the docking port, the set of service procedures is performed by the tool.
PCT/US2006/010577 2005-03-28 2006-03-24 Apparatus for servicing a plasma processing system with a robot WO2006104842A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020107024451A KR101311471B1 (en) 2005-03-28 2006-03-24 Apparatus for servicing a plasma processing system with a robot
CN2006800105223A CN101175612B (en) 2005-03-28 2006-03-24 Apparatus for servicing a plasma processing system with a robot
JP2008504174A JP2008535256A (en) 2005-03-28 2006-03-24 Maintenance device for plasma processing system using robot
KR1020077024136A KR101337850B1 (en) 2005-03-28 2006-03-24 Apparatus for servicing a plasma processing system with a robot

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/092,848 US20060218680A1 (en) 2005-03-28 2005-03-28 Apparatus for servicing a plasma processing system with a robot
US11/092,848 2005-03-28

Publications (3)

Publication Number Publication Date
WO2006104842A2 WO2006104842A2 (en) 2006-10-05
WO2006104842A3 true WO2006104842A3 (en) 2007-11-08
WO2006104842B1 WO2006104842B1 (en) 2008-01-03

Family

ID=37036752

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/010577 WO2006104842A2 (en) 2005-03-28 2006-03-24 Apparatus for servicing a plasma processing system with a robot

Country Status (6)

Country Link
US (2) US20060218680A1 (en)
JP (1) JP2008535256A (en)
KR (2) KR101337850B1 (en)
CN (2) CN101817179B (en)
TW (1) TWI412444B (en)
WO (1) WO2006104842A2 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7833834B2 (en) * 2004-09-30 2010-11-16 Sharp Kabushiki Kaisha Method for producing nitride semiconductor laser light source and apparatus for producing nitride semiconductor laser light source
US7959984B2 (en) 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
US20100057254A1 (en) * 2006-11-13 2010-03-04 Salamanca Hugo P Methods for using robotics in mining and post-mining processing
US20090177324A1 (en) * 2005-11-10 2009-07-09 Hugo Salamanca Robot system and method for maxibags sampling in ore concentration processes
US20090099688A1 (en) * 2005-11-10 2009-04-16 Hugo Salamanca Integral robot system and method for the dislodging process and/or anode handling from casting wheels
KR100869359B1 (en) * 2006-09-28 2008-11-19 주식회사 하이닉스반도체 Method for fabricating recess gate in semiconductor device
DE102007022431A1 (en) * 2007-05-09 2008-11-13 Leybold Optics Gmbh Plasma-coating assembly for flat surfaces e.g. thin film solar cells has moving electrode and fixed electrode
US8224607B2 (en) 2007-08-30 2012-07-17 Applied Materials, Inc. Method and apparatus for robot calibrations with a calibrating device
US8260461B2 (en) * 2007-08-30 2012-09-04 Applied Materials, Inc. Method and system for robot calibrations with a camera
US20100014748A1 (en) * 2008-07-21 2010-01-21 International Business Machines Corporation Method and apparatus for real time fault detection in high speed semiconductor processes
JP4763074B2 (en) * 2009-08-03 2011-08-31 ファナック株式会社 Measuring device and measuring method of position of tool tip of robot
US8372211B2 (en) * 2009-09-15 2013-02-12 Quantum Global Technologies, Llc Method and apparatus for showerhead cleaning
US9643316B2 (en) 2009-10-27 2017-05-09 Battelle Memorial Institute Semi-autonomous multi-use robot system and method of operation
TWI426579B (en) * 2010-02-01 2014-02-11 Hermes Epitek Corp Semiconductor equipment and method for cleaning semiconductor equipment
KR101794069B1 (en) * 2010-05-26 2017-12-04 삼성전자주식회사 equipment for manufacturing semiconductor device and seasoning process optimization method of the same
US9171305B2 (en) 2012-10-16 2015-10-27 Rockwell Automation Technologies Providing confined space permits and confined space access procedures
US9201940B2 (en) * 2012-10-16 2015-12-01 Rockwell Automation Technologies Providing procedures
US9400495B2 (en) 2012-10-16 2016-07-26 Rockwell Automation Technologies, Inc. Industrial automation equipment and machine procedure simulation
TWI483217B (en) * 2013-02-01 2015-05-01 Nat Univ Chin Yi Technology Intelligent image monitoring vehicle service station system
JP6127728B2 (en) * 2013-05-30 2017-05-17 三星ダイヤモンド工業株式会社 Brittle material substrate transfer head
US10350766B2 (en) * 2015-09-21 2019-07-16 GM Global Technology Operations LLC Extended-reach assist device for performing assembly tasks
JP2017163088A (en) * 2016-03-11 2017-09-14 東芝メモリ株式会社 Substrate processing device and method for controlling substrate processing device
CN105862635B (en) * 2016-04-12 2017-08-25 山东国兴智能科技有限公司 Suitable for the retractable full-automatic sweeping robot and method of work of highway
US10371646B2 (en) * 2016-09-19 2019-08-06 The Boeing Company Method and system for automated data collection and part validation
JP6812264B2 (en) * 2017-02-16 2021-01-13 東京エレクトロン株式会社 Vacuum processing equipment and maintenance equipment
JP6502983B2 (en) * 2017-03-15 2019-04-17 ファナック株式会社 Cleaning process optimization device and machine learning device
US11084169B2 (en) * 2018-05-23 2021-08-10 General Electric Company System and method for controlling a robotic arm
US11056371B2 (en) * 2018-08-14 2021-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Tool and method for cleaning electrostatic chuck
US11211232B2 (en) * 2018-10-29 2021-12-28 Taiwan Semiconductor Manufacturing Co., Ltd. Methods for cleaning semiconductor device manufacturing apparatus
CN115916481A (en) * 2020-03-03 2023-04-04 朗姆研究公司 Cooperative robotic system on mobile cart with room docking system
JP7419154B2 (en) 2020-05-01 2024-01-22 東京エレクトロン株式会社 Parts replacement system and equipment
WO2023149958A1 (en) * 2022-02-04 2023-08-10 Lam Research Corporation Portable robot for semiconductor equipment maintenance tasks

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4610075A (en) * 1983-12-01 1986-09-09 Asea Aktiebolag Tool holder for industrial robots
US6139697A (en) * 1997-01-31 2000-10-31 Applied Materials, Inc. Low temperature integrated via and trench fill process and apparatus
US20020121291A1 (en) * 2001-03-03 2002-09-05 Daum Wolfgang R.A. Method and device to clean the interior room of a car
US20030186566A1 (en) * 2002-04-01 2003-10-02 Fujitsu Limited Contactor, method for manufacturing such contactor, and testing method using such contactor
US20030207655A1 (en) * 2001-03-13 2003-11-06 Jackson David P Dense fluid spray cleaning process and apparatus
US20040134519A1 (en) * 2002-11-01 2004-07-15 Samsung Electronics Co., Ltd. Dishwasher and method of controlling the same

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594111A (en) * 1984-10-04 1986-06-10 Coonan Edmund C Liquid phase cleaner-solvent
EP0192014B1 (en) * 1985-02-20 1988-12-07 GebràœDer Sulzer Aktiengesellschaft Cleaning apparatus for textile machines
JPS6358834A (en) 1986-08-27 1988-03-14 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション Sputtering apparatus
JPH03185824A (en) * 1989-12-15 1991-08-13 Sony Corp Chamber and chamber system using same
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
JPH081923B2 (en) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 Clean transfer method and device
JPH06272027A (en) * 1993-03-17 1994-09-27 Fuji Photo Film Co Ltd Method for automatically cleaning vacuum deposition tank and device therefor
JPH0831906A (en) * 1994-07-08 1996-02-02 Sony Corp Substrate process system
JPH0851098A (en) * 1994-08-08 1996-02-20 Mitsubishi Electric Corp Semiconductor treatment device
JP2778574B2 (en) * 1995-03-30 1998-07-23 日本電気株式会社 Semiconductor manufacturing equipment
TW327236B (en) 1996-03-12 1998-02-21 Varian Associates Inductively coupled plasma reactor with faraday-sputter shield
KR100476039B1 (en) * 1996-03-18 2005-07-11 비오이 하이디스 테크놀로지 주식회사 Inductively Coupled Plasma CVD Equipment
US6135697A (en) * 1997-01-30 2000-10-24 Siemens Electrocom, L.P. Transfer of cartridges containing flat articles
US6521081B2 (en) * 1997-12-05 2003-02-18 Tegal Corporation Deposition shield for a plasma reactor
US6120660A (en) * 1998-02-11 2000-09-19 Silicon Genesis Corporation Removable liner design for plasma immersion ion implantation
US6287435B1 (en) * 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6388382B1 (en) * 1999-03-09 2002-05-14 Hitachi, Ltd. Plasma processing apparatus and method
JP2000306973A (en) 1999-04-19 2000-11-02 Tokyo Electron Ltd Treatment system
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
JP3527450B2 (en) * 1999-12-22 2004-05-17 東京エレクトロン株式会社 Processing equipment
JP2001246331A (en) * 2000-03-08 2001-09-11 Sharp Corp Cleaning device
US6764367B2 (en) * 2000-10-27 2004-07-20 Science Applications International Corporation Liquid manufacturing processes for panel layer fabrication
US20020100557A1 (en) * 2001-01-29 2002-08-01 Applied Materials, Inc. ICP window heater integrated with faraday shield or floating electrode between the source power coil and the ICP window
US20020108634A1 (en) * 2001-02-15 2002-08-15 Mcmullen Daniel Substrate cleaning process and apparatus
US6606784B1 (en) * 2001-03-13 2003-08-19 Ford Global Technologies, Llc Pallet system
US6830622B2 (en) * 2001-03-30 2004-12-14 Lam Research Corporation Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof
KR100420171B1 (en) * 2001-08-07 2004-03-02 삼성광주전자 주식회사 Robot cleaner and system therewith and method of driving thereof
WO2003029513A1 (en) 2001-09-28 2003-04-10 Tokyo Electron Limited Hybrid plasma processing apparatus
JP3971603B2 (en) * 2001-12-04 2007-09-05 キヤノンアネルバ株式会社 Insulating film etching apparatus and insulating film etching method
JP3896469B2 (en) * 2001-12-07 2007-03-22 Ｄｏｗａホールディングス株式会社 Cleaning method and apparatus for semiconductor thin film manufacturing apparatus
JP4220173B2 (en) * 2002-03-26 2009-02-04 株式会社日立ハイテクノロジーズ Substrate transport method
JP2003311555A (en) * 2002-04-25 2003-11-05 Okuma Corp Screwing apparatus
US20050012380A1 (en) * 2002-08-05 2005-01-20 Ray Barnes Barnes & Barnes neck reliever
TW575919B (en) * 2002-08-27 2004-02-11 Hitachi High Tech Corp Plasma treating apparatus and plasma treating method
US7137353B2 (en) * 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US7434601B2 (en) * 2002-12-23 2008-10-14 Catalyst Services, Inc. Cleaning and/or inspecting robot for hazardous environments including catalyst removal
JP2005039015A (en) * 2003-07-18 2005-02-10 Hitachi High-Technologies Corp Method and apparatus for plasma processing
US7241397B2 (en) * 2004-03-30 2007-07-10 Tokyo Electron Limited Honeycomb optical window deposition shield and method for a plasma processing system
US20050241669A1 (en) * 2004-04-29 2005-11-03 Tokyo Electron Limited Method and system of dry cleaning a processing chamber
US7578945B2 (en) * 2004-09-27 2009-08-25 Lam Research Corporation Method and apparatus for tuning a set of plasma processing steps
US7959984B2 (en) * 2004-12-22 2011-06-14 Lam Research Corporation Methods and arrangement for the reduction of byproduct deposition in a plasma processing system
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4610075A (en) * 1983-12-01 1986-09-09 Asea Aktiebolag Tool holder for industrial robots
US6139697A (en) * 1997-01-31 2000-10-31 Applied Materials, Inc. Low temperature integrated via and trench fill process and apparatus
US20020121291A1 (en) * 2001-03-03 2002-09-05 Daum Wolfgang R.A. Method and device to clean the interior room of a car
US20030207655A1 (en) * 2001-03-13 2003-11-06 Jackson David P Dense fluid spray cleaning process and apparatus
US20030186566A1 (en) * 2002-04-01 2003-10-02 Fujitsu Limited Contactor, method for manufacturing such contactor, and testing method using such contactor
US20040134519A1 (en) * 2002-11-01 2004-07-15 Samsung Electronics Co., Ltd. Dishwasher and method of controlling the same

Also Published As

Publication number Publication date
US20060218680A1 (en) 2006-09-28
WO2006104842B1 (en) 2008-01-03
KR20070114395A (en) 2007-12-03
KR101337850B1 (en) 2013-12-06
TWI412444B (en) 2013-10-21
KR20110002066A (en) 2011-01-06
KR101311471B1 (en) 2013-09-25
US8764907B2 (en) 2014-07-01
CN101817179A (en) 2010-09-01
WO2006104842A2 (en) 2006-10-05
CN101175612B (en) 2013-03-20
CN101817179B (en) 2013-04-10
TW200702124A (en) 2007-01-16
JP2008535256A (en) 2008-08-28
US20100024186A1 (en) 2010-02-04
CN101175612A (en) 2008-05-07

Similar Documents

Publication Publication Date Title
WO2006104842A3 (en) Apparatus for servicing a plasma processing system with a robot
CN102198659B (en) Gripping judgment means and gripping determination methods
EP3989841A4 (en) Systems and methods for robotic arm alignment and docking
WO2008008727A3 (en) Scheduling method for processing equipment
WO2007065307A3 (en) Handling a device related operation in a virtualization environment
WO2010110962A3 (en) System and method of managing the execution of applications at a portable computing device and a portable computing device docking station
WO2007149712A3 (en) System and method for transporting inventory items
TW200643670A (en) Robot locus control method and apparatus and program of robot locus control method
WO2011093837A3 (en) Method and apparatus for detecting hold condition on an acoustic touch surface
WO2009065831A3 (en) Robot, medical work station, and method for projecting an image onto the surface of an object
WO2006113418A3 (en) Apparatus and process for a universal diagnostic monitor module on a wireless device
EP2333626A3 (en) Automated positioning and alignment method and system for aircraft structures using robots
WO2011094092A3 (en) Robotic end effector system and method
WO2012177340A9 (en) Automated ply layup system and method of laying up
WO2007127270A3 (en) Robotic system with autonomously operable tools
WO2007146177A3 (en) Wagering game system with docking stations
EP2085849A3 (en) Method and system for manufacturing an article using portable hand-held tools
WO2013052187A3 (en) On-board tool tracking system and methods of computer assisted surgery
WO2007149628A3 (en) Robotic gripper for transporting multiple object types
WO2011135282A3 (en) Coordinate measuring machine with interchangeable task module counterweight
WO2011071963A3 (en) Apparatus, methods, components, and systems for assembling and/or inflating a tire-wheel assembly
WO2008087702A1 (en) Device and method for automatically assembling parts
WO2009086027A3 (en) Systems and methods for calibrating end effector alignment in a plasma processing system
MX2012010435A (en) Positioning device, working system, and hot working apparatus.
WO2008054619A3 (en) System and method for sharing atrusted platform module

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680010522.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
ENP Entry into the national phase

Ref document number: 2008504174

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020077024136

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06739393

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 1020107024451

Country of ref document: KR