WO2006080359A1 - Dispositif capteur d’image - Google Patents

Dispositif capteur d’image Download PDF

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Publication number
WO2006080359A1
WO2006080359A1 PCT/JP2006/301155 JP2006301155W WO2006080359A1 WO 2006080359 A1 WO2006080359 A1 WO 2006080359A1 JP 2006301155 W JP2006301155 W JP 2006301155W WO 2006080359 A1 WO2006080359 A1 WO 2006080359A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
solid
imaging device
signal processing
image pickup
Prior art date
Application number
PCT/JP2006/301155
Other languages
English (en)
Japanese (ja)
Inventor
Kazunari Ueda
Jun Asakura
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO2006080359A1 publication Critical patent/WO2006080359A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Definitions

  • the present invention relates to an imaging device, and more particularly, to an imaging device useful as an imaging means for a mobile terminal device such as a mobile phone, a portable information terminal, a DVC (Digital Video Camera) equipped with an image sensor and a signal processing IC. .
  • a mobile terminal device such as a mobile phone, a portable information terminal, a DVC (Digital Video Camera) equipped with an image sensor and a signal processing IC.
  • DVC Digital Video Camera
  • FIG. 1 As an imaging apparatus that meets such a demand, for example, an imaging apparatus as shown in FIG. 1 is known (see, for example, Patent Document 1).
  • a conventional imaging device 10 includes a transparent substrate 11, a solid-state imaging device 31, and peripheral I.
  • It consists of C chip 41, printed wiring board 51, lead part 54, chip part 57, lens holder 81, lens 91, and the like.
  • the solid-state image sensor 31 has a bump contact with the light receiving surface facing the transparent substrate 11. The alloy is joined afterwards. On the solid-state image sensor 31, an image photographed by the imaging device 10 is formed through the lens 91 and the transparent substrate 11. Further, the solid-state imaging device 31 is sealed with a thermosetting resin 32.
  • the peripheral IC chip 41 also has power such as a digital signal processing IC that processes the signal output from the solid-state image sensor 31, and is bonded to the back side of the light-receiving surface of the solid-state image sensor 31 with a thermosetting resin 32. Are stacked.
  • the transparent substrate 11 and the printed wiring board 51 are bump-connected by wire bumps with the solid-state imaging device 31 and the peripheral IC chip 41 inserted into a through-hole having a saddle portion provided on the printed wiring board 51.
  • the lead electrode provided in the saddle portion of the printed wiring board 51 and the peripheral IC chip 41 are wire-bonded and connected by the wire 61! Speak.
  • the wire 61, the solid-state image sensor 31 and the peripheral IC chip 41 are sealed with a coat resin 71.
  • the lens holder 81 is attached with an adhesive 82 to the back surface of the surface of the transparent substrate 11 to which the solid-state imaging element 31 is bonded and the printed wiring board 51 with the side surface of the transparent substrate 11 as a reference.
  • Chip components 57 such as resistors and capacitors are mounted on the surface of the printed wiring board 51.
  • the imaging apparatus 10 has a structure in which the peripheral IC chip 41 is connected by the printed wiring board 51 and the wire 61, and the lens 91, the solid-state imaging device 31 and the digital signal processing IC are vertically arranged. Since it is mounted in the direction, space saving, downsizing and thinning can be achieved.
  • Patent Document 1 Japanese Patent Laid-Open No. 2002-231916
  • the image pickup apparatus described in Patent Document 1 has a complicated construction method such as wire bonding connection between a peripheral IC chip such as a digital signal processing IC and a printed wiring board, and for high performance. Cleanliness is high and needs to be installed in a location.
  • An object of the present invention is to provide an imaging apparatus that can easily be mass-produced and reduced in cost while maintaining downsizing, thinning, and high performance.
  • the image pickup apparatus of the present invention includes a solid-state image sensor, a signal processing IC chip that processes a signal output from the solid-state image sensor, and a printed board on which the solid-state image sensor is mounted.
  • the processing IC chip is mounted on a dedicated IC chip mounting substrate, and the IC chip mounting substrate is disposed on the surface of the printed board opposite to the mounting surface of the solid-state imaging device.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a conventional imaging device
  • FIG. 2 is a cross-sectional view showing a schematic configuration of an imaging apparatus according to an embodiment of the present invention.
  • FIG. 3 is a block diagram when the imaging device according to one embodiment of the present invention is connected to a mobile terminal device.
  • FIG. 2 is a cross-sectional view showing a schematic configuration of the imaging apparatus according to the embodiment of the present invention.
  • the imaging apparatus 100 includes a solid-state imaging device 101, a printed board 103, a signal processing IC chip 104, an IC chip mounting board 105, peripheral components 106, and the like.
  • FIG. 3 shows a case where the imaging device according to one embodiment of the present invention is connected to a mobile terminal device.
  • the solid-state imaging device 101 of the imaging device 100 is electrically connected to the signal processing IC chip 104.
  • the signal processing IC chip 104 of the imaging device 100 is electrically connected to the control unit 201 of the mobile terminal device 200, processes a signal output from the solid-state imaging device 101, and sends the processed signal to the control unit 201.
  • the solid-state image sensor 101 has a protrusion 102. Therefore, the solid-state image sensor 101 cannot be mounted on the printed circuit board 103 as it is.
  • protruding portion is formed on printed circuit board 103.
  • a through-hole 107 large enough to accommodate 102 is provided. And the projecting part in this through hole 107
  • a solid-state imaging device 101 is mounted on a printed circuit board 103 by an LGA (Land Grid Array).
  • LGA Land Grid Array
  • the solid-state imaging device 10 with the protruding portion 102 inserted into the through hole 107 That is, in this example, the solid-state imaging device 10 with the protruding portion 102 inserted into the through hole 107.
  • the joint 108 between the land portion 1 and the printed circuit board 103 is soldered by reflow to mount the solid-state imaging device 101 on the printed circuit board 103.
  • the signal processing IC chip 104 of the imaging device 100 needs to be electrically connected to the control unit 201 of the mobile terminal device 200 as shown in FIG.
  • the printed circuit board 103 is provided with a connector for drawing out connection wiring, an ACF (Anisotropic Conductive Film) connection portion, or the like, the board area of the printed circuit board 103 is increased.
  • ACF Anaisotropic Conductive Film
  • the printed circuit board 103 a rigid part having a rigid printed circuit board force capable of mounting components, and a flexible part having a flexible printed circuit board force capable of being bent.
  • a rigid-flex board is used as the printed circuit board 103.
  • An imaging apparatus 100 using such a printed circuit board 103 as a rigid flexible circuit board is a printed circuit board.
  • the structure can be reduced in size by reducing the area used for 103 connection wiring leads.
  • this imaging apparatus 100 does not require a connector, a cable, or the like, it is possible to reduce the total cost including the component cost and the inspection cost associated therewith. Furthermore, in this imaging apparatus 100, it is possible to reduce noise due to the antenna action at the conventional cable portion and reflection at the connection portion.
  • a bear chip IC is used as signal processing IC chip 104.
  • an IC chip mounting substrate 105 dedicated for bare chip IC is a general method for ensuring low cost and high reliability.
  • the signal processing IC chip 104 is mounted by ACF connection using a conductive film.
  • the above-mentioned IC chip mounting board 105 is soldered to the surface of the printed board 103 opposite to the mounting surface of the solid-state image sensor 101 by reflow soldering.
  • LGA mounting structure The other joint 110 between the printed circuit board 103 and the IC chip mounting board 105 is a land Z solder joint for drawing out to the control unit 201 of the mobile terminal device 200.
  • peripheral components 106 such as chip capacitors and chip resistors necessary for signal processing IC chip 104 are also mounted on IC chip mounting substrate 105. This can prevent performance degradation such as an increase in noise. Therefore, it is desirable that the size of the IC chip mounting substrate 105 in the imaging apparatus 100 of the present example is larger than the size of the solid-state imaging element 101.
  • the solid-state imaging device 101 and the IC chip mounting board 105 are mounted on the front and back of the printed board 103 and are electrically connected.
  • the pitch and position of the land for the solid-state imaging device 101 and the land for the IC chip mounting board 105 provided on the printed board 103 are determined on the front and back sides of the printed board 103. It is desirable to keep them consistent. [0040] In this way, by making the pitch and position of the lands on the front and back sides of the printed circuit board 103 coincide with each other, linear wiring from the land for the solid-state imaging device 101 to the land for the IC chip mounting substrate 105 is achieved. Therefore, it is possible to prevent unnecessary wiring and the like, and the printed circuit board 103 can be downsized.
  • An imaging device includes a solid-state imaging device, a signal processing IC chip that processes a signal output from the solid-state imaging device, and a print substrate on which the solid-state imaging device is mounted.
  • the signal processing IC chip is mounted on a dedicated IC chip mounting board, and the IC chip mounting board is disposed on the surface of the printed board opposite to the mounting surface of the solid-state imaging device. Take the configuration.
  • the signal processing IC chip is mounted on the dedicated IC chip mounting substrate, a general purpose for ensuring low cost and high reliability without using an expensive substrate is used.
  • a signal processing IC chip can be implemented by ACF connection using an anisotropic conductive film, which is a simple construction method. Therefore, according to this configuration, it is possible to easily achieve mass production and low cost while maintaining downsizing, thinning, and high performance.
  • An imaging device employs a configuration in which, in the first aspect, a peripheral component for signal processing of the signal processing IC chip is mounted on the IC chip mounting substrate.
  • peripheral components such as chip capacitors and chip resistors necessary for the signal processing IC chip are also mounted on the IC chip mounting substrate, so that performance deterioration such as noise increase can be prevented. it can.
  • An imaging device employs a configuration in which the size of the IC chip mounting substrate is larger than the size of the solid-state imaging device in the second aspect.
  • lands provided on the front and back of the printed circuit board on which the solid-state imaging device is mounted are arranged at the same position at the same pitch. Adopt the configuration. [0048] According to this configuration, since the pitches and positions of the lands on the front and back sides of the printed circuit board coincide with each other, linear wiring from the land for the solid-state imaging device to the land for the IC chip mounting board becomes possible. This can prevent unnecessary wiring and reduce the size of the printed circuit board.
  • the image pickup apparatus can be easily mass-produced and reduced in cost while maintaining downsizing, thinning, and high performance. Therefore, the image pickup device and the signal processing IC are mounted. It is useful as an imaging means for mobile terminal devices such as mobile phones, personal digital assistants, and DVCs.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)

Abstract

Dispositif capteur d’image autorisant aisément une production de masse et une diminution des coûts tout en réduisant la taille et l’épaisseur et en conservant de hautes performances. Le dispositif capteur d’image est équipé d’un élément capteur d’image à semi-conducteurs (101), d’un circuit imprimé (103) et d’une puce de CI de traitement de signal (104). La puce de CI de traitement de signal (104) traite un signal fournit par l’élément capteur d’image à semi-conducteurs (101). Le circuit imprimé (103) est composé d’un substrat souple rigide dans lequel est pratiqué un trou traversant (107) dans lequel une section protubérante (102) de la puce de CI de traitement de signal (104) peut être introduite. L’élément capteur d’image à semi-conducteurs (101) est monté directement sur une surface de la section rigide du circuit imprimé (103). La puce de CI de traitement de signal (104) est montée sur un substrat de montage de puce de CI (105) disposé à l’autre surface de la section rigide du circuit imprimé (103).
PCT/JP2006/301155 2005-01-26 2006-01-25 Dispositif capteur d’image WO2006080359A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005018112 2005-01-26
JP2005-018112 2005-01-26

Publications (1)

Publication Number Publication Date
WO2006080359A1 true WO2006080359A1 (fr) 2006-08-03

Family

ID=36740389

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/301155 WO2006080359A1 (fr) 2005-01-26 2006-01-25 Dispositif capteur d’image

Country Status (1)

Country Link
WO (1) WO2006080359A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074879A (ja) * 1983-09-30 1985-04-27 Olympus Optical Co Ltd 固体撮像装置
JPS6074880A (ja) * 1983-09-30 1985-04-27 Olympus Optical Co Ltd 固体撮像装置
JPH1032323A (ja) * 1996-05-17 1998-02-03 Sony Corp 固体撮像装置とそれを用いたカメラ
JPH1084509A (ja) * 1996-09-06 1998-03-31 Matsushita Electron Corp 撮像装置およびその製造方法
JP2001292363A (ja) * 2000-04-10 2001-10-19 Mitsubishi Electric Corp 撮像装置および携帯電話機
JP2002223378A (ja) * 2000-11-14 2002-08-09 Toshiba Corp 撮像装置及びその製造方法、ならびに電気機器
JP2004010478A (ja) * 2002-06-10 2004-01-15 Boc Group Inc:The 吸着精製プロセスを用いるフッ素の回収方法
JP2004146816A (ja) * 2002-09-30 2004-05-20 Matsushita Electric Ind Co Ltd 固体撮像装置およびこれを用いた機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074879A (ja) * 1983-09-30 1985-04-27 Olympus Optical Co Ltd 固体撮像装置
JPS6074880A (ja) * 1983-09-30 1985-04-27 Olympus Optical Co Ltd 固体撮像装置
JPH1032323A (ja) * 1996-05-17 1998-02-03 Sony Corp 固体撮像装置とそれを用いたカメラ
JPH1084509A (ja) * 1996-09-06 1998-03-31 Matsushita Electron Corp 撮像装置およびその製造方法
JP2001292363A (ja) * 2000-04-10 2001-10-19 Mitsubishi Electric Corp 撮像装置および携帯電話機
JP2002223378A (ja) * 2000-11-14 2002-08-09 Toshiba Corp 撮像装置及びその製造方法、ならびに電気機器
JP2004010478A (ja) * 2002-06-10 2004-01-15 Boc Group Inc:The 吸着精製プロセスを用いるフッ素の回収方法
JP2004146816A (ja) * 2002-09-30 2004-05-20 Matsushita Electric Ind Co Ltd 固体撮像装置およびこれを用いた機器

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