WO2006069140A3 - Electriplast moldable capsule and method of manufacture - Google Patents

Electriplast moldable capsule and method of manufacture Download PDF

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Publication number
WO2006069140A3
WO2006069140A3 PCT/US2005/046337 US2005046337W WO2006069140A3 WO 2006069140 A3 WO2006069140 A3 WO 2006069140A3 US 2005046337 W US2005046337 W US 2005046337W WO 2006069140 A3 WO2006069140 A3 WO 2006069140A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
bundle
method
based material
resin
moldable
Prior art date
Application number
PCT/US2005/046337
Other languages
French (fr)
Other versions
WO2006069140A2 (en )
Inventor
Thomas Aisenbrey
Original Assignee
Integral Technologies Inc
Thomas Aisenbrey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

A method to form moldable capsules of a conductively doped resin-based material are created. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20 % and about 50 % of the total weight of each moldable capsule.
PCT/US2005/046337 2004-12-21 2005-12-21 Electriplast moldable capsule and method of manufacture WO2006069140A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US63808004 true 2004-12-21 2004-12-21
US60/638,080 2004-12-21

Publications (2)

Publication Number Publication Date
WO2006069140A2 true WO2006069140A2 (en) 2006-06-29
WO2006069140A3 true true WO2006069140A3 (en) 2007-06-14

Family

ID=36602281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/046337 WO2006069140A3 (en) 2004-12-21 2005-12-21 Electriplast moldable capsule and method of manufacture

Country Status (1)

Country Link
WO (1) WO2006069140A3 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9012021B2 (en) * 2008-03-26 2015-04-21 Xerox Corporation Composition of matter for composite plastic contact elements featuring controlled conduction pathways, and related manufacturing processes
DE202013100463U1 (en) * 2013-02-01 2014-05-07 Smp Deutschland Gmbh Polymer harness

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085931A (en) * 1989-01-26 1992-02-04 Minnesota Mining And Manufacturing Company Microwave absorber employing acicular magnetic metallic filaments
US5545474A (en) * 1994-03-01 1996-08-13 Martin Marietta Corporation Electromagnetic-attenuating coating materials
US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085931A (en) * 1989-01-26 1992-02-04 Minnesota Mining And Manufacturing Company Microwave absorber employing acicular magnetic metallic filaments
US5545474A (en) * 1994-03-01 1996-08-13 Martin Marietta Corporation Electromagnetic-attenuating coating materials
US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom

Also Published As

Publication number Publication date Type
WO2006069140A2 (en) 2006-06-29 application

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