WO2006065059A1 - Appareil de chauffage d'un dispositif a air chaud electronique - Google Patents

Appareil de chauffage d'un dispositif a air chaud electronique Download PDF

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Publication number
WO2006065059A1
WO2006065059A1 PCT/KR2005/004273 KR2005004273W WO2006065059A1 WO 2006065059 A1 WO2006065059 A1 WO 2006065059A1 KR 2005004273 W KR2005004273 W KR 2005004273W WO 2006065059 A1 WO2006065059 A1 WO 2006065059A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
film heater
metal
heater
heating apparatus
Prior art date
Application number
PCT/KR2005/004273
Other languages
English (en)
Inventor
Hyung Woo Kim
Original Assignee
Hyung Woo Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyung Woo Kim filed Critical Hyung Woo Kim
Publication of WO2006065059A1 publication Critical patent/WO2006065059A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D20/00—Hair drying devices; Accessories therefor
    • A45D20/04—Hot-air producers
    • A45D20/08—Hot-air producers heated electrically
    • A45D20/10—Hand-held drying devices, e.g. air douches
    • A45D20/12—Details thereof or accessories therefor, e.g. nozzles, stands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the present invention relates to a heating apparatus of an electronic hot wind device, and more particularly, to a heating apparatus of an electronic hot wind device, wherein a thin film heater is used as a heating element in the heating apparatus of the electronic hot wind device, such as a hair dryer, a hand dryer, a drying hood, a fan heater, a hot blast heater, a small-sized hot blast heater for an automobile, a clothes dryer, a dishwasher, a dish dryer and a printer dryer, thereby shortening temperature rise time and lowering electric power consumption.
  • a thin film heater is used as a heating element in the heating apparatus of the electronic hot wind device, such as a hair dryer, a hand dryer, a drying hood, a fan heater, a hot blast heater, a small-sized hot blast heater for an automobile, a clothes dryer, a dishwasher, a dish dryer and a printer dryer, thereby shortening temperature rise time and lowering electric power consumption.
  • a halogen lamp, a bulk heater or a coil heater is used as a heating element in an electronic hot wind device such as a hair dryer, a drying hood, a fan heater and a hot blast heater.
  • the electronic hot wind device comprises a sensor for sensing temperature.
  • the heating element is bulky and a heating rate threof is very small due to the small contact area of the heating element with the metal plate.
  • the heating element has high electric power consumption by requiring a high electric power of 0.9kW to several kW as electric power for heat generation of the heating element. Additionally, in case of a bulk heater or a coil heater, there is a problem in that a temperature descent rate is small even though the supply of electric power is cut off after use of the electronic hot wind device. Disclosure of Invention
  • An object of the present invention is to provide a heating apparatus of an electronic hot wind device, wherein a thin film heater is used as a heating element of the electronic hot wind device, thereby shortening temperature rise time of a surface of a metal plate and lowering electric power consumption.
  • a conductive pattern may be formed on one side of the thin film heater of the heating apparatus to induce uniform heat generation of an entire surface of the thin film heater and to reduce a difference in temperature between an electrode lead-in portion of the thin film heater and a central portion of the thin film heater within a shorter period of time at an early stage of supply of electric power, and the metal pads may define a pattern such that a plurality of heating thin film cells are formed.
  • FIGs. 1 and 2 are sectional views illustrating embodiments of the structure of a heating apparatus of an electronic hot wind device using a metal plate, according to the present invention.
  • FIGs. 3 and 4 are sectional views illustrating embodiments of the structure of a heating apparatus of an electronic hot wind device using a nonmetal plate, according to the present invention.
  • FIGs. 5 to 7 are exemplary views of thin film heaters with conductive patterns formed thereon.
  • FIGs. 8 and 9 are views showing embodiments of a metal pad defining a pattern on a thin film heater.
  • FIGs. 10 to 12 are a view showing a heating apparatus of an electronic hot wind device to which the present invention is applied, and graphs showing measured surface temperature values of the heating apparatus, respectively.
  • FIG. 1 is a view illustrating an embodiment of the structure of a heating apparatus using a metal plate for use in an electronic hot wind device, according to the present invention.
  • Reference numerals 11, 12, 13, 14, 15, 16 and 17 designate a metal plate, a thin film heater, a temperature sensor, an insulation film, a metal pad, a power connection terminal and a fan, respectively.
  • FIG. 2 is a view illustrating an embodiment of the structure of a heating apparatus using a metal plate and a conductive pattern for use in an electronic hot wind device, according to the present invention.
  • Reference numerals 18 and 19 designate a conductive pattern and a protecting layer, respectively.
  • FIG. 3 is a view illustrating an embodiment of the structure of a heating apparatus of an electronic hot wind device using a nonmetal plate, according to the present invention.
  • Reference numerals 20, 12, 13, 14, 15, 16 and 17 designate a nonmetal plate, a thin film heater, a temperature sensor, an insulation film, a metal pad, a power connection terminal and a fan, respectively.
  • FIG. 4 is a view illustrating another embodiment of the structure of a heating apparatus of an electronic hot wind device using a nonmetal plate, according to the present invention.
  • Reference numerals 18 and 19 designate an conductive pattern and a protecting layer, respectively.
  • a heating apparatus of an electronic hot wind device comprises a metal plate 11; an insulation film 14 formed on one side of the metal plate 11 to shield transfer of electricity to the metal plate; a thin film heater 12 formed on the insulation film 14 to generate heat by receiving electric power; metal pads 15 formed at end portions of one side of the thin film heater 12 to supply electric power to the thin film heater; and power connection terminals 16 that are in contact with the metal pads 15 to supply electric power to the metal pads.
  • a temperature sensor 13 is in contact with a certain portion of the thin film heater 12 to sense temperature, and a fan 17 exhausts air heated by the metal plate.
  • a conductive pattern 18 may be formed on the one side of the thin film heater 12 to induce uniform heat generation of an entire surface of the thin film heater within a short period of time at an early stage of supply of electric power and to reduce a difference in temperature between an electrode lead-in portion of the thin film heater and a central portion of the thin film heater.
  • the metal pads 15 can define a pattern such that a plurality of heating thin-film cells are formed.
  • a heater protecting layer 19 is preferably formed on a lower surface of the thin film heater 12 to protect the thin film heater 12 from external foreign substances and the like.
  • the heater protecting layer may be formed of inorganic heater protecting layer materials (SiNx, SiOx), organic heater protecting layer materials (polyimide, polyamide, Teflon, PET, etc.), and the like.
  • the metal plate 11 in the present invention may be composed of a plurality of divided pieces and is fixed by a support member.
  • the metal plate 11 used in the present invention is formed of a metal with superior thermal conductivity, such as aluminum or stainless steel.
  • the thickness of the metal plate 11 preferably ranges from 0.3mm to 3mm, more preferably 0.3mm to 2mm.
  • the insulation film 14 When the thermal conductivity of the insulation film 14 is higher, heat generated by the thin film heater is transferred at a higher rate to the metal plate 11. Therefore, it is preferred that the insulation film have a smaller thickness. That is, the insulation film should be designed to have a smallest thickness capable of securing electrical insulation between the thin film heater 12 and the metal plate 11.
  • the thickness of the insulation film 14 preferably ranges from 0.5D to 500D, preferably 0.5D to 200D.
  • the thickness of the insulation film may vary according to the material of the insulation film.
  • the insulation film 14 should not produce dielectric breakdown and should maintain a leakage current below 2OD when a voltage of about 100V is applied to the thin film heater.
  • the insulation film should have a superior contact property with the thin film heater or the metal plate such that the insulation film is not physically de- laminated from the metal plate when the material of the thin film heater generates heat at a high temperature. Furthermore, when the material of the thin film heater generates heat at a high temperature, a chemical reaction between the insulation film and the material of the thin film heater or the metal plate should not occur.
  • the insulation film should have good surface roughness such that the surface roughness thereof does not affect the electrical resistivity of the material of the thin film heater.
  • the surface of the metal plate may be formed with one or two or more insulation films selected from the group consisting of an oxidized insulation film formed by oxidizing the surface of aluminum or stainless steel using an arc, an insulation film formed by coating ceramic, glass or ceramic glaze on the surface of the metal plate, and a polymer insulation film formed by coating a polymer on the surface of the metal plate.
  • the insulation film may be a polymer insulation film formed of polymer-based materials such as polyimide, polyamide, Teflon and PET, or a film to which the oxidized insulation film and the polymer insulation film are simultaneously applied.
  • the oxidized insulation film can be formed using electrical energy such as an arc applied from the outside to the metallic surface of a metal plate, which is made of aluminum (Al), beryllium (Be), titanium (Ti) or stainless steel and dipped in an alkaline electrolyte, so that an electrochemical reaction occurs between metal atoms of the metal surface and external oxygen to convert properties of the metallic surface into an oxidized film.
  • electrical energy such as an arc applied from the outside to the metallic surface of a metal plate, which is made of aluminum (Al), beryllium (Be), titanium (Ti) or stainless steel and dipped in an alkaline electrolyte, so that an electrochemical reaction occurs between metal atoms of the metal surface and external oxygen to convert properties of the metallic surface into an oxidized film.
  • Al O , ZrO , Y O or the like is used for the oxidized insulation film, and the oxidized insulation film may be formed on the metal plate by means of plasma spray coating and the like.
  • plasma spray coating and the like one embodiment of a process of forming the oxidized insulation film on the metal plate will be described below.
  • an aluminum oxide can be formed on the surface of a metal plate 11 made of aluminum
  • a titanium oxide can be formed on the surface of a metal plate 11 made of titanium
  • a beryllium oxide can be formed on the surface of a metal plate 11 made of beryllium.
  • an electrical insulation film using a polymer material is formed to have a uniform thickness between a metal substrate and a thin film heater for generating heat by means of a spin coating method using the polymer material capable of securing an electrical insulation property for electrical insulation between the two layers.
  • a polymer insulation film is formed using a liquid organic polymer material that is to be uniformly coated on the surface of the metal plate 11 made of a metal.
  • coating methods include a spin coating method, a spray coating method, a dipping coating method, and a screen printing method.
  • polymer materials include polyimide-based materials, polyamide- based materials, Teflon-based materials, paint-based materials, silver-ston, Tefzel-s, epoxy, rubber, and UV-sensitive materials.
  • An embodiment of a process of coating a polyimide-based material on the metal plate 11 by means of the spray coating method is as follows. [51] The metal plate 11 is cleaned with acetone, IPA (isopropyl alcohol) or the like, the polyimide-based material is sprayed onto the metal plate 11 while the cleaned metal plate 11 is rotated at a high speed (e.g., 2,000rpm or more), and the polyimide-based material coated on the surface of the metal plate 11 is subjected to heat treatment.
  • a high speed e.g., 2,000rpm or more
  • a double insulation film comprising an oxidized insulation film and a polymer insulation film can be formed by forming the oxidized insulation film on the surface of a metal plate 21 made of a metal and uniformly coating a polymer-based material on the oxidized insulation film, or by coating the polymer-based material on the surface of the metal plate made of a metal and forming the oxidized insulation film on the coated polymer-based material.
  • the case where the oxidized insulation film and the polymer insulation film are simultaneously formed can reduce the thickness of each of the insulation films and minimize dielectric breakdown of the insulation films as compared with a case where only one insulation film of the oxidized insulation film and the polymer insulation film is formed.
  • the thickness of the insulation film 14 preferably ranges from 0.5D to 500D, more preferably 0.5D to 200D for efficient heat transfer (the thickness of the insulation film varies according to the material of the insulation film).
  • the insulation film 14 has a dielectric breakdown voltage of 1,000V or more, and a leakage current of 2OD or less upon application of a voltage of 100V.
  • the insulation film 14 should be formed such that it is not delaminated respectively from the metal plate 11 and the thin film heater 12 when the thin film heater 12 generates heat (in a thermal cycle).
  • the thin film heater 12 generates heat in a resistive heat generation manner by means of application of a DC or AC voltage to the metal pads 15 connected to the thin film heater 12 so that a predetermined amount of current can flow through the thin film heater.
  • the thin film heater 12 may be made of a single metal (e.g., Ta, W, Pt, Ru, Hf, Mo,
  • a binary metal alloy e.g., TaW, etc.
  • a binary metal-nitride e.g., WN, MoN, ZrN, etc.
  • a binary metal- suicide e.g., TaSi, WSi, etc.
  • a thick conductive paste such as Ag/Pd.
  • the thin film heater 12 has a thickness of several tens D or less (e.g., 0.05D to 3OD, wherein the thickness of the thin film heater varies according to the material of the thin film heater).
  • the heat capacity of the thin film heater 12 is expressed as a function with a parameter of thickness.
  • the present invention can deduce an optimum thickness range of the thin film heater 12 through various simulations and experiments to satisfy two requirements for the instantaneous rise of the temperature of the thin film heater 12 and the extension of the lifespan of the thin film heater 12. There may be a slight difference in thickness according to the material of the thin film heater 12.
  • the optimum thickness of the thin film heater 12 is deduced based on the following formula.
  • the optimum thickness range of the thin film heater 12 (e.g., 0.05D to 30D) is deduced according to the material of the thin film heater 12 corresponding to characteristics of each product by performing simulation with the aforementioned parameters as input data considering the resistivity value range of the material of the thin film heater 12.
  • Methods for forming a thin film heater using vacuum evaporation include a thick film screen printing method, physical vapor deposition (sputtering, reactive sputtering, co-sputtering, evaporation and E-beam) methods, and chemical vapor deposition (low pressure chemical vapor deposition (LPCVD) and plasma enhanced chemical vapor deposition (PECVD)) methods.
  • sputtering, reactive sputtering, co-sputtering, evaporation and E-beam physical vapor deposition
  • chemical vapor deposition low pressure chemical vapor deposition (LPCVD) and plasma enhanced chemical vapor deposition (PECVD)
  • a protecting layer is preferably formed on the thin film heater to protect the thin film heater.
  • the heater protecting layer is formed of inorganic heater protecting layer materials such as SiNx and SiOx and organic heater protecting layer materials such as polyimide, polyamide, Teflon and PET.
  • the protecting layer may be formed on a thin film heater with a conductive pattern formed thereon as well as a thin film heater with no conductive pattern formed thereon.
  • a conductive pattern 18 having lower electric resistance and higher thermal conductivity than thin film heaters with various shapes and configurations can be formed on one side of the thin film heater.
  • the formation of the conductive pattern on the thin film heater can improve a production yield over a single thin film heater on which a conductive pattern is not formed upon production of the thin film heater. This is because the single thin film heater on which a conductive pattern is not formed may suffer from degradation in the quality of the entire resistor even due to a minute thickness difference in or damage such as a scratch to a portion of the entire thin film heater, resulting in drop in the production yield of the thin film heater.
  • the metal pads 15 are formed on both ends of the thin film heater 12 to secure a uniform current density in the thin film heater 12, so that the metal pads 15 can be responsible for electrical connection between the thin film heater 12 and an external power supply.
  • the metal pads 15 may have various shapes and configurations. It is preferred that the width of the metal pads 15 be identical with or larger than that of the thin film heater 12 to provide a constant current density to the thin film heater 12.
  • the metal pads 15 in the present invention can define patterns at different positions with a variety of configurations, sizes and numbers such that a plurality of heating thin film cells are formed as illustrated in Figs. 8 and 9.
  • the metal pads should have temperature stability during heat generation of the thin film heater and should not produce resistance increase or physical delamination due to oxidation of the metal pads.
  • the metal pads in the present invention can be made of Al, Au, W, Pt, Ag, Ta, Mo, Ti or the like.
  • a protecting layer be formed on the thin film heater
  • the protecting layer may be formed of inorganic heater protecting layer materials (SiNx, SiOx), organic heater protecting layer materials (polyimide, polyamide, Teflon, PET, etc.) and the like.
  • a heating apparatus of an electronic hot wind device comprises a nonmetal plate 20; a thin film heater 12 formed on one side of the nonmetal plate 20 to generate heat by receiving electric power; metal pads 15 formed at end portions of one side of the thin film heater 12 to supply electric power to the thin film heater; and power connection terminals 16 that are in contact with the metal pads 15 to supply electric power to the metal pads.
  • the one side of the thin film heater 12 may be formed with a conductive pattern 18 for ensuring uniform heat generation on the entire surface of the thin film heater within a shorter period of time at an early stage of supply of electric power and for preventing the occurrence of an overheating phenomenon at an electrode lead-in portion of the thin film heater as well as a heater protecting layer 19 for protecting the thin film heater 12 from external foreign substances.
  • the metal pads 15 can define a pattern such that a plurality of heating thin film cells are formed in the same manner as the case where the metal plate is used.
  • a nonmetal plate is made of thermally enhanced plastics, heat resistant resins, ceramics, glass and earthenware capable of resisting to a temperature of at least 25O 0 C.
  • FIG. 9 shows a heating apparatus of an electronic hot wind device to which the present invention is applied
  • Fig. 10 illustrates a graph showing measured changes in the surface temperature of the heating apparatus with time when an electric power of 50 watts is applied to the heating apparatus of the electronic hot wind device shown in Fig. 9
  • Fig. 11 illustrates a graph showing measured changes in the surface temperature when varying power is applied for 10 seconds to the heating apparatus of the electronic hot wind device shown in Fig. 9.
  • 9 to 11 are numerical values obtained in one embodiment of a heating apparatus of an electronic hot wind device, and the numerical values may be deduced as different results according to resistance values, thicknesses and materials of respective components such as the thin film heater, the insulation film, the metal pads and the metal plate.
  • an optimum product can be produced by differently applying resistance values, thicknesses, materials and the like of respective components such as the thin film heater, the insulation film, the metal pads and the metal plate in consideration of product requirements for a heating apparatus of an electronic hot wind device so as to reduce time required to reach a surface temperature and power consumption corresponding to product characteristics.

Landscapes

  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)

Abstract

La présente invention concerne un appareil de chauffage d'un dispositif à air chaud électronique, dans lequel un dispositif de chauffage à couche mince est utilisé comme élément chauffant pour réduire le temps d'élévation de la température d'une surface d'une plaque métallique ou non métallique et réduire la consommation de courant électrique. Dans un mode de réalisation, l'appareil comprend une plaque métallique ou non métallique. Si la plaque est métallique, une pellicule d'isolation électrique est formée sur un côté de la plaque métallique. L'appareil comprend également un dispositif de chauffage à couche mince monté sous forme de couche mince sur un côté de la pellicule d'isolation ou de la plaque non métallique, permettant de produire instantanément de la chaleur à une température élevée grâce à sa propre résistance électrique et au courant électrique externe fourni. L'appareil comprend également un motif conducteur formé sur un côté du dispositif de chauffage à couche mince, permettant de chauffer de manière uniforme l'ensemble de la surface du dispositif de chauffage à couche mince et de réduire les écarts de température entre une partie où l'électrode entre dans le dispositif de chauffage à couche mince et une partie centrale du dispositif de chauffage à couche mince sur un laps de temps plus court lorsque le courant électrique est fourni. L'appareil comprend également des éléments métalliques formés au niveau de l'extrémité d'au moins un côté du dispositif de chauffage à couche mince, permettant d'alimenter le dispositif de chauffage à couche mince en courant électrique. L'appareil comprend également des broches de connexion qui sont en contact avec ces éléments métalliques.
PCT/KR2005/004273 2004-12-14 2005-12-13 Appareil de chauffage d'un dispositif a air chaud electronique WO2006065059A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20040105733 2004-12-14
KR10-2004-0105733 2004-12-14

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WO2006065059A1 true WO2006065059A1 (fr) 2006-06-22

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008103372A2 (fr) * 2007-02-20 2008-08-28 Thermoceramix Inc. Appareil de chauffage au gaz et procédés associés
EP2044858A1 (fr) * 2007-06-26 2009-04-08 Takashi Mukai Fer à friser
WO2011025880A1 (fr) * 2009-08-27 2011-03-03 Tornier, Inc. Élément chauffant à substrat métallique
WO2012019855A1 (fr) * 2010-08-11 2012-02-16 Valeo Systemes Thermiques Module chauffant comprenant un element chauffant serigraphie
WO2020026751A1 (fr) * 2018-07-30 2020-02-06 株式会社デンソー Élément de génération de chaleur

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102292835B1 (ko) 2019-11-08 2021-08-25 주식회사헤옴 복사열 방사 전기히터
KR102235925B1 (ko) * 2020-07-10 2021-04-05 서중석 세라믹 히터를 포함하는 무선 헤어드라이어

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Publication number Priority date Publication date Assignee Title
KR0171971B1 (ko) * 1995-06-23 1999-05-01 . 금속박막 발열체의 제조방법 및 금속박막 발열히터
KR100187292B1 (ko) * 1995-07-28 1999-05-15 조남인 박막형 전열기

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
KR0171971B1 (ko) * 1995-06-23 1999-05-01 . 금속박막 발열체의 제조방법 및 금속박막 발열히터
KR100187292B1 (ko) * 1995-07-28 1999-05-15 조남인 박막형 전열기

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008103372A2 (fr) * 2007-02-20 2008-08-28 Thermoceramix Inc. Appareil de chauffage au gaz et procédés associés
WO2008103372A3 (fr) * 2007-02-20 2013-08-15 Thermoceramix Inc. Appareil de chauffage au gaz et procédés associés
EP2044858A1 (fr) * 2007-06-26 2009-04-08 Takashi Mukai Fer à friser
EP2044858A4 (fr) * 2007-06-26 2011-06-22 Takashi Mukai Fer à friser
WO2011025880A1 (fr) * 2009-08-27 2011-03-03 Tornier, Inc. Élément chauffant à substrat métallique
FR2951348A1 (fr) * 2009-10-12 2011-04-15 Tornier Sa Element chauffant et appareil chirurgical le mettant en oeuvre
WO2012019855A1 (fr) * 2010-08-11 2012-02-16 Valeo Systemes Thermiques Module chauffant comprenant un element chauffant serigraphie
FR2963867A1 (fr) * 2010-08-11 2012-02-17 Valeo Systemes Thermiques Module chauffant comprenant un element chauffant serigraphie
WO2020026751A1 (fr) * 2018-07-30 2020-02-06 株式会社デンソー Élément de génération de chaleur
JP2020021563A (ja) * 2018-07-30 2020-02-06 株式会社デンソー 発熱部材
JP7131178B2 (ja) 2018-07-30 2022-09-06 株式会社デンソー 発熱部材

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