WO2006063934A3 - Procede de realisation d'un dispositif volumique miniaturise - Google Patents
Procede de realisation d'un dispositif volumique miniaturise Download PDFInfo
- Publication number
- WO2006063934A3 WO2006063934A3 PCT/EP2005/056336 EP2005056336W WO2006063934A3 WO 2006063934 A3 WO2006063934 A3 WO 2006063934A3 EP 2005056336 W EP2005056336 W EP 2005056336W WO 2006063934 A3 WO2006063934 A3 WO 2006063934A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- volume
- making
- miniaturized device
- matrix
- miniaturized
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0645—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0654—Lenses; Optical fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK05816276T DK1830694T3 (da) | 2004-12-17 | 2005-11-30 | Fremgangsmåde til fremstilling af en volumentminiaturiseret indretning |
US11/721,650 US20090249621A1 (en) | 2004-12-17 | 2005-11-30 | Method for making a miniaturized device in volume |
JP2007546013A JP2008524835A (ja) | 2004-12-17 | 2005-11-30 | 小型三次元装置の製造方法 |
EP05816276A EP1830694B1 (fr) | 2004-12-17 | 2005-11-30 | Procede de realisation d'un dispositif volumique miniaturise |
DE602005006019T DE602005006019T2 (de) | 2004-12-17 | 2005-11-30 | Verfahren zur herstellung einer in volumen miniaturisierten vorrichtung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04405782A EP1672967A1 (fr) | 2004-12-17 | 2004-12-17 | Procédé de réalisation d'un dispositif volumique miniaturisé |
EP04405782.6 | 2004-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006063934A2 WO2006063934A2 (fr) | 2006-06-22 |
WO2006063934A3 true WO2006063934A3 (fr) | 2006-10-19 |
Family
ID=34932412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/056336 WO2006063934A2 (fr) | 2004-12-17 | 2005-11-30 | Procede de realisation d'un dispositif volumique miniaturise |
Country Status (8)
Country | Link |
---|---|
US (1) | US20090249621A1 (fr) |
EP (2) | EP1672967A1 (fr) |
JP (1) | JP2008524835A (fr) |
CN (1) | CN101080193A (fr) |
AT (1) | ATE391455T1 (fr) |
DE (1) | DE602005006019T2 (fr) |
DK (1) | DK1830694T3 (fr) |
WO (1) | WO2006063934A2 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010019597B4 (de) * | 2010-05-05 | 2014-05-28 | Cortec Gmbh | Verfahren zum Herstellen einer Elektrodenstruktur sowie Elektrodenstruktur für eine neuronale Schnittstelle |
US8802568B2 (en) | 2012-09-27 | 2014-08-12 | Sensirion Ag | Method for manufacturing chemical sensor with multiple sensor cells |
US11371951B2 (en) | 2012-09-27 | 2022-06-28 | Sensirion Ag | Gas sensor comprising a set of one or more sensor cells |
US10746612B2 (en) | 2016-11-30 | 2020-08-18 | The Board Of Trustees Of Western Michigan University | Metal-metal composite ink and methods for forming conductive patterns |
JP6944849B2 (ja) * | 2017-10-18 | 2021-10-06 | 野村マイクロ・サイエンス株式会社 | 立体造形物の製造方法及び立体造形用サポート材組成物 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136212A (en) * | 1996-08-12 | 2000-10-24 | The Regents Of The University Of Michigan | Polymer-based micromachining for microfluidic devices |
US20020079219A1 (en) * | 2000-09-19 | 2002-06-27 | Mingqi Zhao | Microfluidic chip having integrated electrodes |
US20030096081A1 (en) * | 2001-10-19 | 2003-05-22 | Lavallee Guy P. | Integrated microfluidic, optical and electronic devices and method for manufacturing |
US6632400B1 (en) * | 2000-06-22 | 2003-10-14 | Agilent Technologies, Inc. | Integrated microfluidic and electronic components |
US20040115861A1 (en) * | 2002-12-16 | 2004-06-17 | Palo Alto Research Center Incorporated | Method for integration of microelectronic components with microfluidic devices |
US20040160465A1 (en) * | 2000-12-09 | 2004-08-19 | Hugh Baker-Smith | Method of printing using a droplet deposition apparatus |
WO2004083843A1 (fr) * | 2003-03-18 | 2004-09-30 | Cambridge University Technical Services Limited | Detecteur microfluidique electrochimique et procede pour produire ses microcanaux par estampage |
US20040209392A1 (en) * | 1999-01-13 | 2004-10-21 | Craighead Harold G. | Monolithic nanofluid sieving structures for DNA manipulation |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3398557B2 (ja) * | 1997-01-29 | 2003-04-21 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 表層配線プリント基板の製造方法 |
-
2004
- 2004-12-17 EP EP04405782A patent/EP1672967A1/fr not_active Withdrawn
-
2005
- 2005-11-30 CN CN200580043226.9A patent/CN101080193A/zh active Pending
- 2005-11-30 EP EP05816276A patent/EP1830694B1/fr not_active Not-in-force
- 2005-11-30 DE DE602005006019T patent/DE602005006019T2/de active Active
- 2005-11-30 US US11/721,650 patent/US20090249621A1/en not_active Abandoned
- 2005-11-30 JP JP2007546013A patent/JP2008524835A/ja not_active Abandoned
- 2005-11-30 AT AT05816276T patent/ATE391455T1/de not_active IP Right Cessation
- 2005-11-30 WO PCT/EP2005/056336 patent/WO2006063934A2/fr active IP Right Grant
- 2005-11-30 DK DK05816276T patent/DK1830694T3/da active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136212A (en) * | 1996-08-12 | 2000-10-24 | The Regents Of The University Of Michigan | Polymer-based micromachining for microfluidic devices |
US20040209392A1 (en) * | 1999-01-13 | 2004-10-21 | Craighead Harold G. | Monolithic nanofluid sieving structures for DNA manipulation |
US6632400B1 (en) * | 2000-06-22 | 2003-10-14 | Agilent Technologies, Inc. | Integrated microfluidic and electronic components |
US20020079219A1 (en) * | 2000-09-19 | 2002-06-27 | Mingqi Zhao | Microfluidic chip having integrated electrodes |
US20040160465A1 (en) * | 2000-12-09 | 2004-08-19 | Hugh Baker-Smith | Method of printing using a droplet deposition apparatus |
US20030096081A1 (en) * | 2001-10-19 | 2003-05-22 | Lavallee Guy P. | Integrated microfluidic, optical and electronic devices and method for manufacturing |
US20040115861A1 (en) * | 2002-12-16 | 2004-06-17 | Palo Alto Research Center Incorporated | Method for integration of microelectronic components with microfluidic devices |
WO2004083843A1 (fr) * | 2003-03-18 | 2004-09-30 | Cambridge University Technical Services Limited | Detecteur microfluidique electrochimique et procede pour produire ses microcanaux par estampage |
Also Published As
Publication number | Publication date |
---|---|
EP1672967A1 (fr) | 2006-06-21 |
EP1830694B1 (fr) | 2008-04-09 |
DE602005006019D1 (de) | 2008-05-21 |
DK1830694T3 (da) | 2008-08-04 |
ATE391455T1 (de) | 2008-04-15 |
DE602005006019T2 (de) | 2008-11-13 |
JP2008524835A (ja) | 2008-07-10 |
WO2006063934A2 (fr) | 2006-06-22 |
CN101080193A (zh) | 2007-11-28 |
US20090249621A1 (en) | 2009-10-08 |
EP1830694A2 (fr) | 2007-09-12 |
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