WO2006063563A1 - Flash tube mirror arrangement - Google Patents
Flash tube mirror arrangement Download PDFInfo
- Publication number
- WO2006063563A1 WO2006063563A1 PCT/DE2005/002215 DE2005002215W WO2006063563A1 WO 2006063563 A1 WO2006063563 A1 WO 2006063563A1 DE 2005002215 W DE2005002215 W DE 2005002215W WO 2006063563 A1 WO2006063563 A1 WO 2006063563A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mirror
- flash
- flashlamp
- substrates
- assembly according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Definitions
- the invention relates to a flashlamp mirror assembly as part of a radiation heating arrangement for the short-term heating of preferably disc-shaped semiconductor substrates by means of rod-shaped flashlamps.
- irradiation inhomogeneities result in extreme thermal stresses within the discs, which in turn can lead to permanent bending or even rupture thereof. But even a slight bending can lead to the fact that subsequent photolithographic process steps in the device manufacturing are no longer feasible.
- the increase in the homogeneity of the light irradiation in flash lamp systems thus serves to a high degree to increase the yield in the component manufacturing.
- the increase in the homogeneity in the flash lamp irradiation is achieved by a large distance of the lamps to the discs to be irradiated and by a correspondingly extended lamp field (multiple of the disc diameter).
- the necessarily associated necessary enlargement of the irradiation chamber and the lamp field and thus also the capacitor bank, as an energy source for the flash lamps but leads to an extraordinary increase in investment costs.
- the invention has for its object to propose a flashlamp mirror assembly that allows a homogeneous and rapid heating of semiconductor substrates at immaterial increased system costs.
- each individual cylindrical lamp is arranged with its axis adjustable in the focal point of a parabolic cylindrical mirror and also each mirror / lamp unit is arranged parallel to the adjacent, wherein the individual
- Alignment are freely adjustable. This creates the possibility of positioning the individual light bundles generated by the parabolic mirrors, which are homogeneous in their intensity, by adjusting the individual mirrors so that a uniform, uniformly illuminated surface results.
- the light of all flash lamps is bundled.
- the substrate surface is irradiated with a high energy density.
- the area modified with a flash is small.
- the light of the flash lamps is projected parallel to the substrate.
- the energy densities achievable in this arrangement are lower, but the surface irradiated at the same time can be increased almost arbitrarily.
- the main advantage of the flash lamp mirror assembly described compared to Conventional arrangements with a single mirror consist in the elimination of the intensity drop to the edge of the disk to be irradiated, as it is inevitably observed in an array of exposed parallel lamps.
- the lamp length should be at least twice the diameter of the disks to be irradiated, so that the homogeneity of the irradiation in the direction of the lamp axes is ensured.
- Another advantage is that the total energy of the light pulse need not or hardly be increased.
- each flash lamp 5 is individually and adjustably located in the focal line of a water-cooled parabolic mirror.
- each lamp-mirror arrangement produces a rectangular, homogeneous strip of parallel light beams.
- Each individual mirror-lamp construction is also pivotally mounted in an axis parallel to the mirror axis, whereby the rectangular strips of light can be adjusted side by side on the substrate 4 so that a closed and illuminated with uniform intensity surface.
- the sample holder 1 in the interior of which the substrate 4 is thermally insulated mounted on quartz tubes, except the quartz window 3 for transmitting the flash lamp light, a second, opposite quartz window 2 for transmitting the light of halogen lamps 6, which serve to pre-heat the samples from lightning.
- the quartz window 3 for transmitting the flash lamp light
- a second, opposite quartz window 2 for transmitting the light of halogen lamps 6, which serve to pre-heat the samples from lightning.
- two or more light stripes can be positioned one above the other on the substrate 4 by pivoting the mirrors. 2 shows the constructionally least expensive case of the closely juxtaposed mirrors with parallel light emission, wherein the maximum energy density on the substrate 4 is limited by the dimensions of the mirrors and the lamp parameters.
- the sample holder 1 is designed as shown in FIG.
- the flash lamps 5 are electrically powered by high-power capacitors, which emit their energy in a pulsed manner by a combination with inductors.
- the light pulse times can be adjusted between 500 ⁇ s and 20 ms.
- the energy input by the flash lamps 5 into the substrates 4 is typically in the range of 100 joules / cm 2 .
- the substrate 4 can be preheated in the range of a few hundred degrees to 1100 0 C.
- the substrate diameters are usually between 100 mm and 200 mm.
- the temperature of the substrate surface at the end of the light pulse is typically 1400 C.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112005003465T DE112005003465A5 (en) | 2004-12-16 | 2005-12-09 | Flash lamp mirror arrangement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410060557 DE102004060557A1 (en) | 2004-12-16 | 2004-12-16 | Flash lamp mirror arrangement |
DE102004060557.2 | 2004-12-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006063563A1 true WO2006063563A1 (en) | 2006-06-22 |
Family
ID=35717591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2005/002215 WO2006063563A1 (en) | 2004-12-16 | 2005-12-09 | Flash tube mirror arrangement |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE102004060557A1 (en) |
WO (1) | WO2006063563A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020179589A1 (en) * | 2000-02-08 | 2002-12-05 | Yukihiro Morita | Lamp annealing device and substrate for a display element |
US20020195437A1 (en) * | 2001-06-20 | 2002-12-26 | Tatsufumi Kusuda | Heat treating apparatus and method |
US6717158B1 (en) * | 1999-01-06 | 2004-04-06 | Mattson Technology, Inc. | Heating device for heating semiconductor wafers in thermal processing chambers |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6600138B2 (en) * | 2001-04-17 | 2003-07-29 | Mattson Technology, Inc. | Rapid thermal processing system for integrated circuits |
DE10132974A1 (en) * | 2001-07-06 | 2003-01-30 | Trilux Lenze Gmbh & Co Kg | Optics for room lights |
DE10136501C1 (en) * | 2001-07-27 | 2002-11-07 | Gunther Ackermann | Substrate heating device using electromagnetic radiation has cooling medium feed with integrated flow channel directing cooling medium onto substrate outside heated area |
-
2004
- 2004-12-16 DE DE200410060557 patent/DE102004060557A1/en not_active Withdrawn
-
2005
- 2005-12-09 WO PCT/DE2005/002215 patent/WO2006063563A1/en not_active Application Discontinuation
- 2005-12-09 DE DE112005003465T patent/DE112005003465A5/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6717158B1 (en) * | 1999-01-06 | 2004-04-06 | Mattson Technology, Inc. | Heating device for heating semiconductor wafers in thermal processing chambers |
US20020179589A1 (en) * | 2000-02-08 | 2002-12-05 | Yukihiro Morita | Lamp annealing device and substrate for a display element |
US20020195437A1 (en) * | 2001-06-20 | 2002-12-26 | Tatsufumi Kusuda | Heat treating apparatus and method |
Also Published As
Publication number | Publication date |
---|---|
DE112005003465A5 (en) | 2007-11-22 |
DE102004060557A1 (en) | 2006-06-29 |
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