WO2006061201A1 - Method for registering workpieces and detection system for registering the analysis - Google Patents

Method for registering workpieces and detection system for registering the analysis

Info

Publication number
WO2006061201A1
WO2006061201A1 PCT/EP2005/013104 EP2005013104W WO2006061201A1 WO 2006061201 A1 WO2006061201 A1 WO 2006061201A1 EP 2005013104 W EP2005013104 W EP 2005013104W WO 2006061201 A1 WO2006061201 A1 WO 2006061201A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
reference
position
points
positions
processing
Prior art date
Application number
PCT/EP2005/013104
Other languages
German (de)
French (fr)
Inventor
Paul R. Waldner
Original Assignee
Multiline International Europa L.P
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015Orientation; Alignment; Positioning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns, inspection means or identification means
    • H05K1/0269Marks, test patterns, inspection means or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Abstract

The invention relates to the optimised orientation of workpieces (24) in a machining station. Said method consists of detecting two main reference points (26a, b). whereby the actual positions thereof are compared to the desired positions for optimising the position. The actual positions and the additional reference points (28a - f) are detected in a step upstream from the receiving station (20) and are compared to the desired positions in order to improve the precision of the position and/or to reduce the duration of the method. All of the reference points (26a, b, 28a - f) are taken into account in order to obtain the optimised orientation of the workpiece (24) and the optimised position is then defined by a position handicap for the at least two main reference points (26a, b). Subsequently, the workpiece (24) is orientated in the machining station using said position handicap for both of the main reference points (26a, b). Said invention also relates to a detection system (20) for the above-mention method.

Description

Procedures for registration of workpieces and capture system for the registration analysis

The present invention relates to a method for the optimized registration, ie alignment of a surface of workpieces in a processing station, in which two main reference positions are detected, at least, and the orientation means of a comparison of the actual posi- tions of the main reference positions is carried out with predetermined positions of at least. The present invention also provides a detection system for use in such a method.

For automated machining of workpieces, it is usually necessary to codify exactly defined in the machining position, where it is called a registry of the workpiece. The registration may be necessary for a variety of completely different machining operations, for example in an abrasive machining FOR MOUNTING considered such. B. like the loading of a circuit board, etching or BeIichtungsVorgänge as part of a routing erplattenherstellung, the defined printing of surfaces and. In particular, the production of circuit boards can be considered a manufacturing process as a Musterbeispiel_für in WEL ehern a workpiece in the subsequent processing steps must be accurately registered again in each case, to produce a corresponding printed circuit board to the requirements. To make matters worse, that although the circuit board is a rigid structure in itself, can result through the individual processing steps, however, changes in shape, such. As a compression or stretching means that certain processing points change their relative positions to each other. This realignment, each with a newly to be performed optimization in each processing station is required.

So far it is known, for example from the field of printed circuit board manufacture, to provide parts with two reference marks, the actual position is detected in the processing station by cameras. Subsequently, the detected actual positions of the reference points are compared with predetermined target positions, and it is carried out a position correction in which an optimization of the position of the two reference points is provided.

The problem registering with two reference points is when large workpieces such. As large PCBs, have experienced a greater delay in a previous production step in some areas, as in the reference marks. Thus it may be that, while the areas around the reference marks are optimized ausgerich- tet, but there is a delay in the edge region can not be taken into account, which ultimately leads that tolerances are exceeded and the machined workpiece is Committee. The realization that in such a case is often a correction during the registration in principle possible borrowed, because the tolerance range around the reference points has not yet been exhausted, has led to considerations provide further reference points on the workpiece, such reference points marks, but also provided anyway on the workpiece particularities such. As visible edges, conductor track ends, printing or may be like. can then by a correspondingly increased number of cameras or a movable camera in the processing station carried out a registration of the workpieces kes taking into account all the reference points, so that an occurring only in a smaller area of ​​the workpiece distortion by making use of the tolerance ranges in the non-warped zones can be compensated. Power shortcoming in a such Lδsung the one is the extremely high cost because all affected workstations with additional cameras to capture all reference points or with a precise traversing for a camera must be equipped with even one- appropriate software for the comparison of the actual positions is required to set positions at all stations. On the other hand however, a delay results in the retention time in the processing station as the location optimization with a plurality of reference points takes some time to complete, especially if only one camera has to move all the reference points one by one. In clocked manufacturing operations in an automated sequence of multiple machining operations, such a cycle time extension affects very negatively because the slowest cycle time is significantly onsfxequenz for the production.

From EP 1112676 Bl, a method for processing substrates is known, in which a plurality of detected Lagekoordi- naten and considered in the processing.

These positional coordinates are passed to further processing stations, however, is not intended to make an orientation of the substrate based on two main coordinates. therefore, the process described therein is only suitable for machining operations with individually controllable coordinates, such as drilling holes with a movable drill head, or for the printed circuit board assembly as set forth in this document. For optimized orientation of the substrate, for example, with respect to a mask, it is not suitable.

The object of the present invention is to provide a method for registration of workpieces in processing stations, which is not dependent on a plurality of detection cameras or a complex movable camera in the processing station for the same registration accuracy.

The embodiment of the method according to the invention provides to solve the problem that sungsstation in a step prior to the transfer of the workpiece at the machining station in a Erfas- actual positions of the main reference positions and further by reference positions are detected, comparing the actual positions with the target positions of all the reference points be an optimized positional alignment of the workpiece is determined in consideration of all the reference points, the optimized position is defined by a position setting for the at least two main reference positions and the orientation of the workpiece is carried out on the basis of a position for the two main reference positions in the processing station."

The inventive method has the advantage that the detection of the actual positions of the main reference points of the workpiece as usual with the already provided detection cameras can take place. In contrast to the known registration but no position correction is then made based on previously stored target positions for the main reference points, but the orientation of the main reference points is based on the data of the position specification, which has been previously determined in the recording station. The accuracy of the method according to the invention corresponds to a directly carried out in the processing station procedure with an equal number of reference points, ie the sum of the main and auxiliary reference positions with a corresponding number of cameras in the processing station, since the rigid per se workpiece not at the position correcting can be compressed or stretched, but only a displacement in the XY plane and / or a rotation about the Z-axis is possible. The same Ausrichtmöglichkeit is in conjunction with the exact position specification for this even with only two reference points. Also known analysis and optimization software can onsvorgabe be used to determine the position has in itself.

A further advantage of the process according to the invention is that the residence time of the workpiece in the machining station is not renewed and u. U. can be shortened even as the actual / setpoint adjustment is anticipated with the location of optimization by the position-specification _im-wesentXichen and after the determination of the actual positions of the main reference positions, they can be immediately moved to the optimum position. Thus, it is conceivable, for example in gene automated AnIa-, ​​connected upstream the detection station of the respective processing station and carry out the preset position with the transfer of the workpiece at the machining station. The timing of the entire processing is therefore not delayed and u. U. accelerated because of the comparable can be shortened evaluation. As already mentioned, the reference points can be formed by separate markers, but they can be also readily present anyway characteristics of the workpiece such. As visible edges of holes, heels, traces or already mounted components to be selected as reference points. It is conceivable, in this context, to send certain reference points priorities because, for example in the area of ​​PCB production in certain areas of the board a higher Fertigungsgenau- is accuracy desired as in other zones.

It is also conceivable that the reference points are not visible and optically, for example by arranged in the workpiece cavities, enclosed on all sides conductor tracks or lines or other inhomogeneities in the material are defined texture of the workpiece. To capture these references, for example, X-rays, infrared light, ultrasound or magnetic fields may be used, wherein the detection instead of the visible light used in conventional cameras using Röntgenkame- ras, infrared photosensitive Kamexas., Ultrasound sensors or inductive sensors is carried out. In this way, it is also possible to use method for determining the position, for example by means of X-rays in a processing station not could be realized in most cases. In a separate position detection which then required shielding without major problems can be reached for example in X-rays.

The provision of two preferably detectable with ordinary cameras main reference points is expedient to maintain the previously normal detection with two cameras in the processing stations. Since holes, visible edges, color markings or the like can be detected as a rule, with X-rays, infrared rays or ultrasound Positionser- even those main reference points are readily at an appropriately chosen type detected-making at the sensing station.

For position detection in the detection station, it is conceivable that these corresponding with the number of reference points number of cameras or sensors is detected, but it is also possible to detect the positions of the reference points by a camera or a sensor, at least in a X '-' Y plane is movable and is successively moved to the reference positions Alternatively, the procedural can ren also a group of cameras or sensors, respectively, which are moved, for example, in only one direction and in each case a number of reference points taken simultaneously or it. also image sensing systems with one or more rigid cameras or sensors may be provided, wherein each camera captures a plurality of reference points and the Lageerfas- is sung then made in the context of the image evaluation. a fast detection with multiple cameras is above all advantageous if in the processing station a brief editing process durchgefü is intended to be carried, so as not sungszeit longer than the processing time which is Erfas- and thus prolongs the cycle time.

Particularly advantageous is an embodiment of the method in which the position detection of the reference positions using a flash light during the movement of the camera is carried. Because you reach a gain of time since a stop of the camera for position detection is no longer necessary. As already mentioned, it is advantageous to select the default position is to provide that this is provided for positioning provided with the transfer of the workpiece at the machining station in a data format. The. Data format then geared appropriately to the already provided for controlling the registration data format to make only by software-programming existing Bearbeitsstationen for use of the method according to the invention capable. Or suppose an immediate control of the position optimization in the processing station by the data processing means of the detection station.

In a direct data transfer to the workpiece and the allocation of the position specification determined for the corresponding workpiece is not a problem. but at a spatial separation of the detection station and processing station, it may also be useful to provide for a plurality of workpieces, the position specification in a data format is available, to mark the respective associated workpieces individually and at a later time, the position requirements of each work piece in the machining station assigned. So it is conceivable, for example, to analyze a batch of workpieces first in the recording station and then fall back later in the processing to the identified records. Individual identification of the individual workpieces is this, however, essential. A particularly advantageous development of the method, wherein the workpieces themselves with a coding, such this appear. As a bar code, are identified as the data format, which contains the position specification. A particularly preferred development of the method provides that a plurality of position values ​​per workpiece are calculated, the workpiece surface in each case to a given area of ​​the factory or reflect other workpiece surfaces, and the workpiece in the machining station successively with respect to each zone, or one of the surfaces is aligned for processing.

Such a development of the method is advantageous, for example, in the manufacture of printed circuit boards, when a plurality of identical printed circuit boards are made from a single workpiece. For example, it is customary to manufacture the circuit boards for mobile phones from a single large blank, wherein the same machining operation, for example, during exposure, successively for the individual zones is performed, which later form the individual printed circuit boards. By the respective position values ​​to optimize the location for each of these individual loading can be done processing steps, since according to the individual

Zones located there reference points can be used for position correction. However, the multiple optimization can also be used for three-dimensional workpieces, when a plurality of surfaces of the workpiece to be machined after it istration Neuregi-.

that the workpiece is aligned in the first processing station after the two main reference positions and the machining processing, such a further embodiment of the method may provide. B. applying a print image, making a drill patterns or the like, is also performed in consideration of the Mebenreferenzstellen. So it would be conceivable for example in a printed image, this suit in accordance with the previously determined delay considering the location of all the reference points in order to achieve an optimized processing position in all areas of the factory piece.

The present invention also provides a detection system for an aforementioned process to a detection station in which a workpiece is defined positioning bar, at least a camera or a sensor for detecting the actual position of at least two main reference positions, and further extensions, as well as a data processing device, comparing the detected actual values ​​of all the reference positions with stored desired values, calculates an optimized position of the workpiece with respect to all the reference points and the position defined by a position specification with reference to the two main reference positions. Such a detection system may for example be provided upstream of a conventional work station, or it can be used separately rat to determine position values ​​for a number of individually identified or characterizing workpieces.

The camera or sensor of the detection system is preferential as to drive the reference points sequentially movable so that all the reference points can be detected with a single camera or a sensor. It is particularly advantageous to provide a strobe light, which allows the detection of the reference points during the camera motion, in order to shorten the time for the detection process is total. For the above-mentioned processing of multiple areas Werkstückobexfläche with the same machining operations a further development of the detection system of advantage which may be, are defined examples of the main reference positions for optimized orientation of respectively assigned individual zones of the workpiece surface a plurality of position values ​​with respect to the. In order for a zone-optimal orientation with respect to the lying there near reference points is possible.

As mentioned above, the detection system for the direct transfer of the data for the preset position with the workpiece may be provided on the processing station, but the detection system may be further formed in such a manner that the data of the position setting stored in a a specific workpiece uniquely assignable manner are. For example, the detection system may also be advantageously designed so that it stores data by marking the workpiece with a code. In this way, a secure assignment of the position specification at any later date is possible.

Be used for position detection no conventional cameras but infrared or X-ray cameras or ultrasonic sensors or inductive sensors, they should be able to detect also the main reference positions in position, which then in the processing station visible with conventional cameras for detecting light determined in position are.

Description will be made with reference to the accompanying drawings to embodiments of the invention. In the drawings: Figure 1 is a schematic view of a target detection with two cameras in a processing station;.

Figure 2 is a schematic view of an apparatus for target acquisition by the prior art.

Fig. 3 is a schematic perspective view of a

Position detection system;

Fig. 4 is a plan view of a gene to be processed printed circuit board with Referenzmarkierun-;

. Fig. 5 with reference to the circuit board of Figure 4 shows a first method step;

Fig. 6 with reference to the circuit board handicap a subsequent process step for position;

Figure 7 is based on the circuit board an op- len further process step for a zone by zone location optimization.

Fig. 8 shows schematically a comparison of soil-and actual shape of a printed circuit board.

In Fig. 1, an arrangement for determining the actual position of a workpiece 10 with two Referenzmarkierun- is shown schematically gen 12, as known from machining stations according to the prior art. Two rigidly arranged cameras 14, instead of them, a movable camera arranged may be provided detect optically the actual posi- tions of the reference points 12 and compare it with desired positions. Subsequently, the workpiece 10 is aligned to an optimal position of the two marking locations is reached.

An arrangement with an improved accuracy is shown in FIG.

2 shown. To improve the alignment accuracy eight reference marks are detected by eight cameras 14b 12b and the optimized alignment of the workpiece 10 is effected by comparing all eight actual positions of the reference points 12b with stored reference values. Apart from the increased time required immediately in the processing station, a great investment cost of such a solution are opposed to rigid cameras.

Fig. 3 shows an inventive system for detecting

Carrying out the method according to the invention, which is arranged in front of the actual processing station which is suitable overall for example, with a camera provided in the sensing device for the actual positions of two reference points, as shown in FIG. 1. The detection system comprises a frame 22, in which the workpiece 24, here a printed circuit board is defined securable. The circuit board 24 is presented with eight reference points, two main reference positions 26a, 26b and six Nebenreferenz- filters 28a - 28f. is further connected to the frame 22, a crossbeam

30 slidably mounted in a linear guide and displaceable with the aid of a powerful drive in the Y direction. To the cross member, in turn, is a camera support 32 in a I_ ± nearf.ührung (not shown) is arranged linearly displaceable and with the help of a drive-adjustable, so that a permanently attached to the camera support 32 camera 34 at JE de XY-coordinate above the circuit board 24 quickly moved. The position detection of the individual reference points 26a, b and 28a - f is done sequentially by selectively starting the relevant position by the digital camera 34, which has a short detection time. The recordings advertising the recorded at the individual points with continued moving camera 34 during movement, which is enabled by a flash lamp 36, which briefly triggers in the corresponding x, y location. Position sensors (not shown) thereby determine the exact position of the camera and a connected data processing device processes the image data into a suitable data format that the exact actual position of the individual reference points 26a and 28a - f represents.

The sequence of the alignment of the circuit board 10 in the machining beitungsstation with the aid of the detection system 20 is below with reference to Figures 4 - explained in more detail. 6.

In FIG. 4 in plan view of the printed circuit board 10 with the two main reference positions 26a and 26b as well as the Nebenreferenz- is set 28a - f shown. Conductor tracks 38 and soldered joints are indicated schematically further 40 or already provided elements 42, bores or the like, which can serve as reference points in addition to or in place of the marked reference points.

Since the circuit board shown in FIG. 4 can be precisely aligned in a next machining operation, so that neighboring following editing operations can be performed on the already formed conductive patterns 38, 40, 42 fitting the circuit board 10 corresponding to the picture in FIG. 3 in the receptacle 23 of the detection system 20 inserted. The camera-ra 34 now begins with the aid of the adjustable device to depart the reference points in succession, the sequence expediently then directed, as all the reference points can be approached in succession with the shortest possible path. In the example shown in Fig. 5, the Positionserf-as' solution begins with the sub-reference parts 28f and in the further sequence of the main reference positions 26a, the Ne benreferenzstellen 28a, 28b, 28c, the other main reference point 26b, and finally the two secondary reference portions 28d and 28e detected. The detection is carried out, as already described above, in the movement of the camera by triggering the flash light 36. While Fig. 4 and 5 show idealized circuit boards with precisely located at the correct position reference points, actually results in practice, a different picture. As can be seen from Fig. 6, the actually detected actual positions are (light shown) in the

Usually more or less clearly offset from the ideal desired positions. This offset is obtained by shrinkage acquisition or stretching operations of the circuit board during processing, whereby the positions listed may already applied strip conductors 38, solder joints 40 or holes are affected by these delay operations.

Using a known per se, suitable software which is not the subject of this application, an ideal position shall then be calculated mathematical basis is in which the sum of the offset of all the reference points miniert from their desired positions. This optimized alignment of the managerial terplatte by the comparison of all the actual positions of the reference points with the nominal positions will be stored in the way in a suitable data format that are 5 züglich defines a desired position of this through a preset position of the two main reference positions 26a, b sawn. This data is then subsequently transferred to the workpiece 10 at the processing station, which exclusively detects again the two main reference positions 26a, b (see Fig. 1), but in deviation from prior art solutions, the alignment

10 makes reference to the preset position and not on the basis of optimizing the actual positions of the main reference points 26a, b exclusively to their assigned target positions. The accuracy of the alignment is not suffering as since it is in the board already an at least in the context

15 of the Ausrichtsvorganges acts as a rigidly formed to be adopted, that is, it is sufficient, the determined optimized position based on the two main reference positions in the detection position set.

20 The processing station itself can be converted through a small software-change on-.the interaction with the detection system rule that provides the position specification in a form suitable for processing station format."25 ~" ~

Instead of a direct data transfer together with the workpiece, creating a special assignment is not necessary, it is also conceivable to determine the position requirements initially for a number of printed circuit boards and the individual

30 records this assigned individually. To an individual labeling of the boards is necessary, and for example, serial numbers of the individual data records can be assigned. However, it is also possible to mark the position specification immediately as the code on the circuit board, for example as a bar code, and then to detect these in the processing station by a suitable reader, which can be very simply adapted to perform the optimized alignment of the workpiece.

In Fig. 7, finally, is illustrated again with reference to the embodiment shown in Figure 6 is the printed circuit board, which further uses the detection of the main reference positions 26a, b, and additionally the secondary reference points 28a -. F offers. From the actual positions of all the reference points in Fig. 7, the data processing means of the detection system determines an anticipated actual state of the circuit board 46 during the acquisition process. Using this as a pure data format or graphically stored image of the actual state of the circuit board, it is conceivable to take on the editing process itself influence and move next to the preset position also, for example, the coordinates to be attached drilling, soldering or other corresponding to the detected image of the board ,

With reference to Fig. 7 and 8 but a still further embodiment of the method may be illustrated, which is particularly useful when it is divided to manufacture printed circuit boards in a plurality of zones 48, 50, 52, 54, in which the same conductor paths are to be formed respectively, to prepare later from the "blank several smaller printed circuit boards, in the embodiment shown four. in such a case, the conductor is plate in the processing station is usually one of the number of zones exposed corresponding number of repeating the same machining operations. with the aid of the detection system 20, it is now possible for each of these processing steps optimized orientation with respect to the respective zone 48, 50, 52 or 54 vorzu- take, which is due date for the next machining operation. in this manner, distortions can particularly in the area of ​​a single zone, the Kings not very fall in the rest statistically significant and lead n-th, that the circuit board produced in this zone is later Committee, be compensated by the particular orientation.

In the illustrated embodiment, the ideal positioning of each zone could be made on the basis of the three in this range reference points, wherein aller- recently turn this ideal position is applied as a position for only the two main reference positions 26a, b in data form to turn the alignment in conventional processing stations allow.

It is also conceivable in the detection system concealed workpiece features such. B. cavities enclosed lines or conductors or other inhomogeneities of the workpieces kit to detect, for example by means of X-ray radiation, infrared radiation, inductive sensors or ultrasonic sensors working. However .Zweckmäßigerweise the main reference positions are at least optically visible in order to be able to use the conventional position detection in the processing station unchanged with the aid of two optical cameras.

Claims

claims
1. A method for optimal alignment of at least one surface of workpieces (24) in a Bearbeitungssta- tdon, wherein at least two main reference points (26a, 26b) are detected and the alignment on the basis of a comparison of the actual positions of the main reference positions (26a, 26b) with set positions is carried out, characterized in that in a step prior to the transfer of the workpiece (24) to the processing station in a detection station (20) actual positions of the Hauptreferenz- filters (26a, 26b), and further by-reference parts (28a - f) detected are the actual positions with Sollposi- functions of all the reference points (26a, b, 28a - f) are compared, an optimized positional alignment of the workpiece (24), taking account of all the reference points (26a, b, 28a - f) is determined, the optimized position by a Posi-t-ionsvorgabe for the at least two Hauptrefe- Renz filters (26a, 26b) is defined and in the processing station, the alignment~ The "workpiece (24) based on the position specification for the two main reference points (26a, b) is made.
2. The method according to claim 1, characterized in that the reference points (26a, b, 28a - f) by markings and / or workpiece features such. B. visible edges, already mounted components, concealed voids and / or other inhomogeneities of the workpiece structure are formed. 3. The method of claim 1 or 2, characterized in that two Hauptxeferenzsteilen (26a, 26b) are provided.
4. The method according to any one of claims 1 to 3, characterized indicates overall that the position detection of the reference points (26a, 26b) with the number of performed corresponding number of cameras or sensors, the position detection of all the reference points with a fixed camera or a rigid sensor is carried out via a corresponding image analysis or the position detection of the reference points in groups with a respectively associated fixed camera or a respective associated rigid sensor via a corresponding image evaluation.
5. The method according to any one of claims 1 to 3, characterized in that the positions of the reference points (26a, 26b) by a camera (34) or a sensor are detected, the which is movable or at least in an XY plane and successively (- f 26a, 26b, 28a) is moved to the reference positions.
6. The method according to claim 5, characterized in that the position detection of the reference points (26a, 26b, 28a
, - .f) .. with- the aid of a strobe light activation - (-3-6) während- ■ the movement of the camera (34).
7. The method according to any one of the preceding claims, characterized in that the position specification is provided in a data format and the data with the transfer of the workpiece (24) that are provided for the optimized positioning available to the processing station. 8. A method according to any one of claims 1 to 6, characterized in that for a plurality of workpieces (24) provided the position specifications in a data format available 5 and associated workpieces (24) to be marked individually and at a later time, the position targets the respective workpiece (24) are assigned in the processing station.
10 9. The method of claim 8, characterized in that the workpieces (24) with a coding, for example. As a bar code, are identified, including the position specifications.
15 10. Method according to one of the preceding claims, characterized in that a plurality of position values ​​per workpiece (24) are calculated, each relating to a particular zone (48, 50, 52, 54) reflect the surface of the workpiece or other workpiece surfaces and the 0 workpiece (24) in the processing station in relation to a respective zone (48, 50, 52, 54) or one of the surfaces is aligned with the respective processing.
--- ll -.- method -to einem- the vorhergehenden- claims, DA - 5 characterized by that the workpiece (24) in the machining station between the two main reference points (26a, 26b) is aligned and also taking into account the processing the actual position of the Nebenreferenz- filters (28a - f) is adjusted. 0 12. The method according to any one of the preceding claims, characterized in that there are used as workpieces circuit boards (24).
13. acquisition system for a method according to any preceding claim, which is positionable a detection station (20), in which a workpiece (24) defines at least one camera (34) and / or at least one sensor for detecting the actual positions of at least two main reference points (26a, 26b) and further reference points of by-products (28a - f) and a data processing, comprising means to the detected actual positions of all the reference points (26a, b, 28a - f) compares with stored desired positions, an optimized location of the tool piece (24) with respect to all reference points (26a, b, 28a - f) is calculated and the location by a preset position with respect to the two main reference points (26a, b) are defined.
14. A detection system according to claim 13, characterized in that the camera (34) or the sensor for controlling the reference points (26a, b, 28a - f) is sequentially movable.
15. A detection system according to claim 14, characterized in that a flash lamp (36) is provided, the detection of the reference points (26a, b, 28a - f) allows during the camera motion.
16. detection system (26a, b) of the defined according to one of claims 13 to 15, characterized in that it provide a plurality of position values ​​per surface with respect to the two Hauptreferenz- for optimized orientation of each zugeordneten..Zone the workpiece surface.
17. A detection system according to any one of claims 13 to 16, data characterized by that preset the data for the position with the workpiece (24) passed to the processing station.
in 18. A detection system according to any one of claims 13 to 16, data through that data on the position specification clearly zuor- denbaren manner are stored in a a specific workpiece (24).
19. A detection system according to claim 18, characterized gekennzeich- net that it stores the data of the position specified by marking the workpiece (24) with a code.
20. A detection system according to claim 13 or 14, characterized in that the at least one camera and the at least one sensor for the detection of hidden secondary reference points and optically visible main reference positions is suitable detectable in the processing station by means of at least an ordinary camera are.
PCT/EP2005/013104 2004-12-08 2005-12-07 Method for registering workpieces and detection system for registering the analysis WO2006061201A1 (en)

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DE102004059018.4 2004-12-08

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JP5893154B2 (en) * 2011-11-14 2016-03-23 エーファウ・グループ・エー・タルナー・ゲーエムベーハー Measurements of the change in shape of the substrate

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EP0326236A2 (en) * 1988-01-28 1989-08-02 Dynapert Limited Method of setting up apparatus for handling electrical or electronic components
WO1995021376A1 (en) * 1994-02-02 1995-08-10 Kratzer Automatisierung Gmbh Device for imaging a three-dimensional object
US6016599A (en) * 1995-11-29 2000-01-25 Matsushita Electric Industrial Co., Ltd. Device and method for mounting electronic parts
WO2004019670A1 (en) * 2002-08-23 2004-03-04 Fuji Machine Mfg. Co., Ltd. Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system

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US6079098A (en) * 1998-09-08 2000-06-27 Siemens Aktiengesellschaft Method and apparatus for processing substrates

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EP0326236A2 (en) * 1988-01-28 1989-08-02 Dynapert Limited Method of setting up apparatus for handling electrical or electronic components
WO1995021376A1 (en) * 1994-02-02 1995-08-10 Kratzer Automatisierung Gmbh Device for imaging a three-dimensional object
US6016599A (en) * 1995-11-29 2000-01-25 Matsushita Electric Industrial Co., Ltd. Device and method for mounting electronic parts
WO2004019670A1 (en) * 2002-08-23 2004-03-04 Fuji Machine Mfg. Co., Ltd. Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system

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