WO2006060524A2 - Fluoropolymer molding process and fluoropolymer molded product - Google Patents
Fluoropolymer molding process and fluoropolymer molded product Download PDFInfo
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- WO2006060524A2 WO2006060524A2 PCT/US2005/043393 US2005043393W WO2006060524A2 WO 2006060524 A2 WO2006060524 A2 WO 2006060524A2 US 2005043393 W US2005043393 W US 2005043393W WO 2006060524 A2 WO2006060524 A2 WO 2006060524A2
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- fluoropolymer
- melting point
- molding process
- molded product
- molding
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/005—Processes for mixing polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08L27/18—Homopolymers or copolymers or tetrafluoroethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Definitions
- the present invention relates to a molding process for fluoropolymer molded products that have superior resistance to chemical and gas permeation, and a low coefficient of linear expansion, and to the fluoropolymer molded products obtained from said process.
- Fluoropolymers that possess the characteristics of heat resistance and chemical resistance can be utilized in the linings of pipes or tanks, and in pipes used for transporting chemicals such as in semiconductor manufacturing processes or chemical plants, in joints such as flanges and couplings, and in chemical storage vessels.
- PTFE polytetrafluoroethylene
- PTFE polytetrafluoroethylene
- Paste extrusion is the process wherein a fine PTFE powder that has been fibrillated by application of shearing forces forms a mixture (paste) with a known lubricant. This paste is extruded at low temperature (not exceeding 75°C).
- Compression molding is the process wherein PTFE powder is maintained at a temperature above its glass transition point (Tg), is loaded into a mold and is then compressed with a ram, and heated (sintered) to effect molding.
- Tg glass transition point
- the lubricant must be removed after paste extrusion.
- Tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer possesses the advantages of superior heat resistance, and chemical resistance equal to that of PTFE, and can be used for melt molding such as extrusion, injection molding, blow molding, transfer molding, and melt compression molding. Because it is more economical to process, articles made from PFA have a lower cost than the same articles made from PTFE, and is suitable for mass production. Nevertheless, since it is inferior to PTFE in terms of resistance to chemical and gas permeation, it has been suggested that the resistance to chemical and gas permeation can be improved by increasing the degree of crystallinity in the molded products through blending PTFE with PFA.
- low molecular weight PTFE also known as micropowder
- the increase in viscosity can be avoided and melt molding is possible, and increased resistance to chemical and gas permeation can thus be achieved.
- the addition of low molecular weight PTFE affects mechanical strength adversely, so that the quantity of low molecular weight PTFE that can be added is limited.
- ⁇ •' 'Fbftnerm ⁇ reT WheWlubropolymer molded products have been heated at temperatures above the melting point, the linear expansion coefficient becomes larger as compared to other materials, such as the metal that is used in piping.
- the lining can warp when exposed to elevated temperatures, and this can cause leaks at the seals of joints.
- the linear expansion coefficient is smaller with a higher degree of crystallinity (where there is a smaller fraction of non-crystalline regions, which have a higher expansion coefficient) in the molded product, it is preferable for the degree of crystallinity in the molded product to be high.
- the degree of crystallinity in the molded product can be increased through slow cooling after heating, but the benefit is minor and it is not possible to obtain by this means a material improvement in resistance to chemical and gas permeation and reduced linear expansion coefficient.
- the present invention provides a fluoropolymer composition that is melt processible and results in a molded article that has superior resistance to chemical and gas permeation, and a low coefficient of linear expansion.
- the present invention further provides a process wherein it is possible to obtain through melt fabrication a fluoropolymer product that has superior resistance to chemical and gas permeation, and a low coefficient of linear expansion.
- the present invention provides a fluoropolymer molded product, obtained by said molding process, that has superior resistance to chemical and gas permeation, and a low coefficient of linear expansion.
- the present invention provides a molding process wherein a mixture is obtained by combining at least two fluoropolymers, each having different melting points, and molding is carried out at a temperature that is at or above the melting point of the fluoropolymer with the lowest melting point and is less than the melting point of the fluoropolymer with the highest melting point.
- the fluoropolymers used in the present invention comprise at least two fluoropolymers having different melting points and can be selected from the group -BoWSMf nJfoP p ⁇ lftetrafluoroethylene, tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer, tetrafluoroethylene/hexafluoropropylene copolymer, ethylene/tetrafluoroethylene copolymer, ethylene/chlorotrifluoroethylene copolymer, polychlorotrifluoroethylene, poly(vinylidene fluoride), vinylidene fluoride/hexafluoropropylene copolymer, and tetrafluoroethylene/vinylidene fluoride/hexafluoropropylene copolymer.
- a fluoropolymer molding process is a preferred mode of the present invention.
- a preferred mode of the present invention is the fluoropolymer molding process wherein the fluoropolymers are polytetrafluoroethylene and tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer.
- a preferred mode of the present invention is the fluoropolymer molding process wherein the fluoropolymers are polytetrafluoroethylene and tetrafluoroethylene/hexafluoropropylene copolymer.
- a preferred mode of the present invention is the fluoropolymer molding process wherein the polytetrafluoroethylene has a heat of fusion ( ⁇ H) of greater than or equal to about 45 J/g.
- the present invention also provides a fluoropolymer molded product obtained by the aforementioned fluoropolymer molding process.
- a fluoropolymer molded product with a linear expansion coefficient between 100 0 C and 15O 0 C of less than or equal to about 15 ⁇ 10 '5 /°K is a preferred mode of the present invention.
- a fluoropolymer molded product with a specific gravity of greater than or equal to about 2.180 is a preferred mode of the present invention.
- the present invention provides a molding process for fluoropolymer molded products that have superior resistance to chemical and gas permeation, and a low coefficient of linear expansion, as well as a fluoropolymer molded product obtained from said molding process.
- the fluoropolymer molding process of the present invention by carrying out the molding on a mixture obtained by combining at least two of fluoropolymers that have different melting points, where the molding takes place at a temperature that is at or above the melting point of the fluoropolymer with the lowest melting point and is less than the melting 'p ⁇ im i ⁇ of We :: fl ⁇ dropb1ymer ; ⁇ with the highest melting point, the degree of crystallinity in the fluoropolymer with a high-melting point is maintained, so that the resulting fluoropolymer molded product has superior resistance to chemical and gas permeation, and a low coefficient of linear expansion.
- the fluoropolymer molded products of the present invention possess superior performance such as superior resistance to chemical and gas permeation, and a low coefficient of linear expansion
- the fluoropolymer molded products can find applications such as in semiconductors, preventing chemical corrosion (CPI), office automation (OA), sliding materials, automotive products (engine components such as electrical cables, oxygen sensors, and fuel hoses), and printed circuit boards.
- Fig. 1 is a photograph of the appearance of the extruded product (bead) obtained in Example 2.
- Fig. 2 is a photograph of the appearance of the extruded product obtained in Comparative Example 1.
- the present invention provides a fluoropolymer molding process wherein a mixture obtained by combining at least two of fluoropolymers having different melting points, and carrying out the molding at a temperature that is at or above the melting point of the fluoropolymer with the lowest melting point and is less than the melting point of the fluoropolymer with the highest melting point.
- the present invention also provides a fluoropolymer molded product obtained by the aforementioned fluoropolymer molding process.
- the at least two fluoropolymers having different melting points are selected from the group consisting of polytetrafluoroethylene, tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer (PFA), tetrafluoroethylene/hexafluoropropylene copolymer (FEP), ethylene/tetrafluoroethylene copolymer, " 'ethyle ' ne'y&htbrotr ⁇ fMbfomyiene copolymer, polychlorotrifluoroethylene, poly(vinylidene fluoride), vinylidene fluoride/hexafluoropropylene copolymer, and tetrafluoroethylene/vinylidene fluoride/hexafluoropropylene copolymer.
- polytetrafluoroethylene as the high-melting point fluoropolymer and PFA and/or FEP as the low-melting point fluoropolymer are preferable.
- Polytetrafluoroethylene with a heat of fusion ( ⁇ H) of greater than or equal to about 45 J/g is preferred. If the heat of fusion ( ⁇ H) is less than about 45 J/g, the degree of crystallinity will be lower and there will be less improvement of the resistance to chemical and gas permeation, and linear expansion coefficient.
- the typical melting points of these polymers are as follows: polytetrafluoroethylene - about 343°C (on the first melting; about 327°C on subsequent meltings); PFA - about 275-310 0 C, depending upon comonomer (perfluoro(alkyl vinyl ether) content); and FEP - about 250-280°C( depending upon comonomer (hexafluoropropylene) content).
- PTFE melt flow rate (MFR) of less than about 0 g/10 min is preferred as opposed to PTFE having a measurable MFR.
- polytetrafluoroethylene as used herein means a homopolymer of tetrafluoroethylene, or a copolymer (sometimes referred to below as modified PTFE) of tetrafluoroethylene that includes less than about 2 wt% of a copolymerizable fluoromonomer.
- the content of the copolymerizable fluoromonomer in the modified PTFE is preferably less than about 2 wt%, more preferably less than or equal to about 1.5 wt%, and further preferably less than or equal to about 1 wt%.
- 1 Ih thy aforerhehtib ⁇ bd 1 tetrafluoroethylene copolymer (modified PTFE) 1 examples of copolymerizable fluoromonomer include olefins of C-3 (i.e. having three carbon atoms) or more and more preferably perfluoroalkenes having three carbons or more, most preferably three to six carbons; C-1 to C-6 perfluoro(alkyl vinyl ether) wherein the alkyl groups preferably have from one to six carbon atoms; chlorotrifluoroethylene, and the like.
- HFP hexafluoropropylene
- PMVE perfluoro(methyl vinyl ether)
- PEVE perfluoro(ethyl vinyl ether)
- PPVE perfluoro(propyl vinyl ether)
- PBVE perfluoro(butyl vinyl ether)
- CTFE chlorotrifluoroethylene
- HFP, PEVE and PPVE are more preferred, and HFP is most preferred.
- the use of aqueous dispersions obtained from emulsion polymerization is preferred.
- the mean particle diameter for the fluoropolymer particles is about 0.10-0.40 ⁇ m, and preferably about 0.2-0.3 ⁇ m, and a fluoropolymer content of about 25-70 wt% in water is preferred.
- any conventionally known process that is suitable can be used. For example, it is satisfactory to use the processes described in Japanese Published Examined Applications 37-4643, 46-14466, and 56-26242.
- a mixture comprising about 10-95 wt% of the high-melting point fluoropolymer and about 90-5 wt% of the low-melting point fluoropolymer is preferred.
- the mixing ratio is determined by consideration of the desired resistance to chemical and gas permeation, linear expansion coefficient, maximum strength, and elongation.
- having the proportion of the high-melting point fluoropolymer less than about 10 wt% is not preferable because the degree of crystallinity in the fluoropolymer molded product will be low.
- a preferred process is the mixing of an aqueous dispersion containing the high-melting point fluoropolymer with an aqueous dispersion containing the low-melting point fluoropolymer.
- the composition of the mixture will reflect the preferred ranges of compositions for the respective fluoropolymer aqueous dispersions, while the mixing ratio can be suitably adjusted as preferred.
- a mixture of the present invention obtained by emulsion polymerization that is a preferred specific example is the one wherein a high-melting point fluoropolymer aqueous dispersion (for example, with a mean particle diameter of 0.24 ⁇ m) and a low-melting point fluoropolymer aqueous dispersion (for example, with a mean particle diameter of 0.24 ⁇ m) are mixed together in a proportion of from about 95:5 to about 10:90 based on weights of polymer in the dispersions, and after stirring and coagulation the coagulate obtained is dried to give a powder that has a mean particle diameter on the order of 300-600 ⁇ m, more preferably on the order of 400 ⁇ m.
- a recommended melt flowability (F) (a measure of shear-thinning or thixotropy) for the mixture of the present invention of is preferably greater than or equal to about 0.1 and more preferably is equal to about 1.0 or greater than about 1.0. If the melt flowability (F) is too small, the decreased melt viscosity of the mixture due to the increased rate of shear (shear stress) will be disadvantageous, and the processability will tend to become worse.
- the melt flowability (F) can be determined from Formula (1) below.
- the viscosity as a function of shear rate can be determined from Equation (2) below.
- MV(poise) ⁇ P/ ⁇ (2) (wheTe' ⁇ P ⁇ pressure (MPa) during extrusion of a powdered sample at a fixed shear rate (Y), using a capillary flow tester (Capillograph 1B, Toyo Seiki Co., Ltd.) and increasing the temperature of the orifice (diameter ( ⁇ ): 2 mm; length (L): 20 mm) at the cylinder bottom to a fixed molding temperature).
- Y shear rate
- Y shear rate
- Capillograph 1B Toyo Seiki Co., Ltd.
- any desired additives may be included if needed.
- additives include antioxidants, photostabilizers, fluorescent whiteners, pigments, colorants, dyes, fillers, for example carbon black, graphite, alumina, mica, silicon carbide, boron nitride, titanium oxide, bismuth oxide, bronze, gold, silver, steel, and nickel. These may be in appropriate form such as powders, powdered fibers, or fibers. Nanomaterials that have recently entered mass production and have been commercialized, such as fullerene (C60) and carbon nanotubes, can also be used as additives. Moreover, microparticles of other polymers in addition to fluoropolymers, and other components may be included and used so long as they are not detrimental to the objectives of the present invention.
- the preferred molding process for the fluoropolymers in the present invention is a melt molding process carried out on a mixture obtained by combining at least two fluoropolymers having different melting points, at a temperature that is at or above the melting temperature of the lowest melting point fluoropolymer and is below the melting temperature of the highest melting point fluoropolymer.
- molding processes include extrusion, injection molding, transfer molding, and melt compression molding.
- the molding process can be paste extrusion or compression molding.
- a bead or pellet can be molded at a temperature that is at or above the melting temperature of the PFA and is below the melting temperature of the PTFE using the mixture powder obtained as above (by mixing aqueous dispersions of the two polymers, coagulating and drying the resulting mixture).
- the bead can be cut into penetsrwmch'caft tfeiisfecPto carry out continuous melt extrusion at a temperature that is at or above the melting temperature of the lowest melting point fluoropolymer and is below the melting temperature of the highest melting point fluoropolymer. Any unstable end groups contained in said beads or pellets can be reduced in concentration such as through fluorination.
- said preformed body is placed in a paste extruder, and is extruded, and said lubricant removed, at a temperature that is at or above the melting point of the fluoropolymer with the lowest melting point and is less than the melting point of the fluoropolymer with the highest melting point.
- melt molding can be carried out while maintaining a high degree of crystallinity in the high-melting point fluoropolymer, a fluoropolymer molded product can be obtained which has superior resistance to chemical and gas permeation, and a low linear expansion coefficient.
- a fluoropolymer molded product of the present invention that has a linear expansion factor less than or equal to about 15 ⁇ 10 "5 /°K between 100 0 C and 150 0 C is preferred, because it will have superior dimensional stability at those temperatures. If the linear expansion factor is too large under high temperature usage conditions, there will be a concern that the fluoropolymer molded product obtained will become deformed, so that, for example, tne sear ⁇ etweeh a tube and a joint will fail and chemicals might leak out.
- the specific gravity of a fluoropolymer molded product of the present invention is preferably greater than or equal to about 2.160, and more preferably greater than or equal to about 2.180.
- the specific gravity of a fluoropolymer is an index of the degree of crystallinity of the polymer: lower specific gravity means lower crystallinity. As a consequence, resistance to chemical and gas permeation will tend to be lower also.
- a fluoropolymer molded product of the present invention will find use in applications that require resistance to chemical and gas permeation and a low coefficient of linear expansion, for example tubes, seals, rods, fibers, packing, cables, linings, and laminated bodies that employ molded products of the present invention.
- Fluoropolymer molded products of the present invention are suitable for applications such as in semiconductors, CPI, OA, sliding materials, automotive products (engine components such as electrical cables, oxygen sensors, and fuel hoses), and printed circuit boards.
- a differential scanning calorimeter (Pyrisi DSC, Perkin Elmer) is used.
- a 10 mg portion of the powdered polymer sample is weighed out into an aluminum pan, and after being crimped closed with a crimper, is placed in the main DSC unit, and the temperature is increased from 150 0 C to 36O 0 C at the rate of 10°C/min.
- the heat of fusion is determined from the area defined by the melting curve on either side of the melting peak, and a straight line connecting the point where the melting curve separates from the baseline to the point where it returns to the baseline.
- a compression molding device Hot Press WFA-37, Shinto Industry Co., Ltd.
- the powdered polymer sample is melt compression molded (4 MPa) at the extruding temperature shown in Table 1 to obtain a sheet with a thickness of approximately 1.0 mm.
- a sample piece (height: 20 mm; width: 20 mm) is cut from the sheet obtained, and the specific gravity is determined according to Method A (water displacement method) of JIS K711. (5) Resistance to chemical and gas permeation
- a compression molder Hot Press WFA-37, Shinto Industry Co., Ltd.
- the powdered sample is melt compression molded (4 MPa) at the extruding temperature shown in Table 1 to obtain a sheet with a thickness of approximately 1.0 mm.
- a gas permeability measuring apparatus Shibata Chemical Instrument Co., Model No. S-69 is used to measure the nitrogen gas permeability of the sheet obtained at a temperature of 23°C. (6) Linear expansion coefficient
- a compression molder Hot Press WFA-37, Shinto Industry Co., Ltd.
- the powdered sample is melt compression molded (4 MPa) at the extruding temperature shown in Table 1 to obtain a billet.
- a lathe is used to cut a measurement sample (diameter: 4 mm; length: 20 mm) from the billet 'bbta ⁇ he'd 1 :"
- a 11 TMA T M-7 ⁇ 3 ⁇ d apparatus (Vacuum Engineering, Inc.) was used, and the temperature was increase at the rate of 5°C/min over the range -10 0 C to 270 0 C.
- the dimensional changes were measured between 100 0 C and 15O 0 C, and the linear expansion coefficient was determined according to ASTM D696.
- a capillary flow tester (Capillograph 1 B, Toyo Seiki Co., Ltd.) was used, and the powdered polymer sample was ram-extruded at a shear rate of 15.2 s "1 from the orifice (diameter: 2 mm; length: 20 mm) at the cylinder bottom, which is controlled at the extruding temperature shown in Table 1 , to obtain a bead.
- a stylus-type surface roughness tester (SURFCOM 575A-3D, Tokyo Seimitsu) is used to measure the surface roughness (R(a)) at 5 arbitrarily chosen points, and the surface is considered to be smooth when the mean value for the surface roughness (R(a)) over the 5 points is less than or equal to about 100 ⁇ m.
- a Tensilon RTC-1310A (Orientec Co., Ltd.) is used for determining the maximum tensile strength to break and the elongation to break for the bead obtained. The measurements were made with a chuck gap distance of 22.2 mm and a stretching rate of 50 mm/min.
- Aqueous dispersions of fluoropolymers with different melting points were blended to give ratios as shown as shown in Table 1 , where the weights of the resins are given in wt%.
- the dispersion blends were coagulated by high speed agitation (mechanical coagulation). The coagulate thus obtained was filtered to separate the solids from water, the solids were dried for 16 hours at 270 0 C, to furnish powdered samples having a mean particle diameter of 300-800 ⁇ m.
- the present invention provides a molding process for fluoropolymer molded products that have superior resistance to chemical and gas permeation, and a low coefficient of linear expansion, as well as a fluoropolymer molded product obtained from said molding process. Along with being able to employ molding, it is possible with the fluoropolymer molding process of the present invention to obtain a fluoropolymer molded product with superior resistance to chemical and gas permeation and a low coefficient of linear expansion.
- fluoropolymer molded products of the present invention possess superior performance such as superior resistance to chemical and gas permeation, and a low coefficient of linear expansion
- these fluoropolymer molded products can find possible applications, as for example, in semiconductors, the chemical process industry (CPI), OA, sliding materials, automotive products (engine components such as electrical cables, oxygen sensors, and fuel hoses), and in printed circuit boards.
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800415988A CN101084257B (en) | 2004-12-03 | 2005-11-30 | Fluoropolymer molding process and fluoropolymer molded product |
EP05852582A EP1838760B1 (en) | 2004-12-03 | 2005-11-30 | Fluoropolymer molding process and fluoropolymer molded product |
KR1020127024917A KR101433495B1 (en) | 2004-12-03 | 2005-11-30 | Fluoropolymer Molding Process And Fluoropolymer Molded Product |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004351927A JP4533115B2 (en) | 2004-12-03 | 2004-12-03 | Fluororesin molding method and fluororesin molding |
JP2004-351927 | 2004-12-03 |
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WO2006060524A2 true WO2006060524A2 (en) | 2006-06-08 |
WO2006060524A3 WO2006060524A3 (en) | 2006-07-20 |
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PCT/US2005/043393 WO2006060524A2 (en) | 2004-12-03 | 2005-11-30 | Fluoropolymer molding process and fluoropolymer molded product |
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US (2) | US20060122333A1 (en) |
EP (1) | EP1838760B1 (en) |
JP (1) | JP4533115B2 (en) |
KR (2) | KR20070104885A (en) |
CN (1) | CN101084257B (en) |
TW (1) | TWI392702B (en) |
WO (1) | WO2006060524A2 (en) |
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WO2007143126A2 (en) * | 2006-06-02 | 2007-12-13 | Dupont-Mitsui Fluorochemicals Company, Ltd. | Fluoropolymer molding method and molded article |
EP2840115A4 (en) * | 2012-04-20 | 2015-12-02 | Daikin Ind Ltd | Composition mainly composed of ptfe, mixed powder, molding material, filtering medium for filter, air filter unit, and porous membrane manufacturing method |
EP3061512A4 (en) * | 2013-10-23 | 2017-05-24 | Daikin Industries, Ltd. | Embossed filter medium for air filter, filter pack, air filter unit, and production method for embossed filter medium for air filter |
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WO2007143126A2 (en) * | 2006-06-02 | 2007-12-13 | Dupont-Mitsui Fluorochemicals Company, Ltd. | Fluoropolymer molding method and molded article |
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Also Published As
Publication number | Publication date |
---|---|
KR20120123149A (en) | 2012-11-07 |
EP1838760B1 (en) | 2011-08-03 |
CN101084257A (en) | 2007-12-05 |
TWI392702B (en) | 2013-04-11 |
US20100197861A1 (en) | 2010-08-05 |
JP2006159524A (en) | 2006-06-22 |
EP1838760A2 (en) | 2007-10-03 |
US20060122333A1 (en) | 2006-06-08 |
JP4533115B2 (en) | 2010-09-01 |
KR101433495B1 (en) | 2014-08-22 |
TW200628538A (en) | 2006-08-16 |
CN101084257B (en) | 2010-06-23 |
KR20070104885A (en) | 2007-10-29 |
WO2006060524A3 (en) | 2006-07-20 |
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