WO2006040347A1 - Calibration of optical line shortening measurements - Google Patents

Calibration of optical line shortening measurements Download PDF

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Publication number
WO2006040347A1
WO2006040347A1 PCT/EP2005/055250 EP2005055250W WO2006040347A1 WO 2006040347 A1 WO2006040347 A1 WO 2006040347A1 EP 2005055250 W EP2005055250 W EP 2005055250W WO 2006040347 A1 WO2006040347 A1 WO 2006040347A1
Authority
WO
WIPO (PCT)
Prior art keywords
line shortening
calibration
optical line
mask
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/055250
Other languages
French (fr)
Inventor
David Ziger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE112005002263T priority Critical patent/DE112005002263B4/en
Publication of WO2006040347A1 publication Critical patent/WO2006040347A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A system and method of calibrating optical line shortening measurements, and lithography mask for same. The lithography mask comprises a plurality of gratings, with a calibration marker disposed within each grating. The mask is used to pattern resist on a semiconductor wafer for purposes of measuring and calibrating line shortening. The pattern on the wafer is measured and compared to measurements made of the pattern on the mask. The difference gives the amount of Êiae shortening due to flare, and may be used to calibrate line shortening measurements made using optical measurement tools.

Description


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Claims

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PCT/EP2005/055250 2004-10-13 2005-10-13 Calibration of optical line shortening measurements Ceased WO2006040347A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112005002263T DE112005002263B4 (en) 2004-10-13 2005-10-13 Calibration of optical line shortening measurements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/964,376 2004-10-13
US10/964,376 US7541121B2 (en) 2004-10-13 2004-10-13 Calibration of optical line shortening measurements

Publications (1)

Publication Number Publication Date
WO2006040347A1 true WO2006040347A1 (en) 2006-04-20

Family

ID=35478827

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/055250 Ceased WO2006040347A1 (en) 2004-10-13 2005-10-13 Calibration of optical line shortening measurements

Country Status (3)

Country Link
US (3) US7541121B2 (en)
DE (1) DE112005002263B4 (en)
WO (1) WO2006040347A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7472815B2 (en) * 2005-09-21 2009-01-06 Ethicon Endo-Surgery, Inc. Surgical stapling instruments with collapsible features for controlling staple height
US8169703B1 (en) * 2006-09-06 2012-05-01 Lightsmyth Technologies Inc. Monolithic arrays of diffraction gratings
KR101703745B1 (en) * 2010-12-17 2017-02-08 삼성전자 주식회사 Method of forming photomask using calibration pattern, and photomask having calibration pattern
CN103537009B (en) * 2012-07-16 2016-04-13 苏州雷泰医疗科技有限公司 A kind of grating device
US10317285B2 (en) * 2015-07-13 2019-06-11 The Boeing Company System and method for measuring optical resolution with an optical resolution target assembly
CN105716627B (en) * 2016-02-05 2019-06-18 中国科学院国家空间科学中心 A method for arranging uniformly distributed interference baselines of concentric circles for CCD calibration
US9754895B1 (en) 2016-03-07 2017-09-05 Micron Technology, Inc. Methods of forming semiconductor devices including determining misregistration between semiconductor levels and related apparatuses
DE102016218360B4 (en) * 2016-09-23 2019-08-29 Carl Zeiss Industrielle Messtechnik Gmbh Calibration structure and calibration procedure for calibrating optical measuring instruments
US11378724B2 (en) 2018-12-23 2022-07-05 Ii-Vi Delaware, Inc. Diffraction grating array for wide-angle illuminateon

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757507A (en) * 1995-11-20 1998-05-26 International Business Machines Corporation Method of measuring bias and edge overlay error for sub-0.5 micron ground rules
US5902703A (en) * 1997-03-27 1999-05-11 Vlsi Technology, Inc. Method for measuring dimensional anomalies in photolithographed integrated circuits using overlay metrology, and masks therefor
US20030232253A1 (en) * 2002-06-18 2003-12-18 Pierre Leroux Techniques to characterize iso-dense effects for microdevice manufacture

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5300786A (en) * 1992-10-28 1994-04-05 International Business Machines Corporation Optical focus phase shift test pattern, monitoring system and process
WO1996004592A1 (en) * 1994-08-02 1996-02-15 Philips Electronics N.V. Method of repetitively imaging a mask pattern on a substrate
US6301008B1 (en) 1997-03-27 2001-10-09 Philips Semiconductor, Inc. Arrangement and method for calibrating optical line shortening measurements
US5962173A (en) 1997-03-27 1999-10-05 Vlsi Technology, Inc. Method for measuring the effectiveness of optical proximity corrections
US5798192A (en) 1997-04-15 1998-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Structure of a mask for use in a lithography process of a semiconductor fabrication
US6339634B1 (en) * 1998-10-01 2002-01-15 Nikon Corporation Soft x-ray light source device
US6396569B2 (en) * 1999-09-02 2002-05-28 Texas Instruments Incorporated Image displacement test reticle for measuring aberration characteristics of projection optics
US6972421B2 (en) * 2000-06-09 2005-12-06 Cymer, Inc. Extreme ultraviolet light source
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
EP1256843A1 (en) * 2001-05-08 2002-11-13 ASML Netherlands B.V. Method of calibrating a lithographic apparatus
US6569584B1 (en) 2001-06-29 2003-05-27 Xilinx, Inc. Methods and structures for protecting reticles from electrostatic damage
JP2003203841A (en) * 2002-01-07 2003-07-18 Mitsubishi Electric Corp Evaluation method, manufacturing condition correction method, and semiconductor device manufacturing method
US7056625B2 (en) * 2003-06-02 2006-06-06 Intel Corporation Focus detection structure
US7230703B2 (en) 2003-07-17 2007-06-12 Tokyo Electron Limited Apparatus and method for measuring overlay by diffraction gratings
US8198105B2 (en) * 2003-07-30 2012-06-12 Texas Instruments Incorporated Monitor for variation of critical dimensions (CDs) of reticles
US7108946B1 (en) * 2004-01-12 2006-09-19 Advanced Micro Devices, Inc. Method of lithographic image alignment for use with a dual mask exposure technique
JP5100990B2 (en) * 2004-10-07 2012-12-19 ギガフォトン株式会社 Driver laser for extreme ultraviolet light source device and LPP type extreme ultraviolet light source device
US7096127B2 (en) * 2004-10-13 2006-08-22 Infineon Technologies Ag Measuring flare in semiconductor lithography
JP5098019B2 (en) * 2007-04-27 2012-12-12 ギガフォトン株式会社 Extreme ultraviolet light source device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5757507A (en) * 1995-11-20 1998-05-26 International Business Machines Corporation Method of measuring bias and edge overlay error for sub-0.5 micron ground rules
US5902703A (en) * 1997-03-27 1999-05-11 Vlsi Technology, Inc. Method for measuring dimensional anomalies in photolithographed integrated circuits using overlay metrology, and masks therefor
US20030232253A1 (en) * 2002-06-18 2003-12-18 Pierre Leroux Techniques to characterize iso-dense effects for microdevice manufacture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
UENO A ET AL: "NOVEL AT-DESIGN-RULE VIA-TO-METAL OVERLAY METROLOGY FOR 193-NM LITHOGRAPHY", IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 17, no. 3, August 2004 (2004-08-01), pages 311 - 316, XP001200856, ISSN: 0894-6507 *

Also Published As

Publication number Publication date
US8717539B2 (en) 2014-05-06
US7842439B2 (en) 2010-11-30
US20090198468A1 (en) 2009-08-06
US20110035171A1 (en) 2011-02-10
DE112005002263T5 (en) 2009-03-26
DE112005002263B4 (en) 2011-03-17
US20060078804A1 (en) 2006-04-13
US7541121B2 (en) 2009-06-02

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