WO2006040184A3 - Illumination system for a microlithographic projection exposure apparatus - Google Patents

Illumination system for a microlithographic projection exposure apparatus Download PDF

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Publication number
WO2006040184A3
WO2006040184A3 PCT/EP2005/011111 EP2005011111W WO2006040184A3 WO 2006040184 A3 WO2006040184 A3 WO 2006040184A3 EP 2005011111 W EP2005011111 W EP 2005011111W WO 2006040184 A3 WO2006040184 A3 WO 2006040184A3
Authority
WO
WIPO (PCT)
Prior art keywords
exposure apparatus
illumination system
pru
projection exposure
microlithographic projection
Prior art date
Application number
PCT/EP2005/011111
Other languages
French (fr)
Other versions
WO2006040184A2 (en
Inventor
Damian Fiolka
Tilmann Heil
Aksel Goehnermeier
Paul Graeupner
Original Assignee
Zeiss Carl Smt Ag
Damian Fiolka
Tilmann Heil
Aksel Goehnermeier
Paul Graeupner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeiss Carl Smt Ag, Damian Fiolka, Tilmann Heil, Aksel Goehnermeier, Paul Graeupner filed Critical Zeiss Carl Smt Ag
Publication of WO2006040184A2 publication Critical patent/WO2006040184A2/en
Publication of WO2006040184A3 publication Critical patent/WO2006040184A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70566—Polarisation control

Abstract

An illumination system for a microlithographic pro­jection exposure apparatus has a light source (14) emit­ting linearly polarized light that has a fixed polariza­tion direction (PDi). A polarization rotation unit (PRU, PRU', PRU '') is provided that is configured to rotate the polarization direction on demand by a rotational angle α ≠ 00. This makes it possible to adapt the polarization direction to different masks (M) with minimal losses of the light intensity.
PCT/EP2005/011111 2004-10-15 2005-10-14 Illumination system for a microlithographic projection exposure apparatus WO2006040184A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61929704P 2004-10-15 2004-10-15
US60/619,297 2004-10-15

Publications (2)

Publication Number Publication Date
WO2006040184A2 WO2006040184A2 (en) 2006-04-20
WO2006040184A3 true WO2006040184A3 (en) 2006-10-12

Family

ID=35464476

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/011111 WO2006040184A2 (en) 2004-10-15 2005-10-14 Illumination system for a microlithographic projection exposure apparatus

Country Status (1)

Country Link
WO (1) WO2006040184A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006032810A1 (en) 2006-07-14 2008-01-17 Carl Zeiss Smt Ag Illumination optics for a microlithography projection exposure apparatus, illumination system with such an illumination optics, microlithography projection exposure apparatus with such an illumination system, microlithographic production method for components and component produced by this method
US7548315B2 (en) * 2006-07-27 2009-06-16 Asml Netherlands B.V. System and method to compensate for critical dimension non-uniformity in a lithography system
DE102006038643B4 (en) * 2006-08-17 2009-06-10 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus and microlithographic exposure method
US7619227B2 (en) 2007-02-23 2009-11-17 Corning Incorporated Method of reducing radiation-induced damage in fused silica and articles having such reduction
US7952685B2 (en) * 2007-03-15 2011-05-31 Carl Zeiss Smt Ag Illuminator for a lithographic apparatus and method
DE102008013567A1 (en) 2007-05-08 2008-11-13 Carl Zeiss Smt Ag Lighting device for microlithographic projection exposure system, has optical element adjusting polarization conditions of radiations, where conditions are different from each other and radiations are deflected in different directions
DE102009016063A1 (en) 2008-05-21 2009-11-26 Carl Zeiss Smt Ag Micro lithographic projection exposure method for manufacturing e.g. LCD, involves projecting mask structure on region of layer using projection exposure apparatus, where regions are arranged in parts in optical path of illumination device
DE102008054844B4 (en) 2008-12-17 2010-09-23 Carl Zeiss Smt Ag Illumination device of a microlithographic projection exposure apparatus, as well as a microlithographic projection exposure method
DE102012200368A1 (en) 2012-01-12 2013-07-18 Carl Zeiss Smt Gmbh Polarization-influencing optical arrangement, in particular in a microlithographic projection exposure apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144705A (en) * 1991-11-22 1993-06-11 Kawasaki Steel Corp Aligner and aligning method
US5442184A (en) * 1993-12-10 1995-08-15 Texas Instruments Incorporated System and method for semiconductor processing using polarized radiant energy
JPH07283119A (en) * 1994-04-14 1995-10-27 Hitachi Ltd Aligner and exposure method
JPH08203806A (en) * 1995-01-25 1996-08-09 Sony Corp Exposure illuminating device
US5673103A (en) * 1993-09-24 1997-09-30 Kabushiki Kaisha Toshiba Exposure apparatus and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144705A (en) * 1991-11-22 1993-06-11 Kawasaki Steel Corp Aligner and aligning method
US5673103A (en) * 1993-09-24 1997-09-30 Kabushiki Kaisha Toshiba Exposure apparatus and method
US5442184A (en) * 1993-12-10 1995-08-15 Texas Instruments Incorporated System and method for semiconductor processing using polarized radiant energy
JPH07283119A (en) * 1994-04-14 1995-10-27 Hitachi Ltd Aligner and exposure method
JPH08203806A (en) * 1995-01-25 1996-08-09 Sony Corp Exposure illuminating device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 525 (E - 1436) 21 September 1993 (1993-09-21) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 02 29 February 1996 (1996-02-29) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 12 26 December 1996 (1996-12-26) *

Also Published As

Publication number Publication date
WO2006040184A2 (en) 2006-04-20

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