WO2006016936A1 - Thermally conductive sheet - Google Patents
Thermally conductive sheet Download PDFInfo
- Publication number
- WO2006016936A1 WO2006016936A1 PCT/US2005/017668 US2005017668W WO2006016936A1 WO 2006016936 A1 WO2006016936 A1 WO 2006016936A1 US 2005017668 W US2005017668 W US 2005017668W WO 2006016936 A1 WO2006016936 A1 WO 2006016936A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermally conductive
- conductive sheet
- sheet
- meth
- modified liquid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Definitions
- a monomer constituting a binder component, a thermally conductive filler, and a modified liquid polyolefin may be mixed together at once to subject the thermally conductive filler to a surface treatment.
- a predetermined polyolefin used for preparing a modified liquid polyolefin preferably has a kinematic viscosity of 100 to 2500 mm ⁇ /s at 40 0 C, more preferably 120 to 2300 mm ⁇ /s, particularly preferably 140 to 2000 mm ⁇ /s. When a kinematic viscosity of a modified liquid polyolefin is less than 100 mm ⁇ /s at 40 0 C, a resultant thermally conductive sheet is prone to have bleeding.
- additives may be added to the materials for the thermally conductive sheet of the present embodiment as long as the characteristics of the thermally conductive sheet are not spoiled.
- the additive include: crosslinking agents, tackifiers, antioxidants, chain-transfer agents, plasticizers, flame retardants, flame retarding auxiliaries, precipitation inhibitors, thickeners, thixotropic agents such as ultra- fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and surface-treating agents.
- crosslinking agents such as ultra- fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and surface-treating agents.
- thixotropic agents such as ultra- fine silica powder, surfactants, antifoamers, colorants, electrically conductive particles, antistatic agents, and surface-treating agents.
- these additive(s) may be used.
- the content of the polymerization initiator used upon partial polymerization of (meth)acrylic monomers is generally 0.001 to 5 parts by weight with respect to 100 parts by weight of (meth)acrylic monomers.
- a chain-transfer agent selected from mercaptanes, disulfides, ⁇ -methylstyrene dimer, and a combination thereof upon partial polymerization so as to control molecular weight and content of polymers contained in partially polymerized polymers obtained by the partial polymerization.
- the content of the chain- transfer agent is preferably 0.01 to 1 parts by weight, more preferably 0.02 to 0.5 parts by weight, with respect to 100 parts by weight of (meth)acrylic monomer.
- the thermally conductive sheet of an embodiment of the present invention is disposed between a heat sink, a heat radiator, or the like, and electronic parts, particularly, semiconductor electronic parts such as a power transistor, a graphic integrated circuit (IC), a chip set, a memory set, and central processing unit (CPU), and used to suitably transmit heat between them.
- the thickness of the thermally conductive sheet of the present embodiment is not particularly limited. However, the thickness may be 0.1 mm or more from the viewpoint of practical manufacturability and handleability.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Coating By Spraying Or Casting (AREA)
- Surface Treatment Of Glass (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/568,231 US7851534B2 (en) | 2004-07-09 | 2005-05-20 | Thermally conductive sheet |
EP05760265A EP1791874B1 (en) | 2004-07-09 | 2005-05-20 | Thermally conductive sheet |
DE602005013255T DE602005013255D1 (en) | 2004-07-09 | 2005-05-20 | HEAT-RESISTANT SURFACE IMAGE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-203322 | 2004-07-09 | ||
JP2004203322A JP4714432B2 (en) | 2004-07-09 | 2004-07-09 | Thermally conductive sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006016936A1 true WO2006016936A1 (en) | 2006-02-16 |
Family
ID=34978830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/017668 WO2006016936A1 (en) | 2004-07-09 | 2005-05-20 | Thermally conductive sheet |
Country Status (9)
Country | Link |
---|---|
US (1) | US7851534B2 (en) |
EP (1) | EP1791874B1 (en) |
JP (1) | JP4714432B2 (en) |
KR (1) | KR101217289B1 (en) |
CN (1) | CN100586962C (en) |
AT (1) | ATE425191T1 (en) |
DE (1) | DE602005013255D1 (en) |
TW (1) | TWI429738B (en) |
WO (1) | WO2006016936A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010074840A2 (en) * | 2008-12-15 | 2010-07-01 | 3M Innovative Properties Company | Acrylic thermal conductive sheet and method for producing the same |
WO2020236440A1 (en) | 2019-05-21 | 2020-11-26 | Ddp Specialty Electronic Materials Us, Llc | Two-part interface materials, systems including the interface material, and methods thereof |
WO2020236384A1 (en) | 2019-05-21 | 2020-11-26 | Ddp Specialty Electronic Materials Us, Llc | Thermal interface materials |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101449075B1 (en) * | 2006-11-01 | 2014-10-08 | 히타치가세이가부시끼가이샤 | Heat conducting sheet process for producing the same and radiator utilizing the sheet |
JP5547032B2 (en) * | 2010-10-21 | 2014-07-09 | パナソニック株式会社 | Thermally conductive resin composition, resin sheet, prepreg, metal laminate and printed wiring board |
JP5480191B2 (en) * | 2011-03-31 | 2014-04-23 | 古河電気工業株式会社 | Thermally conductive rubber composition and method for producing the same |
CN105038077A (en) * | 2012-08-07 | 2015-11-11 | 朱海燕 | Heat-conducting insulating material of high-power LED substrate |
JP6710828B2 (en) * | 2016-04-06 | 2020-06-17 | 北川工業株式会社 | HEAT CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING HEAT CONDUCTIVE SHEET |
JP2017199776A (en) * | 2016-04-27 | 2017-11-02 | 北川工業株式会社 | Thermally conductive sheet and method for manufacturing thermally conductive sheet |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS573841A (en) * | 1980-06-11 | 1982-01-09 | Karupu Kogyo Kk | Resin composition for heat-shrinkable film |
JPS5742750A (en) * | 1980-08-28 | 1982-03-10 | Nippon Petrochem Co Ltd | Production of polyolefin resin composition |
US4483958A (en) * | 1977-09-27 | 1984-11-20 | Asahi-Dow Limited | Thermoplastic polymer compositions comprising aromatic polyether and an inorganic filler |
US5300569A (en) * | 1990-08-21 | 1994-04-05 | Ricon Resins, Inc. | Adhesive rubber compounds |
US5530064A (en) * | 1991-11-15 | 1996-06-25 | Imperial Chemical Industries Plc | Polymerizable compositions |
US5989459A (en) * | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05171057A (en) | 1990-11-09 | 1993-07-09 | Ajinomoto Co Inc | Filler having its surface treated with titanium oligomer |
JPH05320414A (en) | 1992-05-25 | 1993-12-03 | Dai Ichi Kogyo Seiyaku Co Ltd | Surface modifier for inorganic filler |
JPH10316953A (en) | 1997-05-16 | 1998-12-02 | Nitto Denko Corp | Releasable thermally conductive pressuer-sensitive adhesive and adhesive sheet prepared therefrom |
JP3813301B2 (en) | 1997-06-04 | 2006-08-23 | エフコ株式会社 | Thermally conductive rubber composition and thermally conductive rubber sheet |
JP3290127B2 (en) | 1998-01-27 | 2002-06-10 | 松下電工株式会社 | Heat conductive silicone rubber composition and heat dissipation sheet comprising the heat conductive silicone rubber composition |
JP3636884B2 (en) | 1998-04-03 | 2005-04-06 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | Thermally conductive sheet |
US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
JP4624521B2 (en) | 2000-04-24 | 2011-02-02 | 昭和電工株式会社 | Surface treatment method of aluminum hydroxide |
JP2002030212A (en) * | 2000-06-29 | 2002-01-31 | Three M Innovative Properties Co | Thermally conductive sheet |
JP2002284884A (en) | 2001-03-26 | 2002-10-03 | Sumitomo Wiring Syst Ltd | Filler, resin composition containing the same and manufacturing method of resin composition |
JP4588285B2 (en) | 2002-01-25 | 2010-11-24 | 信越化学工業株式会社 | Thermally conductive silicone rubber composition |
JP2004002527A (en) | 2002-05-31 | 2004-01-08 | Dainippon Ink & Chem Inc | Flame-retardant heat-conductive electrical insulating adhesive material |
JP2004010859A (en) | 2002-06-11 | 2004-01-15 | Dainippon Ink & Chem Inc | Composition for heat-conductive electrically insulating pressure-sensitive adhesive, and pressure-sensitive adhesive sheet using the same |
JP4385573B2 (en) | 2002-07-31 | 2009-12-16 | Dic株式会社 | Composition for heat-conducting electrical insulation pressure-sensitive adhesive and pressure-sensitive adhesive sheet using the same |
-
2004
- 2004-07-09 JP JP2004203322A patent/JP4714432B2/en not_active Expired - Fee Related
-
2005
- 2005-05-20 DE DE602005013255T patent/DE602005013255D1/en active Active
- 2005-05-20 WO PCT/US2005/017668 patent/WO2006016936A1/en active Application Filing
- 2005-05-20 KR KR1020077000452A patent/KR101217289B1/en active IP Right Grant
- 2005-05-20 CN CN200580023169A patent/CN100586962C/en not_active Expired - Fee Related
- 2005-05-20 EP EP05760265A patent/EP1791874B1/en not_active Not-in-force
- 2005-05-20 AT AT05760265T patent/ATE425191T1/en not_active IP Right Cessation
- 2005-05-20 US US11/568,231 patent/US7851534B2/en not_active Expired - Fee Related
- 2005-06-07 TW TW094118824A patent/TWI429738B/en not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4483958A (en) * | 1977-09-27 | 1984-11-20 | Asahi-Dow Limited | Thermoplastic polymer compositions comprising aromatic polyether and an inorganic filler |
JPS573841A (en) * | 1980-06-11 | 1982-01-09 | Karupu Kogyo Kk | Resin composition for heat-shrinkable film |
JPS5742750A (en) * | 1980-08-28 | 1982-03-10 | Nippon Petrochem Co Ltd | Production of polyolefin resin composition |
US5300569A (en) * | 1990-08-21 | 1994-04-05 | Ricon Resins, Inc. | Adhesive rubber compounds |
US5530064A (en) * | 1991-11-15 | 1996-06-25 | Imperial Chemical Industries Plc | Polymerizable compositions |
US5989459A (en) * | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
Non-Patent Citations (2)
Title |
---|
DATABASE WPI Section Ch Week 198216, Derwent World Patents Index; Class A17, AN 1982-31752E, XP002347672 * |
PATENT ABSTRACTS OF JAPAN vol. 006, no. 063 (C - 099) 22 April 1982 (1982-04-22) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010074840A2 (en) * | 2008-12-15 | 2010-07-01 | 3M Innovative Properties Company | Acrylic thermal conductive sheet and method for producing the same |
WO2010074840A3 (en) * | 2008-12-15 | 2010-08-19 | 3M Innovative Properties Company | Acrylic thermal conductive sheet and method for producing the same |
WO2020236440A1 (en) | 2019-05-21 | 2020-11-26 | Ddp Specialty Electronic Materials Us, Llc | Two-part interface materials, systems including the interface material, and methods thereof |
WO2020236384A1 (en) | 2019-05-21 | 2020-11-26 | Ddp Specialty Electronic Materials Us, Llc | Thermal interface materials |
Also Published As
Publication number | Publication date |
---|---|
TW200609339A (en) | 2006-03-16 |
CN100586962C (en) | 2010-02-03 |
EP1791874B1 (en) | 2009-03-11 |
TWI429738B (en) | 2014-03-11 |
KR101217289B1 (en) | 2012-12-31 |
CN101120023A (en) | 2008-02-06 |
JP2006022263A (en) | 2006-01-26 |
KR20070029795A (en) | 2007-03-14 |
ATE425191T1 (en) | 2009-03-15 |
EP1791874A1 (en) | 2007-06-06 |
US20070224426A1 (en) | 2007-09-27 |
US7851534B2 (en) | 2010-12-14 |
JP4714432B2 (en) | 2011-06-29 |
DE602005013255D1 (en) | 2009-04-23 |
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