WO2006010108A3 - Methods and apparatus for low distortion parameter measurements - Google Patents

Methods and apparatus for low distortion parameter measurements Download PDF

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Publication number
WO2006010108A3
WO2006010108A3 PCT/US2005/024505 US2005024505W WO2006010108A3 WO 2006010108 A3 WO2006010108 A3 WO 2006010108A3 US 2005024505 W US2005024505 W US 2005024505W WO 2006010108 A3 WO2006010108 A3 WO 2006010108A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
apparatus
data
methods
low distortion
measuring
Prior art date
Application number
PCT/US2005/024505
Other languages
French (fr)
Other versions
WO2006010108B1 (en )
WO2006010108A2 (en )
Inventor
Mason L Freed
Dean Hunt
Kameshwar Poolla
Costas J Spanos
Michael Welch
Original Assignee
Onwafer Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16Special arrangements for conducting heat from the object to the sensitive element
    • G01K1/18Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means

Abstract

This invention seeks to provide methods and apparatus that can improve the accuracy of measured parameter data used for processing workpieces. One aspect of the present invention includes methods of measuring process conditions with low distortion of the measurements caused by the measuring apparatus. The measurements include data for applications such as data for monitoring, controlling, and optimizing processes and process tools. Another aspect of the present invention includes apparatus for measuring substantially correct data for applications such as generating data for monitoring, controlling, and optimizing processes and process tools.
PCT/US2005/024505 2004-07-10 2005-07-08 Methods and apparatus for low distortion parameter measurements WO2006010108B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US58689104 true 2004-07-10 2004-07-10
US60/586,891 2004-07-10

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007520584A JP5137573B2 (en) 2004-07-10 2005-07-08 Method and apparatus for reducing the distortion of the parameters measured
KR20077001465A KR101237782B1 (en) 2004-07-10 2005-07-08 Methods and apparatus for low distortion parameter measurements

Publications (3)

Publication Number Publication Date
WO2006010108A2 true WO2006010108A2 (en) 2006-01-26
WO2006010108A3 true true WO2006010108A3 (en) 2007-03-22
WO2006010108B1 true WO2006010108B1 (en) 2007-05-31

Family

ID=35785782

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/024505 WO2006010108B1 (en) 2004-07-10 2005-07-08 Methods and apparatus for low distortion parameter measurements

Country Status (4)

Country Link
US (1) US7299148B2 (en)
JP (2) JP5137573B2 (en)
KR (1) KR101237782B1 (en)
WO (1) WO2006010108B1 (en)

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US8742944B2 (en) * 2004-06-21 2014-06-03 Siemens Energy, Inc. Apparatus and method of monitoring operating parameters of a gas turbine
US7378834B2 (en) * 2002-10-29 2008-05-27 Finisar Corporation Electronic assembly tester and method for optoelectronic device
US7545272B2 (en) 2005-02-08 2009-06-09 Therasense, Inc. RF tag on test strips, test strip vials and boxes
US7802917B2 (en) * 2005-08-05 2010-09-28 Lam Research Corporation Method and apparatus for chuck thermal calibration
GB0523667D0 (en) * 2005-11-21 2005-12-28 In2Tec Ltd Displacement sensor
US7498802B2 (en) 2006-07-10 2009-03-03 3M Innovative Properties Company Flexible inductive sensor
US7948380B2 (en) 2006-09-06 2011-05-24 3M Innovative Properties Company Spatially distributed remote sensor
US7969323B2 (en) * 2006-09-14 2011-06-28 Siemens Energy, Inc. Instrumented component for combustion turbine engine
US7924408B2 (en) * 2007-02-23 2011-04-12 Kla-Tencor Technologies Corporation Temperature effects on overlay accuracy
US8152367B2 (en) 2007-05-04 2012-04-10 Sealed Air Corporation (Us) Insulated container having a temperature monitoring device
JP4735670B2 (en) * 2008-06-11 2011-07-27 富士ゼロックス株式会社 PCB and the image processing apparatus
US7929294B2 (en) * 2008-09-11 2011-04-19 Commscope Inc. Of North Carolina Hybrid cooling system for outdoor electronics enclosure
JP5704129B2 (en) * 2012-06-22 2015-04-22 東京エレクトロン株式会社 Data acquisition method and a substrate for a sensor of a substrate processing apparatus
US9514970B2 (en) * 2013-01-24 2016-12-06 Kla-Tencor Corporation Methods of attaching a module on wafer substrate
US9719867B2 (en) 2013-05-30 2017-08-01 Kla-Tencor Corporation Method and system for measuring heat flux
US9943232B2 (en) 2014-02-03 2018-04-17 Welch Allyn, Inc. Thermometry heating and sensing assembly
CN104880685A (en) * 2015-06-15 2015-09-02 国网上海市电力公司 Method for evaluating operation of secondary loop of metering device
WO2017014380A1 (en) * 2015-07-20 2017-01-26 엘지이노텍 주식회사 Non-powered body temperature sensing device and communication device included therein

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US20030101006A1 (en) * 1998-12-11 2003-05-29 Symyx Technologies, Inc. Sensor array-based system and method for rapid materials characterization

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JPH0693438B2 (en) * 1986-12-11 1994-11-16 大日本スクリ−ン製造株式会社 Substrate temperature measuring device
JPH06310580A (en) * 1993-04-20 1994-11-04 Nippon Steel Corp Measuring method for temperature of semiconductor wafer and semiconductor wafer with temperature measuring means
US5444637A (en) * 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
US5907820A (en) * 1996-03-22 1999-05-25 Applied Materials, Inc. System for acquiring and analyzing a two-dimensional array of data
US5967661A (en) * 1997-06-02 1999-10-19 Sensarray Corporation Temperature calibration substrate
US5969639A (en) * 1997-07-28 1999-10-19 Lockheed Martin Energy Research Corporation Temperature measuring device
US5970313A (en) * 1997-12-19 1999-10-19 Advanced Micro Devices, Inc. Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
JPH11307606A (en) * 1998-04-20 1999-11-05 Dainippon Screen Mfg Co Ltd Evaluating method and device for substrate heat treatment equipment
JP2000241257A (en) * 1999-02-24 2000-09-08 Hayashi Denko Kk Temperature sensor for insulating substrate
US6190040B1 (en) * 1999-05-10 2001-02-20 Sensarray Corporation Apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool
US6691068B1 (en) * 2000-08-22 2004-02-10 Onwafer Technologies, Inc. Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
JP4739544B2 (en) * 2001-02-21 2011-08-03 株式会社アルバック In-line heat treatment apparatus for temperature measurement device
US6542835B2 (en) * 2001-03-22 2003-04-01 Onwafer Technologies, Inc. Data collection methods and apparatus
US6889568B2 (en) * 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US7151366B2 (en) * 2002-12-03 2006-12-19 Sensarray Corporation Integrated process condition sensing wafer and data analysis system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030101006A1 (en) * 1998-12-11 2003-05-29 Symyx Technologies, Inc. Sensor array-based system and method for rapid materials characterization

Also Published As

Publication number Publication date Type
JP5705187B2 (en) 2015-04-22 grant
WO2006010108B1 (en) 2007-05-31 application
US7299148B2 (en) 2007-11-20 grant
KR20070051255A (en) 2007-05-17 application
WO2006010108A2 (en) 2006-01-26 application
JP5137573B2 (en) 2013-02-06 grant
JP2013058760A (en) 2013-03-28 application
KR101237782B1 (en) 2013-02-28 grant
JP2008506267A (en) 2008-02-28 application
US20060052969A1 (en) 2006-03-09 application

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