WO2006003133A1 - Electronic component with encapsulation - Google Patents

Electronic component with encapsulation Download PDF

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Publication number
WO2006003133A1
WO2006003133A1 PCT/EP2005/053009 EP2005053009W WO2006003133A1 WO 2006003133 A1 WO2006003133 A1 WO 2006003133A1 EP 2005053009 W EP2005053009 W EP 2005053009W WO 2006003133 A1 WO2006003133 A1 WO 2006003133A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
encapsulation
electronic component
metal
substrate
layer
Prior art date
Application number
PCT/EP2005/053009
Other languages
German (de)
French (fr)
Inventor
Christoph Brabec
Jens Hauch
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/42Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for sensing infra-red radiation, light, electro-magnetic radiation of shorter wavelength or corpuscular radiation and adapted for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation using organic materials as the active part, or using a combination of organic materials with other material as the active part; Multistep processes for their manufacture
    • H01L51/44Details of devices
    • H01L51/448Passivation, containers, encapsulations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5203Electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/54Material technologies
    • Y02E10/549Material technologies organic PV cells

Abstract

The invention relates to a an electronic component with a new type of encapsulation and disclosing for the first time a packaging of electronic elements by means of an inexpensive film composite containing a proportion of metal. The packaging fulfills high requirements, in particular it has good barriere properties to oxygen and water vapor. It allows encapsulation without or only a small bonded joint, since the encapsulation can be welded and/or soldered to the substrate or the lower electrode. Moreover, it ensures integration of electric connections, also for establishing glued, soldered and/or welded connections.

Description

description

Electronic component with encapsulation

The invention relates to an electronic component, insbeson particular one with at least one organic functional layer and a novel encapsulation.

Electronic components, particularly those containing at least egg ner organic functional layer, usually empfind¬ Lich against environmental influences. Them comprising, enveloped fully enclosed with from damage to be¬ true, components, usually at least a substrate, a lower electrode, at least one organic layer and an upper electrode Funktions¬ or encapsulated. There are many methods for lung Verkapse¬ known, besides, both whole, form-stable in itself caps are attached to the component as well as coatings of films deposited over the component and sealingly connected to the substrate.

The material of these encapsulations is usually a plastic or a glass, with barrier properties respek¬ tive impermeability to moisture and / or air as well as mechanical stability are the essential requirements for the material. Unfortunately, there is no optimal solutions to this problem in terms of the material of the Verkapse¬ development because materials with increased density generally have poor mechanical stability and vice versa. Be¬ but critical in terms of tightness on the one hand the transition from the encapsulation to the substrate, said

Problem by various adhesive techniques and screw connection techniques meanwhile, is completely dissolved and, second, the spot in the encapsulation, by going tierungen the Kontak¬. In particular, the adhesive bonding of two glass plates is loaded always with a glue joint, which leads to permeation of gases / water. The object of the invention to provide an electronic component having ei¬ ner encapsulation available that combines mechanical stability with tightness, it remains simple and suitable for mass production to manufacture.

This problem is by the subject matter of the independent An¬ and associated ünteransprüche in Zusammen¬ hang solved gur with the description as well as the subject of the Fi¬.

The invention relates to an electronic component, an encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode, and the ent-speaking contacts comprising, wherein the encapsulation, at least holds a layer of a metal composite environmentally. The invention additionally relates to a process for manufacturing an electronic component, a lung Verkapse¬, a substrate, a lower electrode, at least one functional layer and an upper electrode as well as the corresponding contacts comprising at least the following steps:

- applying a bottom electrode to a substrate

- applying at least one functional layer on the electrode un¬ tere - applying a top electrode and

composite material encapsulating the entire component by a Metall¬ and connecting the encapsulation to the substrate and / or the lowermost layer of the component -.

While the invention in connection with the manufacture of electronic components having at least one organic layer Funk¬ tion was developed, but it can equally well be applied to electronic components of the conventional silicon-containing semiconductor technology.

According to one embodiment of the method the Verkapse¬ is development with the substrate either welded, bonded and / or soldered. In this case, the encapsulation is sealed strat for example, by a low-cost welding of metal film to the Sub¬. Also, the plastic layer of the encapsulation Ver¬ may be connected to the substrate.

The contact of the electrodes to a voltage and / or current source may be prepared via the contact by the Verkapse¬ lung, either by welding or by using a low temperature solder. Depending on the execution form a subregion of the film will have a laid-open metal region for contacting, so that a low contact resistance is guaranteed.

According to an advantageous embodiment of the invention, at least one of the vias of the component is made through the metal portions of the metal composite material. The good barrier properties, high mecha¬ African stability and the electrical conductivity of the Me¬ be talls optimally used for encapsulation.

Metal composite material is a plastic or a glass that contains metal in some form. It may be a particles filled with metal fibers, metal flakes and / or other Metall¬ polymer, but it can also be a layered structure with alternating metal and plastic or

Glass layers, for example in the form dünnster films are vor¬. The metal may be in plastic or glass or a laminate layer or in the form of fusible alloys, ie in the form of low-melting metal alloys.

In the event that both vias that the upper and the lower electrodes were placed by the encapsulation, is, there must be an electrically insulating part inside the metal composite forming the encapsulation to keep the two lines electrically separated from each other. The term line is taken as far as desired and is not limited to a continuous metallic line because filled with metal particles plastics can form the lines.

This problem is by the subject matter of the independent claims and the accompanying dependent claims in Zusammen¬ hang with the description as well as the subject of the Fi¬ gur solved.

As an electronic component having at least one functional layer of organic material, for example, photo- voltaic elements, photodetectors, electrochromic Farbele¬ elements, diodes, light emitting diodes, in particular, may benefit the large-area light-emitting diodes by the Erfin dung among the light-emitting diodes, transistors, capacitors, rectifiers and other designated.

With the metal composite according to the invention, both components with rigid as well as those lungs with flexible Verkapse¬ can, the latter may be referred to under some circumstances as Versiegelun- gene can be produced.

The encapsulations preferably in the range of thin films and dünnster, thus for example with a thickness of 200 microns, preferably 75 microns and more preferably from 30 microns before.

In one embodiment, an encapsulation is produced by a layered structure with alternating layers of plastic with metal layers in a film composite and form a flexible encapsulation. Here, especially light ermög¬ that the vias are tegriert in¬ in the encapsulation, because the two metal layers of the vias are separated by electrically insulating plastic interlayers effectively from each other kön- nen to prevent short circuits. At the same time, the

contribute metal layers of vias to tightness and mechanical stability of the encapsulation. For example, the following layers are successively introduced aufge¬: flexible sheet as they can also be used as a substrate, metal film, flexible film. This film composites bund has high barrier properties to oxygen and water vapor and it is possible to carry out the Kon¬ contacts through the encapsulation into the metal layers of encryption to lay encapsulation film composite.

Depending on the embodiment, for example, a portion of the film, for contacting has a Laid-Open metal region so that a low contact resistance results.

In the method for producing the component, the encryption can be connected to an active function layer of the component to the component encapsulation. For example, the Verkap¬ can Selung directly with the lower and / or upper electrode connected to the substrate instead.

In the following the invention will be with reference to a figure, which shows an embodiment of the invention in more detail .. _ explained.

Evident is below a substrate 1, which may be either a flexib¬ le film or a rigid support such as beispielswei- se a glass or quartz or the like. It is the bottom electrode 2, which is transparent at the photodetectors, the e- lektrochromen color elements and the light-emitting diodes, so that radiation layer through it to the active (s) 1 Funktions¬ (s) may take.

It, there is at least one active organic Funkti¬ onsschicht 3, which may be terialien created depending on the component from a variety of Ma¬. The upper end forms the upper electrode 4. For example, may be placed over the component nor a so-called TopCoat, that is a

Protective film through which the component gegen¬ once protection to non-clean room - is granted conditions so that the encapsulation can be done aufge¬ under normal manufacturing conditions.

The TopCoat can from organic (parylene), inorganic (silicon dioxide, aluminum oxide, silicon nitride (SiN x), etc.) organi¬ cal / be created as well as from a film composite with a hybrid structure (inorganic.

Around the entire component around and tightly connected to the substrate 1 is the encapsulation 5, a composite material comprising Metallver¬. Encapsulation via their Me¬ tallanteil the two contacts of the component after au¬ SEN. The encapsulation 5 comprises a synthetic portion 6 that is also present in particular at the location 8 where the two current-carrying metal portions 7 coming from opposite poles, overlap. The metal portions 7 guide the contacts of the two electrodes through the encapsulation therethrough to the outside.

According to one embodiment ^ getter materials are used between the encapsulating film and the element (einge¬ inserted). Getter materials are materials that react very strongly with water molecules and oxygen Atemen and bind them at a penetration in the element and / or chemically neutralize them. Examples of getter materials are zeolite and calcium oxide to water molecules and iron oxide material for Sauer¬.

In one embodiment, getter materials are incorporated directly into the film.

The invention for the first time discloses the packaging of organic solar cells by a low-cost film composite comprising ei¬ nen metal content. The packaging meets demanding requirements, and in particular with respect to high barrier properties against oxygen and hydrogen vapor

Encapsulation can be / are soldered without or with only minimal adhesive joint, because the encapsulation welded to the substrate or the bottom electrode, integrated implementation of electrical terminals, also for bonded, soldered and / or welded connections An¬.

Claims

claims
1. An electronic component eine.Verkapselung, a substrate, a lower electrode, at least one functional layer and 'an upper electrode and the corresponding contacts comprising, wherein the encapsulation comprises at least one layer of a metal composite material.
2. The electronic component according to claim 1, wherein the Verkap- seiung is adhered to the substrate or a lower layer of the partly Bau¬ either welded and / or soldered.
3. The electronic component according to any one of claims 1 or 2, wherein the contact of at least one of the electrodes goes to a voltage and / or current source by the encapsulation.
4. The electronic component according to any preceding Ansprü¬ che, wherein either the encapsulation and / or the connection of the encapsulation to the component comprises a low-temperature solder.
5. The electronic component according to any preceding Ansprü¬ che, wherein for contacting a portion of the encapsulation has a Laid-Open metal region.
6. The electronic component according to any preceding Ansprü¬ surface, wherein the metal composite material contains the metal in the form of metal fibers, metal flakes and / or other Metallparti¬ angles and / or a layer structure comprising alternate metal-metallic and plastic layers.
7. The electronic component according to any preceding Ansprü¬ che, wherein the encapsulations are present in the field of thin films and dünnster.
8. The electronic component according to any preceding Ansprü¬ che, wherein the component also comprises a TOPCOAT protective layer.
9. A method for manufacturing an electronic component, an encapsulation, a substrate, a lower electrode, minimum zu¬ a functional layer and an upper electrode and the corresponding contacts comprising at least the following method steps: applying a bottom electrode to a substrate
Applying at least one active functional layer to the lower electrode
Applying a top electrode and
Encapsulating the entire component by means of a metal composite material and connecting the encapsulation to the substrate and / or a lower layer of the component.
10. The method of claim 9, wherein the compound of Ver¬ encapsulation welded to the substrate or a lower layer, bonded and / or soldered is.
PCT/EP2005/053009 2004-07-02 2005-06-27 Electronic component with encapsulation WO2006003133A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102004032207 2004-07-02
DE102004032207.4 2004-07-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20050769610 EP1763895A1 (en) 2004-07-02 2005-06-27 Electronic component with encapsulation

Publications (1)

Publication Number Publication Date
WO2006003133A1 true true WO2006003133A1 (en) 2006-01-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/053009 WO2006003133A1 (en) 2004-07-02 2005-06-27 Electronic component with encapsulation

Country Status (2)

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EP (1) EP1763895A1 (en)
WO (1) WO2006003133A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019285A (en) * 2004-07-02 2006-01-19 Konarka Technologies Inc Organic photovoltaic component with encapsulation
DE102007046730A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Organic electronic component for organic light emitting diodes, polymer elements, organic photovoltaic cell or electrochromic elements, has substrate and is provided on substrate
DE102008050332A1 (en) * 2008-10-07 2010-04-22 Leonhard Kurz Stiftung & Co. Kg Photovoltaic cell comprises a photovoltaic conversion layer, a lower electrode layer applied on a lower surface of the photovoltaic conversion layer, and a multilayer foil applied on an upper surface of the photovoltaic conversion layer
WO2014076132A1 (en) * 2012-11-14 2014-05-22 Osram Opto Semiconductors Gmbh Optoelectronic component
US9607301B2 (en) 2000-04-27 2017-03-28 Merck Patent Gmbh Photovoltaic sensor facilities in a home environment

Citations (6)

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Publication number Priority date Publication date Assignee Title
EP0468440A2 (en) * 1990-07-26 1992-01-29 Eastman Kodak Company Organic electroluminescent device with stabilized cathode
EP0566736A1 (en) * 1990-11-30 1993-10-27 Idemitsu Kosan Company Limited Organic electroluminescence device
US5998733A (en) * 1997-10-06 1999-12-07 Northrop Grumman Corporation Graphite aluminum metal matrix composite microelectronic package
US6198217B1 (en) * 1997-05-12 2001-03-06 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent device having a protective covering comprising organic and inorganic layers
US20040033375A1 (en) * 2002-08-19 2004-02-19 Hiroshi Mori Thin-film layer, method for forming a thin-film layer, thin-film layer fabrication apparatus and thin-film device
US20040046497A1 (en) * 2002-09-11 2004-03-11 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0468440A2 (en) * 1990-07-26 1992-01-29 Eastman Kodak Company Organic electroluminescent device with stabilized cathode
EP0566736A1 (en) * 1990-11-30 1993-10-27 Idemitsu Kosan Company Limited Organic electroluminescence device
US6198217B1 (en) * 1997-05-12 2001-03-06 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent device having a protective covering comprising organic and inorganic layers
US5998733A (en) * 1997-10-06 1999-12-07 Northrop Grumman Corporation Graphite aluminum metal matrix composite microelectronic package
US20040033375A1 (en) * 2002-08-19 2004-02-19 Hiroshi Mori Thin-film layer, method for forming a thin-film layer, thin-film layer fabrication apparatus and thin-film device
US20040046497A1 (en) * 2002-09-11 2004-03-11 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9607301B2 (en) 2000-04-27 2017-03-28 Merck Patent Gmbh Photovoltaic sensor facilities in a home environment
JP2006019285A (en) * 2004-07-02 2006-01-19 Konarka Technologies Inc Organic photovoltaic component with encapsulation
EP1617494A3 (en) * 2004-07-02 2007-12-19 Konarka Technologies, Inc. Organic photovoltaic component with encapsulation
US7781670B2 (en) 2004-07-02 2010-08-24 Konarka Technologies, Inc. Organic photovoltaic component with encapsulation
DE102007046730A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Organic electronic component for organic light emitting diodes, polymer elements, organic photovoltaic cell or electrochromic elements, has substrate and is provided on substrate
DE102008050332A1 (en) * 2008-10-07 2010-04-22 Leonhard Kurz Stiftung & Co. Kg Photovoltaic cell comprises a photovoltaic conversion layer, a lower electrode layer applied on a lower surface of the photovoltaic conversion layer, and a multilayer foil applied on an upper surface of the photovoltaic conversion layer
WO2014076132A1 (en) * 2012-11-14 2014-05-22 Osram Opto Semiconductors Gmbh Optoelectronic component
CN104813501A (en) * 2012-11-14 2015-07-29 欧司朗Oled有限责任公司 Optoelectronic component
US9502682B2 (en) 2012-11-14 2016-11-22 Osram Oled Gmbh Optoelectronic device

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