WO2005101165A3 - Modular, scalable thermal solution - Google Patents

Modular, scalable thermal solution Download PDF

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Publication number
WO2005101165A3
WO2005101165A3 PCT/US2005/012064 US2005012064W WO2005101165A3 WO 2005101165 A3 WO2005101165 A3 WO 2005101165A3 US 2005012064 W US2005012064 W US 2005012064W WO 2005101165 A3 WO2005101165 A3 WO 2005101165A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling module
modular
thermal solution
core cooling
core
Prior art date
Application number
PCT/US2005/012064
Other languages
French (fr)
Other versions
WO2005101165A2 (en
Inventor
Joseph Douglass Walters
Zoran Stefanoski
Tommy C Lee
Original Assignee
Nvidia Corp
Joseph Douglass Walters
Zoran Stefanoski
Tommy C Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/822,958 external-priority patent/US7359197B2/en
Application filed by Nvidia Corp, Joseph Douglass Walters, Zoran Stefanoski, Tommy C Lee filed Critical Nvidia Corp
Priority to JP2007508413A priority Critical patent/JP4970248B2/en
Priority to EP05732102A priority patent/EP1735684A2/en
Priority to CN2005800162541A priority patent/CN1957316B/en
Publication of WO2005101165A2 publication Critical patent/WO2005101165A2/en
Publication of WO2005101165A3 publication Critical patent/WO2005101165A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

One embodiment of a modular, scalable cooling system includes a core cooling module (302, 802, 902) configured to be thermally coupled to a heat-generating electronic device (703, 804, 901, 903) and a supplemental cooling module (350, 850, 950A, 950B) configured to be thermally coupled to the core cooling module (302, 802, 902). A first interface (304, 806, 9081, 9082) attached to the core cooling module (302, 802, 902) is configured to thermally couple the core cooling module (302, 802, 902) to the supplemental cooling module (350, 850, 950A, 950B). The core cooling module (302, 802, 902) and the supplemental cooling module (350, 850, 950A, 950B) may be used alone or in combination to dissipate heat from the heat-generating electronic device (703, 804, 901, 903).
PCT/US2005/012064 2004-04-12 2005-04-08 Modular, scalable thermal solution WO2005101165A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007508413A JP4970248B2 (en) 2004-04-12 2005-04-08 Expandable and shrinkable modular thermal solution
EP05732102A EP1735684A2 (en) 2004-04-12 2005-04-08 Modular, scalable thermal solution
CN2005800162541A CN1957316B (en) 2004-04-12 2005-04-08 System for cooling heated electronic device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/822,958 2004-04-12
US10/822,958 US7359197B2 (en) 2004-04-12 2004-04-12 System for efficiently cooling a processor
US10/917,137 2004-08-12
US10/917,137 US7151667B2 (en) 2004-04-12 2004-08-12 Modular, scalable thermal solution

Publications (2)

Publication Number Publication Date
WO2005101165A2 WO2005101165A2 (en) 2005-10-27
WO2005101165A3 true WO2005101165A3 (en) 2006-03-02

Family

ID=34964703

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/012064 WO2005101165A2 (en) 2004-04-12 2005-04-08 Modular, scalable thermal solution

Country Status (5)

Country Link
US (2) US7151667B2 (en)
EP (1) EP1735684A2 (en)
JP (1) JP4970248B2 (en)
TW (1) TWI410209B (en)
WO (1) WO2005101165A2 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US7151667B2 (en) * 2004-04-12 2006-12-19 Nvidia Corporation Modular, scalable thermal solution
DE102005016115B4 (en) * 2005-04-08 2007-12-20 Rittal Gmbh & Co. Kg Arrangement for cooling an electronic device
JP4593438B2 (en) * 2005-10-24 2010-12-08 富士通株式会社 Electronics and cooling modules
US7321494B2 (en) * 2005-12-14 2008-01-22 Evga Corporation Graphics card apparatus with improved heat dissipating mechanisms
TW200725230A (en) * 2005-12-28 2007-07-01 Inventec Corp Method and device for connecting several types of fans
TWM304893U (en) * 2006-06-09 2007-01-11 Cooler Master Co Ltd Cooling structure of interface card
TWM304894U (en) * 2006-06-09 2007-01-11 Cooler Master Co Ltd Cooling device of interface card
US7428150B1 (en) * 2006-10-31 2008-09-23 Zoran Stefanoski Computing platform component cooling with quick disconnect
US8726681B2 (en) * 2007-01-23 2014-05-20 Hewlett-Packard Development Company, L.P. Method and system of cooling components of a computer system
US20090009965A1 (en) * 2007-07-02 2009-01-08 Ta-Yang Cheng Heat dissipating structure of microcomputer
US7619889B2 (en) * 2007-08-20 2009-11-17 Nvidia Corporation Controllable heat transfer medium system and method for use with a circuit board
US20090073654A1 (en) * 2007-09-14 2009-03-19 Beam James M Compact surface-mount heat exchanger
EP2254000A3 (en) * 2009-05-22 2012-05-16 Ricoh Company, Ltd. Image forming apparatus with image color measuring unit and image forming method
CN102135117A (en) * 2010-01-23 2011-07-27 富准精密工业(深圳)有限公司 Centrifugal fan
US8159819B2 (en) 2010-05-14 2012-04-17 Xfx Creation Inc. Modular thermal management system for graphics processing units
US8405975B2 (en) * 2011-01-11 2013-03-26 Dell Products L.P. Dual mode portable information handling system cooling
JP5849536B2 (en) * 2011-08-31 2016-01-27 日本電気株式会社 Electronic equipment cooling system
US20130194744A1 (en) * 2012-01-26 2013-08-01 Fu-Yi Chen Thermal control using an add-on module
CN202870717U (en) * 2012-08-27 2013-04-10 高亿实业有限公司 Heat dissipation device of notebook computer
US9781861B2 (en) * 2014-07-31 2017-10-03 Dell Products L.P. Information handling system thermal control with adaptive non-rotational cooling devices
CN106527621B (en) * 2015-09-10 2019-08-23 讯凯国际股份有限公司 Electronic system and its circumscribed auxiliary radiating device
US10146277B1 (en) * 2017-09-13 2018-12-04 Motorola Solutions, Inc. Vehicle adapter and sealed cooling system for portable communications device
US20190098799A1 (en) * 2017-09-26 2019-03-28 Dura Operating, Llc Thermal enclosure
JP7081203B2 (en) * 2018-02-26 2022-06-07 トヨタ自動車株式会社 Radiation fin structure and cooling structure of electronic board using this
CN109144208A (en) * 2018-11-05 2019-01-04 北京小米移动软件有限公司 A kind of radiator, cooling system and electronic equipment
CN109471512A (en) * 2018-11-05 2019-03-15 北京小米移动软件有限公司 Cooling heat-exchanging system and laptop
CN109271008A (en) * 2018-11-05 2019-01-25 北京小米移动软件有限公司 External cooling system and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343478B1 (en) * 2000-03-21 2002-02-05 Neng-Chao Chang Water/air dual cooling arrangement for a CPU
DE20212754U1 (en) * 2002-08-20 2002-11-14 Yu, Chien-Chun, Tai Shan, Taipeh Coolant heat dissipation device
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634360Y2 (en) * 1989-10-13 1994-09-07 新日本製鐵株式会社 Structure of the tip of the hot metal tilting gutter
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
US5158136A (en) 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor
US5365749A (en) * 1993-12-23 1994-11-22 Ncr Corporation Computer component cooling system with local evaporation of refrigerant
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US6452797B1 (en) * 1997-11-12 2002-09-17 Intel Corporation Fan-cooled card
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6170563B1 (en) * 1999-07-26 2001-01-09 Hsieh Hsin-Mao Heat radiating device for notebook computer
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
JP4386219B2 (en) * 2000-03-31 2009-12-16 富士通株式会社 Heat dissipation mechanism and electronic device having the heat dissipation mechanism
DE20015931U1 (en) * 2000-09-14 2001-01-04 Lin, Liken, Tu-Cheng, Taipeh CPU cooling device
US6442024B1 (en) * 2000-12-11 2002-08-27 Shoei-Yuan Shih Fan flow guide
JP2003050645A (en) * 2001-08-06 2003-02-21 Tousui Ltd Heat sink and notebook-type personal computer
US6587343B2 (en) * 2001-08-29 2003-07-01 Sun Microsystems, Inc. Water-cooled system and method for cooling electronic components
JP2003076445A (en) * 2001-09-05 2003-03-14 Matsushita Refrig Co Ltd Electronic device
US6926070B2 (en) * 2002-03-22 2005-08-09 Intel Corporation System and method for providing cooling systems with heat exchangers
JP2003280769A (en) * 2002-03-26 2003-10-02 Royal Electric Co Ltd Cooling system of computer
JP2003314936A (en) * 2002-04-18 2003-11-06 Matsushita Refrig Co Ltd Cooling device
US6760222B1 (en) * 2002-05-21 2004-07-06 Ncr Corporation Dissipating heat using a heat conduit
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6671177B1 (en) * 2002-10-25 2003-12-30 Evga.Com Corporation Graphics card apparatus with improved heat dissipation
US6970355B2 (en) * 2002-11-20 2005-11-29 International Business Machines Corporation Frame level partial cooling boost for drawer and/or node level processors
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US7002797B1 (en) * 2003-11-17 2006-02-21 Nvidia Corporation Noise-reducing blower structure
US6958910B2 (en) * 2003-11-18 2005-10-25 Kabushiki Kaisha Toshiba Cooling apparatus for electronic apparatus
US7151667B2 (en) * 2004-04-12 2006-12-19 Nvidia Corporation Modular, scalable thermal solution
US7359197B2 (en) * 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343478B1 (en) * 2000-03-21 2002-02-05 Neng-Chao Chang Water/air dual cooling arrangement for a CPU
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
DE20212754U1 (en) * 2002-08-20 2002-11-14 Yu, Chien-Chun, Tai Shan, Taipeh Coolant heat dissipation device

Also Published As

Publication number Publication date
EP1735684A2 (en) 2006-12-27
JP4970248B2 (en) 2012-07-04
JP2007533028A (en) 2007-11-15
TW200539792A (en) 2005-12-01
US7151667B2 (en) 2006-12-19
US20050225940A1 (en) 2005-10-13
US7339789B2 (en) 2008-03-04
TWI410209B (en) 2013-09-21
US20070097641A1 (en) 2007-05-03
WO2005101165A2 (en) 2005-10-27

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