WO2005093840A1 - ショットキー接合型半導体装置の製造方法 - Google Patents
ショットキー接合型半導体装置の製造方法 Download PDFInfo
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- WO2005093840A1 WO2005093840A1 PCT/JP2005/005530 JP2005005530W WO2005093840A1 WO 2005093840 A1 WO2005093840 A1 WO 2005093840A1 JP 2005005530 W JP2005005530 W JP 2005005530W WO 2005093840 A1 WO2005093840 A1 WO 2005093840A1
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- schottky
- heat treatment
- semiconductor device
- epitaxial layer
- type semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 62
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 16
- 230000004888 barrier function Effects 0.000 claims abstract description 15
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 12
- 239000011733 molybdenum Substances 0.000 claims abstract description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010937 tungsten Substances 0.000 claims abstract description 11
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 10
- 238000005275 alloying Methods 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 239000013078 crystal Substances 0.000 description 38
- 239000000758 substrate Substances 0.000 description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- -1 aluminum ion Chemical class 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 241000652704 Balta Species 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910016006 MoSi Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/6606—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
Definitions
- the present invention relates to a method for manufacturing a Schottky single-junction semiconductor device in which a Schottky electrode layer is formed on the surface of a silicon carbide epitaxial layer.
- SiC silicon carbide
- This Schottky diode is composed of a SiC single crystal substrate obtained by slicing a SiC Balta single crystal grown by sublimation or the like into a wafer, and the surface force of this SiC single crystal substrate.
- An epitaxy layer on which a SiC single crystal film is grown by CVD (Chemical Vapor Deposition), a Schottky electrode formed on the surface of this epitaxy layer by sputtering, vacuum deposition, etc., and the back side of the SiC single crystal substrate The ohmic electrode and force formed in the structure are also composed. Nickel, titanium, and the like are used as materials for the Schottky electrode (Patent Document 1).
- the Schottky diode power loss which is based on the sum of the power loss during forward energization and the power loss due to leakage current and the like when a reverse voltage is applied, is determined by the junction interface between the Schottky electrode and SiC epitaxial layer. It depends on the height of the Schottky barrier (SBH: Schottky Barrier Height).
- the power loss density of a Schottky diode at a 50% duty cycle can be described as 1Z2 (VJ + VJ) (Non-Patent Document 1). Where V is the reverse voltage and J is forward
- V forward voltage
- J reverse current
- Schottky diode rating V
- ViJ depends on SBH.
- J is lOOAcm 2
- V is rffrfr
- a Schottky diode with a reverse withstand voltage of about 0.6-5. OkV is often used, but with such a reverse withstand voltage, the SBH is about 0.9 to 1.3 eV. In some cases, power loss is minimized. However, when a Schottky electrode is formed of nickel or titanium, its SBH is about 1.6 eV for nickel and 0.8 eV for titanium, so that the power loss of the Schottky diode cannot be minimized.
- Patent Document 1 JP-A-2000-188406
- Non-Patent Document 1 “II Trans-Electron Device (IEEE Trans.
- Non-Patent Document 2 "Iii Trans Electron Device (IEEE Trans. Electron Devices) April 2002, Vol. 49, No. 4, p. 665—672
- the present invention has been made in order to solve the above-described problems in the related art, and obtains a withstand voltage of about 0.6-5. OkV, which is often used in a Schottky diode. It is an object of the present invention to provide a method of manufacturing a Schottky junction type semiconductor device capable of controlling the height of a Schottky barrier without increasing the n-factor to a desired value that minimizes power loss.
- the present inventor has found that by forming a Schottky electrode using molybdenum or tungsten and performing heat treatment, the height of the Schottky barrier can be reduced to 1 while maintaining the n-factor at about 1.05 or less.
- the present inventors have found that it can be controlled to a desired optimum value in a region where power loss is as small as 0.1 eV and 3 eV, and have completed the present invention.
- a method for manufacturing a Schottky junction type semiconductor device is a method for manufacturing a Schottky junction type semiconductor device in which a Schottky electrode is formed on the surface of a silicon carbide epitaxial layer,
- an alloying reaction occurs at the interface between the silicon carbide epitaxial layer and the Schottky electrode by heat treatment.
- An alloy layer is formed at the interface, whereby the height of the Schottky barrier is controlled while keeping the n-factor at a substantially constant low value.
- This heat treatment is 300-1200. C, preferably 400-700. C, so that the height of the Schottky barrier is 1.0-1.3 eV (1.1-1.3 eV for molybdenum, tungsten Then, it can be controlled arbitrarily within the range of 1.0-1. LeV).
- the height of the Schottky barrier that does not significantly increase the n-factor It can be controlled to a desired value in a region where the loss is minimum.
- the Schottky electrode is preliminarily subjected to a high-temperature heat treatment at the time of manufacture, the characteristics under a high-temperature environment are improved, and the heat resistance against heat generated by surge current or the like is high. A device can be obtained.
- FIG. 1 is a cross-sectional view for explaining a manufacturing process of a Schottky diode according to one embodiment of the present invention.
- FIG. 2 is a graph showing the relationship between the heat treatment temperature and SBH and n-factor.
- FIG. 3 is a graph showing the results of forward and reverse current-voltage measurements performed on the Schottky diode obtained by the manufacturing method of the present invention, and FIG. 3 (a) shows the forward characteristic.
- FIG. 3B shows the reverse characteristic.
- FIG. 1A 1 is a SiC single crystal substrate
- 2 is a SiC epitaxial layer
- 3 is an ion injection layer.
- the SiC single crystal substrate 1 is an n-type 4H—SiC substrate doped with impurities at a high concentration (5 ⁇ 10 18 cm 3 ), and a SiC Balta crystal grown by the sublimation method (improved Rayleigh method) is used. I use sliced ones.
- the modified Rayleigh method for example, put SiC powder in a crucible, It is heated to vaporize and deposited on the surface of the seed crystal, typically at a rate of 0.8-ImmZh, to grow bartha. The obtained ingot is sliced into a predetermined thickness so that a desired crystal plane is exposed, and a SiC single crystal substrate 1 is obtained.
- the surface of the SiC single crystal substrate 1 is smoothed by polishing or the like.
- polishing or the like.
- CMP chemical mechanical polishing
- an SiC single crystal film is epitaxially grown from the smoothed surface of the SiC single crystal substrate 1 by a CVD method.
- Propane or the like is used as the C source gas, and silane or the like is used as the Si source gas.
- a mixed gas of these source gases, a carrier gas such as hydrogen, and nitrogen as a dopant gas is supplied to the surface of the SiC single crystal substrate.
- SiC is epitaxially grown at a growth rate of 2-20 mZh.
- a 4H—SiC single crystal of the same crystal type as that of the SiC single crystal substrate 1 is grown in a step flow, and is doped with 2.2 ⁇ 10 15 cm— 3 of nitrogen as an impurity.
- the epitaxial layer 2 is formed.
- a vertical hot wall furnace can be used.
- a water-cooled double cylindrical tube made of quartz is installed. Inside the water-cooled double cylindrical tube, a cylindrical heat insulating material, a hot wall made of graphite, and a SiC single tube are installed.
- a wedge-shaped susceptor is provided to hold the crystal substrate in the vertical direction.
- a high-frequency heating coil is installed around the outside of the water-cooled double cylindrical tube. The high-frequency heating coil heats the hot wall with high-frequency induction, and the radiant heat from the hot wall heats the SiC single crystal substrate held by the wedge-shaped susceptor. I do.
- the SiC grows epitaxially on the surface of the SiC single crystal substrate.
- the substrate is washed, and then the substrate is introduced into a thermal oxidation furnace and subjected to an oxidation treatment at 1125 ° C. for about 1 hour. .
- an oxide film acting as a protective film for preventing contamination during ion implantation is formed on the SiC epitaxial layer 2.
- an opening is formed by removing a portion of the oxide film by photolithography, and the SiC epitaxial layer 2 is exposed from the opening. Thereafter, the opening force is also ion-implanted with aluminum, which is a p-type impurity, to form an aluminum ion-implanted layer 3 (JTE: Junction Termination Extension).
- the aluminum ion implanted layer 3 is formed at a position to be a peripheral portion of a Schottky electrode in order to reduce electric field concentration at a peripheral portion of a Schottky electrode to be formed later and improve withstand voltage.
- the aluminum ion concentration in the aluminum ion implanted layer 3 is controlled so that the central force becomes lower toward the outside, and the aluminum ion concentration is 2.2 ⁇ 10 18 cm— 3 at the center and 3 ⁇ 10 17 cm— 3 .
- heat treatment is performed at 1700 ° C for 3 minutes to electrically activate the aluminum.
- the oxide film 4 in the region where the Schottky electrode is to be formed is removed by photolithography in the same manner as described above.
- a molybdenum film 8 (Schottky electrode) is deposited to a film thickness of 100 nm on the surface of the SiC epitaxial layer 2 using Ar as a sputtering gas for several minutes at a room temperature of about 50 ° C. by a sputtering method.
- heat treatment is performed at a predetermined temperature.
- the heat treatment is preferably performed in an atmosphere of an inert gas such as argon or nitrogen.
- alloying proceeds at the interface between silicon carbide epitaxial layer 2 and Schottky electrode 8, and an alloy layer of several nm is formed at the interface.
- the presence of this alloy layer can be confirmed as a contrast image by a high-resolution transmission electron microscope.
- the composition of the alloy layer is considered to be a powerful alloy with MoC and MoSi.
- SBH By forming the alloy layer by heat treatment, SBH can be controlled so that SBH has a desired value in a region where power loss is minimized. That is, 300-1200. C, preferably 400-700.
- SBH can be arbitrarily controlled between 1.1-1.3 eV (1.1-1.25 eV at 400-700 ° C). At this time, the n-factor hardly changes due to the heat treatment in this temperature range, and is kept at a low value close to 1.
- FIG. 2 shows the relationship between the heat treatment temperature and SBH, and the relationship between the heat treatment temperature and the n-factor.
- SBH increases from about 1.leV before heat treatment to about 1.2eV at 600 ° C, and the n-factor is kept at a nearly constant value of 1.05 or less.
- the SBH was 1.27 eV and the n-factor was 1.05 or less.
- the SBH was adjusted to 1.2 eV, which is the optimal value for reducing power loss when the withstand voltage was 4 kV, by performing a heat treatment at 600 ° C. for 10 minutes.
- the SBH can be controlled by heat treatment as shown in FIG. Since the n-factor greatly fluctuates and increases, the performance of the element is affected, such as an increase in leakage current when a reverse voltage is applied.
- FIG. 3 shows the results of forward and reverse current-voltage measurements performed at a temperature of 20 ° C. on the Schottky diode obtained by the present embodiment.
- Fig. 3 (a) shows the forward characteristics
- Fig. 3 (b) shows the reverse characteristics.
- Characteristic on resistance (Ron) is 12.2mQ
- Characteristics O emissions Voltage (Vf: forward current density becomes voltage and lOOAcm 2) is 2. 2V, the withstand voltage was 4. 4 kV.
- the leakage current density of 0.14 mAcm- 2 at 3.5 kV in reverse voltage of the Schottky diode (2) is 1 / of that of the 5-kV Ni-4H-SiC Schottky diode reported in Non-Patent Document 2 described above. Despite being less than 100, the characteristic on-voltage (at 25Ac m " 2 ) was about 1Z2.
- the Schottky diode (2) when the Schottky diode (2) was operated at 150 ° C with a forward current of lOOmAcm- 2 and a reverse voltage of 3kV, the power loss in the on and off states was 36 0.9 Wcm— 2 . Thus, even in a high-temperature environment, the power loss in the off state is much smaller than that in the on state.
- a high-temperature heat treatment is applied to the Schottky electrode in advance in the manufacturing process, so that the Schottky diode obtained by the present invention can operate stably even at a high temperature.
- good characteristics under high temperature environment For example, under high temperature as in the above example In this case, operation is possible even at a very low leakage current, for example, 250 ° C.
- the Schottky electrode is preliminarily subjected to high-temperature heat treatment as described above, so it is easily damaged and has high heat resistance.
- the force using molybdenum as the material for forming the Schottky electrode As shown in FIG. 2, even if tungsten is used, the n-factor is kept at a low value and the performance of the element is not deteriorated.
- the height of the Schottky barrier can be controlled to a desired value in a region where the power loss is minimized.
- the SBH which was about 1.2 eV before the heat treatment, decreased to about 1. leV at 600 ° C, and the n-factor remained almost constant at 1.05 or less.
- the SBH was 1.06 eV and the n-factor was 1.05 or less.
- tungsten When tungsten is used as a material for forming an electrode, a tungsten film is deposited on a SiC epitaxial layer to form a Schottky electrode, and then heat treatment is performed at a predetermined temperature.
- the heat treatment is preferably performed in an atmosphere of an inert gas such as argon or nitrogen.
- alloying proceeds at the interface between the silicon carbide epitaxial layer and the Schottky electrode, and an alloy layer of several nm is formed on the interface.
- the composition of the alloy layer is considered to be an alloy composed of WC and WSi.
- Heat treatment is performed within the range of 300 to 1200 ° C, preferably 400 to 700 ° C, whereby tungsten and SiC are reacted at the interface to form an alloy layer, thereby reducing the n-factor.
- SBH kept at 1.05 or less, set the SBH to an optimum value with the smallest power loss between 1.0-1. LeV (400-700 ° Ce «l. 05-1. LeV). Can be controlled. Even when the Schottky electrode is formed using an alloy of molybdenum and tungsten, the same control can be performed by heat treatment in the above temperature range.
- the single crystal substrate on which the epitaxial film is grown may be, for example, silicon.
- the crystal type is not particularly limited, and various crystal types of SiC single crystal substrates can be used.
- 4H-SiC hexagonal four-periodic type
- 6H-SiC hexagonal six-periodic type
- 3C cubic three-periodic type
- the crystal plane and crystal orientation on which the epitaxial growth of the SiC single crystal substrate is performed are not particularly limited.
- Crystal planes for epitaxial growth of SiC single crystal substrates include, for example, (OOOl) Si plane, (000-1) C plane, (11 20) plane, (01-10) plane, (03-38) plane, etc. Are mentioned.
- the individual orientation is indicated by ⁇
- the individual plane is indicated by ().
- a negative sign is added to the front of the number.
- a vacuum deposition method, an electron beam method, or the like may be used instead of the sputtering method.
- the force of heat treatment using molybdenum for the Schottky electrode of the Schottky diode is also applicable to the manufacture of a Schottky junction type semiconductor device such as a MESFET using a Schottky electrode as a gate electrode. Applied.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US10/594,044 US7507650B2 (en) | 2004-03-26 | 2005-03-25 | Process for producing Schottky junction type semiconductor device |
EP05727143A EP1739753A4 (en) | 2004-03-26 | 2005-03-25 | PROCESS FOR PRODUCING A SEMICONDUCTOR COMPONENT OF THE SCHOTTKY BARRIER TYPE |
Applications Claiming Priority (2)
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JP2004-092660 | 2004-03-26 | ||
JP2004092660 | 2004-03-26 |
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WO2005093840A1 true WO2005093840A1 (ja) | 2005-10-06 |
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PCT/JP2005/005530 WO2005093840A1 (ja) | 2004-03-26 | 2005-03-25 | ショットキー接合型半導体装置の製造方法 |
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US (1) | US7507650B2 (ja) |
EP (1) | EP1739753A4 (ja) |
KR (1) | KR100797855B1 (ja) |
CN (1) | CN100463216C (ja) |
TW (1) | TW200534377A (ja) |
WO (1) | WO2005093840A1 (ja) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0555552A (ja) * | 1991-08-27 | 1993-03-05 | Hitachi Ltd | 化合物半導体装置及びその製造方法 |
JPH0684967A (ja) * | 1992-08-31 | 1994-03-25 | Nec Corp | 半導体装置 |
JP2003068760A (ja) * | 2001-08-29 | 2003-03-07 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
JP2003258271A (ja) * | 2002-03-01 | 2003-09-12 | Shindengen Electric Mfg Co Ltd | 炭化けい素ショットキーダイオードおよびその製造方法 |
EP1349202A2 (en) | 2002-03-28 | 2003-10-01 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000164528A (ja) | 1998-11-25 | 2000-06-16 | Sanyo Electric Co Ltd | ショットキ接合を有する炭化珪素半導体装置 |
JP3635956B2 (ja) | 1998-12-24 | 2005-04-06 | 富士電機ホールディングス株式会社 | 炭化けい素ショットキーバリアダイオードの製造方法 |
JP3890311B2 (ja) | 2002-03-28 | 2007-03-07 | ローム株式会社 | 半導体装置およびその製造方法 |
-
2005
- 2005-03-25 US US10/594,044 patent/US7507650B2/en not_active Expired - Fee Related
- 2005-03-25 CN CNB2005800096944A patent/CN100463216C/zh not_active Expired - Fee Related
- 2005-03-25 EP EP05727143A patent/EP1739753A4/en not_active Ceased
- 2005-03-25 TW TW094109677A patent/TW200534377A/zh unknown
- 2005-03-25 WO PCT/JP2005/005530 patent/WO2005093840A1/ja active Application Filing
- 2005-03-25 KR KR1020067022102A patent/KR100797855B1/ko not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0555552A (ja) * | 1991-08-27 | 1993-03-05 | Hitachi Ltd | 化合物半導体装置及びその製造方法 |
JPH0684967A (ja) * | 1992-08-31 | 1994-03-25 | Nec Corp | 半導体装置 |
JP2003068760A (ja) * | 2001-08-29 | 2003-03-07 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
JP2003258271A (ja) * | 2002-03-01 | 2003-09-12 | Shindengen Electric Mfg Co Ltd | 炭化けい素ショットキーダイオードおよびその製造方法 |
EP1349202A2 (en) | 2002-03-28 | 2003-10-01 | Rohm Co., Ltd. | Semiconductor device and method of manufacturing the same |
Non-Patent Citations (3)
Title |
---|
IEEE TRANS. ELECTRON DEVICES, vol. 49, April 2002 (2002-04-01), pages 665 - 672 |
See also references of EP1739753A4 |
WEISS R ET AL.: "Tungsten, nickel, and molybdenum Schottky diodes with different edge termination", APPLIED SURFACE SCIENCE, vol. 184, 12 December 2001 (2001-12-12), pages 413 - 418, XP009102491, DOI: doi:10.1016/S0169-4332(01)00527-X |
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US9412880B2 (en) | 2004-10-21 | 2016-08-09 | Vishay-Siliconix | Schottky diode with improved surge capability |
US9496421B2 (en) | 2004-10-21 | 2016-11-15 | Siliconix Technology C.V. | Solderable top metal for silicon carbide semiconductor devices |
US9419092B2 (en) | 2005-03-04 | 2016-08-16 | Vishay-Siliconix | Termination for SiC trench devices |
US9472403B2 (en) | 2005-03-04 | 2016-10-18 | Siliconix Technology C.V. | Power semiconductor switch with plurality of trenches |
US8368165B2 (en) | 2005-10-20 | 2013-02-05 | Siliconix Technology C. V. | Silicon carbide Schottky diode |
US9627553B2 (en) | 2005-10-20 | 2017-04-18 | Siliconix Technology C.V. | Silicon carbide schottky diode |
US7902054B2 (en) * | 2006-02-16 | 2011-03-08 | Central Research Institute Of Electric Power Industry | Schottky barrier semiconductor device and method for manufacturing the same |
EP2047514A1 (en) * | 2006-07-31 | 2009-04-15 | Vishay-Siliconix | Molybdenum barrier metal for sic schottky diode and process of manufacture |
EP2047514A4 (en) * | 2006-07-31 | 2010-12-01 | Vishay Siliconix | MOLYBDENUM BARRIER METAL FOR SIC SCHOTTKY DIODE AND METHOD FOR MANUFACTURING THE SAME |
KR101193453B1 (ko) * | 2006-07-31 | 2012-10-24 | 비쉐이-실리코닉스 | 실리콘 카바이드 쇼트키 다이오드를 위한 몰리브덴 장벽 금속 및 제조방법 |
US9627552B2 (en) | 2006-07-31 | 2017-04-18 | Vishay-Siliconix | Molybdenum barrier metal for SiC Schottky diode and process of manufacture |
CN100428436C (zh) * | 2006-11-23 | 2008-10-22 | 复旦大学 | 一种通过导纳值测量提取肖特基势垒高度的测试方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100463216C (zh) | 2009-02-18 |
EP1739753A1 (en) | 2007-01-03 |
US7507650B2 (en) | 2009-03-24 |
KR20070020232A (ko) | 2007-02-20 |
CN1938857A (zh) | 2007-03-28 |
TW200534377A (en) | 2005-10-16 |
EP1739753A4 (en) | 2008-08-27 |
US20070134897A1 (en) | 2007-06-14 |
KR100797855B1 (ko) | 2008-01-24 |
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