WO2005080075A1 - メッキ樹脂成形体 - Google Patents
メッキ樹脂成形体 Download PDFInfo
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- WO2005080075A1 WO2005080075A1 PCT/JP2005/002827 JP2005002827W WO2005080075A1 WO 2005080075 A1 WO2005080075 A1 WO 2005080075A1 JP 2005002827 W JP2005002827 W JP 2005002827W WO 2005080075 A1 WO2005080075 A1 WO 2005080075A1
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- WO
- WIPO (PCT)
- Prior art keywords
- resin
- acid
- heavy metal
- resin molded
- thermoplastic resin
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/053—Polyhydroxylic alcohols
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Definitions
- the present invention relates to a plating resin molded product having high plating strength, and a method for producing the same.
- resin moldings such as ABS resin and polyamide resin are used as automobile parts.
- copper and nickel plating are used. Is given.
- an etching step of roughening the resin molded article after the degreasing step is indispensable in order to increase the adhesion strength between the resin molded article and the plating layer.
- a chromic acid bath a mixture of chromium trioxide and sulfuric acid
- Wastewater contains toxic hexavalent chromate ions. For this reason, it is necessary to perform a treatment of reducing hexavalent chromate ions to trivalent ions and then performing neutralization precipitation.
- JP-A-2003-82138 and JP-A-2003-166067 solve such problems of the prior art, and achieve high adhesion strength despite the fact that etching treatment using a chromium bath is not required.
- a molded resin article having a metal plated layer is obtained.
- JP-A-2003-82138 and JP-A-2003-166067 disclose a resin molded product comprising a polyamide and a styrene resin such as ABS resin, or a polyp resin. There is disclosed a plating resin molded article in which the surface of a resin molded article made of pyrene is metal-coated. Disclosure of the invention
- the present invention even when applied to a resin molded product made of a combination of a polyamide and a thermoplastic resin other than a styrene-based resin, has a high adhesion strength between the resin molded product and the plating layer and has a beautiful appearance.
- One object is to provide a resin molded body.
- Another object of the present invention is to provide a method for producing the above-mentioned plating resin molded article, which can eliminate the need for etching treatment with chromic acid or the like.
- thermoplastic resin molded article In the process of further studying the inventions disclosed in JP-A-2003-82138 and JP-A-2003-166067, a strong metal plating was formed on the surface of the thermoplastic resin molded article. As a result, we found out that the water absorption of the resin contained in the thermoplastic resin molded body was involved in the formation of a strong metal plating, and conducted research based on this newly discovered mechanism. We have discovered new combinations of resins and have made them applicable to a wider range of technical fields.
- the present invention preferably provides means issues, and (A) 23 ° C water under water absorption after 24hr (I SO 62) is that 0.6% or more Matricaria box resin 10-90 wt 0/0, ( B) A thermoplastic resin molded article comprising a composition containing 90 to 10% by mass of a resin excluding a styrene resin, having a water absorption (IS062) of less than 0.6% after 24 hours in water at 23 ° C.
- a plating resin molded product having a metal plating layer on a surface, wherein the thermoplastic resin molded product has not been subjected to etching treatment with an acid containing a heavy metal.
- Another object of the present invention is to provide a method for producing a molded resin article as described above, which is a method for producing a molded resin molded article by plating a surface of a thermoplastic resin molded article with a metal. A pretreatment of contacting the thermoplastic resin article with a heavy metal-containing resin, an acid or a base; Provided is a method for producing a molded resin molded article that does not include a molding step.
- the adhesive resin molded object of this invention has the high adhesion strength of a thermoplastic resin molded object and a metal adhesive layer, and its beautiful appearance. Compared with the conventional plating method, the production method of the present invention does not require an acid treatment containing heavy metals such as chromic acid and potassium permanganate, and can provide the above-mentioned plating resin molded article by treatment under mild conditions. Excellent in point. Detailed description of the invention
- the method for producing the plating resin molded product of the present invention will be described, and the plating resin molded product will also be described.
- a step of contacting the thermoplastic resin molding with an acid or base containing no heavy metal hereinafter referred to as “contact treatment step with an acid or the like”.
- the method is not particularly limited as long as it does not include an etching step using an acid containing a heavy metal, and some of the following processing steps can be deleted, and another known plating step can be added.
- thermoplastic resin molded body (Preparation of thermoplastic resin molded body)
- thermoplastic resin molded article is obtained by molding a composition containing the components (A) and (B) and, if necessary, other components.
- the matrix resin of the component (A) has a water absorption of 0.6% or more, preferably 0.6 to 11%, more preferably 0.6 to 5%, and 0.6 to 5%. More preferably 25%.
- a polyamide resin As the matrix resin of the component (A), a polyamide resin, an acrylate resin, a cellulose resin, a vinyl alcohol resin, a polyether resin, or the like that satisfies the above saturated water absorption is preferable. Ether resins are more preferred, and polyamide resins are most preferred.
- the polyamide resin is a polyamide resin formed from diamine and dicarboxylic acid, and a copolymer thereof.
- nylon 66 polyhexamethylene sebacamide (nylon 6.10), polyhexamethylene dodecanaamide (6.12), polydodecamethylene dodecanamide (nylon 1212), Polymeta xylylene adipamide (nylon MXD6), polytetramethylene adipamide (Nylon 46) and mixtures and copolymers thereof; nylon 66/6 T nylon 6 66, 6T component is 50 mole 0/0 or less (6 T: hexamethylene terephthalamide Tarami de poly -), the 6 I component 50 mol 0 /.
- Copolymers such as nylon 66-no-6I (61: polyhexamethylene isophthalamide), nylon 6T / 6I Z66, nylon 6T / 61/610, etc .; polyhexamethylene terephthalamide (Nylon 6T), polyhexamethylene isophthalamide (nylon 6I), poly (2-methylpentamethylene) terephthalamide (nylon M5T), poly (2-methylpentamethylene) isophthalamide (nylon M5I ), Nylon 6 TZ6 I, Nylon 6 T / M 5 T., and other copolymer nylons such as amorphous nylon.Amorphous nylons include terephthalic acid and trimethylhexamethylene diamine. And polycondensates of amine.
- ring-opened polymers of cyclic lactams, polycondensates of aminocarboxylic acids and copolymers of these components for example, nylon 6, poly- ⁇ -ndene force amide
- nylon 11 aliphatic amide resins such as poly- ⁇ -dodecanamide (nylon 12) and copolymers thereof, copolymers with polyamides composed of diamine and dicarboxylic acid, specifically nylon 6 ⁇ 6, nylon 6TZ11, nylon 6T / 12, nylon 6 ⁇ "6 1/12, nylon 6 6 1/610/12 and mixtures thereof.
- ⁇ (nylon) 6 As the polyamide resin, ⁇ (nylon) 6, PA (nylon) 66, and PA (nylon) 666 are preferable among the above.
- the component (B) has a water absorption of less than 0.6%, excluding the styrene resin, and more preferably 0.4% or less.
- the styrene-based resin means a polymer containing 10% by mass or more of a structural unit derived from styrene and a styrene derivative such as ⁇ -substituted or nuclear-substituted styrene.
- the components include an olefin resin, a polyphenylene ether resin ( ⁇ ), a polyphenylene sulfone resin (PPS), a polysulfone resin, an acrylic resin (however, an acrylate resin) Or these alloys are preferred.
- Olefin-based resin is a polymer whose main monomer component is monoolefin having 2 to 8 carbon atoms.Low density polyethylene, high density polyethylene, linear low density polyethylene, polypropylene, ethylene-propylene random copolymer And at least one selected from ethylene-propylene block copolymer, polymethylpentene, polybutene-11, and modified products thereof. Among these, polypropylene and acid-modified polypropylene are preferable.
- poly (2,3-dimethyl-6-ethyl-1,4-phenylene ether) examples include poly (2,3-dimethyl-6-ethyl-1,4-phenylene ether) and poly (2-methyl ether).
- -6-Chloromethyl-1,4-phenylene ether poly (2-methyl-6-hide-opened-kisethyl-1,4-phenylene ether), poly (2-methyl-6- ⁇ - Butyl-1,4-phenylene ether), poly (2-ethyl-6-isopropyl-1,4-phenylene ether), poly (2-ethyl-6- ⁇ -propyl 1,4-phenylene) Ether), poly (2,3,6-trimethyl-1,4-phenylene ether), poly (2- (4'-methylphenyl)
- component (I) and the component (II) those produced by applying a known polymerization method by an emulsion polymerization method, a bulk polymerization method, a suspension polymerization method, or a combination thereof can be used.
- the content of (Alpha) component and (beta) component in the composition (Alpha) component 1 0-9 0 mass 0/0, preferably 2 0 8 0 wt%, more preferably 3 0 70% by mass
- the component (B) is the balance of each component (100% by mass in total).
- the water-soluble substance of component (C) has a solubility in water of 100 g (25 ° C) of not more than 300 g, preferably a solubility of not more than 100 g, more preferably Is less than 10 g.
- polysaccharides such as starch, dextrin, pullulan, hyanorelonic acid, canoleboxymethylsenorellose, methinoresenolose, ethinolose.
- Ethylene glycol diethylene glycol, neopentinole glycol, butanediol, pentanediol, polyoxyethylene glycol, polyoxypropylene glycol trimethylolprono.
- Polyhydric alcohols such as pentaerythritol, dipentaerythritol, glycerin, etc .; polybiol alcohol, polyacrylic acid, polymaleic acid, polyacrylamide, polyvinylpyrrolidone, polyethylene oxide acrylic acid maleic anhydride Copolymers, maleic anhydride-diisobutylene copolymer, maleic anhydride monoacetate butyl copolymer, naphthalene sulfonate honolemarin condensate and salts thereof can be mentioned.
- pentaerythritol solubility 7.2 g / 100 g
- dipentaerythritol dipentaerythritol (solubility 0.1 g or less 100 g) are preferred.
- the content ratio of the component (C) in the composition is preferably 0.01 to 50 parts by mass, more preferably 0.01 to 3 parts by mass, based on 100 parts by mass of the components (A) and (B) in total. 0 parts by mass is more preferable, and 0.01 to 15 parts by mass is even more preferable.
- the component (D) is a surfactant and / or a coagulant.
- the surfactant may be one in which a surfactant (milking agent) used when emulsion polymerization is applied during the production of the component (A) and the component (B) remains in the resin, or a bulk polymerization. When a production method that does not use an emulsifier such as is applied, it may be added separately to the components (A) and (B). When the component (D) is contained in the thermoplastic resin molded article, the adhesion strength of the metal plating layer is increased.
- Surfactants and coagulants are used not only for emulsion polymerization of resins but also for emulsion polymerization. Other surfactants may be used, and the surfactant is preferably an anionic surfactant, a cationic surfactant, a nonionic surfactant, or an amphoteric surfactant.
- Surfactants include fatty acid salts, rosinates, alkyl sulfates, alkyl benzene sulfonates, alkyl diphenyl ether sulfonates, polyoxyethylene alkyl ether sulfates, sulfosuccinic acid diester salts, ⁇ -olefin sulphate ester salts
- Anionic surfactants such as thiophene sulfonate; cationic surfactants such as mono- or dialkylamine or polyoxyethylene adduct thereof; mono- or di-long-chain alkyl quaternary ammonium salts; Glucoside, poly (ethylene glycol), poly (ethylene glycol), sucrose fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene fatty acid ester, polyoxy Can be exemplified carboxyalkyl betaine, sulfobetaine, an amphoteric
- the content ratio of the component (D) in the composition is preferably from 0.01 to 10 parts by mass, more preferably from 0.01 to 5 parts by mass, based on 100 parts by mass of the components ( ⁇ ) and ( ⁇ ) in total. Parts by mass are more preferable, and 0 to 2 parts by mass is more preferable.
- the phosphorus compound as the component (II) one or more selected from the following can be used.
- the component (II) in the thermoplastic resin molded article, the adhesion strength of the metal plating layer is enhanced.
- Triphenylenophosphate Tricredinolephosphate, Trixyleninolephosphate, Tris (isopropylphenyl) phosphate, Tris ( ⁇ - or ⁇ -phenylphenyl) phosphate, Trinaphthylphosphate, Cresildiphenylenophosphate, Xyleneninolefinate Norephosphate, diphenyl (2-ethylhexynole) phosphate, di (isopropynolephenyl) phenyl phosphate, ⁇ -phenylphenyl dicresyl phosphate, tris (2,6-dimethylphenyl) phosphate, tetraphenyl m-phenylenediphosphate, tetraphenylene phosphate p-phenylenediphosphate, phenylresolenosin / polyphos Condensed phosphate esters such as fate, bisphenol A-bis (diphenyl phosphat
- Alkali metal salts such as melamine polyphosphate, tripolyphosphoric acid, pyrophosphoric acid, orthophosphoric acid, and hexamethalic acid; phosphoric acid compounds such as phytic acid; and alkaline metal salts or alkaline olamine salts thereof.
- phosphorus-based compound other than the above known phosphorus-based compounds used as flame retardants and antioxidants for resins can be used.
- the content ratio of the component (E) in the composition is preferably from 0.1 to 30 parts by mass, more preferably from 0.1 to 20 parts by mass, based on 100 parts by mass of the total of the components (A) and (B). Parts are more preferable, and 0.1 to 10 parts by mass is more preferable.
- thermoplastic resin in addition to the components (A) and (B) and the components (C) to (E), known additives to be added to the thermoplastic resin within a range that can solve the problem of the present invention, for example, A compatibilizer for the components (A) and (B) and a copolymer of the components (A) and (B) can be contained.
- thermoplastic resin molded article can be obtained by molding a composition containing the components (A) to (E) into a desired shape suitable for the application by a known method such as injection molding or extrusion molding. .
- a degreasing treatment is performed on the thermoplastic resin molded body.
- the degreasing treatment is carried out using an aqueous solution containing a surfactant such as sodium hydroxide or sodium carbonate or an acid such as sulfuric acid or carbonic acid.
- a surfactant such as sodium hydroxide or sodium carbonate or an acid such as sulfuric acid or carbonic acid.
- An etching process using an acid containing heavy metals such as aluminum (chromium, manganese, etc. in the present invention) is unnecessary.
- thermoplastic resin molded body after the degreasing treatment is subjected to a contact treatment with an acid or the like.
- the acid or base containing no heavy metal used in this step is preferably in a low concentration, preferably less than 4.0 normal, more preferably 3.5 normal or less, and even more preferably 3. 0 or less.
- thermoplastic resin molded body is immersed in a heavy metal-free acid or base
- a method of soaking for 0.5 minutes can be applied.
- the acid containing no heavy metal one selected from organic acids such as acetic acid, citric acid, and formic acid in addition to hydrochloric acid, phosphoric acid, and sulfuric acid can be used.
- a base not containing a heavy metal a base selected from alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide or the like, or alkaline earth metal hydroxides can be used. .
- a water washing step a step of treating with a catalyst application liquid, a water washing step, a step of treating with an activating liquid (activation step), and a water washing step can be performed.
- the step of treating with the catalyst-imparting liquid and the step of treating with the activating liquid can be performed simultaneously.
- the treatment with the catalyst-providing liquid is, for example, immersion in a 35% hydrochloric acid solution (10 to 20 mg l) of tin chloride (20 to 40 g I- 1 ) at room temperature for about 1 to 5 minutes. , palladium chloride! (0.:! ⁇ 0. S gl- 1) of 35% hydrochloric acid solution - in (3 ⁇ 5m g 1 1), at room temperature: immersed to 2 minutes.
- the plating bath a bath containing nickel, copper, konokoleto, nickel-cobalt alloy, gold and the like, and a reducing agent such as formalin and hypophosphite can be used.
- the pH and temperature of the plating bath are selected according to the type of plating bath used.
- an electric plating step using copper or the like may be added after the activation treatment using an acid or an alkaline metal.
- the adhesion strength according to JISH 8630 is preferably 10 kPa or more, more preferably a maximum value of 50 kPa or more, further preferably a maximum value of 100 kPa or more, particularly preferably a maximum value of 150 kPa or more be able to.
- thermoplastic resin molded body and the metal plating layer in the plated body of the present invention is as follows.
- the thermoplastic resin molded body before the plating process has a “sea-island structure” in which the component (A) is a sea and the component (B) is an island.
- the component (C) is contained, the component (B) is aggregated to form a sea-island structure in which a larger domain is formed.
- a sea-island structure in which the component (B) is finely dispersed is obtained.
- thermoplastic resin molded body When such a “sea-island structure” thermoplastic resin molded body is subjected to contact treatment with an acid or the like, the matrix resin phase of the component (A) in the surface layer of the molded body swells to form a swollen layer. Then, the catalyst component permeates into the swelling layer, and the plating metal adheres to and grows on the nucleus using the catalyst component as a nucleus to form a network-like three-dimensional structure. It is considered that as a result of the growth of the plating from inside the swelling layer, a metal plating layer having high adhesion strength is formed on the surface of the molded body. In this process,
- component (B) acts to maintain the swelled layer, and a molded body containing no component (B) and only component (A) forms a metal plating layer having high adhesion strength. Not done.
- the plating resin molded product obtained by applying the production method of the present invention can be applied to various uses, and is particularly suitable for use in automobile parts such as bumpers, emblems, wheel camps, interior parts, and exterior parts. .
- Example 1 The plating resin molded product obtained by applying the production method of the present invention can be applied to various uses, and is particularly suitable for use in automobile parts such as bumpers, emblems, wheel camps, interior parts, and exterior parts. .
- thermoplastic resin molding and the metal plating layer was determined by the adhesion test method described in JIS H8630 Annex 6 using the plating resin moldings obtained in the following Examples and Comparative Examples. a; highest value) was measured.
- Test pieces of 100 ⁇ 50 ⁇ 3 mm obtained by injection molding (cylinder temperature: 240 ° C., mold temperature: 60 ° C.) of each composition comprising the components shown in Table 1 were used. Details of each component are as follows.
- A— 1 Polyamide 6, UBE Nylon 6 1013B manufactured by Ube Industries, Ltd., 1.8% water absorption
- A-2 Polyamide 66, UBE Nylon 66 2020B manufactured by Ube Industries, Ltd., Water absorption 1.3%
- A-3 6-66 copolymer polyamide UBE nylon 5013B manufactured by Ube Industries, Ltd., water absorption 2.0%
- A-4 (Comparative component): Polyamide 12, UBE nylon 12 30241 manufactured by Ube Industries, Ltd., water absorption 0.25%
- B- 1 Polyphenylene ether resin, poly (2,6-dimethyl-1,4-phenylene) ether having an intrinsic viscosity of 0.40 (30 ° C, in the form of black foam), water absorption 0.07%
- B-2 Polypropylene resin, PMB60A manufactured by San-Alomer, water absorption 0.01% or less
- B-3 Olefin copolymer, MH7010, manufactured by Mitsui Chemicals, Inc., water absorption 0.05%
- E-1 Triphenyl phosphate (manufactured by Daihachi Chemical Industry Co., Ltd.)
- thermoplastic resin molded article composed of the components shown in Table 1, a resin mold was obtained by the following steps.
- Table 1 shows the adhesion of the plating layer.
- Catalyst application step immersed for 3 minutes in a mixed aqueous solution (liquid temperature 25 ° C) of 35% by mass hydrochloric acid 15 ⁇ ⁇ 1 and 40 m 1 / L aqueous solution of Catalyst C (manufactured by Okuno Pharmaceutical Co., Ltd.) .
- Nickel electroless plating process The test piece was prepared by chemical nickel HR-TA (manufactured by Okuno Pharmaceutical Co., Ltd.) 1 50mlZL and chemical nickel HR-TB (manufactured by Okuno Pharmaceutical Co., Ltd.) 15 It was immersed in a mixed aqueous solution of Om I / L (liquid temperature 40 ° C) for 5 minutes.
- Acid activating step The test piece was immersed in a 100 g aqueous solution of Topsan (manufactured by Okuno Pharmaceutical Co., Ltd.) at a temperature of 25 ° C. for 1 minute.
- thermoplastic resin molded product having the components shown in Table 1, a plating resin molded product was obtained in the same manner as in Example 1.
- Table 1 shows the adhesion of the plating layer.
- A— 4 water absorption 0.2590 60 60 60 60
- (A) and (B) are 100 parts by mass in total. 1 ⁇ 2, (C) to (E) are parts by mass with respect to 100 parts by mass of (A) and (B).
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05710530.6A EP1719615B1 (en) | 2004-02-20 | 2005-02-16 | Plated resin formed article |
US10/586,378 US9057127B2 (en) | 2004-02-20 | 2005-02-16 | Plated resin molded articles |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004043925A JP4276555B2 (ja) | 2004-02-20 | 2004-02-20 | メッキ樹脂成形体 |
JP2004-043925 | 2004-02-20 |
Publications (1)
Publication Number | Publication Date |
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WO2005080075A1 true WO2005080075A1 (ja) | 2005-09-01 |
Family
ID=34879324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/002827 WO2005080075A1 (ja) | 2004-02-20 | 2005-02-16 | メッキ樹脂成形体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9057127B2 (ja) |
EP (1) | EP1719615B1 (ja) |
JP (1) | JP4276555B2 (ja) |
KR (1) | KR20060128991A (ja) |
CN (1) | CN1922006A (ja) |
TW (1) | TW200536883A (ja) |
WO (1) | WO2005080075A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1961839A4 (en) * | 2005-12-15 | 2015-05-27 | Daicel Polymer Ltd | PLATED RESIN BODY |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5080117B2 (ja) * | 2006-08-04 | 2012-11-21 | ダイセルポリマー株式会社 | めっき樹脂成形体 |
JP5364237B2 (ja) * | 2006-08-28 | 2013-12-11 | ダイセルポリマー株式会社 | めっき樹脂成形体 |
JP6340217B2 (ja) * | 2014-03-11 | 2018-06-06 | 株式会社シンセイ | めっき加工された樹脂成形品および製造方法 |
EP3346024B1 (en) * | 2015-09-03 | 2023-12-13 | Mitsubishi Chemical Corporation | Polyester resin composition for laser direct structuring |
JP7053137B2 (ja) * | 2016-10-05 | 2022-04-12 | 旭化成株式会社 | 積層成形体 |
EP3631042B1 (en) * | 2017-05-25 | 2023-03-22 | Basf Se | Article comprising a polymer body and a metal plating |
EP3741559A4 (en) | 2018-01-16 | 2021-09-22 | Taiyo Manufacturing Co., Ltd. | PLATING FORMED SILICA COATED DEPOSIT LAYER |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57123048A (en) * | 1981-01-26 | 1982-07-31 | Toyo Ink Mfg Co | Laminated material |
JPS59142244A (ja) * | 1983-02-02 | 1984-08-15 | Toray Ind Inc | 金属表面化樹脂成形品の製造方法 |
JPH07330934A (ja) * | 1994-06-03 | 1995-12-19 | Mitsubishi Chem Corp | ポリフェニレンエーテル/ポリアミドアロイ樹脂成形品の表面処理方法 |
JP2004002996A (ja) * | 2002-04-03 | 2004-01-08 | Daicel Polymer Ltd | メッキ樹脂成形体の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3123119B2 (ja) * | 1991-06-17 | 2001-01-09 | 三菱化学株式会社 | ポリアミド樹脂メッキ製品 |
CA2221266A1 (en) * | 1996-12-10 | 1998-06-10 | Achim Grefenstein | Laminated sheets or films and moldings thereof |
JP4284808B2 (ja) * | 1999-03-30 | 2009-06-24 | 宇部興産株式会社 | 射出溶着用材料 |
KR100448115B1 (ko) * | 2000-11-30 | 2004-09-10 | 현대자동차주식회사 | 폴리아미드 수지 조성물 |
JP4030754B2 (ja) | 2001-11-28 | 2008-01-09 | ダイセルポリマー株式会社 | メッキ樹脂成形体 |
JP4593036B2 (ja) | 2001-09-11 | 2010-12-08 | ダイセルポリマー株式会社 | メッキ樹脂成形体 |
TWI224120B (en) * | 2001-09-11 | 2004-11-21 | Daicel Polymer Ltd | Process for manufacturing plated resin molded article |
-
2004
- 2004-02-20 JP JP2004043925A patent/JP4276555B2/ja not_active Expired - Lifetime
-
2005
- 2005-02-16 WO PCT/JP2005/002827 patent/WO2005080075A1/ja not_active Application Discontinuation
- 2005-02-16 US US10/586,378 patent/US9057127B2/en active Active
- 2005-02-16 EP EP05710530.6A patent/EP1719615B1/en active Active
- 2005-02-16 CN CNA2005800055060A patent/CN1922006A/zh active Pending
- 2005-02-16 KR KR1020067015577A patent/KR20060128991A/ko not_active Application Discontinuation
- 2005-02-18 TW TW094104746A patent/TW200536883A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57123048A (en) * | 1981-01-26 | 1982-07-31 | Toyo Ink Mfg Co | Laminated material |
JPS59142244A (ja) * | 1983-02-02 | 1984-08-15 | Toray Ind Inc | 金属表面化樹脂成形品の製造方法 |
JPH07330934A (ja) * | 1994-06-03 | 1995-12-19 | Mitsubishi Chem Corp | ポリフェニレンエーテル/ポリアミドアロイ樹脂成形品の表面処理方法 |
JP2004002996A (ja) * | 2002-04-03 | 2004-01-08 | Daicel Polymer Ltd | メッキ樹脂成形体の製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1719615A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1961839A4 (en) * | 2005-12-15 | 2015-05-27 | Daicel Polymer Ltd | PLATED RESIN BODY |
Also Published As
Publication number | Publication date |
---|---|
JP4276555B2 (ja) | 2009-06-10 |
US9057127B2 (en) | 2015-06-16 |
EP1719615A1 (en) | 2006-11-08 |
KR20060128991A (ko) | 2006-12-14 |
EP1719615A4 (en) | 2014-01-22 |
CN1922006A (zh) | 2007-02-28 |
US20080027165A1 (en) | 2008-01-31 |
EP1719615B1 (en) | 2016-08-17 |
JP2005231219A (ja) | 2005-09-02 |
TW200536883A (en) | 2005-11-16 |
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