WO2005072032A1 - Circuit board, mounting structure of circuit board, and mounting method for circuit board - Google Patents

Circuit board, mounting structure of circuit board, and mounting method for circuit board Download PDF

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Publication number
WO2005072032A1
WO2005072032A1 PCT/JP2005/000887 JP2005000887W WO2005072032A1 WO 2005072032 A1 WO2005072032 A1 WO 2005072032A1 JP 2005000887 W JP2005000887 W JP 2005000887W WO 2005072032 A1 WO2005072032 A1 WO 2005072032A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
surface
characterized
mounting
formed
Prior art date
Application number
PCT/JP2005/000887
Other languages
French (fr)
Japanese (ja)
Inventor
Naomi Ishizuka
Yoshifumi Kanetaka
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2004-016723 priority Critical
Priority to JP2004016723 priority
Application filed by Nec Corporation filed Critical Nec Corporation
Publication of WO2005072032A1 publication Critical patent/WO2005072032A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09909Special local insulating pattern, e.g. as dam around component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks

Abstract

A solder dam (10) is formed around a surface land (6) on a circuit board (1). A part receiver (11) for ensuring that the installation height of an insertion type electronic part is a predetermined height is provided. An electronic part (13) is flow-soldered in a state that it is lifted over the board.

Description

Specification

Circuit board, the mounting structure of the circuit board and the circuit board mounting method

Technical field

[0001] The present invention is a circuit board for soldering 揷入 type electronic component in lead-free solder, and

Relates mounting structure and the mounting method using the same, particularly, the surface has a land on the back, the table - the circuit board between the back surface lands are connected by plaited through hole, the 揷入 electronic component it relates circuit board and the mounting structure and the mounting method using the implement.

BACKGROUND

[0002] The circuit board, the force S that many leadless electronic components are surface mounted, connectors, some electronic components such as a variable resistor, the lead pre-one as an insertion type electronic component Ted through-hole (hereinafter simply referred to as a through-hole) Ru is soldered is inserted into. Figure 1 is a cross-sectional view of the soldering part showing a mounting structure of the insertion type electronic component to a conventional circuit board.

[0003] circuit board used for mounting electronic components, the most common subtractive method Taking as an example be made as follows. Glass and the like to a substrate tucked into fibers, on the laminate of Puripureda impregnated with thermosetting resin such as epoxy resin, les use a copper-clad laminate was stuck to the copper foil was treated pressurizing and heating ,, copper foil and putter Jung to prepare a wiring board having an inner layer pattern of a predetermined number of layers, stacked via a Puripureda their wiring board and a copper clad laminate as a copper-clad laminate is an outermost layer allowed to be integrated in pressurized and heated to produce a substrate having an inner layer wiring 3 in the resin laminate 2.

[0004] Then, an opening 5 is formed by Doriruka 卩E, activation, electroless plated, and subjected to electrolytic plated to form a through hole 8. Subsequently, the putter Jung outermost copper layers Te Gyotsu, to form the outer layer wirings 4, in the substrate surface side (herein, the mounting surface of the insertion type electronic component and the surface side, on the opposite side the surface lands 6 the surface and back surface) to form a rear surface lands 7 on the back surface side.

[0005] Thereafter, the photosensitive solder resist material is printed and applied to a region except for the soldering portions of the rear surface of the substrate table to form a solder resist 9 is exposed. Finally, although not shown, the mounting position and the electronic component by applying a white display paints by screen printing method, part number, to form a display symbols such as substrate numbers, manufacturing of the circuit board 1 process is completed.

[0006] with reference to the circuit board 1 thus prepared is thus, step for soldering electronic components, generally, to implement a surface mount components such as chip components and QFP (Quad Flat Package) after the reflow process, the flow step of mounting 揷入 type electronic component of Ru performed. In the reflow process, supplying solder one ^ i one strike lands for surface-mounted components mounted on the circuit board, after coating falls, the temporary fixing thermosetting adhesive for components prevent displacement, surface mount mounted mold part, Ru are soldered by heating in a reflow furnace or the like. In the next flow process, an electronic component is mounted by 揷入 the lead 12 of the electronic component 13 of 揷入 type through hole 8, in this state, in contact with molten solder to have use of such wave soldering bath by performs soldering. Thus, is fillet 14 is formed I, are leads 12 electrically 'mechanically coupled with the lands 6, 7 and the through hole 8. When mounting the surface mount components to the circuit board rear surface side, in the flow process of this, insertion type electronic component and the surface-mounted components simultaneously soldered. In this case, by applying a thermosetting adhesive for temporary fixing, mainly after curing the surface-mount mounting components was heated adhesive, such as chip components, tower mounting the electronic components 13 of the insertion-type and, perform the flow soldering.

In [0007] previous mounting method, solder used in reflow process flow steps were Suzunamaritomo eutectic solder. While the force, in recent years, environmental pollution caused by lead by the growing environmental awareness, is progressing conversion to lead-free solder that does not contain lead. This lead-free solder, tin as a main component, silver, copper, zinc, bismuth, indium, antimony, nickel, which is the like germanium.

[0008] The current Do main lead-free solder, added around the Sn -9. Owt% Zn is eutectic composition of tin zinc solder (tin, zinc, or change the amount of zinc, the other elements . representative examples of tin-zinc solder generic term for a substance with improved properties and are, Sn-8. OZn-3. OBi) and is the eutectic composition of the tin-copper based solder (tin-copper Sn- 0 . about the 7 wt% Cu, to change the amount of copper, called. typical examples are collectively tin copper based solder those with improved properties by adding other elements, Sn-0. 7Cu- 0. 3Ag) and tin-silver-based is the eutectic composition of the solder (tin silver Sn- to 3. mainly 5 wt% Ag, collectively to change the amount of silver, those with improved properties by adding other elements Rere intends tin silver-based solder 'Te. representative ί column, Sn-3. OAg-0. 5Cu, there Sn_3. 5Ag-0. 75Cu) Hitoshiryoku S.

[0009] These lead-free solder, tin-lead eutectic has been most widely used in the solder bonding of electronic devices'm (Sn63wt%, remaining Pb) compared to the tensile strength of the metal, the creep strength is Tsuyogu also elongation it has a metal characteristic that is small. Therefore, Kugu to occur lead solder Dayori stress relaxation in the soldered portion also compared to the melting temperature also a tin-lead eutectic solder is a 183 ° C, lead-free solder is a 190 ° C- 230 ° C since being high summer, the residual stress due to thermal expansion difference after solder solidification tends to increase.

[0010] FIGS. 2, 3, 4, in the conventional circuit board, using a lead-free solder, solder the electronic component having a housing according to a polyamide resin with the following leads, cross-sectional view showing a state of a solder fillet it is. 2, the right side of the figure indicates the center of the electronic component 13, the left side of the figure shows the end portion of the electronic component 13. Table 1 shows the thermal expansion coefficient of the polyamide resin which is a housing material Garasue epoxy resin laminated plate and the electronic component 13 is a substrate material of the circuit board 1. As can be seen from Table 1, in the horizontal direction of the circuit board, there is a large difference in thermal expansion coefficient between the substrate material and the electronic component enclosure.

[0011] [Table 1]

As shown in FIG. 2, the lead 12, which is fixed by lead-free solder, toward the end portion from the center of the electronic component 13, greatly inclined. In Figure 2, the lead of the slope is exaggerated than actual shown. In practice, lead 12 located at the most end, and against the center of the through hole 8, tilts about half of the lead in radius. Thus, the thermal expansion coefficient of the housing of the electronic component 13, the mismatch between the thermal expansion coefficient of the substrate material of the circuit board 1, a great stress will be Kakekaru the lead 12 of the particular end. Along with this, so that significant stress occurs in the solder fillet lead 12 of the end portion is formed therein with through holes is inserted. Conventionally, but tin-lead eutectic solder, for the very easy to creep deformation, even if such stress occurs, stress due to creep deformation of the solder itself has been absorbed. However, creep resistance of the solder itself effect of Suzunamaritomo several tens of times one hundred times to become lead-free solder 6 to your Itewa of crystal, Suzunamaritomo eutectic solder as of stress relaxation can not be expected.

[0013] Further, by melting temperature has decreased high, large stresses due to thermal expansion / contraction occurs, peeling through hole plated from the substrate (hereinafter referred to as through-holes peeling) phenomenon occurs, the through hole disconnection will occur in the vicinity. Figure 3 shows a state where Suruho Le peeling 15 occur. The through hole peeling 15 is mainly a thermal expansion coefficient of the housing of the electronic component 13, tends to occur frequently observed when a mismatch of the thermal expansion coefficient of the circuit board 1 is large, the circuit board 14 that occurred during soldering Roh X- Y stress direction (substrate plane direction), generated by concentrating at the interface of the through-hole plated circuit board 1

[0014] Also, when using lead-free solder, as shown in FIG. 4, release surface land 6 from the substrate surface (hereinafter, referred to as land peeling) phenomenon is also confirmed. The land peeling 16 by lead-free the does Dano melting point becomes high, the solder fillets 14 forces the lead-free solder which is formed on the front surface land 6 S, compared with Suzunamaritomo eutectic solder, solidified earlier at higher temperatures put away because, increases the amount of shrinkage in the Z-direction of the circuit board 1 after the fillet 14 I on the surface was formed, generated from the stress concentration on the end portion of the Handafu Iretto 14.

[0015] Note that these problems do not occur in the circuit board piece surface formed lands and the wiring pattern only on one side. Les, such are formed through holes through-hole which is force electroless plated is formed to 揷入 the electronic component leads of 揷入 type in single-sided board. Further, since the one side force command (corresponding to the back surface land of the present invention) is not formed, the electronic component side is not present those strikes the surface land, the solder fillets also a formed les. Furthermore, since the one surface of the circuit board only the back surface land side not made soldering, lead through hole and the electronic component side of the circuit board is a free state without being fixed. Therefore, it does not occur stress concentration in the soldering portion, an electronic component side, the through-hole peeling, such as land peeling does not occur.

[0016] However, as shown in FIG. 2, so as to sandwich the resin laminate 2, surface run-de 6 Table 'back surface has a back surface land 7, through the through hole 8, the surface land 6, the back surface in double-sided or multilayer circuit board solder fillets on both the land 7 is formed, through holes peeling generated residual stress and accordingly, the lands peeling is a serious problems affecting reliability. And Thus, in recent years, high-density, high performance has accelerated, multi-layer of the circuit substrate is indispensable.

Disclosure of the Invention

[0017] The present invention, which has been made in order to solve the above problems, and it is an object, even if you perform the soldering at it is lead-free solder, Les ,, trust such of causing a through-hole peeling to provide sexual high circuit board of and its mounting structure and mounting method.

[0018] To achieve the above object, according to the present invention has a conductive through-hole leaded component leads are soldered are inserted, the surface land to the mounting surface of the leaded component, the opposite in the circuit board having the surface lands and electrically connected to the back surface land through the conductive through hole on the surface side, the mounting surface of the leaded component to regulate the mounting height of the component with lead parts receiving the circuit board, characterized in that provided a plurality is provided.

[0019] Then, preferably, a land coat you cover the periphery of the front surface land is formed on the mounting surface of the leaded components.

[0020] In order to achieve the above object, according to the present invention, the front surface land on the mounting surface of the leaded components, electrical and the surface land through a conductive through hole on the opposite surface circuitry connected to the lead-in portion gOODS force that leads to the mounting surface of the leaded components of the circuit board having a back surface land is 揷入 the conductive through hole is soldered are mounted at Les, Ru manner to in the mounting structure of the substrate, the mounting structure of a circuit board on which the the leaded components of a circuit board on, characterized in that receiving part for regulating the mounting height of the component with lead is provided with a plurality of the provided It is.

[0021] To achieve the above object, according to the present invention, the front surface land on the mounting surface of the leaded components, electrical and the surface land through a conductive through hole on the opposite surface a first step of providing a plurality of component receiving to regulate the mounting height of the-out with the lead component on the mounting surface of the leaded components of the circuit board with connected back surface land, leaded components, the lead implementation of the circuit board and having a, a second step of implementation by soldering to 揷入 the conductive through hole is provided.

[0022] According to the present invention having the above configuration, it is possible to ensure a constant distance (stand-off) between the bottom surface of the circuit board and 揷入 electronic component. Thus, the electronic component molten solder solidifies, the deformation of the electronic component leads during the circuit board contracts is suppressed, occurs due to the difference in thermal expansion coefficient between the electronic component enclosure and the circuit board leads, the solder fillets stress can be alleviated. This situation, with reference to FIG. 5 will be described more specifically. Figure 5 is imitating the two leads of 揷入 electronic component, assuming that the left side of the leads 12a are fixed, deformation due to thermal change between leads 12a-12b occurs in the right rie de 12b the model is shown. Mounting the electronic component 13 having a lead 12a, the lead 12b to the circuit board 1, when the flow soldering without lead solder, the electronic component 13 and the circuit board 1 is heated, followed by being returned to room temperature, the electronic component and 13 of the housing of the thermal expansion coefficient ay (82ppm / ° C), at a rate of thermal expansion coefficient of the circuit board 1 (XY direction) a x (16ppm / ° C ), they undergo thermal deformation. At this time, the lead 12b at the housing side of the electronic component, if a y_ ct x = α ratio by deformation force standoff L that will of ζ is large, the lead 12b is X- Y direction by the width W whereas the displacement, if the standoff is 1 / a small displacement of the lead 12b becomes large amount of displacement as shown by the width W ', it takes a large stress in the soldered portions and the through holes . Therefore, by increasing the standoff L, can be suppressed small displacement of the lead 1 2b, can be force S to suppress an increase in the stress generated in the through holes.

[0023] according to Table 2 Sutando temperature cycle test component heat expansion coefficient housing side direction

(Ppn / :) bottle diameter (ran) off L (咖) disconnection cycles (eye) Component A 20 0.3 1.5 2> 1000

Parts B 83 0.3 1.5> 1000

Parts C 82 1.14 9.0> 1000

83 0.64 0.1 7 300 parts Ε 82 1.25 1.0 2 14

Capital i¾F 82 1.14 0.3 6 1

[0024] Table 2, y shed thermal expansion coefficient of the housing, pin diameter of the housing longitudinally, different electronic components standoff L, respectively, -40 ° C (30 minutes) one 25. C (5 minutes) when carried out a temperature cycle test an 125 ° C (30 minutes) as one cycle is shown to table the relationship between the number of breakage cycles up to breakage. Than this, part D, component E, as component F, the thermal expansion coefficient ay of the housing 80 ppm / ° C or more, a pin diameter of the casing longitudinal direction 0.5mm or more still and, standoff: !. in the following electronic parts 4 Omm, for a very large stress to the soldering section is generated, it can be seen that early in easy disconnection. These parts are especially occurs Suruho Lumpur peeling as shown in FIG. 3 and immediately significantly affecting reliability. However, as the component C, the larger standoff L is, the thermal expansion coefficient ay of the housing, at 80 ppm / ° C or more, the pin diameter of the housing length side direction at more electronic components 0.5 mm, the lead because the amount of deformation was small, it is possible to reduce the concentration of stress on the soldered portion and the circuit board. Therefore, the height as viewed from the substrate surface parts products received, it is preferably determined based on the diameter of the substrate material of the circuit board and the electronic component enclosure thermal expansion coefficient and electronic parts lead.

[0025] Thus, according to the present invention to provide a component received in between the circuit board first electronic component, a circuit board - it is possible to ensure a certain level of standoff between the electronic components, stress inside the through hole can be reduced, thus suppressing the occurrence of the through-holes peeling, it is possible to improve the reliability of the mounting structure according to the circuit board.

[0026] Here, a technique for increasing the standoff L is no need to change the design specifications, such components enclosure material and pin diameter.

[0027] Further, according to the peripheral portion of the surface land to the configuration covering with an insulating coating, can solder is prevented from spreading wetting to the end of the front surface land, the solder fillet to the surface land ends stresses no longer Kakekara, it is possible to alleviate the stress concentration on the peripheral portion tends to follow the thermal expansion 'contraction of the circuit board to prevent land peeling.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] is a sectional view showing a conventional mounting structure [Figure 1].

FIG. 2 is a sectional view for explaining a conventional example of problems.

It is a cross-sectional view showing the FIG. 3 prior art problems.

It is a cross-sectional view showing the FIG. 4 conventional problems.

[Figure 5] for explaining the advantages of the present invention, it is a cross-sectional view showing a mounting structure.

It is a cross-sectional view showing a circuit board of the first embodiment of FIG. 6A] present invention.

It is a sectional view showing a mounting structure of the first embodiment of FIG. 6B] present invention.

It is a cross-sectional view showing a circuit board of the second embodiment of FIG. 7A] present invention.

It is a sectional view showing a mounting structure of the second embodiment of FIG. 7B] present invention.

Is a sectional view showing a mounting structure of the first embodiment of FIG. 8A] present invention.

It is a plan view showing a mounting structure of the first embodiment of FIG. 8B] present invention.

Is a sectional view showing a mounting structure of the second embodiment of FIG. 9A] present invention.

It is a plan view showing a mounting structure of the second embodiment of FIG. 9B] present invention.

Is a sectional view showing a mounting structure of the third embodiment of FIG. 10A] present invention.

It is a plan view showing a mounting structure of the third embodiment of FIG. 10B] present invention.

Is a sectional view showing a mounting structure of the fourth embodiment of FIG. 11A] present invention.

It is a plan view showing a mounting structure of the fourth embodiment of FIG. 11B] present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0029] and have preferred embodiment Nitsu circuit board and mounting structure using the same according to the present invention will be described in detail with reference to the accompanying drawings.

[0030] FIGS. 6A and 6B are sectional views showing a first embodiment of the present invention. As shown in Figure 6A, the circuit board 1, the inner wiring 3 therein the resin laminate plate 2 made of glass epoxy as a substrate material, and has an outer-layer wiring 4 on its outer surface. The rie de insertion point of the circuit board has an opening 5 is opened, and the surface la-end 6 and the back surface land 7 is formed in the periphery of an opening of the substrate table 'rear surface. The surface lands 6 and back lands 7 are electrically connected by through holes (plaited through hole) 8. Les, such limitations for an illustration in the 6A and 6B, although an example having an inner layer wiring 3 of two layers is shown that the number of layers. Further, it may be a double-sided circuit board having no inner wiring. Region other than the soldering points of the substrate front and back surfaces are covered with a solder resist 9.

[0031] periphery of the front surface land 6 of the substrate surface is covered by the solder dam 10 to prevent solder wetting. The solder dam may be formed by printing using a heat-resistant resin screen printing and the like. Further, the component mounting position and part numbers on the substrate surface, and the substrate number when printing with white indicator coating material, yo be shape formed by the same coating les. Thus, it can force S to prevent the man-hour increase for forming a solder dam 10. Although not shown, it may be formed a solder dam also covers the peripheral part on the back surface land 7. Thus, it is possible to improve the reliability further.

[0032] On the substrate surface, parts receiving 11 for regulating the mounting height of 揷入 electronic component is provided. Installation location of the component receiving 11 is not particularly limited as to its position if just below the electronic component to be mounted. Further, there is no special limitation on this long its installation number also several or more. Receiving the component 11 can be force S to form a heat-resistant resin with one or a plurality of times print 'coating. Also, when printing 'applying a thermosetting adhesive to temporarily fix the surface-mounted components, it may also be possible to form the part receiving 11 simultaneously using the same material les. Thus, Ru can be prevented steps increase for forming the component receiving 11. Yo les, even as have been shown which are arranged in different positions, providing the component receiving 11 on the solder dam 10 and FIG. 6A and 6B, the dam 10 the solder component receiving 11. More this, it is possible to form the component receiving 1 1 of the required elevation height efficiently.

[0033] Component receiving 11, instead of the method of forming a resin composition was printed 'applied by printing techniques, the resin may be formed by bonding a spacer made of metal or ceramics. Adhesive used in this case, an adhesive for temporarily fixing the surface mount electronic device when printing 'coating, may be applied simultaneously using the same material. Also, the part accepted 11 previously formed at least in part by a solderable material, may be soldered on a substrate in a marked step solder reflow. In this case, it is desirable to perform the reflow soldering in a state where the parts received 11 were temporarily fixed with an adhesive. [0034] Figure 6B is a cross-sectional view showing a first state in which the electronic component has been implemented on a circuit board of the embodiment of the present invention shown in FIG. 6A. Although not shown, before mounting the electronic component 13 shown in FIG. 6B, a surface mount electronic device implementation is assumed to be completed. On the circuit board 1, it is mounting an electronic component 13 by 揷入 the lead 12 to the through hole 8 of the circuit board. At this time, by the bottom surface of the electronic component 13 contacts the top surface of the component receiving 11, it is possible to secure the standoff on the constant than. In this state, the flow soldering by dipping the substrate rear surface such as wave soldering bath. Thus, the lead 12 of the electronic component 13, the through hole 8 of the circuit board 1, the surface land 6 and the back surface land 7, is more electrically and mechanically coupled to the solder fillet 14.

[0035] Flow after soldering, the electronic component 13, as shown in FIG. 6B, are often fixed in a state where its bottom surface is in contact with the component accept 11, is fixed to float from the component receiving 11 Kotochiaru.

[0036] Figures 7A and 7B are sectional views showing a mounting state of the electronic components of a cross-sectional view of a circuit board of the second embodiment of the present invention and its circuit board. 7A and 7B, designated by the same reference numbers in the first embodiment of the portion equivalent to parts shown in FIGS. 6A and 6B, description thereof is omitted. Differs from the first embodiment shown in FIGS. 6A and 6B of this embodiment are not solder dam is formed, instead of the solder one resist 9 is the surface land 6 and the back surface land 7 a point that extends to the peripheral portion, component receives 11 is made spherical member is a point-les, Ru.

[0037] Component receiving 11, a resin, are formed of metal or ceramic, they are bonded by an adhesive applied in advance on the substrate. Alternatively, spheroids which the adhesive is applied to the surface may be arranged on the substrate.

Example 1

[0038] With reference to FIGS. 8A and 8B for Example 1 of the present invention will be described. 8A is a sectional view in the onset Ming circuit substrate of Example 1 shows the electronic components are mounted structure, FIG. 8B is a perspective plan view when viewing FIG. 8A from the upper surface of the electronic component side is there. In FIG. 8A and FIG. 8 B, FIGS. 6A and 6B, since the form of parts equivalent to parts of the embodiment shown in FIGS. 7A and 7B are face down with the same reference numbers, the redundant description appropriately omitted. For another embodiment shown in FIGS. 9A- FIG 11B is the same.

[0039] In Example 1, the solder dam 10, the arrangement of electronic parts, part number, and is formed with a display paint being used for such a substrate ID of any marking printing. And it is also formed dams solder at the same time in the step of forming the display portion. In addition, the display paints, Ru proven der in the performance of this until the heat resistance against hung heat during soldering.

[0040] Further, in this embodiment, parts receiving 11 uses a thermosetting adhesive used surface mount electronic device in order to temporarily fixed, superimposed on the solder dam 10, is formed . Since forming the component receiving 1 1 in the adhesive layer forming step for temporarily fixing a surface mount component, there is no increase in man-hours.

Example 2

[0041] FIG. 9A is a sectional view showing an electronic component is mounted structure on the circuit board of Example 2 of the present invention, FIG. 9B is perspective plan when viewed Figure 9A from the upper surface of the electronic component side it is a diagram.

[0042] In this embodiment, the source Ruda resist 9 which is used to protect the outer layer wiring 4 of the substrate surface, is coated to extend up to the periphery of the front surface land 6. Also, parts accepted 11 uses a thermosetting adhesive is a temporary fixing adhesive is formed in a position away from the surface land 6.

Example 3

[0043] Figure 10A is a cross-sectional view showing an electronic component is mounted structure on the circuit board of Example 3 of the present invention, FIG. 10B is a perspective when viewing FIG. 10A from the upper surface of the electronic component side plan view der Ru.

[0044] In this embodiment, the solder dam 10 is formed by using a thermosetting adhesive to temporarily fix the surface mount electronic device. Then, the component receives 11 is a spacer made of resin is bonded on a substrate by adhesive constituting the solder dam 10.

Example 4

[0045] FIG. 11A is a cross-sectional view showing an electronic component is mounted structure on a circuit board of the fourth embodiment of the present invention, FIG. 11B is a perspective when viewing FIG. 11A from the upper surface of the electronic component side plan view der Ru. In this embodiment, no solder dam is formed in the same manner as in Example 2, a solder one resist 9 is extended to the periphery of the front surface land 6. The parts receiving 11, the surface of the resin sphere 1 la is a resin sphere is configured to adhesive 1 lb is coated les, Ru. The component receiving 11 is provided by causing the advance thermosetting adhesive applied resin spheres to cure the adhesive performed disposed heat treatment on the substrate.

Claims

The scope of the claims
[1] leaded component leads has a conductive through-hole to be soldered is 揷入, the surface land to the mounting surface of the leaded component, via the conductive through hole on the opposite surface Oite the circuit board having the surface lands electrically connected to the back surface land,
Circuit board, characterized in that the part products receiving said on the mounting surface of the leaded component to regulate the mounting height of the component with lead is provided with a plurality.
[2] The circuit board according to claim 1, wherein the mounting surface of the leaded components wherein the lands coating covering the periphery of the front surface land is formed.
[3] The circuit board according to claim 2 wherein the lands coating, characterized in that covers the entire circumference of a peripheral portion of the front surface land.
[4] The circuit board according to claim 2 or 3 wherein the component receiving is characterized in that it is formed on the land film.
[5] The circuit board according to any one of claims 2 or et 4, wherein the component receiving is characterized in that it is formed by a thermosetting adhesive.
[6] the component received by the circuit board according resin, to any force 4 of claims 2 to 5, characterized in that it is formed by Rukoto to bond the spacer made of a metal or ceramics .
[7] Claim the front and rear surfaces of the circuit board is formed by a solder resist is formed, the La-end coating is characterized that you are formed by a solder resist material as an extension of the solder resist 2 the circuit board according to any force 4 of the 6.
[8] the land film circuit board according to any one of claims 2 to 7, characterized in that it is formed by heat-resistant resin.
[9] the land coating, the circuit board according to any force one of claims 2 to 8, characterized in that it is formed by the display unit of the same materials that are formed on the front surface and the back surface of the circuit board .
[10] In any forces one of claims 1 to is on the opposite side of the mounting surface of the leaded component, characterized in that the back surface land coating covering the periphery of the back surface land is formed 6 the circuit board according.
[11] Claim 10 of the front and back surfaces of the circuit board is formed with a solder resist is formed, the back surface land film is characterized in that it is formed by the solder resist material as an extension of the solder resist the circuit board according to.
[12] The circuit board according to claim 10 or 11 wherein the back surface land coating is characterized in that it is formed by heat-resistant resin.
[13] the back lands coating any force from claim 10, characterized in that it is formed by the display unit and the same material formed on the front surface and the back surface of the circuit board 12, placing serial to item 1 circuit board.
[14] The surface lands on the mounting surface of the leaded components, opposite surface to the through conductive through-hole of the circuit substrate having the surface lands and electrically connected to the back surface land the lead with parts of the mounting surface to the part with lead, the lead is above the conductive through hole 揷 input is soldered in mounting structure of a circuit board which is mounted in and that aspect the leaded components of a circuit board mounting structure of a circuit board, characterized in that receiving part for regulating the mounting height of the leaded components is provided with a plurality.
[15] circuit board packaging structure according to claim 14, the bottom surface of at least one of the component receiving the leaded component housing on top of which is characterized in that in contact.
[16] the thermal expansion coefficient of the leaded components of the housing material, mounting structure of a circuit board according to claim 14 or 15, characterized in that greater than Netsu膨 expansion coefficient of the substrate material of the circuit board.
[17] circuit board packaging structure according to any one of claims 14 to 16, wherein the leaded component leads is characterized in that it is soldered by a lead-free solder.
[18] The height as viewed from the component receiving the substrate surface, and characterized that you have been determined based on the diameter of the substrate material of the circuit board the leaded component in thermal expansion coefficient and the leaded component leads mounting structure for a circuit board according to any force 4 of claims 14 to 17 for.
[19] The surface lands on the mounting surface of the leaded components, opposite surface to the through conductive through-hole of the circuit substrate having the surface lands and electrically connected to the back surface land the lead with parts of the a first step of providing several multiple components receiving to regulate the mounting height of the component with lead on the mounting surface,
The leaded component, a second step of mounting by soldering inserts the leads into the conductive through hole,
Circuit board mounting method characterized in that it comprises a.
[20] the first step, a circuit board mounting method according to claim 19, characterized in that the step of forming the part subjected by applying a heat-resistant adhesive.
[21] that the first step is a step of forming a component received by the step of bonding the spacer to the circuit board using the process and heat resistant adhesive material for applying a heat-resistant adhesive circuit board mounting method according to claim 19, wherein.
[22] In the above first step of applying a heat-resistant adhesive step, applying a heat-resistant adhesive to temporarily fix the surface mounted component on the mounting portion of the surface mount components simultaneously, the second circuit board mounting method according to claim 20 or 21 step of mounting the surface mount components by reflow prior to the process is characterized that you are added.
[23] Prior to the first step, the step of forming a land coating covering the periphery of the front surface land is added, the component received from 請 Motomeko 19, characterized in that provided on the land film circuit board mounting method according to any one of 22.
[24] In the above step of forming the land film, a circuit board mounting method according to claim 23, characterized in that formed using a material that form the land coat the display unit at the same time.
PCT/JP2005/000887 2004-01-26 2005-01-25 Circuit board, mounting structure of circuit board, and mounting method for circuit board WO2005072032A1 (en)

Priority Applications (2)

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JP2004016723 2004-01-26

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JP2005517301A JPWO2005072032A1 (en) 2004-01-26 2005-01-25 Circuit board, the mounting structure of the circuit board and the circuit board mounting method

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017028215A (en) * 2015-07-28 2017-02-02 住友電装株式会社 Connector mounting substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000059002A (en) * 1998-08-06 2000-02-25 Daishinku Corp Electronic component
JP2003318524A (en) * 2002-04-22 2003-11-07 Nec Corp Wiring board, electronic equipment, and method of mounting electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000059002A (en) * 1998-08-06 2000-02-25 Daishinku Corp Electronic component
JP2003318524A (en) * 2002-04-22 2003-11-07 Nec Corp Wiring board, electronic equipment, and method of mounting electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017028215A (en) * 2015-07-28 2017-02-02 住友電装株式会社 Connector mounting substrate

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