WO2005031642A1 - 撮像装置及び同装置を搭載した被撮像物移動装置 - Google Patents
撮像装置及び同装置を搭載した被撮像物移動装置 Download PDFInfo
- Publication number
- WO2005031642A1 WO2005031642A1 PCT/JP2004/014715 JP2004014715W WO2005031642A1 WO 2005031642 A1 WO2005031642 A1 WO 2005031642A1 JP 2004014715 W JP2004014715 W JP 2004014715W WO 2005031642 A1 WO2005031642 A1 WO 2005031642A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- imaging
- illumination
- line sensor
- imaged
- image
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Definitions
- the present invention relates to an imaging device for imaging a relatively moving imaging object and an imaging object moving device equipped with the imaging device.
- an illumination unit for irradiating light to an object to be imaged and an imaging unit for imaging a part under illumination conditions by the illumination unit, the posture of the object to be captured based on an image captured by the imaging unit
- An imaging device that detects the shape, shape, and the like is known.
- An imaging device of this type is also known which is configured to individually image the object under a plurality of illumination conditions in order to individually detect a plurality of detection targets set on the object.
- Patent Document 1 Japanese Patent Application Publication No. 2003-83800
- the surface mounter disclosed in Patent Document 1 absorbs an area array terminal type package component having a bump electrode called a bump on a package surface typified by a BGA (Ball Grid Array) by a head unit.
- the components are configured to be transported and mounted on the positioned printed circuit board.
- the surface mounter has a function to detect the bump-specific unevenness of this component before mounting, and the position of the component with respect to the head unit in order to accurately position the component with respect to the printed circuit board. It is required to have an imaging device having a function of detecting.
- the surface mounter includes a first sensor unit for detecting the orientation of the component and a second sensor unit for detecting a bump failure as an imaging device.
- the first sensor unit includes illumination means for irradiating the lower surface of the component, and imaging means for imaging the component from directly below under the illumination conditions, and detects the posture of the component by imaging the contour of the component. I have come to know.
- the second sensor unit includes a pair of illuminating means for irradiating the bumps with light at different inclination angles, and a pair of imaging means capable of receiving specularly reflected light from components by the illuminating means, respectively.
- the bump height is detected based on the image position of the same bump imaged twice under different lighting conditions. In the transport process, the component sucked by the head unit passes over the first sensor unit to detect its posture, and passes over the second sensor unit to detect whether there is a bump failure. It has become.
- Patent Document 1 needs to individually image components under three types of illumination conditions in order to image the contour and bump of the component to be detected. It became necessary to arrange a plurality of image pickup means individually corresponding to the lighting means, and this had caused a rise in the cost of the apparatus. Therefore, it is conceivable to switch the respective lighting conditions and image the components by the number of illumination conditions by one imaging means.However, in this case, it is necessary to pass the components to the imaging means by the number of times of imaging. However, since the transport distance of the component is increased, the efficiency of component mounting work is reduced.
- the present invention has been made in view of the above problems, and allows an image of an object under a plurality of illumination conditions to pass through the object once once by using a single imaging unit. It is an object of the present invention to provide an imaging apparatus capable of individually imaging, an object moving apparatus equipped with the imaging apparatus, and an imaging method. Disclosure of the invention
- the present invention is an imaging apparatus capable of imaging a relatively moving imaging object under a plurality of illumination conditions, and capable of irradiating the imaging object with light from a plurality of directions.
- Illuminating means a line sensor capable of scanning the object by scanning a predetermined number of times in accordance with the relative movement along a direction intersecting the moving direction, and a line sensor for imaging the object by the line sensor.
- An imaging control for controlling the light irradiation timing and the line sensor scanning timing of the illumination direction selected corresponding to the illumination condition so that a plurality of illumination conditions for irradiating light by selecting the illumination direction are appropriately switched.
- Means, and image processing means for extracting a plurality of images corresponding to each of the above-mentioned illumination conditions from the taken image (claim 1).
- the imaging device of the present invention since the imaging device is provided with the imaging control means, for example, when there are two parts to be detected for the object to be imaged, the light in two irradiation directions is scanned every time the line sensor scans. Can be alternately irradiated. For this reason, in the above example, an image in which the imaging line on which one part to be detected is projected and the imaging line on which the other part to be detected is projected are alternately arranged as one line An object to be imaged passing through the sensor is individually imaged under each illumination condition, and two types of images under different illumination conditions can be extracted from the image by the image processing means.
- a plurality of line sensors for imaging a plurality of objects, a plurality of illumination means capable of irradiating the object with light from a plurality of directions for each line sensor, a predetermined number of times for each line sensor, One or a plurality of imaging control means for controlling so as to appropriately switch a plurality of illumination conditions during scanning, and one for extracting a plurality of images corresponding to each of the above illumination conditions from an image taken for each line sensor.
- an image pickup apparatus is composed of a plurality of image processing means, even if the type of image required for each of many types of regions and portions is different efficiently, a plurality of types corresponding to the regions or portions with a small relative movement can be obtained. (An independent image for each region or portion, or an image composed of a plurality of regions or portions having a common image type).
- the illuminating means is disposed on the line sensor side with the imaged object as a boundary, and is a reflection illuminating means for irradiating light toward the imaged object; and is disposed on the anti-line sensor side with the imaged object as a boundary.
- an image in which the surface of the object to be imaged is projected by the reflection illumination means and an image in which the outline of the object to be imaged is projected by the transmission illumination means are individually captured by a relatively small relative movement. can do.
- the illuminating means is disposed on the line sensor side with the imaged object as a boundary, and illuminates for reflection for irradiating light toward the imaged object; and a lateral position of the imaged object substantially orthogonal to the optical axis of the line sensor.
- Side illumination means for irradiating light toward the object to be imaged from above, wherein the imaging control means appropriately switches between the reflection illumination means and the side illumination means during the predetermined number of scans of the line sensor. It is preferable that the lamp is lit (claim 3).
- an image of the surface of the object to be imaged by the reflecting illumination means, and a projection formed on the surface of the object by the side illumination means for example, a bump of an electronic component. It is possible to individually capture the image showing the image and the like with a small relative movement.
- the illuminating means is disposed on the side opposite to the line sensor with the imaged object as a boundary, and is a transmission illuminating means for irradiating light from the back side of the imaged object to the line sensor side; Side illumination means for irradiating light from the side position of the object to the object to be imaged, wherein the imaging control means comprises a transmission illumination means and a side illumination during the predetermined number of scans of the line sensor. It is preferable that the lighting device is configured to be switched on and off as appropriate (Claim 4).
- an image in which the outline of the object is projected by the illumination device for transmission and an image in which the projections and the like formed on the surface of the object are projected by the side illumination device are individually separated.
- An image can be taken with a relatively small relative movement.
- the illuminating means includes a plurality of reflecting illuminating means arranged on the line sensor side with the imaged object as a boundary, and irradiating light directed toward the imaged object from directions different from each other. It is preferable that the plurality of reflection illumination means are switched on and turned on during the predetermined number of scans (claim 5). According to the imaging device of claim 5, it is possible to capture a plurality of types of different reflection images with a small relative movement.
- the illuminating means is disposed on the line sensor side with the imaged object as a boundary, and is a reflection illuminating means for irradiating light toward the imaged object; and is disposed on the opposite line sensor side with the imaged object as a boundary, A transmission illuminating means for irradiating light from the back side of the object toward the line sensor; and a side for irradiating light from the side position of the object substantially orthogonal to the optical axis of the line sensor toward the object.
- Illumination means, and the imaging control means is configured to appropriately switch and turn on the reflection illumination means, the transmission illumination means and the side illumination means during the predetermined number of scans of the line sensor. (Claim 6) is preferred.
- an image in which the contour of the object is projected with a small relative movement, an image in which the surface of the object is projected, and projections formed on the surface of the object are projected. Images can be obtained.
- the present invention is an imaging apparatus capable of imaging a relatively moving imaging object under a plurality of illumination conditions, and an illumination unit capable of irradiating the imaging object with light of a plurality of colors;
- a line sensor capable of scanning a predetermined number of times along the direction intersecting with the moving direction and corresponding to the relative movement to image the object, and a predetermined number of scans for imaging the object by the line sensor.
- An imaging control means for controlling the color and irradiation timing of the light from the illumination means and the scanning timing of the line sensor so as to irradiate the object with light of a specific color by appropriately switching the light;
- an image processing means for extracting a plurality of images corresponding to the respective illumination colors from the image data.
- the image pickup control means is provided, for example, by sequentially irradiating three colors of red, green, and blue light each time the line sensor scans, the image pickup passing through the line sensor can be performed.
- Objects can be individually imaged under illumination conditions of each color, and three types of images under different illumination conditions can be extracted from the captured images by image processing means. By combining these images, a color image of the object to be imaged can be formed, so that a line sensor having a color filter for capturing the color image is used. There is no need to provide a separate device, and the cost of the device can be reduced.
- the plurality of illumination conditions are sequentially switched for each scan during the predetermined number of scans by the line sensor.
- the imaging device of claim 8 since the amount of information for controlling the lighting condition can be reduced as compared with the case where the lighting condition is controlled for each pixel of the line sensor, this information is stored.
- the storage resources can be saved, and the number of processing steps can be reduced to speed up the imaging process.
- Another aspect of the present invention is a device for moving an object to be imaged, comprising: the image pickup device described above; and a transporting unit that conveys the object to be imaged.
- the imaging device performs shape confirmation, position correction, and the like of the imaging object based on images individually captured under a plurality of illumination conditions. Objects can be transported to the destination.
- the imaging object moving device includes a head unit as a transfer unit that transfers a component as an imaging object and mounts the component on a printed circuit board, and performs imaging by the imaging device while the component is being transported by the head unit. (Claim 10).
- the component is mounted on a printed circuit board while confirming the shape and correcting the position of the component based on images individually captured by the imaging device under a plurality of illumination conditions. can do.
- the device for moving an object to be imaged is provided with a head unit as a conveying means for conveying a part as the object to be inspected to an inspection socket, and an image is taken by the image pickup device while the part is being conveyed by the head unit.
- a head unit as a conveying means for conveying a part as the object to be inspected to an inspection socket, and an image is taken by the image pickup device while the part is being conveyed by the head unit.
- it is a test device (claim 11).
- the component testing apparatus of claim 11 while checking the shape and correcting the position of the component based on the images individually captured by the imaging device under a plurality of illumination conditions, the component is inspected up to the inspection socket. Can be transported.
- FIG. 1 is a plan view schematically showing a surface mounter on which an imaging device according to an embodiment of the present invention is mounted.
- FIG. 2 is a front view showing a part of the surface mounter shown in FIG.
- FIG. 3 is a schematic partial cross-sectional view schematically showing the imaging device of FIG.
- FIG. 4 is a plan view showing an illumination area of the funnel-shaped illumination means.
- FIG. 5 is a block diagram showing an electrical configuration of a control unit of the surface mounter of FIG.
- FIG. 6 is a timing chart showing illumination and imaging timing by the imaging device.
- FIG. 5 is a diagram showing a captured image at the time of illumination by the transmission illumination means and the side illumination means.
- FIGS. 8A and 8B are image diagrams in which the image of FIG. 6 is extracted for each lighting condition.
- FIG. 8A shows an image when illuminated by the transmissive illumination means
- FIG. 8B shows an image when illuminated by the side illumination means. are doing.
- FIG. 9 is a diagram schematically showing a lighting location of an illumination area in the funnel-shaped lighting means and images of bumps and pads corresponding to the location.
- FIG. 10 is a diagram showing an image obtained by combining the images of FIG.
- FIG. 11 is a flowchart showing the mounting control operation by the control means of the surface mounter.
- FIG. 12 is a flowchart showing the operation in the component recognition processing of FIG.
- FIG. 13 is a plan view schematically showing a component test apparatus on which the imaging device according to the embodiment of the present invention is mounted.
- FIG. 14 is a side view schematically showing a head unit on which an imaging device according to another embodiment of the present invention is mounted.
- FIG. 1 and 2 schematically show a surface mounter on which the imaging device according to the present invention is mounted (the surface mounter according to the present invention).
- a conveyor 2 for transporting a printed circuit board is arranged on a base 1 of a mounting machine, and a printed circuit board 3 is transported on the conveyor 2 and stopped at a predetermined mounting work position. It has become.
- component supply units 4 and 5 are arranged on both sides of the conveyor 2, component supply units 4 and 5 are arranged.
- the component supply unit 4 on one side (the upper side in FIG. 1) of the component supply units 4 and 5 is provided with a large number of rows of tape feeders 14a in the X-axis direction.
- Each of the tape feeders 4a is configured such that small pieces of chip components such as ICs, transistors, capacitors, etc. are stored and held at predetermined intervals, and the tape held out is taken out from a reel. Parts are taken out intermittently by the duct unit 6.
- trays 5a and 5b are set in the component supply section 5 on the other side at predetermined intervals in the X-axis direction.
- Package-type components such as QFP (Quad Flat Package) and BGA (Ball Grid Array) are arranged and placed on each tray 5a and 5b, and can be taken out by the head unit 6. It has become.
- a head unit 6 for mounting components is provided above the base 1, a head unit 6 for mounting components is provided.
- the head unit 6 can be moved across the component supply units 4 and 5 and the component mounting unit where the printed circuit board 3 is located, and can be moved in the X-axis direction (conveying direction of the conveyor 2) and the Y-axis direction (in the horizontal plane). (In the direction perpendicular to the X axis).
- a fixed rail 7 in the Y-axis direction and a pole screw shaft 8 that is rotated and driven by the Y-axis thermometer 9 are provided, and are mounted on the fixed rail 7.
- a ductit support member 11 is arranged, and a nut portion 12 provided on the support member 11 is screwed to the pole screw shaft 8.
- the support member 11 is provided with a guide member 13 in the X-axis direction and a port screw shaft 14 driven by an X-axis support member 15.
- Head unit 6 is movably held by member 13 and A nut portion (not shown) provided in the dunit 6 is screwed to the pole screw shaft 14.
- the support member 11 is moved in the Y-axis direction by the operation of the Y-axis support motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis support motor 15. It is designed to move.
- the head unit 6 is provided with a plurality of heads 16 each having a nozzle 16 a for picking up components at the tip.
- the head 16 can move up and down (movement in the Z-axis direction) with respect to the frame of the head unit 6 and rotate around the nozzle center axis (R-axis: not shown). It is designed to be operated by a lifting drive means such as a Z-axis supporter and a rotary drive means such as an R-axis supporter. Note that the present embodiment shows a configuration in which six nozzles 16a are provided.
- the head unit 6 is provided with a transmission illumination means 17 for irradiating light to the component adsorbed by each nozzle 16a.
- the transmission illumination means 17 includes a plurality of LEDs 17a fixed to the lower surface of the head unit 6, and a diffuser plate 17b arranged so as to cover the LEDs 17a below.
- the illumination light of each LED 17a is applied to the base 1 from the rear (upper) force of the component.
- the diffusion plate 17b is penetrated so that the middle part of each nozzle 16a is allowed to move in the Z-axis direction and rotate around the R-axis.
- an imaging device 18 for recognizing an image of the component taken out from the component supply unit 4 or 5 prior to mounting is provided on the base 1 and between the trays 5a and 5b.
- the imaging device 18 is fixedly disposed on the base 1, and as shown in FIG. 3, a camera 30 for imaging the component C sucked on the head 16, and a camera 30 for imaging the component.
- a lighting unit 31 for providing lighting is provided.
- Camera 30 is a camera equipped with a line sensor in which a plurality of image sensors are arranged in a line.
- the image elements are arranged on the base 1 so as to be arranged in the Y-axis direction, and the head unit 6 is moved in a direction (sub-scanning direction; X-axis direction) orthogonal to the arrangement direction of the imaging elements (main scanning direction).
- the components adsorbed on each head 16 are imaged from below.
- the lighting unit 31 is provided above the camera 30, and has a funnel-shaped lighting means 32 a disposed in the upper center of the unit 31, and a reflection light disposed inside the unit 31.
- Means 3 2b which is provided with three types of lighting means: side lighting means 32 c disposed above the unit 31 and outside the funnel-shaped lighting means 32 a.
- the funnel-shaped illuminating means 32a has a plurality of LEDs 33 on the inner surface of a funnel-shaped frame having an opening at the center as shown in FIG. By illuminating, the suction component C above the imaging device 18 is irradiated with light obliquely from below. Further, in the funnel-shaped illumination means 32a, as shown in FIG. 4, four illumination areas 33a to 33d are sectioned at 90 ° around the optical axis of the camera 30. Each of these lighting areas 33a to 33d is configured so that it can be individually turned on and turned off, as one section.
- the reflecting illumination means 32b is disposed below the funnel-shaped illumination means 32a, and has a plurality of LEDs 34 and half mirrors 35 arranged side by side as light sources. Then, the light from the LED 34 is refracted by 90 ° by the half mirror 35 so that the optical axis of the camera 30 is positioned directly below the suction component C above the imaging device 18. It is configured to irradiate light in parallel directions.
- the side illuminating means 3 2 c has a plurality of LEDs 36 facing inward so as to surround the funnel-shaped illuminating means 32 a, and by illuminating these LEDs 36, it is located above the imaging device 18.
- the suction component C is configured to emit illumination light from its side.
- the above-described mounting machine includes a CPU 61 for executing a logical operation, a ROM 62 for previously storing a control program and the like by the CPU 61, and A control means 60 composed of a RAM 63 for temporarily storing various data is provided, and all of the servomotors 9 and 15, the head unit 6 and the imaging device 18 and the like are provided by the control means 60. , A series of component mounting operations are executed according to a program stored in advance.
- the CPU 61 includes imaging control means 61 a for setting the number of light irradiation directions to the component and the number of scanning of the power camera 30 in accordance with the number, and controlling the imaging timing and the lighting lighting timing.
- Imaging control means 61 a for setting the number of light irradiation directions to the component and the number of scanning of the power camera 30 in accordance with the number, and controlling the imaging timing and the lighting lighting timing.
- 30 Image processing means 61b for extracting an image corresponding to each illumination direction from the image picked up by 30 and lightness on the image detected by the part to be imaged so as to perform processing as shown in Fig. 9 described later.
- an image synthesizing unit 61 d for synthesizing each of the images whose brightness has been detected as shown in FIG. 10 described later.
- the ROM 62 is used to control the imaging timing of the camera 30 and the illumination timing of the illumination means 17 for transmission or the illumination means 32 a to 32 c of the illumination unit 31 by the CPU 61.
- a timing chart as shown in FIG. 6 is stored.
- FIGS. 6A and 6B are timing charts showing an example of control by the control means.
- FIG. 6A is a timing at the time of transmissive one-side illumination, and FIG. Are respectively shown.
- the control means 60 turns on the transmission lighting means 17 and the side lighting means 32 alternately at each scanning timing of the camera 30, as shown in FIG. It has become.
- the image captured in this manner has scanning lines captured during illumination by the transmissive illumination means 17 and scanning lines captured during illumination by the side illumination means 32 c alternately. It will be arranged.
- the substantially square main body H is projected in a rectangular shape because of the above-mentioned imaging system.
- the number of illuminating means (the transmitting illuminating means 17 and the This is because the number of scans is set as the number multiplied by the two-way illumination means 3 2 c; 2).
- the image processing unit 6 1 b separately extracts from the image the imaging line at the time of illumination by the transmission illumination unit 17 and the imaging line at the time of illumination by the side illumination unit 3 2 c (the number of scanning lines). To 1 Z 2).
- This image has the resolution captured at the regular number of scans, as shown in (a) and (b) of FIG. FIG. 8 (a) shows an image of the component (outline of the main body H) during illumination by the transmission illumination means 17 and FIG. 8 (b) shows the image of the side illumination means 32c. This shows the image of the part (bump Bu) during illumination.
- the control means 60 sequentially switches the illumination area 33 a to 33 d of the funnel-shaped illumination means 32 a at each scanning timing of the camera 30 as shown in FIG. To be lit. Specifically, the illumination areas 33a, 33b, 33c, and 33 are sequentially turned on by the control means every time the camera 30 captures an image, and these are circulated and turned on. As shown in (a) to (d) of FIG.
- images captured in this way and individually extracted imaging lines for each illumination condition by each of the illumination areas 33 a to 33 d are bumps B u
- the light irradiation position (the position facing the lit lighting area 33a to 33d) by the lit area in the lighting area 33a to 33d is near the top of It will be brighter.
- the lower surface of the pad Pa is brightened at the same position with respect to the component (hereinafter referred to as a bright portion), and these bright portions are detected by the brightness detecting means 61c.
- the image synthesizing means 61 according to the detection result of the lightness detecting means 61 c The lightness is changed so that each light part is darkened.
- each of the images (a) to (d) in FIG. 9 has a regular resolution because the imaging control means 61a has a predetermined number of scans (the number of illumination means ( Since the number of scans is set to the number multiplied by each illumination area (33a to 33d; 4), it is extracted from the captured image corresponding to each illumination line 33a to 33d. This is because the number of imaging lines of the image (the image in which the imaging line is 1Z4) becomes regular.
- the imaging control means 61 a is a lighting means having different irradiation directions depending on a part to be detected, such as the outline of the component C, the bump Bu or the pad Pa, and the like.
- irradiation timing of these illuminating means 17 and 33 a to 33 c and the imaging timing of camera 30 are controlled.
- the number multiplied by the quantity of each of the illumination means 17 and 33a to 33c is set as the number of scans.
- the illumination means for transmission 17 and the side illumination means 32b are alternately turned on, and the illumination areas 33a to 33d of the funnel-shaped illumination means 32a are sequentially turned on.
- the present invention is not limited to this, and the reflecting lighting means 32 c and the transmitting lighting means 17, the reflecting lighting means 32 c and the side lighting means 32 b or Alternatively, it is also possible to sequentially switch each of the transmission illumination means 17 and the side illumination means 32b to light them. Further, a configuration may be adopted in which the state in which all the illumination areas 33a to 33d in the funnel-shaped illumination means 32a are turned on and the state in which the reflective illumination means 32c are turned on are alternately switched. It is possible. In the above example, the funnel-shaped lighting means 32a is divided into four areas, but the shape of the division may be not only the X shape illustrated but also a cross shape. It is also possible to reduce or increase the number of divisions from four.
- the division may be configured such that each area is unequal.
- the funnel-shaped lighting means 32a is divided, but the above-described control and imaging are performed by appropriately dividing not only the funnel-shaped lighting means 32a but also the side lighting means 32b. Is also possible.
- each of the illuminating means 17 and 32 a to 32 c for irradiating illumination light having a different irradiation direction is employed, but the present invention is not limited thereto.
- a configuration may be employed in which illumination means capable of irradiating illumination light of a plurality of colors is provided.
- the imaging control unit 61 a controls the imaging timing of the camera 30 and the irradiation timing of the illumination unit so that light of a different color is sequentially emitted for each scan of the camera 30.
- the imaging control unit 61 a it is preferable to configure the imaging control unit 61 a so that the number of scans is set to the number obtained by multiplying the number of scans by the camera 30 by the number of colors of the selected illumination unit.
- the image captured by the number of scans and the image pickup line extracted for each illumination color has the resolution captured by the regular number of scans in the same manner as described above.
- Step S 2 The component C is sucked from the component supply units 4 and 5 by the nozzles 16 a of the head unit 6 (step S 1), and the component recognition process is performed when the head unit 6 passes over the imaging unit 18.
- Step S 2 the component recognition processing S2, as shown in FIG. 12, first, the head unit 6 is moved to a preset standby position on the base 1 (step S21), and the imaging means 18 Start moving to the side (step S22). Next, it is determined whether or not a plurality of lighting conditions are set as the lighting conditions set for the next component C to be imaged (step S23).
- a single lighting condition If it is determined that the illumination is normal illumination (NO in step S23), the illumination means set in advance is turned on, and scanning by the camera 30 is started (step S24). On the other hand, if it is determined that a plurality of illumination conditions are satisfied (YES in step S23), the part C is switched while switching a plurality of preset illumination means for each scan of the camera 30. The imaging of is started (step S25). Next, it is determined whether or not the imaging of the part C started in steps S24 and S25 has been completed (step S26). If not completed (NO in step S26), the repetition step is performed. Execute S26.
- step S27 it is determined whether or not the imaging of all the components C sucked by each nozzle 16a has been completed (step S2). 7) If it is determined that there is a component C that has not been imaged here (NO in step S27), while step S23 is repeatedly performed, if imaging of all components C is completed, The processing shifts to step S3 in FIG.
- step S3 it is detected whether there is a defect in the height of the bump Bu or a defect in the surface state of the component C (step S3). If determined (NO in step S3), the part C is registered as a discard target (step S4), and the process proceeds to step S7 described later. On the other hand, if it is determined that the part C is non-defective (YES in step S3), the position of the part C with respect to the head 16 (including the rotation direction) is determined based on the image on which the outline of the part C is projected. Is detected, and a correction value of the mounting position is calculated according to the detection result (step S5).
- Step S6 the part C is mounted on the printed circuit board 3 while adjusting the moving amount of the head unit 6 according to the correction value.
- Step S6 determines whether all the components C sucked to each nozzle 16a of the head unit 6 have been mounted or registered as a disposal target in step S3, that is, the components C sucked to each nozzle 16a have been processed. Is determined (step S7). If it is determined that there is an unprocessed component C (NO in step S7), step S3 is repeatedly executed. On the other hand, if it is determined that each part C has been processed (YES in step S7), all parts C registered as discard targets are transported to a not-shown defective product storage box (step S8).
- step S9 it is determined whether or not all components C to be mounted have been mounted on the printed circuit board 3 (step S9).
- the above step S1 is repeatedly executed, while all mounting targets are mounted. If it is determined that the processing has been performed (YES in step S9), the processing ends.
- the present invention is not limited to this.
- a component testing device 40 for inspecting an electronic component such as an IC chip may be used. It is also possible to mount it on.
- FIG. 13 is a plan view showing a component testing apparatus 40 on which the imaging device according to the present invention is mounted.
- the X and Y axes are shown in the figure to clarify the direction.
- the base 41 of the component testing apparatus 40 has a cassette mounting section 4 on which a cassette 42 containing wafers Wa in a state where bare chips are diced is stored in upper and lower tiers. Three are provided.
- the cassette 42 mounted on the cassette installation section 43 is transported by a transport mechanism (not shown) to a position below the opening 44 formed in the base 41, and at this position the bare chips are transferred. Picked up by five.
- the head 45 transports a bare chip from the opening 44 to the component standby portion 47 along a rail 46 extending in the Y-axis direction on the base 41.
- the component standby unit 47 is arranged between a pair of rails 48 extending in the X-axis direction on the base 41, and the bare chips conveyed to the component standby unit 47 are driven along each rail 48.
- the pair of head units 49, 50 are transported to the inspection socket 51 on the base 41, and a predetermined inspection is performed.
- imaging devices 118 and 218 are provided on the base 41 between the component standby unit 47 and the inspection socket 51.
- the headlight units 49 and 50 are provided with the above-mentioned transmission illumination means 17 (see FIG. 2) corresponding to the imaging devices 118 and 218, respectively.
- the imaging devices 118 and 218 are provided with, for example, a camera 30 as shown in FIG. 3 and an illumination unit 31 that can switch light having different irradiation directions.
- the imaging devices 1 18 and 2 18 detect a defect (for example, a bump height defect) of the bare chip transported from the component standby section 47 to the inspection socket 51, and detect that it is defective here.
- the bare chips that have been removed are not transferred to the base 41 by the head units 49 and 50. It is transported to the defective product tray 53 placed on the non-defective product collection section 52.
- the above-mentioned imaging devices 118 and 218 detect the attitude of the bare chip with respect to the head units 49 and 50, and shift the position with respect to the head units 49 and 50 here.
- the detected base chip is transported to the inspection socket 51 after the position correction is performed by the head units 49 and 50.
- the bare chips determined to be defective as a result of the inspection in the inspection socket 51 are conveyed to the defective tray 53 by the head units 49 and 50, while determined to be non-defective.
- the bare chips are transported by the respective head units 49, 50 to the component storage section 54 on the base 41, where the base tape for the tape feeder is provided.
- the base tape 55 is accommodated in the base tape 55, and a cover tape (not shown) is attached to the base tape 55.
- the tray 53 of the defective product collection unit 52 becomes full, the tray 53 is transferred to the tray discharge unit 56 by a tray moving mechanism (not shown), and the defective product collection unit 5
- the tray 58 in the tray standby section 57 adjacent to 2 is transferred to the defective product collection section 52 by the head units 49 and 50, and is emptied into the tray standby section 57 by the tray moving mechanism (not shown).
- An empty tray is transported from the tray receiver 59.
- FIG. 14 is a side view schematically showing a component transport headunit on which the imaging device according to the present invention is mounted.
- the X and Y axes are shown in the figure to clarify the direction.
- the head unit 303 for transporting the parts includes a base 300 extending vertically, a head 300 attached to the front surface of the base 300, and Imaging unit attached to the back of the base 307 so that it can be displaced in the X-axis direction 309.
- the head 308 can move up and down and rotate around the nozzle center axis with respect to the frame of the head unit 303 as in the above embodiments.
- the imaging unit 309 includes a frame 310 attached to the base 307, and an imaging device 318 disposed on the frame 310.
- the imaging device 318 includes a camera 3300 composed of a line sensor, a mirror 331 that reflects an image of the suction component so that the camera 330 can capture an image, and illuminates a side of the suction component.
- Side illumination means 332c and PJ reflection illumination means 3332b for illuminating the wearing component from below.
- the camera 330 is arranged on the frame 310 so that the image sensors are arranged in the Y-axis direction, similarly to the above embodiments, and the frame 310 is moved in the X-axis direction with respect to the head 3108. By moving the component, the component adsorbed on the head 308 is imaged from below.
- the side lighting means 332c is provided with a plurality of LEDs 336 facing in the X-axis direction facing inward, and irradiates the suction component with illumination light from the side. Is configured.
- the reflecting illumination means 3332b has a plurality of LEDs 3334 arranged in a horizontal direction and a half mirror 3335, and is parallel to the optical axis of the camera 30 similarly to the above-mentioned reflecting illumination means 32b. Light is emitted in the direction.
- the head unit 303 configured as described above moves the imaging unit 310 with respect to the base 307, and the side lighting means 3332c and the reflection unit are used for each imaging of the camera 330. By alternately switching the illumination means 3 32 b and irradiating, it is possible to individually image the suction components under each of these illumination conditions.
- the above-mentioned imaging devices 18, 118, 218, and 318 can be applied to various devices other than the mounting machine and the component inspection device. It is also possible to apply. That is, while the head unit provided with the imaging device capable of imaging the surface of the substrate is relatively moved with respect to the substrate carried into a predetermined working position by the conveyor 2 of the mounting machine, An apparatus for imaging a board and inspecting the board based on the image is conventionally known. It is also possible to mount the imaging device 18, 118, 218, 318 as in the above embodiment as a device.
- an inspection apparatus for example, when irradiating with illumination light having a plurality of irradiation angles and it is not possible to detect the shape of a component mounted on a board without individually imaging under these illumination conditions,
- the components can be reliably detected using the imaging devices 18, 118, 218, and 318.
- the imaging control means 61 a is provided, for example, a part to be detected for the component C
- a part to be detected for the component C When there are two locations, light in two different illumination directions can be emitted alternately every time the camera 30 scans. Therefore, in the above example, an image in which the imaging line on which one of the detection target parts is projected and the imaging line on which the other detection target part is projected is arranged alternately in one camera
- the component C passing through 30 can be individually imaged under each lighting condition, and two types of images under different lighting conditions can be extracted from the image by the image processing means 61b.
- An image showing the outline of C can be separately captured.
- an image in which the surface of the component C is projected by the reflecting lighting means 32 b and the side lighting means 32 c Accordingly, it is possible to separately capture an image showing the bumps Bu and the like formed on the surface of the component C.
- the contours of the first and last operations of the main scan performed multiple times (for example, 50 times or 100 times) during the head unit 6
- the image may be captured by turning on the transmission illumination means 17 and turning on the side illumination means 32b and the reflection illumination means 32c during many intermediate scans.
- the camera 30 captures an image while turning on the illuminating means for transmission 17 a, b the camera 30 captures an image while illuminating the side illuminating means 32 b, and b illuminating means for reflection
- c is the time at which the camera 30 captures an image while turning on 32 c
- a, b, b, b, c, and c may be repeated for each scan.
- images may be taken as a, a, a, b, b-a, b, a, a, a in accordance with the timing at which the image sensors arranged in the Y direction sequentially take images.
- Good This is done by storing in advance the data on which lighting means to turn on in the RAM 63 of the imaging control means 61a in accordance with the imaging coordinates in the X-axis direction and the Y-axis direction. It becomes possible by turning on the illumination means corresponding to the stored data in accordance with the number of scans associated with the movement of 6 and the timing at which the image sensor of the camera 30 sequentially captures images.
- a, b, and c are described as illumination conditions, respectively.
- the present invention is not limited to this.
- the transmission illumination unit 17 and the side illumination unit 3 2 b The lighting condition (a + b) and the lighting condition (b + c) of the reflecting lighting means 32c and the side lighting means 32b are set as lighting conditions, respectively, and each running line is set. Alternatively, these may be sequentially switched for each pixel.
- a plurality of illuminating means capable of irradiating light from the camera are provided, and the illuminating timing of each illuminating means 17, 32 a to 32 c so that a plurality of lighting conditions are appropriately switched during a predetermined number of operations for each camera 30.
- the imaging control means 61a may be configured to control the scanning timing of each camera 30. In this case, one or a plurality of images (images composed of image pixels corresponding to different predetermined coordinates) are extracted from the images captured for each camera 30 according to each of the above lighting conditions.
- a plurality of image processing means 6 lb may be provided.
- the imaging apparatus includes the imaging control means 61a.
- the imaging control means 61a By sequentially irradiating the color light, the component C passing through one camera 30 can be individually imaged under the illumination conditions of each color, and the image processing means can use a different image processing means from the imaged image. Three types of images can be extracted under different lighting conditions. If these images are combined, a color image of the part C can be formed, so that it is not necessary to separately provide a line sensor having a color filter to capture a color image, and the cost of the apparatus is reduced. Can be reduced. Industrial applicability
- the imaging apparatus since the imaging apparatus is provided with the imaging control means, for example, when there are two parts to be detected of the object to be imaged, two types of irradiation directions for each running of the line sensor are provided. Light can be alternately irradiated. Therefore, in the above example, an image in which one imaging line showing the part to be detected and the other imaging line showing the part to be detected are alternately arranged is one image. An image of the object passing through the line sensor is individually captured under each lighting condition, and two types of images under different lighting conditions can be extracted from the image by the image processing means.
- a plurality of line sensors for imaging a plurality of objects, a plurality of illumination means capable of irradiating the object with light from a plurality of directions for each line sensor, a predetermined number of times for each line sensor, One or a plurality of imaging control means for controlling so as to appropriately switch a plurality of illumination conditions during scanning, and one for extracting a plurality of images corresponding to each of the above illumination conditions from an image taken for each line sensor.
- an image pickup apparatus is composed of a plurality of image processing means, even if the type of image required for each of many types of regions and portions is different efficiently, a plurality of types corresponding to the regions or portions with a small relative movement can be obtained. (An independent image for each region or portion, or an image composed of a plurality of regions or portions having a common image type) can be extracted.
Landscapes
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Facsimile Scanning Arrangements (AREA)
- Image Input (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2004800282483A CN1860499B (zh) | 2003-09-29 | 2004-09-29 | 摄像装置及搭载该装置的被摄像物移动装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003338384A JP4381764B2 (ja) | 2003-09-29 | 2003-09-29 | 撮像装置及び同装置を搭載した被撮像物移動装置 |
JP2003-338384 | 2003-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005031642A1 true WO2005031642A1 (ja) | 2005-04-07 |
Family
ID=34386156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/014715 WO2005031642A1 (ja) | 2003-09-29 | 2004-09-29 | 撮像装置及び同装置を搭載した被撮像物移動装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4381764B2 (ja) |
CN (1) | CN1860499B (ja) |
WO (1) | WO2005031642A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2533622A1 (en) * | 2011-06-09 | 2012-12-12 | Yamaha Hatsudoki Kabushiki Kaisha (Yamaha Motor Co., Ltd.) | Component imaging method, component imaging device, and component mounting device having component imaging device |
EP3848751A4 (en) * | 2018-09-06 | 2021-08-25 | Fuji Corporation | IMAGE ILLUMINATION DEVICE AND PARTS HOLDER |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010003293A (ja) * | 2008-05-22 | 2010-01-07 | Seiko Precision Inc | 画像表示装置及び画像表示方法 |
JP5274350B2 (ja) * | 2009-04-14 | 2013-08-28 | キヤノン株式会社 | 記録材表面検出装置及びそれを備える画像形成装置 |
JP5714394B2 (ja) * | 2011-04-15 | 2015-05-07 | 富士機械製造株式会社 | 部品実装ライン |
JP5584651B2 (ja) * | 2011-05-12 | 2014-09-03 | ヤマハ発動機株式会社 | 吸着状態検査装置、表面実装機及び部品試験装置 |
JP5753020B2 (ja) * | 2011-08-03 | 2015-07-22 | ヤマハ発動機株式会社 | 部品実装装置 |
JP5854501B2 (ja) * | 2011-11-17 | 2016-02-09 | 東レエンジニアリング株式会社 | 自動外観検査装置 |
JP5798047B2 (ja) * | 2012-01-10 | 2015-10-21 | ヤマハ発動機株式会社 | 部品撮像装置、表面実装機および部品検査装置 |
JP5559392B2 (ja) * | 2013-05-16 | 2014-07-23 | キヤノン株式会社 | 記録材検出装置及びそれを備える画像形成装置 |
JP6378053B2 (ja) * | 2014-11-12 | 2018-08-22 | 株式会社Fuji | 部品実装機および部品実装ヘッド |
EP3567425B1 (en) * | 2017-01-06 | 2024-05-01 | Fuji Corporation | Illumination device for image capturing |
JP6831460B2 (ja) * | 2017-06-26 | 2021-02-17 | ヤマハ発動機株式会社 | 部品実装装置および部品データ作成方法 |
JP2021163870A (ja) * | 2020-03-31 | 2021-10-11 | パナソニックIpマネジメント株式会社 | 部品装着装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6483751A (en) * | 1987-09-26 | 1989-03-29 | Matsushita Electric Works Ltd | System ceiling |
JPH08213800A (ja) * | 1995-02-02 | 1996-08-20 | Yamaha Motor Co Ltd | 実装機の部品状態検出装置 |
JP2000292126A (ja) * | 1999-04-01 | 2000-10-20 | Hitachi Ltd | 外観検査装置およびそれを使用した半導体装置の製造方法 |
JP2002277406A (ja) * | 2001-03-14 | 2002-09-25 | Saki Corp:Kk | 外観検査方法および装置 |
JP2002296192A (ja) * | 2001-03-30 | 2002-10-09 | Rozefu Technol:Kk | カラー照明を用いた欠陥検査方法 |
JP2002310934A (ja) * | 2001-04-18 | 2002-10-23 | Saki Corp:Kk | 外観検査装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3580493B2 (ja) * | 2000-08-11 | 2004-10-20 | 株式会社サキコーポレーション | 走査ヘッドおよびそれを利用可能な外観検査方法および装置 |
-
2003
- 2003-09-29 JP JP2003338384A patent/JP4381764B2/ja not_active Expired - Lifetime
-
2004
- 2004-09-29 WO PCT/JP2004/014715 patent/WO2005031642A1/ja active Application Filing
- 2004-09-29 CN CN2004800282483A patent/CN1860499B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6483751A (en) * | 1987-09-26 | 1989-03-29 | Matsushita Electric Works Ltd | System ceiling |
JPH08213800A (ja) * | 1995-02-02 | 1996-08-20 | Yamaha Motor Co Ltd | 実装機の部品状態検出装置 |
JP2000292126A (ja) * | 1999-04-01 | 2000-10-20 | Hitachi Ltd | 外観検査装置およびそれを使用した半導体装置の製造方法 |
JP2002277406A (ja) * | 2001-03-14 | 2002-09-25 | Saki Corp:Kk | 外観検査方法および装置 |
JP2002296192A (ja) * | 2001-03-30 | 2002-10-09 | Rozefu Technol:Kk | カラー照明を用いた欠陥検査方法 |
JP2002310934A (ja) * | 2001-04-18 | 2002-10-23 | Saki Corp:Kk | 外観検査装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2533622A1 (en) * | 2011-06-09 | 2012-12-12 | Yamaha Hatsudoki Kabushiki Kaisha (Yamaha Motor Co., Ltd.) | Component imaging method, component imaging device, and component mounting device having component imaging device |
US8654412B2 (en) | 2011-06-09 | 2014-02-18 | Yamaha Hatsudoki Kabushiki Kaisha | Component imaging method, component imaging device, and component mounting device having component imaging device |
EP3848751A4 (en) * | 2018-09-06 | 2021-08-25 | Fuji Corporation | IMAGE ILLUMINATION DEVICE AND PARTS HOLDER |
Also Published As
Publication number | Publication date |
---|---|
JP2005107716A (ja) | 2005-04-21 |
CN1860499B (zh) | 2010-04-28 |
JP4381764B2 (ja) | 2009-12-09 |
CN1860499A (zh) | 2006-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9258474B2 (en) | Image capturing apparatus, component mounting apparatus, component testing apparatus, and substrate inspection apparatus | |
WO2005031642A1 (ja) | 撮像装置及び同装置を搭載した被撮像物移動装置 | |
CN109524320B (zh) | 半导体制造装置及半导体器件的制造方法 | |
JP4804295B2 (ja) | 部品認識方法、部品認識装置、表面実装機及び部品検査装置 | |
CN108962784B (zh) | 半导体制造装置及半导体器件的制造方法 | |
JP2005140597A (ja) | 物品認識方法及び同装置、並びに同装置を備えた表面実装機、同部品試験装置、同ディスペンサ、同実装基板検査装置及び同印刷基板検査装置 | |
JP6836938B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
JP2019168238A (ja) | 画像認識装置 | |
JP4536293B2 (ja) | 部品検査装置及び同装置を搭載した表面実装機 | |
JPH09321498A (ja) | 実装機の部品検査方法及び同装置 | |
JP2010157539A (ja) | 部品検査装置および部品移載装置 | |
JP4312563B2 (ja) | 部品検査装置及び同装置を搭載した部品移動装置 | |
JP4298462B2 (ja) | 部品認識装置、部品認識方法、表面実装機および部品試験装置 | |
WO2022190200A1 (ja) | 良否判定装置および良否判定方法 | |
JP4386419B2 (ja) | 部品認識装置及び同装置を搭載した表面実装機並びに部品試験装置 | |
JP6231397B2 (ja) | 部品認識装置、部品移載装置および部品実装装置 | |
JP7212467B2 (ja) | 部品実装装置 | |
JP2005093906A (ja) | 部品認識装置及び同装置を搭載した表面実装機並びに部品試験装置 | |
JP4509537B2 (ja) | 部品認識装置、表面実装機および部品試験装置 | |
JP4216114B2 (ja) | 表面実装機の部品認識装置 | |
JP4368709B2 (ja) | 表面実装機 | |
JP2005101211A (ja) | 部品認識装置及び同装置を搭載した表面実装機並びに部品試験装置 | |
JP2004327495A (ja) | 表面実装機の部品認識方法および同装置 | |
JP2003198195A (ja) | 電子部品実装装置 | |
JP2005337725A (ja) | 撮像装置用照明装置、表面実装機および部品検査装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200480028248.3 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |