WO2005010993A1 - Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same - Google Patents

Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same Download PDF

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Publication number
WO2005010993A1
WO2005010993A1 PCT/US2004/022355 US2004022355W WO2005010993A1 WO 2005010993 A1 WO2005010993 A1 WO 2005010993A1 US 2004022355 W US2004022355 W US 2004022355W WO 2005010993 A1 WO2005010993 A1 WO 2005010993A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
substrate
major surface
underfill material
edge portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/022355
Other languages
French (fr)
Inventor
Zhiyong Wang
Song-Hua Shi
Lars Skoglund
Rajen Dias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of WO2005010993A1 publication Critical patent/WO2005010993A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • This invention relates generally to an electronic assembly of the kind
  • wafers which are subsequently "singulated” or “ diced” by directing a blade of a
  • Resulting dies have conductive interconnection members that can be placed on
  • contact terminals of a package substrate and be soldered to the contact terminals.
  • a package substrate typically has a coefficient of thermal expansion
  • An epoxy underfill material is often applied to the package substrate, flows into a
  • the underfill material typically has a CTE which is even higher than that
  • Figure 1 is a plan view of a semiconductor wafer having a plurality of
  • Figure 2 is a cross-sectional side view of a portion of the semiconductor
  • Figure 3 is a plan view of the wafer after the wafer has been singulated
  • Figure 4 is a view similar to Figure 2, illustrating a blade of a saw as it
  • Figure 5 is a view similar to Figure 4, further illustrating a laser that is
  • Figure 6 is an enlarged plan view illustrating a region of one of the dies
  • Figure 7 is a top plan view of an electronic assembly that includes one of
  • Figure 8 is a cross-sectional side view of the electronic assembly on 8-8 in
  • Figure 9 is a cross-sectional view on 9-9 in Figure 7.
  • FIG. 1 and 2 of the accompanying drawings illustrate a semiconductor
  • Scribe streets 16 are defined in x- and
  • the blade 18 is not intended to cut through the supporting layer 12, but may cut it
  • the dies 20 are attached to the supporting layer 12, and the supporting
  • Each die 20 includes a
  • Figure 5 illustrates further processing of the dies 20, wherein a laser 22 is
  • the laser 22 is preferably an Excimer
  • the laser 22 is positioned above the dies 20, and a laser beam 23 is
  • Laser is preferred over grinding
  • Figure 6 illustrates a portion of one of the dies 20 after a corner edge
  • the die 20 has two side edge surfaces 26 that meet at
  • the die 20 has a rounded surface 30 that joins remaining portions of the
  • corner edge portion 24 is thus bound by the rounded
  • the rounded surface 30 may have a radius (R) of between 50 ⁇ m and 1000
  • the corner edge portion 24 accordingly has an area of between 537 ⁇ m 2 and
  • one of the dies 20 is repeated on all four corners of each one of the rectangular dies 20. It can thus be seen that removal of the corner edge portions is automated
  • Figures 7 and 8 illustrate an electronic assembly 34 that includes a
  • package substrate 36 includes a carrier substrate 40 and a plurality of contact
  • interconnection members 46 each attached to a respective one of the contact pads
  • the die 20 is placed on the package substrate 36 so that each one of the
  • interconnection members 46 is on a respective one of the contact terminals 42.
  • the contact terminals 42 are in rows and columns forming an array, and the
  • interconnection members 46 have a pattern that matches the pattern of the contact
  • interconnection members 46 are so soldered
  • the underfill material 38 is an epoxy that is applied in liquid form on the underfill material 38
  • volume between the die 20 and the carrier substrate 40 is substantially filled with the liquid underfill material 38, and some of the underfill material 38 also forms
  • the die 20 typically has a thickness of about
  • the rounded surface 30 thus also has a thickness of 750 ⁇ m.
  • underfill material 38 is also formed on a lower portion of the rounded surface 30.
  • the underfill material 38 has a CTE of between 16 and 50 ppm/°C, the
  • the die 20 has a CTE of approximately 4 ppm/°C
  • the package substrate 36 has a
  • any part of the electronic assembly is avoided in a region where side edge

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention provides an electronic assembly comprising a carrier substrate (36), a die (20), and a solidified underfill material (38). The carrier substrate (36) has an upper plane. The die (20) has a die substrate and an integrated circuit (20) formed on one side of the die substrate. The die (20) has a lower major surface over the upper plane, an upper major surface, and a plurality of side edge surfaces (26) from the upper major surface to the lower major surface. A corner edge portion where extensions of two of the side edge surfaces meet has been removed. The solidified underfill material (38) is located between and contacts both the upper plane of the carrier substrate (36) and the lower surface of the die (20).

Description

ELECTRONIC ASSEMBLY HAVING A DIE WITH ROUNDED CORNER EDGE PORTIONS AND A METHOD OF FABRICATING THE SAME
BACKGROUND OF THE INVENTION
1). Field of the Invention
[0001] This invention relates generally to an electronic assembly of the kind
having a die with an integrated circuit formed thereon, and more specifically to
prevention of cracking of the electronic assembly due to differences in coefficients
of thermal expansion of the die, an underfill material below the die, and a package
substrate.
2). Discussion of Related Art
[0002] Integrated circuits are formed in rows and columns on semiconductor
wafers, which are subsequently "singulated" or " diced" by directing a blade of a
saw through scribe streets in x- and y-directions between the integrated circuits.
Resulting dies have conductive interconnection members that can be placed on
contact terminals of a package substrate, and be soldered to the contact terminals.
[0003] A package substrate typically has a coefficient of thermal expansion
(CTE) which is higher than that of the die, which creates stresses on the
interconnection members when the electronic assembly heats up and cools down.
An epoxy underfill material is often applied to the package substrate, flows into a
space between the package substrate and the die under capillary action, and is subsequently cured at a high temperature. The stresses on the interconnection
members are redistributed to the solidified underfill material.
[0004] The underfill material typically has a CTE which is even higher than that
of the substrate, which creates stresses on certain areas of the die when the
assembly cools down after the underfill material is cured. These stresses are
particularly high at corner edge portions of the die where side edge surfaces
thereof meet, and may cause cracking in the die, the underfill material, or in the
package substrate at or near the corner edge portions of the die.
[0005]
[0006] BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The invention is described by way of example with reference to the
accompanying drawings, wherein:
[0008] Figure 1 is a plan view of a semiconductor wafer having a plurality of
integrated circuits formed thereon;
[0009] Figure 2 is a cross-sectional side view of a portion of the semiconductor
wafer which is mounted on a support layer;
[0010] Figure 3 is a plan view of the wafer after the wafer has been singulated
into individual dies;
[0011] Figure 4 is a view similar to Figure 2, illustrating a blade of a saw as it
travels through the wafer;
[0012] Figure 5 is a view similar to Figure 4, further illustrating a laser that is
used to remove portions of the dies; [0013] Figure 6 is an enlarged plan view illustrating a region of one of the dies
where a corner edge portion thereof is removed;
[0014] Figure 7 is a top plan view of an electronic assembly that includes one of
the dies;
[0015] Figure 8 is a cross-sectional side view of the electronic assembly on 8-8 in
Figure 7; and
[0016] Figure 9 is a cross-sectional view on 9-9 in Figure 7.
DETAILED DESCRIPTION OF THE INVENTION
[0017] Figures 1 and 2 of the accompanying drawings illustrate a semiconductor
wafer 10 which has been attached to a supporting layer 12, typically made of
Mylar®, for purposes of sawing the wafer 10. The wafer 10, as will be commonly
understood, has a plurality of identical circuits 14 that are replicated in rows and
columns across a circular area of the wafer. Scribe streets 16 are defined in x- and
y-directions between the circuits 14. A respective rectangular guard ring (not
shown) surrounds each respective circuit 14.
[0018] As illustrated in Figures 3 and 4, a blade 18 of a saw is directed through
the wafer (10 in Figure 1) so that the wafer is singulated into individual dies 20.
The blade 18 is not intended to cut through the supporting layer 12, but may cut it
partially. The dies 20 are attached to the supporting layer 12, and the supporting
layer 12 maintains the dies 20 in their original position of Figure 1. The blade 18 is
directed through the scribe streets (16 in Figure 1) and between the guard rings so that the circuits 14 are protected by the guard rings. Each die 20 includes a
respective one of the circuits 14.
[0019] Figure 5 illustrates further processing of the dies 20, wherein a laser 22 is
used to remove portions of the dies 20. The laser 22 is preferably an Excimer
laser, because an Excimer laser beam does not transfer heat to an object that is
being ablated. The laser 22 is positioned above the dies 20, and a laser beam 23 is
directed by the laser 22 onto one of the dies 20. Laser is preferred over grinding
and milling because of the possibility to produce higher volumes. Laser is also
preferred over etching because of tighter control over dimensional tolerances.
[0020] Figure 6 illustrates a portion of one of the dies 20 after a corner edge
portion 24 thereof has been removed with the laser 22 in Figure 5. Before removal
of the corner edge portion 24, the die 20 has two side edge surfaces 26 that meet at
right angles to one another at a corner edge 28. After removal of the corner edge
portion 28, the die 20 has a rounded surface 30 that joins remaining portions of the
side edge surfaces 26. The corner edge portion 24 is thus bound by the rounded
surface 30 and extensions 32 of the side edge surfaces 26.
[0021] The rounded surface 30 may have a radius (R) of between 50 μm and 1000
μm. The corner edge portion 24 accordingly has an area of between 537 μm2 and
860000 μm2. The purpose for providing these ranges is merely to establish that
the intent is to differentiate over the tiny radii found on sharp, even knifelike
edges.
[0022] Referring to Figure 3, the process of removing a corner edge portion from
one of the dies 20 is repeated on all four corners of each one of the rectangular dies 20. It can thus be seen that removal of the corner edge portions is automated
by removing the corner edge portions directly after the dies 20 are singulated, but
before the dies 20 are removed from the supporting layer 12.
[0023] Figures 7 and 8 illustrate an electronic assembly 34 that includes a
package substrate 36, one of the dies 20, and an underfill material 38. The
package substrate 36 includes a carrier substrate 40 and a plurality of contact
terminals 42 formed at an upper surface of the carrier substrate 40. The die 20
also has a plurality of contact pads 44 and a plurality of conductive solder ball
interconnection members 46, each attached to a respective one of the contact pads
44.
[0024] The die 20 is placed on the package substrate 36 so that each one of the
interconnection members 46 is on a respective one of the contact terminals 42.
The contact terminals 42 are in rows and columns forming an array, and the
interconnection members 46 have a pattern that matches the pattern of the contact
terminals 42. The entire assembly, excluding the underfill material 38, is then
heated in a reflow oven so that the interconnection members 46 melt, and is
subsequently allowed to cool. The interconnection members 46 are so soldered
and secured to the contact terminals 42.
[0025] The underfill material 38 is an epoxy that is applied in liquid form on the
package substrate 36 around the die 20. Capillary forces draw the liquid underfill
material 38 into a space between an upper surface of the carrier substrate 40 and a
lower surface of the die 20 between the interconnection members 46. The entire
volume between the die 20 and the carrier substrate 40 is substantially filled with the liquid underfill material 38, and some of the underfill material 38 also forms
on side edge surfaces 26 of the die 20.
[0026] As illustrated in Figure 9, the rounded surface 30 has formed through an
entire thickness 50 of the die 20. The die 20 typically has a thickness of about
750 μm, and the rounded surface 30 thus also has a thickness of 750 μm. The
underfill material 38 is also formed on a lower portion of the rounded surface 30.
[0027] The entire assembly illustrated in Figures 7, 8, and 9 is then located in an
oven and heated to a temperature sufficient to allow the underfill material 38 to
cure. Curing solidifies the underfill material 38. The assembly 34 is then allowed
to cool. The underfill material 38 has a CTE of between 16 and 50 ppm/°C, the
die 20 has a CTE of approximately 4 ppm/°C, and the package substrate 36 has a
CTE of approximately 20 ppm/°C. The different coefficients of thermal
expansion creates stresses on the die 20 when the electronic assembly 34 is
allowed to cool after curing of the underfill material 38. These stresses are
particularly high at sharp edges. By removing the corner edge portion 24, these
stresses are reduced. Rounded corners, as opposed to, for example, faceted
corners, are particularly effective for reducing stresses. Dome-shaped corners
may be even more effective to reduce stresses than cylindrically rounded corners,
but may be more difficult to manufacture. By reducing the stresses, cracking of
any part of the electronic assembly is avoided in a region where side edge
surfaces thereof meet.
[0028] While certain exemplary embodiments have been described and shown in
the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this
invention is not restricted to the specific constructions and arrangements shown
and described since modifications may occur to those ordinarily skilled in the art.

Claims

CLAIMSWhat is claimed:
1. An electronic assembly, comprising: a carrier substrate having an upper plane; a die having a die substrate and an integrated circuit formed on one side of
the die substrate, the die having a lower major surface over the upper plane, an
upper major surface, and a plurality of side edge surfaces from the upper major
surface to the lower major surface, a corner edge portion where extensions of two
of the side edge surfaces meet, having been removed; and a solidified underfill material between and contacting both the upper plane
of the carrier substrate and the lower surface of the die.
2. The electronic assembly of claim 1, wherein the corner edge portion has an
area of between 537 μm2 and 860000 μm2.
3. The electronic assembly of claim 1, wherein the die is rounded at the corner
edge portion.
4. The electronic assembly of claim 3, wherein the die has a radius of between
50 μm and 1000 μm at the corner edge portion.
5. The electronic assembly of claim 3, wherein an entire thickness of the die
from the upper to the lower major surface is rounded.
6. The electronic assembly of claim 1, wherein the underfill material has a
different CTE than the substrate.
7. The electronic assembly of claim 1, further comprising: a plurality of conductive interconnection members between and electrically
connecting the carrier substrate to the die, the underfill material being disposed
between the conductive interconnection members.
8. An electronic component, comprising: a die having a die substrate and an integrated circuit formed on the die
substrate, the die having upper and lower major surfaces and a plurality of side
edge surfaces from the upper to the lower major surface, a corner edge portion
where extensions of two of the side edge surfaces meet, having been removed.
9. The electronic component of claim 8, wherein the corner edge portion has an
area of between 537 μm2 and 860000 μm2.
10. The electronic component of claim 8, wherein the die is rounded at the
corner edge portion.
11. The electronic component of claim 10, wherein the die has a radius of
between 50 μm and 1000 μm at the corner edge portion.
12. The electronic component of claim 10, wherein an entire thickness of the die
from the upper to the lower major surface is rounded.
13. The electronic component of claim 8, further comprising: a plurality of conductive interconnection members on a side of the die of the
integrated circuit.
14. The electronic component of claim 13, wherein the conductive
interconnection members are solder balls.
15. A method of making microelectronic dies, comprising: singulating a wafer substrate on which a plurality of integrated circuits are
formed into a plurality of dies, each die including a respective one of the
integrated circuits, and each die having opposing major surfaces and a plurality of
side edge surfaces connecting the major surfaces; and removing a corner edge portion of each die where two side edge surfaces of
the respective die meet.
16. The method of claim 15, wherein the portions are removed after the dies are
singulated.
17. The method of claim 15, wherein the portions are removed with an Excimer laser beam.
18. A method of constructing an electronic assembly, comprising: mounting a die having a die substrate and an integrated circuit formed on
the die substrate over a carrier substrate with an underfill material between and
contacting both one major surface of the die and a plane of the carrier substrate; heating the underfill material to cure the underfill material; and allowing the underfill material to cool, the die having side edge surfaces
from the one major surface to an opposing major surface thereof, a corner portion
where two of the side edge surfaces meet, having been removed to reduce stresses
that may crack the die due to differential coefficients of thermal expansion of the
die and the underfill material.
19. The method of claim 18, further comprising: singulating a wafer substrate on which a plurality of integrated circuits are
formed into a plurality of dies, each including a respective one of the integrated
circuits, and each die having opposing major surfaces and a plurality of side edge
surfaces connecting the major surfaces; and removing a corner edge portion of each die where two side edge surfaces of
the respective die meet, one of the dies being the die that is mounted.
20. The method of claim 19, wherein the portions are removed with an Excimer
laser beam.
PCT/US2004/022355 2003-07-22 2004-07-14 Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same Ceased WO2005010993A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/625,109 US20050017371A1 (en) 2003-07-22 2003-07-22 Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same
US10/625,109 2003-07-22

Publications (1)

Publication Number Publication Date
WO2005010993A1 true WO2005010993A1 (en) 2005-02-03

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PCT/US2004/022355 Ceased WO2005010993A1 (en) 2003-07-22 2004-07-14 Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same

Country Status (4)

Country Link
US (1) US20050017371A1 (en)
CN (1) CN1826695A (en)
TW (1) TWI247397B (en)
WO (1) WO2005010993A1 (en)

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EP0969504A1 (en) * 1997-12-24 2000-01-05 Shinko Electric Industries Co. Ltd. Semiconductor device
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Also Published As

Publication number Publication date
TWI247397B (en) 2006-01-11
CN1826695A (en) 2006-08-30
US20050017371A1 (en) 2005-01-27
TW200522304A (en) 2005-07-01

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