WO2005002794A3 - Cell, system and article for electrochemical mechanical processing (ecmp) - Google Patents

Cell, system and article for electrochemical mechanical processing (ecmp) Download PDF

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Publication number
WO2005002794A3
WO2005002794A3 PCT/US2004/022722 US2004022722W WO2005002794A3 WO 2005002794 A3 WO2005002794 A3 WO 2005002794A3 US 2004022722 W US2004022722 W US 2004022722W WO 2005002794 A3 WO2005002794 A3 WO 2005002794A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
polishing
cell
system
platen assembly
article
Prior art date
Application number
PCT/US2004/022722
Other languages
French (fr)
Other versions
WO2005002794A2 (en )
Inventor
Yan Wang
Siew S Neo
Feng Q Liu
Stan D Tsai
Yongqi Hu
Alain Duboust
Antoine P Manens
Ralph M Wadensweiler
Rashid Mavliv
Liang-Yuh Chen
Donald J K Olgado
Paul D Butterfield
Ming-Kuei Tseng
Shou-Sung Chang
Lizhong Sun
Original Assignee
Applied Materials Inc
Yan Wang
Siew S Neo
Feng Q Liu
Stan D Tsai
Yongqi Hu
Alain Duboust
Antoine P Manens
Ralph M Wadensweiler
Rashid Mavliv
Liang-Yuh Chen
Donald J K Olgado
Paul D Butterfield
Ming-Kuei Tseng
Shou-Sung Chang
Lizhong Sun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00Combined machining
    • B23H5/06Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08Electrolytic grinding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Abstract

The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. A system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
PCT/US2004/022722 2000-02-17 2004-07-01 Cell, system and article for electrochemical mechanical processing (ecmp) WO2005002794A3 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US48418903 true 2003-07-01 2003-07-01
US60/484,189 2003-07-01
US10/642,128 2003-08-15
US10642128 US6962524B2 (en) 2000-02-17 2003-08-15 Conductive polishing article for electrochemical mechanical polishing
US51668003 true 2003-11-03 2003-11-03
US60/516,680 2003-11-03

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006518987A JP2007528794A (en) 2003-07-01 2004-07-01 Method and apparatus for electrochemical mechanical process
EP20040757017 EP1648658A2 (en) 2003-07-01 2004-07-01 Cell, system and article for electrochemical mechanical processing (ecmp)

Publications (2)

Publication Number Publication Date
WO2005002794A2 true WO2005002794A2 (en) 2005-01-13
WO2005002794A3 true true WO2005002794A3 (en) 2005-03-31

Family

ID=33568609

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/022722 WO2005002794A3 (en) 2000-02-17 2004-07-01 Cell, system and article for electrochemical mechanical processing (ecmp)

Country Status (4)

Country Link
EP (1) EP1648658A2 (en)
JP (1) JP2007528794A (en)
KR (1) KR20060035653A (en)
WO (1) WO2005002794A3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4598095B2 (en) * 2008-03-11 2010-12-15 育弘 池田 Polishing apparatus
EP2318180A1 (en) 2008-06-26 2011-05-11 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
KR20120125612A (en) 2009-12-30 2012-11-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Polishing pads including phase-separated polymer blend and method of making and using the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116998A (en) * 1997-01-13 2000-09-12 Struers A/S Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support
US20020148732A1 (en) * 2001-04-11 2002-10-17 Ismail Emesh Method and apparatus for electrochemically depositing a material onto a workpiece surface
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US20030114087A1 (en) * 2001-12-19 2003-06-19 Applied Materials, Inc. Method and apparatus for face-up substrate polishing
US20030220053A1 (en) * 2000-02-17 2003-11-27 Applied Materials, Inc. Apparatus for electrochemical processing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116998A (en) * 1997-01-13 2000-09-12 Struers A/S Attachment means and use of such means for attaching a sheet-formed abrasive or polishing means to a magnetized support
US20030220053A1 (en) * 2000-02-17 2003-11-27 Applied Materials, Inc. Apparatus for electrochemical processing
US6497800B1 (en) * 2000-03-17 2002-12-24 Nutool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US20020148732A1 (en) * 2001-04-11 2002-10-17 Ismail Emesh Method and apparatus for electrochemically depositing a material onto a workpiece surface
US20030114087A1 (en) * 2001-12-19 2003-06-19 Applied Materials, Inc. Method and apparatus for face-up substrate polishing

Also Published As

Publication number Publication date Type
JP2007528794A (en) 2007-10-18 application
WO2005002794A2 (en) 2005-01-13 application
EP1648658A2 (en) 2006-04-26 application
KR20060035653A (en) 2006-04-26 application

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