WO2004107468A2 - Flexible multilayer packaging material and electronic devices with the packaging material - Google Patents
Flexible multilayer packaging material and electronic devices with the packaging material Download PDFInfo
- Publication number
- WO2004107468A2 WO2004107468A2 PCT/EP2004/005842 EP2004005842W WO2004107468A2 WO 2004107468 A2 WO2004107468 A2 WO 2004107468A2 EP 2004005842 W EP2004005842 W EP 2004005842W WO 2004107468 A2 WO2004107468 A2 WO 2004107468A2
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- barrier layer
- organic
- packaging material
- electronic device
- Prior art date
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- 239000005022 packaging material Substances 0.000 title claims abstract description 35
- 230000004888 barrier function Effects 0.000 claims abstract description 180
- 239000000919 ceramic Substances 0.000 claims abstract description 83
- 239000007800 oxidant agent Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 180
- 239000000758 substrate Substances 0.000 claims description 43
- 239000002346 layers by function Substances 0.000 claims description 24
- 229920000858 Cyclodextrin Polymers 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 11
- 150000008064 anhydrides Chemical class 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 7
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- -1 the organic Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229940099408 Oxidizing agent Drugs 0.000 description 14
- 239000007789 gas Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- 239000013047 polymeric layer Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 240000008564 Boehmeria nivea Species 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 229940024548 aluminum oxide Drugs 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 230000002000 scavenging effect Effects 0.000 description 2
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 102000004357 Transferases Human genes 0.000 description 1
- 108090000992 Transferases Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001336 alkenes Chemical group 0.000 description 1
- WQZGKKKJIJFFOK-DVKNGEFBSA-N alpha-D-glucose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-DVKNGEFBSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 238000005899 aromatization reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- NQUSVAQGTYCOGL-UHFFFAOYSA-N cyclohexen-1-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CCCCC1 NQUSVAQGTYCOGL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005021 flexible packaging material Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 125000002791 glucosyl group Chemical group C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000004375 physisorption Methods 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- An OLED device comprises a functional stack formed on a substrate.
- the functional stack comprises at least one or more organic functional layers sandwiched between two conductive layers.
- the conductive layers serve as electrodes (cathode and anode) .
- When a voltage is applied to the electrodes charge carriers are injected through these electrodes into the functional layers and upon recombination of the charge carriers visible radiation can be emitted (electroluminescence) .
- This functional stack of the OLED is very sensitive to moisture and oxidizing agents, which can cause, for example oxidation of the metals of the electrodes or deterioration of the organic functional layers.
- flexible OLED devices can be built up on flexible substrates, like polymeric substrates.
- polymeric substrates with a permeability for water or oxidizing agents below 10 "6 g/ (m 2 day) are needed.
- the international patent application WO 01/81649 Al describes an environmentally sensitive display device, which is encapsulated by a barrier assembly consisting of a ceramic barrier layer and a polymeric layer (see Figure 1) . Due to the high permeability of the polymeric layer the barrier ability of this barrier stack is mainly attributed to the ceramic bar- rier layer. Therefore, the ceramic has to be of high quality and should have as less pinholes, grain boundaries, shadowing effects or other defects as possible. These defects can provide a continuos path for permeants for passing through the ceramic layer and therefore lead to a decreased ability of the ceramic barrier layer to function as a barrier. In order to reduce this problem the deposition conditions for the ceramic barrier layers have to be tightly controlled. Often several thin ceramic layers have to be deposited on top of each other in order to enhance the barrier abilities of the ceramic barrier layers. This leads to a complicated and therefore expensive production of flexible barrier layers.
- the present invention meets these needs by providing a flexible multilayer packaging material according to the base claim 1.
- Favourable embodiments of the invention and an electronic device with the packaging mate- rial are subjects of further dependent claims.
- the main subject of the invention according to the base claim is a flexible multilayer packaging material for protection of articles, which are sensitive to moisture and oxidizing agents comprising at least one active polymeric barrier layer which is able to bind the moisture and oxidizing agents and at least one ceramic barrier layer.
- the invention provides an active polymeric barrier layer which can actively bind and therefore neutralise permeants. This binding can take place by e . g. chemi- or physisorption of the permeants. Therefore, the active polymeric barrier layer exhibits an enhanced barrier ability in comparison to the conventional passive polymeric layers which are not able to bind permeants.
- the multilayer packaging material of the invention an article can be sealed from the environment which can be, for example, food, pharmaceuticals or sensitive electronic de- vices.
- the active polymeric layer binds the moisture and oxidizing agents chemically, and therefore permanently.
- the required barrier capabilities of the ceramic barrier layers can be reduced, for example, by one order of magnitude from 5*10 "5 g/ (m 2 day) to 5*10 "4 g/ (m 2 day) .
- the deposition conditions for the ceramic barrier layers do not have to be as tightly controlled as it would be the case with ceramic barrier layers of higher barrier abilities. Therefore the reduced requirements on the ceramic barrier layer result in an easier and therefore cheaper production of a multilayer packaging material of the invention.
- the active polymeric barrier layer is preferably selected from a polymeric matrix with dispersed cyclodextrines, cyclic olefin copolymers, a polymeric matrix with anhydrides and mixtures thereof .
- Cyclodextrines are cyclic oligomers of ⁇ -D-glucose formed by the action of certain enzymes such as cyclodextrin gluco- transferases .
- the cyclodextrines consist of six, seven or eight ⁇ - 1,4 -linked glucose monomers and are known as ⁇ - , ⁇ - or ⁇ -cyclodextrines .
- the cyclodextrine molecules are orientated in a special manner relative to each other so that con- tinuos channels are formed within the crystal lattice of the cyclodextrines. These channels have large hollow interiors of a specific volume and are therefore able to bind permeants e.g. gas molecules.
- the permeants can even be linked cova- lently to the cyclodextrine molecules, for example, by the primary hydroxyl groups at the six-carbon positions of the glucose moiety and the secondary hydroxyl group in the t,wo- and three-carbon positions of the molecule.
- These hydroxyl groups can also be replaced by other groups in order to change the solubility, compatibility and the thermostability of the cyclodextrines.
- the substitution of the hydroxyl groups can also be used to adjust the binding strength to a value lying between the binding strength of cyclodextrines and of potential permeants. Therefore the cyclodextrines are able to permanently neutralize, for example, moisture or oxi- dizing agents.
- cyclodextrines are dispersed in a polymeric matrix like polypropylene.
- the cyclic olefin copolymers can, for example, comprise two components which are blended by extrusion.
- One component can, for example, be an oxidizable polymer, like poly (ethylene/methylacrylate/cyclohexenyl-methylacrylate) (EMCM) .
- the second component can for example, consist of a photoinitiator and a catalyst, for example of a transition metal catalyst. Both components can form a so-called oxygen scavenging system which can be activated, for example upon exposure to UV-radiation.
- the cyclic olefin groups of these polymers are then able to chemically react with e.g. oxygen molecules via ring opening reactions or aromatization reactions .
- the active polymeric barrier layer can also be a polymeric matrix with anhydrides.
- the anhydrides are preferably carbonic acid anhydrides which can be formed by removing water from the respective free acids. Therefore, these anhydrides are able to bind moisture, e.g. water molecules very effectively.
- Preferred examples for acid anhy- drides are acid anhydrides of organic acids like maleic anhydride.
- the acid anhydrides are preferably bound covalently to the polymeric matrix e.g. polystyrene. It is also possible to use a mixture of cyclodextrines, cyclic olefin copolymers and anhydrides to ensure an optimal barrier performance for dif- ferent types of oxidizing agents or moisture.
- liquid crystal polymers as an active polymeric barrier layer. These polymers exhibit the same properties as liquid crystals and are often synthesized by the polycondensation of aromatic dicarboxylic acids and aromatic diamines or phenols.
- the ceramic barrier layer is selected from metalnitrides, metaloxides and metaloxynitrides .
- the metal components of these metalnitrides, metaloxides or metaloxynitrides are preferably selected from aluminum and silicon.
- These ceramic barrier layers provide a physical barrier for the permeation of gases or liquids. Apart from these materials other ceramic materials, which comprise predominantly inorganic and non-metallic compounds or elements can be used.
- the at least one active polymeric barrier layer and the at least one ce- ramie barrier layer are transparent.
- Transparent, flexible, multilayer packaging materials are preferred materials for, for example, organo-optical devices like the above-mentioned OLEDs, because these materials are transparent for the light emitted by the OLEDs.
- a further object of the invention is a containment for the protection of articles which comprises a multilayer flexible packaging material of the invention.
- this containment comprises an alternating assembly of polymeric barrier layers and ceramic barrier layers.
- An assembly of alternating ceramic barrier layers and polymeric barrier layers exhibits very high barrier abilities and for example just shows permeation rates of up to 10 "6 g/ (m 2 day) for several thousand hours .
- one of the ceramic barrier layers of the assembly faces towards the outside of the containment.
- This ceramic barrier layer is then able to prevent most of the moisture and oxidizing agents from permeating into the interior of the containment.
- the few molecules which are nevertheless able to permeate through this outside ceramic barrier layer are then absorbed by the active polymeric barrier layer, which preferably faces the interior of the containment and is arranged on the ceramic barrier layer.
- a l ⁇ m thick active polymeric barrier layer which is arranged on a ceramic barrier layer with a diffusion rate of 10 "3 g/ (m 2 day) leads to 10,000 hours before the first permeating molecule can reach an article packed in the containment of the invention.
- first and a second barrier layer on top of each other, the first ceramic barrier layer facing towards the outside of the containment. Going from the outside of the containment to the interior of the containment these two ceramic barrier layers might be fol- lowed by an active polymeric barrier layer, which is able to absorb the residual molecules permeating through the two ceramic barrier layers.
- the barrier abilities of the two ceramic barrier layers can be enhanced by decoupling the defects of the first and second ceramic barrier layers. This can be done for example by changing the deposition parameters and growth conditions during the deposition of the two ceramic barrier layers.
- first ceramic barrier layer on the active polymeric barrier layer, then modify the surface of the first ceramic barrier layer to in- troduce new nucleation sites on the surface of this first ceramic barrier layer and subsequently form a second ceramic barrier layer on the first ceramic barrier layer using the new nucleation sites. This method can also lead to mismatched subsequent ceramic barrier layers leading to enhanced barrier abilities of an assembly of two ceramic barrier layers.
- the surface of the containment facing towards the outside of the containment entirely consists of a ceramic barrier layer.
- an organic electronic device which is sensitive to moisture or oxidizing agents and comprises a flexible substrate, an organic functional area on the substrate, a cap encapsulating the organic functional area and additionally a flexible multilayer packaging material consisting of a ceramic barrier layer and an active polymeric barrier layer for protection of the organic functional area.
- a flexible multilayer packaging material consisting of a ceramic barrier layer and an active polymeric barrier layer for protection of the organic functional area.
- Such an organic electronic device exhibits an prolonged shelf life due to the enhanced barrier abilities which are attributed mainly to the flexible multilayer packaging material and the cap.
- the flexible multilayer packaging material comprising an assembly of the ceramic barrier layer and the active polymeric barrier between the substrate an the organic functional area (see for example figures 3 and 4) .
- polymeric substrates like poly-ethylenetherepthalate (PET) or polyethersulfones (PES) are preferably used.
- PET poly-ethylenetherepthalate
- PES polyethersulfones
- the polymeric substrates of these flexible organic electric devices are much thicker than the ceramic barrier layers (thickness of ceramic barrier layers between 1 and 250 nm) or the thickness of the active polymeric barrier layers (around 1 to lO ⁇ m) .
- Flexible polymeric substrates normally have a thickness of around 100 to 200 ⁇ m.
- the moisture and oxidizing agent scavenging materials for example the cyclodextrines, the cyclic olefin copolymers or the anhydrides are preferably co-extruded into the polymeric substrate so that the polymeric substrate itself can serve as an active polymeric barrier layer.
- Such a substrate can exhibit very high barrier abilities due to its large thickness (see e.g. figure 5) .
- a cap encapsulating the organic functional stack can com- prise, for example a material like polymers, metals and glass or combinations thereof. It is also possible that the cap comprises a flexible multilayer packaging material consisting of ceramic barrier layers and active polymeric barrier layers (see, for example, Figure 4) .
- the substrate comprises an alternating assembly of active polymeric barrier layers and ceramic barrier layers.
- This alternating assembly results in very good bar- rier abilities of the substrate and therefore leads to a prolonged shelf life of the organic electric device.
- the surface of the substrate facing towards the out- side environment consists of a ceramic barrier layer, which physically blocks the gases and liquid molecules from permeating into the device.
- the organic functional area can consist of a stack of a first electrically conductive layer, an organic functional layer on the first conductive layer and a second electrically conductive layer on the functional layer, wherein the organic functional layer comprises at least one organic, electrolumines- cent layer.
- An electronic device with such an organic functional stack forms an organic electroluminescent device (OLED) .
- the organic functional layer between the first electrically conductive and the second electrically conductive layer can also be an organic, radiation detecting layer, so that the electronic device provides an organic radiation detecting device, for example, an organic solar cell.
- the organic functional area can also form a so-called integrated plastic cir- cuit comprising organic electrically conductive materials.
- Figure 1 shows a conventional electronic device.
- Figure 2 shows a containment of the invention encapsulating an article.
- FIG. 3 shows one embodiment of an organic electroluminescent device of the invention.
- Figure 4 shows another embodiment of an organic electroluminescent device of the invention.
- Figure 5 shows yet another embodiment of an organic electroluminescent device of the invention.
- Figure 1 depicts a conventional environmentally sensitive display device as for example disclosed in the document WO 01/81649 Al .
- a device 25 is arranged on a substrate 5.
- the device 25 is encapsulated by a barrier stack consisting of a barrier layer 20, which can be a ceramic barrier layer and a passive polymeric layer 15. Due to the high permeability of the polymeric layer 15 most of the barrier abilities of the barrier stack are attributed to the ceramic barrier layer 20.
- This ceramic barrier layer has to exhibit a very high quality concerning defects so that for example tightly controlled conditions for the deposition of this ceramic barrier layer are necessary.
- FIG. 2 is a cross-sectional view of a containment 39 ac- cording to the invention, which encapsulates an environmentally sensitive article 40.
- the containment 39 consists of a ceramic barrier layer 45 and an active polymeric barrier layer 50.
- the active polymeric barrier layer is able to absorb the residual oxygen and moisture permeating to the ce- ramie barrier layer 45, so that a containment with enhanced barrier abilities results.
- For higher barrier abilities more ceramic barrier layers and active polymeric barrier layers can be arranged on this containment leading e.g. to alternating arrangements of ceramic barrier layers and active poly- meric barrier layers.
- FIG. 3 depicts a cross-sectional view of one embodiment of an organic electronic device of the invention.
- An organic functional stack is arranged on a substrate 100.
- An assembly 106 of different ceramic barrier layers and active polymeric barrier layers is arranged between the substrate 100 and the organic functional stack to function as a flexible multilayer packaging material.
- the assembly 106 consists of an alternating assembly of a ceramic barrier layer 110 facing the substrate 100, an active polymeric barrier layer 120 and again a ceramic barrier layer 130 and an active polymeric barrier layer 140.
- the active polymeric barrier layer 120 is able to bind the residual moisture and oxygen permeating in the substrate 100, as well as the molecules passing through the ceramic barrier layer 110.
- On top of the active polymeric barrier layers 120 a ceramic barrier layer 130 is arranged.
- This ceramic barrier layer 130 serves to block gases and moisture permeating through the active polymeric barrier layer 120.
- the additional active polymeric barrier layer 140 is arranged on the ceramic barrier layers and can bind molecules permeating through the two ce- ramie barrier layers 110 and 130.
- the organic functional stack consists of at least one organic functional layer 160 sandwiched between a first electrically conductive layer 150 and a second electrically conductive layer 170.
- the at least one organic functional layer 160 comprises at least one organic electroluminescent layer.
- the environmentally sensitive organic functional stack is encapsulated by a cap 180 which, for example, can comprise polymers, metals and glass.
- Contacts 155 and 175 are present, which contact the first 150 and second 170 electrically conductive layers and can provide contact pads. Due to the enhanced barrier abilities of the substrate 105 which is mainly conferred by the barrier assembly 106, such an organic electronic device ex- hibits a prolonged shelf life.
- Figure 4 shows a cross-sectional view of yet another embodiment of an organic electronic device of the invention.
- a barrier assembly 206 is arranged between an organic functional stack and a substrate 200.
- the barrier assembly 206 consists of an alternating assembly of a ceramic barrier layer 210 followed by an active polymeric barrier layer 220 on which another ceramic barrier layer 230 and a second active polymeric barrier layer 240 are deposited.
- the organic functional stack consists of at least one organic functional layer 260 sandwiched between a first electrically conductive layer 250 and a second electrically conductive layer 270.
- an alternating barrier assembly of ceramic barrier layers and active polymeric barrier layers is arranged on top of the functional stack encapsulating the organic functional stack.
- the barrier assembly consists of an alternating sequence of an active polymeric barrier layer 280, a ceramic barrier layer 290, an active polymeric barrier layer 300 and a ceramic barrier layer 310.
- the substrate 200 and the ceramic barrier layers and polymeric barrier layers are preferably transparent in order to enable the light to pass through the different layers.
- Figure 5 depicts an organic electronic device of the invention, where the substrate 300 itself provides an active polymeric barrier layer.
- a ceramic barrier layer 310 is arranged, completely covering the substrate 300, in order to prevent moisture and oxidizing agents from permeating into the substrate and the organic functional stack.
- the organic functional stack comprises at least one organic functional layer 330 sandwiched between a first electrically conductive layer 320 and a second electrically conductive layer 340.
- the functional stack is encapsulated by a cap 350.
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Packages (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112004000938T DE112004000938B4 (en) | 2003-05-30 | 2004-05-28 | Flexible multi-layer packaging material and electronic components with the packaging material |
JP2006508230A JP2007523800A (en) | 2003-05-30 | 2004-05-28 | Soft multilayer packaging material and electronic device having the packaging material |
KR1020057022763A KR101290134B1 (en) | 2003-05-30 | 2004-05-28 | Flexible multilayer packaging material and electronic devices with the packaging material |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
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US60/474,427 | 2003-05-30 | ||
US10/816,718 | 2004-04-02 | ||
US10/816,718 US7535017B2 (en) | 2003-05-30 | 2004-04-02 | Flexible multilayer packaging material and electronic devices with the packaging material |
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WO2004107468A2 true WO2004107468A2 (en) | 2004-12-09 |
WO2004107468A8 WO2004107468A8 (en) | 2005-05-26 |
WO2004107468A3 WO2004107468A3 (en) | 2008-01-10 |
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PCT/EP2004/005842 WO2004107468A2 (en) | 2003-05-30 | 2004-05-28 | Flexible multilayer packaging material and electronic devices with the packaging material |
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US (1) | US7535017B2 (en) |
JP (1) | JP2007523800A (en) |
KR (1) | KR101290134B1 (en) |
CN (1) | CN103325959A (en) |
TW (1) | TWI247364B (en) |
WO (1) | WO2004107468A2 (en) |
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Cited By (6)
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US9099410B2 (en) | 2003-10-13 | 2015-08-04 | Joseph H. McCain | Microelectronic device with integrated energy source |
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US7994715B2 (en) | 2006-05-30 | 2011-08-09 | Osram Opto Semiconductors Gmbh | Organic light-emitting component with an antenna coil |
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Also Published As
Publication number | Publication date |
---|---|
TWI247364B (en) | 2006-01-11 |
KR101290134B1 (en) | 2013-07-26 |
CN103325959A (en) | 2013-09-25 |
TW200511448A (en) | 2005-03-16 |
US20040239241A1 (en) | 2004-12-02 |
KR20060010830A (en) | 2006-02-02 |
WO2004107468A8 (en) | 2005-05-26 |
WO2004107468A3 (en) | 2008-01-10 |
JP2007523800A (en) | 2007-08-23 |
US7535017B2 (en) | 2009-05-19 |
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