WO2004100622A1 - Apparatus for injecting plasma gas in atmosphere - Google Patents

Apparatus for injecting plasma gas in atmosphere Download PDF

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Publication number
WO2004100622A1
WO2004100622A1 PCT/KR2004/000962 KR2004000962W WO2004100622A1 WO 2004100622 A1 WO2004100622 A1 WO 2004100622A1 KR 2004000962 W KR2004000962 W KR 2004000962W WO 2004100622 A1 WO2004100622 A1 WO 2004100622A1
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric panels
plasma
panels
electrodes
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2004/000962
Other languages
French (fr)
Inventor
Kyu-Sun Chung
Yong-Sup Choi
Myoung-Jae Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanyang Hak Won Co Ltd
Industry University Cooperation Foundation IUCF HYU
Original Assignee
Hanyang Hak Won Co Ltd
Industry University Cooperation Foundation IUCF HYU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanyang Hak Won Co Ltd, Industry University Cooperation Foundation IUCF HYU filed Critical Hanyang Hak Won Co Ltd
Priority to US10/556,226 priority Critical patent/US7196336B2/en
Priority to JP2006500680A priority patent/JP2006526253A/en
Publication of WO2004100622A1 publication Critical patent/WO2004100622A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/02—Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma
    • H05H1/16—Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma using externally-applied electric and magnetic fields
    • H05H1/18—Arrangements for confining plasma by electric or magnetic fields; Arrangements for heating plasma using externally-applied electric and magnetic fields wherein the fields oscillate at very high frequency, e.g. in the microwave range, e.g. using cyclotron resonance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube

Definitions

  • the present invention relates to an apparatus for injecting plasma in the atmosphere.
  • FIG. 1 is a front view of a conventional apparatus for injecting plasma in the atmosphere.
  • FIG. 2 illustrates the conventional apparatus of FIG. 1 viewed from direction A.
  • a conventional apparatus for injecting plasma in the atmosphere is manufactured by coupling a pair of dielectric panels 3 and 3 ' to a gas supply portion 4 and forming plate-type electrodes 2 and 2 ' on the surfaces of the dielectric panels 3 and 3 ' such as to be opposite to each other.
  • this plasma injecting apparatus when a high frequency power supply portion 1 applies high frequency power to both the plate-type electrodes 2 and 2 ' , and gas flows between the dielectric panels 3 and 3 ' , the gas turns into plasma which is injected from the ends of the dielectric panels 3 and 3 ' .
  • This plasma is injected into an object, such as a liquid crystal display (LCD), a plasma display panel (PDP), a wafer, or the like, to clean the object.
  • LCD liquid crystal display
  • PDP plasma display panel
  • plasma comprised of charged particles is strongly prone to be bound between the dielectric panels 3 and 3 ' due to an electrical field between the plate-type electrodes 2 and 2 ' .
  • plasma is not properly injected from the dielectric panels 3 and 3 ' .
  • the present invention provides an atmospheric plasma injecting apparatus which can generate plasma by using less power and effectively inject the plasma into the outside.
  • the atmospheric plasma injecting apparatus comprises a plurality of dielectric panels 13a, 13b, 13c, and 13d, a gas supply portion 14, power electrodes 15a, 15b, and 15c, ground electrodes 16a, 16b, 16c, and 16d, and a high frequency generator 17.
  • the dielectric panels 13a, 13b, 13c, and 13d are disposed in parallel at predetermined intervals.
  • the dielectric panels 13a, 13b, 13c, and 13d are fixed to the gas supply portion 14, which supplies a gas to spaces between the dielectric panels 13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d.
  • the power electrodes 15a, 15b, and 15c are linearly installed near the gas supply portion 14 and between the dielectric panels 13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d, respectively.
  • the ground electrodes 16a, 16b, 16c, and 16d are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively.
  • the high frequency generator 17 applies high frequency power to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
  • FIG. 1 is a front view of a conventional apparatus for injecting plasma in the atmosphere
  • FIG. 2 shows the apparatus of FIG. 1 viewed from direction A;
  • FIG. 3 is a front view of an apparatus for injecting plasma in the atmosphere according to the present invention.
  • FIG. 4 shows the apparatus of FIG. 3 viewed from direction B.
  • an apparatus for injecting plasma in the atmosphere includes a plurality of dielectric panels, for example, four dielectric panels 13a, 13b, 13c, and 13d, a gas supply portion 14, power electrodes 15a, 15b, and 15c, ground electrodes 16a, 16b, 16c, and 16d, and a high frequency generator 17.
  • the dielectric panels 13a, 13b, 13c, and 13d are vertically disposed at a predetermined interval in parallel to each other and fixed to the gas supply portion 14.
  • the gas supply portion 14 supplies a gas to the space between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d.
  • the power electrodes 15a, 15b, and 15c are linearly installed between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d, respectively, such as to be close to the gas supply portion 14.
  • the ground electrodes 16a, 16b, 16c, and 16d are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively.
  • the high frequency generator 17 applies high frequency power to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
  • the dielectric panels 13a, 13b, 13c, and 13d must have excellent insulating characteristics.
  • the gas supply portion 14 injects a gas into the space between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d.
  • the gas may be various types of gases, such as, an inert gas (e.g., argon), oxygen, hydrogen, a compound gas, and the like.
  • the power electrodes 15a, 15b, and 15c are formed linearly, that is, in the form of wires, between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d, respectively.
  • the ground electrodes 16a, 16b, 16c, and 16d are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively. More specifically, the ground electrodes 16a, 16b, 16c, and 16d may be coated on the ends of the dielectric panels 13a, 13b, 13c, and 13d or inserted into the ends thereof.
  • the high frequency generator 17 applies high frequency power with a frequency of several to several hundreds of kHz to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d. In this embodiment, power with a 32kHz frequency is applied thereto.
  • the gas supply portion 4 applies a gas to the space between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d, the gas turns into conductive plasma.
  • the conductive plasma is injected from the ends of the dielectric panels 13a, 13b, 13c, and 13d to the outside.
  • a high voltage with a high frequency applied to the power electrodes 15a, 15b, and 15c flows along with the conductive plasma produced between the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
  • an effect where a voltage formed in the power electrodes 15a, 15b, and 15c moves toward the ground electrodes 16a, 16b, 16c, and 16d appears.
  • a short plasma sheathing is formed on surfaces of the dielectric panels 13a, 13b, 13c, and 13d where the ground electrodes 16a, 16b, 16c, and 16d are located.
  • plasma outside the plasma sheathing maintains a high voltage
  • neutral particles existing in the atmosphere in contact with the plasma sheathing turn into plasma due to the high voltage.
  • plasma long in the direction of injection of a gas is obtained.
  • the plasma gas is not easily bound by an electric field between the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
  • the plasma gas injecting apparatus can inject a plasma gas farther than a conventional plasma injecting apparatus does.
  • a greater amount of plasma gas can be produced and injected farther than in a conventional technique, so that a to-be-processed object in a process such as an LCD manufacture, a PDP manufacture, a semiconductor manufacturing process, a PCB cleaning, a polymer surface modification, or the like, can be effectively cleaned in large quantities.
  • an atmospheric plasma injecting apparatus power electrodes are formed at upper sides of dielectric panels, ground electrodes are formed on ends of the dielectric panels, and high frequency power is applied to the space between adjacent electrodes.
  • a gas applied to the space between adjacent dielectric panels can turn into plasma in the atmosphere. Since an electric field formed by the power electrodes and the ground electrodes is in the same direction as the direction of injection of the gas, the plasma gas can spout out farther than in the conventional technique.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Fluid Mechanics (AREA)
  • Plasma Technology (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

An apparatus for injecting plasma in the atmosphere is provided, including a plurality of dielectric panels (13a, 13b, 13c), and 13d, which are disposed in parallel at predetermined intervals, a gas supply portion (14), to which the dielectric panels (13a, 13b, 13c, and 13d) are fixed and which supplies a gas to spaces between the dielectric panels (13a and 13b), between the dielectric panels (13b and 13c), and between the dielectric panels (13c and 13d), power electrodes (15a, 15b, and 15c), which are linearly installed near the gas supply portion (14) and between the dielectric panels (13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d), respectively, ground electrodes (16a, 16b, 16c, and 16d), which are formed in the ends of the dielectric panels (13a, 13b, 13c, and 13d), respectively, and a high frequency generator (17), which applies high frequency power to the power electrodes (15a, 15b, and 15c) and the ground electrodes (16a, 16b, 16c, and 16d).

Description

APPARATUS FOR INJECTING PLASMA GAS IN ATMOSPHERE
Technical Field The present invention relates to an apparatus for injecting plasma in the atmosphere.
Background Art
FIG. 1 is a front view of a conventional apparatus for injecting plasma in the atmosphere. FIG. 2 illustrates the conventional apparatus of FIG. 1 viewed from direction A.
As shown in FIGS. 1 and 2, a conventional apparatus for injecting plasma in the atmosphere is manufactured by coupling a pair of dielectric panels 3 and 3' to a gas supply portion 4 and forming plate-type electrodes 2 and 2' on the surfaces of the dielectric panels 3 and 3' such as to be opposite to each other. In this plasma injecting apparatus, when a high frequency power supply portion 1 applies high frequency power to both the plate-type electrodes 2 and 2', and gas flows between the dielectric panels 3 and 3', the gas turns into plasma which is injected from the ends of the dielectric panels 3 and 3'. This plasma is injected into an object, such as a liquid crystal display (LCD), a plasma display panel (PDP), a wafer, or the like, to clean the object.
However, plasma comprised of charged particles is strongly prone to be bound between the dielectric panels 3 and 3' due to an electrical field between the plate-type electrodes 2 and 2'. As a result, even if the gas supply portion 4 continuously supplies gas, plasma is not properly injected from the dielectric panels 3 and 3'.
To overcome this problem, an effort has been made to increase the amount of plasma by using a high voltage and higher frequency. However, the use of a high voltage causes generation of an arc between plasma and the outside, an increase in the power consumption, and the like.
Disclosure of the Invention The present invention provides an atmospheric plasma injecting apparatus which can generate plasma by using less power and effectively inject the plasma into the outside.
The atmospheric plasma injecting apparatus comprises a plurality of dielectric panels 13a, 13b, 13c, and 13d, a gas supply portion 14, power electrodes 15a, 15b, and 15c, ground electrodes 16a, 16b, 16c, and 16d, and a high frequency generator 17. The dielectric panels 13a, 13b, 13c, and 13d are disposed in parallel at predetermined intervals. The dielectric panels 13a, 13b, 13c, and 13d are fixed to the gas supply portion 14, which supplies a gas to spaces between the dielectric panels 13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d. The power electrodes 15a, 15b, and 15c are linearly installed near the gas supply portion 14 and between the dielectric panels 13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d, respectively. The ground electrodes 16a, 16b, 16c, and 16d are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively. The high frequency generator 17 applies high frequency power to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
Brief Description of the Drawings
FIG. 1 is a front view of a conventional apparatus for injecting plasma in the atmosphere;
FIG. 2 shows the apparatus of FIG. 1 viewed from direction A;
FIG. 3 is a front view of an apparatus for injecting plasma in the atmosphere according to the present invention; and
FIG. 4 shows the apparatus of FIG. 3 viewed from direction B.
Best mode for carrying out the Invention
An apparatus for injecting plasma in the atmosphere according to the present invention will now be described in detail with reference to the attached drawings.
Referring to FIGS. 3 and 4, an apparatus for injecting plasma in the atmosphere according to an embodiment of the present invention includes a plurality of dielectric panels, for example, four dielectric panels 13a, 13b, 13c, and 13d, a gas supply portion 14, power electrodes 15a, 15b, and 15c, ground electrodes 16a, 16b, 16c, and 16d, and a high frequency generator 17. The dielectric panels 13a, 13b, 13c, and 13d are vertically disposed at a predetermined interval in parallel to each other and fixed to the gas supply portion 14. The gas supply portion 14 supplies a gas to the space between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d. The power electrodes 15a, 15b, and 15c are linearly installed between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d, respectively, such as to be close to the gas supply portion 14. The ground electrodes 16a, 16b, 16c, and 16d are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively. The high frequency generator 17 applies high frequency power to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
The dielectric panels 13a, 13b, 13c, and 13d must have excellent insulating characteristics.
As described above, the gas supply portion 14 injects a gas into the space between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d. The gas may be various types of gases, such as, an inert gas (e.g., argon), oxygen, hydrogen, a compound gas, and the like. The power electrodes 15a, 15b, and 15c are formed linearly, that is, in the form of wires, between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d, respectively.
The ground electrodes 16a, 16b, 16c, and 16d are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively. More specifically, the ground electrodes 16a, 16b, 16c, and 16d may be coated on the ends of the dielectric panels 13a, 13b, 13c, and 13d or inserted into the ends thereof.
The high frequency generator 17 applies high frequency power with a frequency of several to several hundreds of kHz to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d. In this embodiment, power with a 32kHz frequency is applied thereto.
In this structure, when the high frequency generator 17 applies high frequency power to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d, and the gas supply portion 4 applies a gas to the space between dielectric panels 13a & 13b, 13b & 13c, and 13c & 13d, the gas turns into conductive plasma. The conductive plasma is injected from the ends of the dielectric panels 13a, 13b, 13c, and 13d to the outside.
At this time, a high voltage with a high frequency applied to the power electrodes 15a, 15b, and 15c flows along with the conductive plasma produced between the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d. In other words, an effect where a voltage formed in the power electrodes 15a, 15b, and 15c moves toward the ground electrodes 16a, 16b, 16c, and 16d appears. Also, a short plasma sheathing is formed on surfaces of the dielectric panels 13a, 13b, 13c, and 13d where the ground electrodes 16a, 16b, 16c, and 16d are located. Because plasma outside the plasma sheathing maintains a high voltage, neutral particles existing in the atmosphere in contact with the plasma sheathing turn into plasma due to the high voltage. As a result, plasma long in the direction of injection of a gas is obtained. The plasma gas is not easily bound by an electric field between the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
Thus, the plasma gas injecting apparatus according to the present invention can inject a plasma gas farther than a conventional plasma injecting apparatus does.
Further, since a plurality of dielectric panels are disposed in parallel, power electrodes are formed at upper sides of the dielectric panels, and ground electrodes are formed on or in the ends of the dielectric panels, a greater amount of gas can turn into plasma.
As described above, a greater amount of plasma gas can be produced and injected farther than in a conventional technique, so that a to-be-processed object in a process such as an LCD manufacture, a PDP manufacture, a semiconductor manufacturing process, a PCB cleaning, a polymer surface modification, or the like, can be effectively cleaned in large quantities.
Industrial Applicability As described above, in an atmospheric plasma injecting apparatus according to the present invention, power electrodes are formed at upper sides of dielectric panels, ground electrodes are formed on ends of the dielectric panels, and high frequency power is applied to the space between adjacent electrodes. Hence, a gas applied to the space between adjacent dielectric panels can turn into plasma in the atmosphere. Since an electric field formed by the power electrodes and the ground electrodes is in the same direction as the direction of injection of the gas, the plasma gas can spout out farther than in the conventional technique.

Claims

What is claimed is:
1. An apparatus for injecting plasma in the atmosphere, the apparatus - comprising: a plurality of dielectric panels 13a, 13b, 13c, and 13d, which are disposed in parallel at predetermined intervals; a gas supply portion 14, to which the dielectπc panels 13a, 13b, 13c, and 13d are fixed and which supplies a gas to spaces between the dielectric panels 13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d; power electrodes 15a, 15b, and 15c, which are linearly installed near the gas supply portion 14 and between the dielectric panels 13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d, respectively; ground electrodes 16a, 16b, 16c, and 16d, which are formed in the ends of the dielectric panels 13a, 13b, 13c, and 13d, respectively; and a high frequency generator 17, which applies high frequency power to the power electrodes 15a, 15b, and 15c and the ground electrodes 16a, 16b, 16c, and 16d.
PCT/KR2004/000962 2003-05-09 2004-04-26 Apparatus for injecting plasma gas in atmosphere Ceased WO2004100622A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/556,226 US7196336B2 (en) 2003-05-09 2004-04-26 Apparatus for injecting plasma gas in atmosphere
JP2006500680A JP2006526253A (en) 2003-05-09 2004-04-26 Normal pressure plasma injection device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2003-0029360A KR100529299B1 (en) 2003-05-09 2003-05-09 Apparatus for injecting plasma gas in atmosphere
KR10-2003-0029360 2003-05-09

Publications (1)

Publication Number Publication Date
WO2004100622A1 true WO2004100622A1 (en) 2004-11-18

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US (1) US7196336B2 (en)
JP (1) JP2006526253A (en)
KR (1) KR100529299B1 (en)
WO (1) WO2004100622A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100975665B1 (en) * 2008-01-25 2010-08-17 (주)에스이 플라즈마 Atmospheric pressure plasma generator for mass production
KR102510247B1 (en) * 2020-09-14 2023-03-15 주식회사 진영코퍼레이션 Plasma generating apparatus for cleaning a surface of PCB

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140773A (en) * 1996-09-10 2000-10-31 The Regents Of The University Of California Automated control of linear constricted plasma source array
KR20010060200A (en) * 1999-10-25 2001-07-06 이마이 기요스케 Plasma treatment apparatus and plasma generation method using the apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4429612A (en) * 1979-06-18 1984-02-07 Gt - Devices Method and apparatus for accelerating a solid mass
JP3897620B2 (en) * 2002-03-14 2007-03-28 三菱重工業株式会社 High frequency power supply structure and plasma CVD apparatus including the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140773A (en) * 1996-09-10 2000-10-31 The Regents Of The University Of California Automated control of linear constricted plasma source array
KR20010060200A (en) * 1999-10-25 2001-07-06 이마이 기요스케 Plasma treatment apparatus and plasma generation method using the apparatus

Also Published As

Publication number Publication date
KR20040096356A (en) 2004-11-16
US20060219173A1 (en) 2006-10-05
JP2006526253A (en) 2006-11-16
US7196336B2 (en) 2007-03-27
KR100529299B1 (en) 2005-11-17

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