WO2004070758A1 - Element de protection - Google Patents

Element de protection Download PDF

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Publication number
WO2004070758A1
WO2004070758A1 PCT/JP2004/001129 JP2004001129W WO2004070758A1 WO 2004070758 A1 WO2004070758 A1 WO 2004070758A1 JP 2004001129 W JP2004001129 W JP 2004001129W WO 2004070758 A1 WO2004070758 A1 WO 2004070758A1
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WO
WIPO (PCT)
Prior art keywords
electrodes
metal
fuse
cover plate
protection element
Prior art date
Application number
PCT/JP2004/001129
Other languages
English (en)
Japanese (ja)
Inventor
Yuji Furuuchi
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Publication of WO2004070758A1 publication Critical patent/WO2004070758A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material

Definitions

  • the present invention relates to a protection element for interrupting a current due to fusing of a low-melting-point metal body when an abnormality occurs.
  • a protection element that can be used to prevent not only overcurrent but also overvoltage
  • a protection element in which a heating element and a low-melting-point metal body (fuse portion) are laminated on a substrate is known (for example, see Japanese Patent No. 27900). No. 433, JP-A No. 8-161690, etc.).
  • current is supplied to the heating element in the event of an abnormality, and the heating element generates heat, thereby melting the low-melting metal body.
  • the melted low-melting metal body is attracted to the electrode due to the good wettability of the electrode surface on which the low-melting metal body is placed, and as a result, the low-melting metal body is melted and the current is interrupted.
  • connection mode between the low-melting metal body and the heating element of this type of protection element is described in JP-A-10-116549 / JP-A10-116550 and the like.
  • the effect of cutting off the current to the heating element at the same time as the fusing of the low melting point metal body is the same.
  • this type of protection element is also required to be thinner.
  • One means for achieving this object is to use a fuse (low melting point metal) on an insulating substrate.
  • a method has been proposed to reduce the thickness by placing a body) and sealing it with an insulating cover plate and resin (see, for example, Japanese Patent Application Laid-Open No. H11-111138).
  • a fuse mounting membrane electrode is formed on one side of an insulating substrate, and a low melting point fusible alloy piece is bridged between the membrane electrodes to provide a low melting point.
  • a flux is applied to the spot fusible alloy piece, an outer insulating par plate smaller than the insulating substrate is disposed on one side of the insulating substrate, and a peripheral end of the insulating cover plate and a peripheral end of the insulating substrate are connected to each other.
  • the gap is filled with a sealing resin, and the outer surface between the peripheral edge of the insulating cover plate of the sealing resin and the peripheral edge of the insulating substrate is formed as a concavely curved inclined surface or a linear inclined surface.
  • the method in which the insulating member is sealed with a bar plate and a resin to reduce the thickness the space for accommodating the low melting point metal body is small.
  • the electrode area tends to be reduced with the miniaturization, there is a possibility that defective fusion may occur. That is, as described above, the above-mentioned substrate type fuse is blown by the molten fuse element (low-melting metal body) flowing into the membrane electrode on the substrate. At this time, if the electrode area is sufficiently large and the volume on the electrode is ensured, no problem will occur, but if not, a situation occurs in which the fuse element cannot be melted and melted.
  • the present invention has been proposed in view of such a conventional situation, and can secure a sufficient wetted area with respect to a molten fuse portion (low-melting metal body). It is an object of the present invention to provide a protection element that does not cause a fusing defect, can reliably shut off current when an abnormality occurs, and has stable operation characteristics. Disclosure of the invention
  • the present invention is directed to a base substrate, a first electrode, a second electrode disposed apart from each other on the base substrate, and a low melting point metal, A fuse portion disposed over the second electrode, wherein a current flowing through the fuse portion is cut off by fusing the fuse portion.
  • the present invention is the protection element in which a second metal pattern separated from the first metal pattern is arranged at a position on the second electrode of the cover plate.
  • a protection element including a heating element provided in the vicinity of the fuse section, wherein a current flows through the heating element, and the fuse section is blown when heat is generated.
  • the present invention is the protection element, wherein a distance between the first and second metal patterns is smaller than a distance between the first and second electrodes.
  • the present invention is the protection element, wherein the distance between the first and second metal patterns is 0.2 mm or more.
  • the distance between the surface of the base substrate on which the first and second electrodes are arranged and the surface of the force bar plate on which the first metal pattern is arranged is determined by: It is a protection element whose thickness is 1.2 times or more and 4 times or less of the thickness of the part.
  • the present invention is a protection element in which the surfaces of the first and second electrodes and the surface of the first metal pattern have higher wettability than the surface exposed between the first and second electrodes. is there.
  • the surface of the first and second electrodes and the surface of the first and second metal patterns have higher wettability than the surface exposed between the first and second electrodes. It is a protection element.
  • a metal pattern showing good wettability with respect to the molten low melting point metal is also formed on the insulating cover plate.
  • the base substrate and the insulating board are made of an insulating material such as ceramic, glass, or resin, and the first and second surfaces are exposed between the first and second electrodes. Since the wettability of the second electrode and the metal pattern surface to the molten low-melting metal is high, when the low-melting metal body is melted at the time of an abnormality, not only the electrode but also the molten metal pattern is melted. It works to attract.
  • the low-melting-point metal that has been melted in a manner similar to capillary action is quickly drawn into the gap between the electrode and the metal pattern, and the low-melting-point metal is reliably reduced
  • the melting point metal body is blown.
  • the surface exposed between the first and second electrodes is not limited to the surface of the base substrate.
  • the surface exposed to the low melting point metal body in a molten state is more than the first and second electrode surfaces and the metal pattern surface. If the wettability is low, for example, the protective film formed on the base substrate may be exposed.
  • FIG. 1 is a plan view showing the internal structure of the protection element according to the first embodiment.
  • FIG. 2 is a schematic sectional view showing a sealed state by an insulating cover plate.
  • FIG. 3 is a plan view showing a surface of the insulating cover plate facing the base substrate.
  • FIGS. 4a and 4b are schematic diagrams showing the state of the molten low-melting metal body on the electrode, and FIG. 4a shows the case where the metal pattern is not formed on the insulating cover plate. The figure shows a case where a metal pattern is formed on the insulating cover plate.
  • FIG. 5a to 5c are views showing the internal structure of the protection element of the second embodiment
  • FIG. 5a is a plan view
  • FIG. 5b is a cross-sectional view taken along line X--X
  • FIG. c is a cross-sectional view taken along the line y--y.
  • FIG. 6 is a circuit diagram showing a circuit configuration of a protection element according to the second embodiment.
  • FIG. 7 is a plan view showing a surface of the insulating cover plate facing the base substrate of the second embodiment.
  • reference numerals 1 and 21 indicate a base substrate
  • reference numerals 2 and 23 indicate fuse portions
  • reference numerals 3 and 25 indicate heating elements
  • reference numerals 4, 5, 6, and 7 indicate electrodes
  • reference numeral 8 , 9, 10, 11 1 indicate leads
  • 13 and 27 indicate insulating covers
  • 14 indicates resin
  • 15 a, 15 b, 28 a, 28 b and 28 c indicate metal patterns. Shown. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 shows an example (first embodiment) of a protection element to which the present invention is applied.
  • FIG. 1 is a plan view in a state where an insulating cover plate has been removed.
  • the protection element of this example is a so-called substrate-type protection element (substrate-type fuse), which is formed of a low-melting-point metal on a base substrate 1 of a predetermined size and cuts off current by fusing.
  • a fuse part (low-melting metal body) 2 serving as a heat source and a heating element (heat sink) 3 for generating heat in the event of an abnormality and melting the fuse part 2 are arranged in close proximity and in parallel.
  • the material of the base substrate 1 may be any material as long as it has an insulating property.
  • a substrate used for a printed wiring board such as a ceramic substrate or a glass epoxy substrate, a glass substrate , A resin substrate, an insulated metal substrate, or the like can be used.
  • a ceramic substrate which is an insulating substrate having excellent heat resistance and good thermal conductivity is preferable.
  • various low-melting metals conventionally used as a fuse material can be used as a material for forming the fuse portion 2 having a function as a fuse.
  • various low-melting metals conventionally used as a fuse material can be used.
  • JP-A-8-161990 The alloys and the like described in Table 1 of the publication can be used. Specifically, Bi SnPb alloy, Bi PbSn alloy, Bi Pb alloy, Bi Sn alloy, SnPb alloy, SnAg alloy, Pb ln alloy, ZnAl alloy, In Sn alloy, PbAg Sn alloy, etc. Can be mentioned.
  • the shape of the fuse part 2 The shape may be a flake or a rod.
  • the heating element 3 needs to be coated with a resist paste made of a conductive material such as ruthenium oxide and carbon black and an inorganic binder such as water glass or an organic binder such as thermosetting resin. And can be formed by firing. Further, a thin film of ruthenium oxide, carbon black, or the like may be formed by printing, plating, vapor deposition, or sputtering, or may be formed by attaching or laminating these films.
  • a pair of electrodes 4 and 5 (first and second electrodes) for the fuse portion 2 and separated from each other, and a pair of electrodes for the heating element 3 are provided on the surface of the base substrate 1.
  • 6 and 7 are formed, and the fuse section 2 and the heating element 3 are formed so as to be connected to the electrodes 4 and 5 or the electrodes 6 and 7.
  • Leads 8, 9, 10, and 11 are connected to the electrodes 4, 5, 6, and 7, respectively, and serve as external terminals.
  • the electrode into which the molten fuse portion 2 flows that is, the constituent materials of the electrodes 4 and 5 for the fuse portion 2, and those having good wettability with the fused fuse portion 2 in the molten state. Can be used.
  • the fused portion 2 in a molten state and a metal material having good wettability such as copper (Cu), Ag, Ag—Pt, Ag—Pd, Au, Ni, Mo
  • a metal material having good wettability such as copper (Cu), Ag, Ag—Pt, Ag—Pd, Au, Ni, Mo
  • Cu copper
  • Ag—Pt Ag—Pt
  • Ag—Pd Ag—Pd
  • Au Ni
  • Mo metal material having good wettability
  • the electrodes 4 and 5 may be formed of a material having poor wettability with the fused portion 2 in a molten state, and a metal layer containing the above-described metal material may be disposed on the surfaces of the electrodes 4 and 5.
  • a metal layer containing the above-described metal material may be disposed on the surfaces of the electrodes 4 and 5.
  • at least the surface of the electrodes 4 and 5 is made of a metal material selected from the group consisting of Cu, Ag, Ag—Pt, Ag—Pd, Au, Ni, and Mo.
  • a metal layer containing at least one or more metal materials may be provided.
  • the electrodes 6 and 7 for the heating element 3 consider the wettability with the fused part 2 in the molten state. Although it is not necessary to consider it, it is usually formed in a lump with the electrodes 4 and 5 for the fuse portion 2, so that it is formed of the same material as the electrodes 4 and 5 for the fuse portion 2.
  • a metal wire such as a flat wire or a round wire is used, and these wires are attached to the electrodes 4, 5, 6, and 7 by soldering or welding. Is electrically connected to When adopting such a form with leads, by making the positions of the leads symmetrical, it is possible to work without being aware of the mounting surface during the mounting work.
  • an inner sealing portion 12 made of flux or the like is provided on the fuse portion 2, to prevent surface oxidation.
  • the flux any known flux such as a rosin-based flux can be used, and the viscosity and the like are also arbitrary.
  • the above-mentioned inner sealing portion 12 is melted together when the fuse portion 2 is melted, and comes into contact with the electrodes 4, 5 and metal patterns 15a, 15b described later.
  • the inner sealing portion 12 is mainly composed of a reducing material such as a flux, a case where a natural oxide film is formed on the surfaces of the electrodes 4, 5 and the metal patterns 15a, 15b
  • the oxide film is reduced by the melt of the inner sealing portion 12 and the metal material having a high affinity for the fuse portion 2 is formed by the electrodes 4, 5 and the metal patterns 15a, 15b. It will be exposed on the surface.
  • the material having a reducing property such as flux is not limited to the case where it is arranged only on the fuse section 2, and the present invention also applies to the case where it is arranged on the surfaces of the electrodes 4 and 5 and the metal patterns 15 a and 15 b. Is included.
  • a metal material having high corrosion resistance such as gold is disposed on the surfaces of the electrodes 4 and 5 and the metal patterns 15a and 15b, and naturally oxidized on the surfaces of the electrodes 4 and 5 and the metal patterns 15a and 15b. If there is no possibility that a film is formed, the inner sealing portion 12 may not be provided on the fuse portion 2 nor on the electrodes 4 and 5 or the metal patterns 15a and 15b.
  • an insulating cover plate 13 is provided so as to cover the fuse portion 2 and the heating element 3.
  • the insulating cover plate 13 is fixed at a predetermined distance to the base substrate 1 by arranging the resin 14 around it, and the space between the insulating cover plate 13 and the base substrate 1 is maintained.
  • the fuse portion 2 and the heating element 3 are housed in the housing.
  • the material of the insulation cover plate 13 may be any material as long as it is an insulating material having heat resistance and mechanical strength enough to withstand the fusing of the fuse portion 2, for example, glass, ceramic, and the like.
  • Various materials can be applied, such as a board material used for a printed wiring board such as a plastic, a glass, and an epoxy board.
  • the insulating cover plate 13 may be formed by using a metal plate and forming an insulating material layer such as a resin or a resist on the surface facing the base substrate 1 to insulate the material.
  • a material having high mechanical strength such as a ceramic plate is used, the thickness of the insulating cover plate 13 itself can be reduced, which greatly contributes to a reduction in the thickness of the entire protection element.
  • the insulating cover plate 13 is made of a material having excellent thermal conductivity, such as a ceramic plate, and is brought into contact with the base substrate 1 via a flux. A fuse with good responsiveness to heat from outside can be obtained.
  • the size of the insulating cover plate 13 is preferably equal to the size of the base substrate 1, but is not limited to this, and even if either one is smaller, Or, even if it is large, the same effect can be obtained.
  • the insulating cover plate 13 may be a mere flat plate or a so-called cap having a rising wall around the periphery.
  • the periphery must be resin-sealed so that the interior becomes hollow and the fused fuse 2 spreads between the metal patterns 15a and 15b and the electrodes 4 and 5.
  • the insulating cover plate 13 may be simply bonded to the base substrate 1.
  • metal patterns 15a, 15b (first and second metal) exhibiting good wettability to the molten fuse portion 2 are provided. Is formed, and this is the most special matter of the protection element of the present invention.
  • the metal patterns 15a and 15b will be described in detail.
  • each of the electrodes 4 and 5 is formed at substantially the same position and substantially the same size.
  • a first metal pattern 15a is arranged on the first electrode 4, and a second metal pattern 15b separated from the first metal pattern 15a is arranged on the second electrode 5.
  • a first metal pattern 15a is arranged on the first electrode 4
  • a second metal pattern 15b separated from the first metal pattern 15a is arranged on the second electrode 5.
  • the material of the metal patterns 15a and 15b is not necessarily limited to metal as long as it has a good wettability with respect to the fused portion 2 that is more molten than the insulating cover plate 13. Otherwise, it is difficult to obtain sufficient wettability, so it is effective to use a metal material.
  • a metal material having good wettability with respect to the fused fuse portion 2 may be selected and used from this viewpoint.
  • At least one metal material selected from the group consisting of copper (Cu), Ag, Ag—Pt, Ag—Pd, Au, Ni, and Mo It is preferable to form the metal patterns 15a and 15b by the following.
  • a metal layer containing the above-described metal material can be disposed on the surface of the metal pattern made of the material having a molten fuse portion 2 and poor wettability.
  • at least the surface of the metal patterns 15a, 15b is selected from the group consisting of Cu, Ag, Ag-Pt, Ag-Pd, Au, Ni, and Mo. It is sufficient that a metal layer containing at least one kind of metal material among the metal materials to be formed is disposed.
  • each of the metal patterns 15a and 15b may be made of the same material, or each of the metal patterns 15a , 15b may be made of different materials.
  • the metal patterns 15a and 15b As a method of forming the metal patterns 15a and 15b, for example, when the insulating cover plate 13 is made of a ceramic plate, the conductive pattern containing the metal material is printed and baked. Can be.
  • the insulating cover plate 13 is made of a material having poor heat resistance such as plastic, for example, a metal film is formed on the insulating cover plate 13 by a method such as vapor deposition and sputtering, and this is patterned by etching. It can be formed by winging.
  • the insulating cover plate 13 When a board material used for a printed wiring board such as a glass epoxy board is used for the insulating cover plate 13, for example, a copper-clad board to which a copper foil is pasted is used, and this is subjected to etching by etching or the like. By doing so, it can be formed. Further, when a metal plate having an insulating material layer such as a resin or a resist formed on the surface facing the base substrate 1 is used as the insulating cover plate 13, the insulating material layer is selectively removed (for example, a resist layer). The exposed metal plate can be used as the metal patterns 15a and 15b.
  • the base plates of the insulating cover plate 13 correspond to the electrodes 4 and 5 for the fuse unit 2 on the base substrate 1 into which the molten low melting point metal flows when the fuse unit 2 is melted.
  • metal patterns 15a and 15b having a property that the molten low melting point metal is easily wetted on the surface opposite to 1, a sufficient melting low melting point metal wet area inside the element while the protection element is made a thin element. And stable operation characteristics can be obtained even at a high rated current (the cross-sectional area of the fuse section 2 is large).
  • FIG. 4 shows the difference in the state of the molten low melting point metal flowing into the electrodes 4 and 5 depending on the presence or absence of the metal patterns 15a and 15b.
  • the fused fuse If the amount of the part 2 is large or the gap between the base substrate 1 and the insulating cover plate 13 is narrow and the top of the fused part 2 is pressed down with the insulating cover plate 13, the fused fuse on the electrodes 4 and 5 2 protrudes laterally, and there is a possibility that the fuse portion 2 on the electrode 4 and the fuse portion 2 on the electrode 5 come into contact with each other. If the fuses 2 on the electrodes 4 and 5 come into contact, the fuses 2 become electrically conductive, and the fuse 2 is not blown.
  • the metal patterns 15a and 15b are formed on the insulating cover plate 13
  • the area of the surface that shows wettability to the molten fuse portion 2 is substantially increased. Will be done.
  • the process of fusing the fuse portion 2 when the metal patterns 15a and 15b are formed will be specifically described.
  • the fuse portion 2 is melted by the heat generated by the heating element 3, the melted fuse portion 2 is attracted to the electrodes 4 and 5 having good wettability, and the portion of the fuse portion 2 located between the electrodes 4 and 5 is Move over electrodes 4,5. Therefore, the fuse portion 2 on the electrodes 4 and 5 increases in volume by the amount moved from between the electrodes 4 and 5 and rises, so that the height of the fuse portion 2 on the electrodes 4 and 5 is higher than before melting. Get higher.
  • the distance t between the base substrate 1 and the insulating cover plate 13 is determined when the molten fuse portion 2 rises on the electrodes 4 and 5 when the fuse portion 2 and each metal pattern 15 a, 1 5b, so that the fuse portion 2 contacts the metal patterns 15a and 15b, and the fused fuse portion 2 contacts the electrodes 4,5 and the electrodes 4,5. 5 Touch both the metal patterns 15a and 15b located above.
  • the fuse portion 2 between the electrodes 4 and 5 has the electrodes 4 and 5 and the electrodes 4 and 5.
  • the metal part 15a, 15b located on the upper part 4, 5 is further drawn and lost, and the fuse part 2 is divided into two parts. As described above, the electrodes 4 and 5 are separated from each other, and the metal plates 15a and 15b are also separated from each other. When the closed portion 2 is divided, the electrodes 4 and 5 are electrically insulated from each other.
  • FIG. 4b shows a state where the fuse portion 2 is drawn between the electrode 4 (or the electrode 5) and the metal pattern 15a (or the metal pattern 15b) on the electrode 4. At this time, a state similar to a so-called capillary phenomenon occurs, and the fused fuse portion 2 is maintained in a state of forming a meniscus, and the electrode 4, 5 and the metal pattern 15 on the electrode 4, 5 are interposed.
  • the side surface of the fused portion 2 which does not bulge out from the side is indented as shown in FIG. 4b, and the protrusion in the lateral direction is suppressed. Therefore, the contact due to the protrusion of the melted fuse portion 2 is eliminated, and the fuse portion 2 is reliably blown.
  • the metal patterns 15a and 15b are formed at positions facing the electrodes 4 and 5 and have the same size as the opposing electrodes 4 and 5, but are not limited thereto. However, the metal patterns 15a and 15b are formed at the center of the effective area of the electrodes 4 and 5 'on the base substrate 1 side where the electrodes 4 and 5' are wet with the fused fuse portion 2 (the remaining portion of the fused portion 2 after melting). Is preferably formed to include the apex of
  • the distance wl between the metal patterns 15a and 15b closer to the distance w2 between the electrodes 4 and 5 on the base substrate 1, it is possible to improve the breaking characteristics when the fuse 2 is melted. is there. However, it is necessary to secure a minimum distance (for example, 0.2 mm or more) that can guarantee complete fusing as the distance wl.
  • the distance t between the insulating cover plate 13 and the base substrate 1 is not particularly limited as long as a sufficient wet area can be secured.
  • the insulating cover 13 and the base substrate 1 are bonded together. At this time, one or both of the insulating par plate 13 and the base substrate 1 may be bent by the pressing, and both the insulating cover plate 13 and the base substrate 1 may contact the fuse portion 2.
  • the insulating cover plate 13 and the base substrate 1 contact the fuse part 2,
  • the distance t between the insulating cover plate 13 and the base substrate 1 is one time the thickness of the fuse portion 2.
  • the insulating cover plate 13 may come into contact with the surface of the internal sealing portion 12.
  • the metal patterns 15 a and 15 b are formed on the inner side of the fuse portion 2. It may come into contact with the sealing portion 12.
  • the patterns 15a and 15b may directly contact the fuse 2.
  • the fuses 2 have the electrodes 4 and 5 and the metal patterns 15 on the electrodes 4 and 5 have the same thickness.
  • the distance t is the value obtained by adding the thickness of the electrodes 4 and 5 to the thickness of the fuse section 2 plus the thickness of the metal patterns 15a and 15b.
  • the electrodes 4, 5 If a sufficient gap is left between the metal patterns 15a and 15b on the electrodes 4 and 5, the molten fuse portion 2 is drawn into the gap, so that the fuse portion 2 is blown. can do.
  • the distance t is not particularly limited, but it is preferable that the distance t is 1.2 times or more and 4 times or less the thickness of the fuse portion 2. If the distance t is less than 1.2 times the thickness of the fuse 2, it is difficult to guarantee rapid melting of the fuse 2 due to melt flow. Conversely, if the distance t exceeds four times the thickness of the fuse portion 2, the distance may be too large and the metal patterns 15a and 15b may not be wet, which is the original purpose. It is difficult to realize a thinner.
  • the metal patterns 15 a and 15 b may be in a state of being in contact with the leads 8 and 9 connected to the electrodes 4 and 5 facing each other.
  • the insulating cover plate 13 and the base substrate 1 may be separated from one or both of them.
  • a gold electrode is used in order to secure a sufficient volume for drawing in the molten fuse 2 in the gap between the electrodes 4 and 5 and the metal patterns 15 a and 15 b on the electrodes 4 and 5, a gold electrode is used. 4, 5
  • the metal patterns 15 on the electrodes 4, 5 may be separated.
  • the effective wetting area for the fused fuse portion 2 is expanded by maximizing the use of the space on the insulating cover plate 13 side. Even if the height is increased (the cross-sectional area of the fuse portion 2 is increased), the melt flow area can be secured by that amount, and stable fusing can be guaranteed.
  • second embodiment of the protection element to which the present invention is applied will be described. Note that the protection element of the present embodiment is an example of a protection element in which the heating element and the fuse portion are not arranged in a plane, but are arranged in an overlapping state.
  • the protection element of this embodiment is provided with fuse portion electrodes 22a, 22b, 22c on a base substrate 21.
  • a fuse 23 (23a, 23b) is provided so as to be bridged between 22a, 22b, and 22c.
  • a heating element 25 is provided on the lower surface side of the center electrode 22 c via an insulating layer 24. The heating element 25 is energized and heated between the wirings 26x, 26y derived from the heating element electrode 26a and the heating element electrode 26b.
  • the heating element electrode 26 b is electrically connected to the fuse section electrode 22 c.
  • FIG. 6 shows a circuit diagram of the protection element configured as described above.
  • a chargeable / dischargeable charger is connected between A l and A 2, and a power supply for charging the charger or an electric device supplied with electricity from the charger is connected between B l and B 2.
  • a power supply is connected between Bl and B2 and an overvoltage is applied between Bl and B2
  • the Zener diode D conducts and the current ib flowing through the resistor R through the transistor becomes Then, the transistor is turned on, and the current ic flows through the heating elements 25a and 25b.
  • the heating elements 25a and 25b generate heat by the current ic, and as described above, the fuse portion 23a between the electrodes 22a and 22c and the fuse portion 23b between the electrodes 22b and 22c are blown, respectively.
  • the charger connected between Al and A2 is not charged by overvoltage.
  • an insulating cover plate 27 is provided, so that the overall protection device can be made thinner and the insulating cover plate 27 can be formed.
  • the surface facing the base substrate 21 has a good resistance to the fused portion 23 corresponding to each fuse portion electrode 22a, 22b, 22c.
  • Metal patterns 28a, 28b, 28c exhibiting wettability are formed.
  • the metal parts 28a, 28b, 28c are formed in three places corresponding to the fuse part electrodes 22a, 22b, 22c.
  • the present invention is not limited to this.
  • only the metal pattern 28c may be formed so as to correspond to only the central fuse portion electrode 22c.
  • the heating element 25 is formed directly below the fuse electrode 22c at the center, and when the heating element 25 generates heat, the heating element 25 is formed on the fuse electrode 22c. Melting starts from the fuse portion 23 of the portion. Therefore, if the fused portion 23 that is melted by the action of the metal pattern 28c is drawn in this portion, the fuse is quickly blown, and the power supply to the protected device is cut off.
  • the fused fuse portion 23 is formed by forming the metal patterns 28a, 28b, and 28c.
  • the effective wet area of the fuse 23 can be increased, and stable melting of the fuse 23 can be guaranteed.
  • This example is an example in which a protection element is manufactured according to the configuration of the first embodiment. That is, a ceramic substrate having a size of 6111111 and 6111111 and a thickness of 0.5 mm was used as a base substrate, and electrodes were formed thereon. As each electrode, an Ag—Pd electrode was formed by printing.
  • a heating resistor of a ruthenium oxide type was printed between a pair of electrodes and baked to form a heating resistor.
  • the electric resistance of the formed heating resistor was 4 ⁇ .
  • a low melting point metal (width lmm, thickness 3mm) was connected by welding between the other pair of electrodes, and sealed with a rosin-based flux.
  • each electrode has? ⁇ 1 plating (: 11 lead wire (width lmm, thickness 0.5mm)) was connected by soldering.
  • a metal pattern of the same size was formed on the insulating cover plate facing the electrode to which the low melting point metal was connected.
  • the metal pattern was formed by printing and baking an Ag-Pd paste in the same manner as the electrodes.
  • the basic configuration of the protection element is the same as in the previous embodiment. However, the difference from the embodiment is that no metal pattern is formed on the insulating cover plate.
  • the metal pattern is formed on the insulating cover plate, a sufficient wet area is ensured for the molten fuse portion (low-melting metal body). Therefore, it is possible to suppress the occurrence of fusing defects in the fuse portion. Therefore, it is possible to reliably shut off the current in the event of an abnormality, and to provide a protection element having stable operation characteristics.

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  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)

Abstract

L'invention concerne un élément de protection destiné à interrompre un courant, par fusion d'un corps métallique à bas point de fusion (2), disposé entre chacun des ensembles d'électrodes (4, 5) formés sur un substrat de base (1). Une plaque de recouvrement isolante (13) est disposée à l'opposé du substrat de base (1), et des modèles métalliques (15a, 15b) sont formés sur la plaque de recouvrement isolante (13) opposée à au moins une électrode. Du fait que les modèles métalliques (15a, 15b) sont formés sur la plaque de recouvrement isolante (13), l'aire présentant une mouillabilité au corps métallique venant à fondre (2) est sensiblement agrandie, et le corps métallique fondu (2) est aspiré rapidement par l'électrode (4, 5) et les modèles métalliques (15a, 15b) dans les intervalles ménagés entre eux.
PCT/JP2004/001129 2003-02-05 2004-02-04 Element de protection WO2004070758A1 (fr)

Applications Claiming Priority (2)

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JP2003028523A JP2004265617A (ja) 2003-02-05 2003-02-05 保護素子
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JP5072796B2 (ja) 2008-05-23 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 保護素子及び二次電池装置
JP5130232B2 (ja) * 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
JP5301298B2 (ja) * 2009-01-21 2013-09-25 デクセリアルズ株式会社 保護素子
JP5130233B2 (ja) 2009-01-21 2013-01-30 デクセリアルズ株式会社 保護素子
US9129769B2 (en) 2009-09-04 2015-09-08 Cyntec Co., Ltd. Protective device
JP5351860B2 (ja) 2009-09-04 2013-11-27 乾坤科技股▲ふん▼有限公司 保護装置
US9025295B2 (en) 2009-09-04 2015-05-05 Cyntec Co., Ltd. Protective device and protective module
JP5618699B2 (ja) * 2010-01-28 2014-11-05 京セラ株式会社 ヒューズ装置、ヒューズ装置用部品および電子装置
JP5987485B2 (ja) * 2012-06-12 2016-09-07 株式会社村田製作所 ヒューズ
JP5994409B2 (ja) * 2012-06-12 2016-09-21 株式会社村田製作所 保護素子
JP6081096B2 (ja) * 2012-08-01 2017-02-15 デクセリアルズ株式会社 保護素子及びバッテリパック
JPWO2014034287A1 (ja) * 2012-08-29 2016-08-08 株式会社村田製作所 ヒューズ
JP5807969B2 (ja) * 2012-11-07 2015-11-10 エヌイーシー ショット コンポーネンツ株式会社 保護素子用フラックス組成物およびそれを利用した回路保護素子
JP6030431B2 (ja) * 2012-12-14 2016-11-24 デクセリアルズ株式会社 保護素子
JP6078332B2 (ja) * 2012-12-25 2017-02-08 デクセリアルズ株式会社 保護素子、バッテリモジュール
JP6254777B2 (ja) * 2013-02-05 2017-12-27 デクセリアルズ株式会社 短絡素子、およびこれを用いた回路
WO2015107631A1 (fr) 2014-01-15 2015-07-23 デクセリアルズ株式会社 Élément protecteur
TWI680482B (zh) * 2014-01-15 2019-12-21 日商迪睿合股份有限公司 保護元件
TWI588857B (zh) * 2014-02-10 2017-06-21 陳莎莉 複合式保護元件與保護電路
JP6622960B2 (ja) * 2014-12-18 2019-12-18 デクセリアルズ株式会社 スイッチ素子
US10181715B2 (en) 2016-10-05 2019-01-15 Polytronics Technology Corp. Protection device and circuit protection apparatus containing the same
JP6886810B2 (ja) * 2016-12-12 2021-06-16 デクセリアルズ株式会社 保護素子
TWI627652B (zh) * 2017-05-05 2018-06-21 聚鼎科技股份有限公司 保護元件及其電路保護裝置
JP2024049240A (ja) * 2022-09-28 2024-04-09 デクセリアルズ株式会社 保護素子及び保護素子の製造方法

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JPH03219520A (ja) * 1989-11-27 1991-09-26 Tasuku Okazaki 回路を瞬時に開放する温度ヒューズ
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JP2004265617A (ja) 2004-09-24
TWI238429B (en) 2005-08-21
TW200423174A (en) 2004-11-01

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