WO2004069479A1 - Outil a fil utilise avec un dispositif de decoupe a fil helicoidal, procede de fabrication dudit outil, et procede de decoupe au moyen du fil helicoidal - Google Patents
Outil a fil utilise avec un dispositif de decoupe a fil helicoidal, procede de fabrication dudit outil, et procede de decoupe au moyen du fil helicoidal Download PDFInfo
- Publication number
- WO2004069479A1 WO2004069479A1 PCT/JP2003/001103 JP0301103W WO2004069479A1 WO 2004069479 A1 WO2004069479 A1 WO 2004069479A1 JP 0301103 W JP0301103 W JP 0301103W WO 2004069479 A1 WO2004069479 A1 WO 2004069479A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wire
- wire saw
- tool
- cutting device
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
L'invention concerne un outil à fil utilisé avec un dispositif de découpe à fil hélicoïdal permettant de couper en tranche une pièce de travail, telle qu'un lingot de cristal unique semi-conducteur, un procédé de fabrication dudit outil à fil, et un procédé de découpe au moyen d'un fil hélicoïdal. Cet outil à fil (1) est utilisé avec le dispositif de découpe à fil hélicoïdal de manière à trancher la pièce de travail, telle que le lingot de cristal unique semi-conducteur. Selon l'invention, un élément à fibres contenant des graines abrasives (3) possédant des graines abrasives (Q) qui adhèrent uniformément sur sa surface est enroulé en spiral sur la surface périphérique d'une âme de fil (2). Ledit élément à fibres contenant des graines abrasives (3) est fixé sur l'âme du fil (2) à l'état thermoplastique par le biais d'un élément de fixation de fibres (4) de résine thermodurcissable capable de durcir et les graines abrasives (Q) utilisées sont le diamant, le carbure de silicium, le nitrure de silicium, l'aluminium, la silice, la céramique ou CBN.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/001103 WO2004069479A1 (fr) | 2003-02-04 | 2003-02-04 | Outil a fil utilise avec un dispositif de decoupe a fil helicoidal, procede de fabrication dudit outil, et procede de decoupe au moyen du fil helicoidal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/001103 WO2004069479A1 (fr) | 2003-02-04 | 2003-02-04 | Outil a fil utilise avec un dispositif de decoupe a fil helicoidal, procede de fabrication dudit outil, et procede de decoupe au moyen du fil helicoidal |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004069479A1 true WO2004069479A1 (fr) | 2004-08-19 |
Family
ID=32843955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/001103 WO2004069479A1 (fr) | 2003-02-04 | 2003-02-04 | Outil a fil utilise avec un dispositif de decoupe a fil helicoidal, procede de fabrication dudit outil, et procede de decoupe au moyen du fil helicoidal |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2004069479A1 (fr) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104084443A (zh) * | 2014-01-19 | 2014-10-08 | 凡登(常州)新型金属材料技术有限公司 | 一种用于多线切割的异构金属丝及其制造装置与制备方法 |
US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000271872A (ja) * | 1999-03-23 | 2000-10-03 | Osaka Diamond Ind Co Ltd | 超砥粒レジンボンドワイヤソー |
JP2000288902A (ja) * | 1999-04-07 | 2000-10-17 | Tokyo Seimitsu Co Ltd | 固定砥粒付ワイヤ及び固定砥粒ワイヤソー |
JP2002166348A (ja) * | 2000-11-30 | 2002-06-11 | Mitsubishi Materials Corp | グラインディングロープを用いた加工装置及び加工法 |
JP2002200506A (ja) * | 2000-12-27 | 2002-07-16 | Kyocera Corp | 内径加工用ワイヤとその製造方法及びこれを用いたセラミックスの加工方法 |
JP2002273663A (ja) * | 2001-03-14 | 2002-09-25 | Noritake Super Abrasive:Kk | レジンボンドワイヤソー |
JP2003080466A (ja) * | 2001-09-10 | 2003-03-18 | Akimichi Koide | ワイヤソー切断装置に用いるワイヤー工具とワイヤー工具の作製方法、および、ワイヤソーによる切断方法 |
-
2003
- 2003-02-04 WO PCT/JP2003/001103 patent/WO2004069479A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000271872A (ja) * | 1999-03-23 | 2000-10-03 | Osaka Diamond Ind Co Ltd | 超砥粒レジンボンドワイヤソー |
JP2000288902A (ja) * | 1999-04-07 | 2000-10-17 | Tokyo Seimitsu Co Ltd | 固定砥粒付ワイヤ及び固定砥粒ワイヤソー |
JP2002166348A (ja) * | 2000-11-30 | 2002-06-11 | Mitsubishi Materials Corp | グラインディングロープを用いた加工装置及び加工法 |
JP2002200506A (ja) * | 2000-12-27 | 2002-07-16 | Kyocera Corp | 内径加工用ワイヤとその製造方法及びこれを用いたセラミックスの加工方法 |
JP2002273663A (ja) * | 2001-03-14 | 2002-09-25 | Noritake Super Abrasive:Kk | レジンボンドワイヤソー |
JP2003080466A (ja) * | 2001-09-10 | 2003-03-18 | Akimichi Koide | ワイヤソー切断装置に用いるワイヤー工具とワイヤー工具の作製方法、および、ワイヤソーによる切断方法 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9862041B2 (en) | 2009-08-14 | 2018-01-09 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9248583B2 (en) | 2010-12-30 | 2016-02-02 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
US10596681B2 (en) | 2012-06-29 | 2020-03-24 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9687962B2 (en) | 2012-06-29 | 2017-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
WO2015106609A1 (fr) * | 2014-01-19 | 2015-07-23 | 凡登(常州)新型金属材料技术有限公司 | Fil métallique hétérogène destiné à être utilisé lors de la découpe multifilaire, procédé de fabrication de celui-ci, et procédé de préparation associé |
CN104084443A (zh) * | 2014-01-19 | 2014-10-08 | 凡登(常州)新型金属材料技术有限公司 | 一种用于多线切割的异构金属丝及其制造装置与制备方法 |
US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10137514B2 (en) | 2015-06-29 | 2018-11-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10583506B2 (en) | 2015-06-29 | 2020-03-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004069479A1 (fr) | Outil a fil utilise avec un dispositif de decoupe a fil helicoidal, procede de fabrication dudit outil, et procede de decoupe au moyen du fil helicoidal | |
CA2673523A1 (fr) | Procede de meulage d'un substrat de saphir | |
JP2009512566A5 (fr) | ||
DE69910075D1 (de) | Superabschleifendes schleifwerkzeug mit einer aktivbindung | |
ES2115797T3 (es) | Herramienta abrasiva. | |
DK1066134T5 (da) | Slibeværktøjer | |
WO2012164757A1 (fr) | Dispositif permettant d'usiner un élément de forme cylindrique | |
Lambropoulos | From abrasive size to subsurface damage in grinding | |
US20140242893A1 (en) | Abrasive Device | |
KR20150073214A (ko) | 연마물의 제조 방법 | |
CN204658222U (zh) | 一种碳纤维基体芯线树脂金刚石线锯 | |
US7014536B2 (en) | Wafer polishing method | |
US8191545B2 (en) | Electroformed thin-wall core drills impregnated with abrasives | |
JP2006088243A (ja) | 砥粒及び砥石 | |
JP5357672B2 (ja) | 研削方法 | |
EP2030733A3 (fr) | Procédé de fabrication de plaquettes de silicium | |
KR100819850B1 (ko) | 다이아몬드 공구 | |
JPS6311273A (ja) | ラツピング加工方法 | |
JP4386814B2 (ja) | レジンボンドワイヤソー | |
DE602004027757D1 (de) | Metallüberzogene würfelförmige bornitridschleifkörner und verfahren zu deren herstellung sowie harzverbundener schleifstein | |
JP2003332276A (ja) | 半導体装置の製造法 | |
KR20220088314A (ko) | 연삭 휠 | |
JPH01188267A (ja) | 研削加工物の固定部材 | |
JPH0639829A (ja) | ワイヤーソー | |
JPH02303769A (ja) | 砥石の目立て材 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |