WO2004068389A2 - Method of forming a conductive metal region on a substrate - Google Patents
Method of forming a conductive metal region on a substrate Download PDFInfo
- Publication number
- WO2004068389A2 WO2004068389A2 PCT/GB2004/000358 GB2004000358W WO2004068389A2 WO 2004068389 A2 WO2004068389 A2 WO 2004068389A2 GB 2004000358 W GB2004000358 W GB 2004000358W WO 2004068389 A2 WO2004068389 A2 WO 2004068389A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- solution
- metal
- deposited
- activator
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1678—Heating of the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/373—Metallic materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Abstract
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04705844A EP1590500A2 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
JP2006502211A JP2006516818A (en) | 2003-01-28 | 2004-01-28 | Method for producing a conductive metal region on a substrate |
US10/543,311 US20060134318A1 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
EP04818166A EP1678761A1 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
US10/975,500 US7243421B2 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
PCT/GB2004/004595 WO2005044451A1 (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
JP2006537433A JP2007510301A (en) | 2003-10-29 | 2004-10-29 | Electrical connection of parts |
KR1020067010084A KR20060126481A (en) | 2003-10-29 | 2004-10-29 | Electrical connection of components |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0301933A GB0301933D0 (en) | 2003-01-28 | 2003-01-28 | Method of forming a conductive metal region on a substrate |
GB0301933.8 | 2003-01-28 | ||
GB0325247.5 | 2003-10-29 | ||
GB0325247A GB0325247D0 (en) | 2003-10-29 | 2003-10-29 | Method of forming a conductive metal region on a substrate |
GB0328221A GB0328221D0 (en) | 2003-12-05 | 2003-12-05 | Formation of solid layers on substrates |
GB0328221.7 | 2003-12-05 | ||
US52794803P | 2003-12-08 | 2003-12-08 | |
US60/527,948 | 2003-12-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004068389A2 true WO2004068389A2 (en) | 2004-08-12 |
WO2004068389A3 WO2004068389A3 (en) | 2005-02-10 |
Family
ID=32830946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2004/000358 WO2004068389A2 (en) | 2003-01-28 | 2004-01-28 | Method of forming a conductive metal region on a substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060134318A1 (en) |
EP (1) | EP1590500A2 (en) |
JP (1) | JP2006516818A (en) |
KR (1) | KR20050097956A (en) |
WO (1) | WO2004068389A2 (en) |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005087979A2 (en) * | 2004-03-11 | 2005-09-22 | Frontcoat Technologies Aps | A method and a device for deposition of a metal layer on a non-conducting surface of a substrate |
WO2006049776A2 (en) * | 2004-10-29 | 2006-05-11 | Hewlett-Packard Development Company, L.P. | Ink-jet printing of coupling agents for trace or circuit deposition templating |
WO2006123144A2 (en) * | 2005-05-18 | 2006-11-23 | Conductive Inkjet Technology Limited | Formation of layers on substrates |
WO2007003247A1 (en) * | 2005-06-30 | 2007-01-11 | Bundesdruckerei Gmbh | Security document or valuable document comprising a contactless interface and a bi-stable display |
WO2007020448A2 (en) | 2005-08-18 | 2007-02-22 | Dunwilco (1198) Limited | Process |
WO2007126177A1 (en) * | 2006-05-02 | 2007-11-08 | Korea Research Institute Of Standards And Science | Process for preparing nanogap electrode and nanogap device using the same |
WO2008040936A1 (en) * | 2006-10-04 | 2008-04-10 | Hexcel Composites Limited | Curable resin films |
EP1939324A1 (en) * | 2006-12-29 | 2008-07-02 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Conductive fibrous web and method for making the same |
JP2008524395A (en) * | 2004-12-16 | 2008-07-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Silver-containing inkjet ink |
WO2008120147A1 (en) * | 2007-03-29 | 2008-10-09 | Koninklijke Philips Electronics N.V. | Textile for connection of electronic devices and manufacturing method therefore |
WO2008152574A1 (en) * | 2007-06-15 | 2008-12-18 | Koninklijke Philips Electronics N.V. | Fabric display with diffuser |
EP2047259A1 (en) * | 2006-07-13 | 2009-04-15 | Korea Research Institute of Standards and Science | Biosensor comprising interdigitated electrode sensor units |
WO2010092392A1 (en) | 2009-02-13 | 2010-08-19 | Conductive Inkjet Technology Limited | Diffractive optical elements |
DE102007025351B4 (en) * | 2007-05-31 | 2010-10-21 | Gigaset Communications Gmbh | injection molding |
WO2010142976A1 (en) | 2009-06-08 | 2010-12-16 | Conductive Inkjet Technology Limited | Display device |
US7868832B2 (en) | 2004-06-10 | 2011-01-11 | Galtronics Corporation Ltd. | Three dimensional antennas formed using wet conductive materials and methods for production |
EP2273591A3 (en) * | 2005-03-30 | 2011-03-30 | Umicore Ag & Co. Kg | Ink for producing catalyst layers |
US8016909B2 (en) | 2005-08-12 | 2011-09-13 | Dunwilco (1198) Limited | Process for producing metal flakes |
US8138614B2 (en) | 2006-02-08 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an antenna with anisotropic conductive adhesive |
US8231811B2 (en) * | 2006-07-22 | 2012-07-31 | Conductive Inkjet Technology Limited | Formation of conductive metal regions on substrates |
EP2489436A2 (en) | 2011-02-21 | 2012-08-22 | Sony DADC Austria AG | Microfluidic devices and methods of manufacture thereof |
WO2013136039A1 (en) | 2012-03-16 | 2013-09-19 | Cambridge Display Technology Limited | Optoelectronic device |
FR3002183A1 (en) * | 2013-02-19 | 2014-08-22 | Innovia Security Pty Ltd | SAFETY DEVICES COMPRISING HIGHLY REFLECTIVE AREAS AND METHODS OF MANUFACTURE |
US20160010273A1 (en) * | 2013-02-25 | 2016-01-14 | The Secretary Of State For Business, Innovation & Skills | Conductive Fibres |
US9823221B2 (en) | 2012-02-17 | 2017-11-21 | STRATEC CONSUMABLES GmbH | Microstructured polymer devices |
Families Citing this family (25)
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KR100831143B1 (en) * | 2004-06-10 | 2008-05-20 | 스미토모덴키고교가부시키가이샤 | Metal catalyst and method for production thereof |
KR20060035052A (en) * | 2004-10-20 | 2006-04-26 | 삼성전자주식회사 | Method of an electrode, display devices and method of manufacturing the same |
US7476616B2 (en) * | 2004-12-13 | 2009-01-13 | Fsi International, Inc. | Reagent activator for electroless plating |
US7531203B2 (en) * | 2005-01-06 | 2009-05-12 | The Hong Kong Polytechnic University | Method for the production of conductive flexible textile arrays |
JP2006295878A (en) * | 2005-01-25 | 2006-10-26 | Ricoh Co Ltd | Image forming device |
JP5282423B2 (en) * | 2008-03-14 | 2013-09-04 | コニカミノルタ株式会社 | Ink jet ink for forming metal pattern and method for forming metal pattern |
KR100938473B1 (en) * | 2008-04-16 | 2010-01-25 | 한국과학기술원 | Polymer organic Light Emitting Diode and manufacturing method thereof |
TWM341266U (en) * | 2008-04-18 | 2008-09-21 | Darfon Electronics Corp | Keyswitch and keyboard |
US8268536B2 (en) | 2008-08-29 | 2012-09-18 | Korea University Research And Business Foundation | Electrode formation based on photo-induced reduction of metal ions in the presence of metal nanomaterials |
JP4998418B2 (en) * | 2008-09-16 | 2012-08-15 | コニカミノルタホールディングス株式会社 | Film for supplying metal and method for producing printed wiring board using the same |
US8337010B2 (en) | 2010-02-24 | 2012-12-25 | Geller Gary R | Method and apparatus for creating a graphic image on a reflective metal surface |
WO2012002418A1 (en) * | 2010-06-30 | 2012-01-05 | 三井金属鉱業株式会社 | Process for production of copper foil for negative electrode current collector |
CN104487609A (en) * | 2012-04-01 | 2015-04-01 | 盖尔创尼克斯有限公司 | Printing method for printing and plating process |
US9371473B2 (en) * | 2012-06-27 | 2016-06-21 | Henkel IP & Holding GmbH | Accelerators for two step adhesive systems |
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Also Published As
Publication number | Publication date |
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JP2006516818A (en) | 2006-07-06 |
WO2004068389A3 (en) | 2005-02-10 |
US20060134318A1 (en) | 2006-06-22 |
EP1590500A2 (en) | 2005-11-02 |
KR20050097956A (en) | 2005-10-10 |
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