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WO2004053951A1 - Exposure method, exposure apparatus and method for manufacturing device - Google Patents

Exposure method, exposure apparatus and method for manufacturing device

Info

Publication number
WO2004053951A1
WO2004053951A1 PCT/JP2003/015408 JP0315408W WO2004053951A1 WO 2004053951 A1 WO2004053951 A1 WO 2004053951A1 JP 0315408 W JP0315408 W JP 0315408W WO 2004053951 A1 WO2004053951 A1 WO 2004053951A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
substrate
optical
projection
liquid
system
Prior art date
Application number
PCT/JP2003/015408
Other languages
French (fr)
Japanese (ja)
Inventor
Nobutaka Magome
Masahiro Nei
Shigeru Hirukawa
Naoyuki Kobayashi
Soichi Owa
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70425Imaging strategies, e.g. for increasing throughput, printing product fields larger than the image field, compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching, double patterning
    • G03F7/70466Multiple exposures, e.g. combination of fine and coarse exposures, double patterning, multiple exposures for printing a single feature, mix-and-match
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70991Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus, shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate, utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids, vacuum

Abstract

When a substrate (P) is exposed to light through a projection optical system, a liquid (50) is supplied between the projection optical system and the substrate (P). Accordingly, a pattern forming area (AR1) of the substrate (P) is exposed to light through a projection optical system (PL) and the liquid, and an edge area (AR2) of the substrate (P) is exposed to light through a projection optical system (PL2) but not through the liquid. Exposure with a large depth of focus can be realized while preventing the liquid from flowing out of the substrate.
PCT/JP2003/015408 2002-12-10 2003-12-02 Exposure method, exposure apparatus and method for manufacturing device WO2004053951A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002-357959 2002-12-10
JP2002357959 2002-12-10
JP2003169903 2003-06-13
JP2003-169903 2003-06-13

Publications (1)

Publication Number Publication Date
WO2004053951A1 true true WO2004053951A1 (en) 2004-06-24

Family

ID=32510637

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/015408 WO2004053951A1 (en) 2002-12-10 2003-12-02 Exposure method, exposure apparatus and method for manufacturing device

Country Status (1)

Country Link
WO (1) WO2004053951A1 (en)

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