WO2004050944A2 - Verfahren zur herstellung einer multilayerschicht und vorrichtung zur durchführung des verfahrens - Google Patents
Verfahren zur herstellung einer multilayerschicht und vorrichtung zur durchführung des verfahrens Download PDFInfo
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- WO2004050944A2 WO2004050944A2 PCT/EP2003/013649 EP0313649W WO2004050944A2 WO 2004050944 A2 WO2004050944 A2 WO 2004050944A2 EP 0313649 W EP0313649 W EP 0313649W WO 2004050944 A2 WO2004050944 A2 WO 2004050944A2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0094—Reactive sputtering in transition mode
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0073—Reactive sputtering by exposing the substrates to reactive gases intermittently
- C23C14/0078—Reactive sputtering by exposing the substrates to reactive gases intermittently by moving the substrates between spatially separate sputtering and reaction stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
Definitions
- the invention relates to a method for producing thin layers and an apparatus for performing the method.
- the method of sputtering is particularly advantageous for materials with a high melting point, in which a plasma is ignited by the action of an electric field in a vacuum range that is significantly above a typical residual gas pressure for a vapor deposition process, from which ions are exposed to a high electrical cathode potential lying target are accelerated and these ions knock atoms out of the target, which then precipitate on the walls of the vacuum chamber and on a spaced from the target, usually lying on ground or a low bias voltage. It is not necessary to heat the material source, rather the target is cooled during the process. In this case, a residual gas pressure usually results predominantly from an inert gas such as argon, which has no disruptive influences on the layer forming on the substrate. In order to separate compounds such as nitrides, carbides or oxides or the like, appropriate reactive gas gases can also be added to the sputtering gas.
- the substrate is usually arranged outside the plasma zone in order to avoid damage to the freshly growing layer by irradiation from the plasma or backsputter effects.
- the mean free path of the ions must be large enough to reach the target with sufficient kinetic energy, i.e. with as little interference as possible from further shock processes in the residual gas, and on the other hand to allow the atomized atoms to reach the substrate, which reduces the possible residual gas pressure limited above.
- the pressure has to be high enough to be able to ignite a stable plasma at all.
- Magnetic field-assisted cathode sputtering enables an increased electron density to be generated at the target, which results in a high plasma density at the target and therefore in a greatly increased atomization rate.
- Oxides can also be produced by adding reactive components, in particular oxygen, to the inert gas.
- reactive atomization process is known, for example, from WO 01/73151 A1.
- the oxygen partial pressure is regulated by means of a lambda probe when the oxide is sputtered, so that a stoichiometric oxide can form in the growing layer.
- the target also reacts with the reactive gas, so that competing processes, namely ablation on the one hand and oxide formation inhibiting ablation take place on the target surface. This in turn has repercussions on the electrical potentials in the coating chamber, the plasma formation and the like.
- the layers of the atomized material which deposit on the inner surfaces of the vacuum chamber form getter surfaces which, for example, bind oxygen as a reactive component and thus lead to a mutual, difficult to predict dependency of various process parameters.
- the relationship between the coating parameters is very complex. Often there is mutual interference when a single coating parameter is changed.
- a device for applying thin titanium oxide layers by means of reactive cathode sputtering is known from EP 0 795 623 A1.
- the power supply to the cathode is controlled by a signal from a ⁇ probe sensor, which compares the proportion of oxygen in the vacuum chamber with a reference gas.
- the process is particularly suitable for the long-term stable deposition of oxides, which should be produced as homogeneously as possible and with a constant composition.
- a plasma-assisted electron beam vapor deposition is known in which an oxide is vaporized at a very high rate by means of an electron beam evaporator and deposited on a substrate.
- the oxide dissociates on evaporation, so that oxygen is lost and is no longer available for oxide formation in the growing layer.
- a stoichiometric oxide can be deposited by regulating either the partial pressure of the reactive gas or the plasma parameters during the coating.
- EP 0 1516 436 E1 discloses a magnetron sputtering device for the reactive deposition of a material on a substrate with a magnetron sputtering device and a secondary plasma device.
- the sputtering device and the secondary plasma device each form sputtering and activation zones that are atmospherically and physically adjacent. By bringing the Sputtering and activation zone, the plasmas of both zones are mixed into a single continuous plasma.
- a coating device is known with a deposition device and a device for generating a plasma of low ion energy.
- the deposition and plasma devices can be operated selectively, so that a composite layer is formed which has at least several layers.
- the composition of each layer can be selected from at least one of the following substances: a first metal, a second metal, an oxide of the first metal, an oxide of the second metal, mixtures of the first and second metals and oxides of mixtures of the first and second metals ,
- the object of the invention is to provide a method for producing thin layers with which the composition of the layer can be reliably influenced in situ, and to provide an apparatus for carrying out the method.
- the targeted deposition of a substoichiometric layer in the area of a sputtering device allows an increase in the coating rate, since the subsequent plasma action can oxidize thicker layers to the stoichiometric oxide in a shorter time.
- the reactive deposition according to the invention of a layer with a predetermined layer thickness with an optical loss that falls below a predetermined minimum value and subsequent exposure to plasma allows relatively rapid production of layers with low optical losses.
- the sputtering process is less likely to come to a standstill due to disturbances such as flashovers or cathode arcing, while layers of high quality are simultaneously formed.
- the structure and / or stoichiometry of the layers is changed by means of the reaction device.
- the invention provides for an interface with a thickness d
- This method makes it possible to comprehensively control the change in the structure and / or stoichiometry of the layers and preferably to produce multilayer layers with low optical losses or low optical reflection and high transmissions.
- the method according to the invention for producing multi-layers with minimal optical losses is based on the knowledge that the deposited layers should have a complete stoichiometry between a first constituent and a reactive constituent, if possible.
- Sputter process operated in a mode of controlled substoichiometry and in a second step the missing portion of the reactive constituent is made available by the action of the additional plasma source.
- the sequence is
- a sputter coating is carried out using a metallic silicon target, with a
- Reactive gas flow from oxygen is used and to a substoichiometric
- Plasma activation with oxygen as a reactive gas which leads to a completely stoichiometric Si0 2 layer.
- the deposition of such layers is determined by parameters that are material-dependent.
- further measures are taken in the production of layers, in particular multilayer layers with a high refractive index layer and an adjacent low refractive index layer, for example between Nb 2 0 5 and Si0 2 , in order to reduce optical losses.
- These measures are preferably indicated because, due to the extremely high reactivity of silicon, a substoichiometric compound such as SiO-.
- a low-refractive-index layer with a certain thickness which is in a largely or fully stoichiometric state, is preferably applied in, for example, a region of the interface which is directly adjacent to the high-index material.
- this layer can typically have a thickness of 3.6 nm in the case of SiO 2 .
- This area of the interface acts as a barrier for the protection of the highly refractive layer underneath.
- the parameters of the sputtering process can be changed in the direction of the deposition of layers with a higher degree of substoichiometry or a higher value of the deficit DEF of the reactive component. Accordingly, it has an SiO 2 layer produced by the method according to the invention, an internal structure, a first part having a small deficit in oxygen and a second part having a higher value of the deficit.
- thin layers can be deposited with high precision and excellent quality.
- the production of oxidic, carbidic and nitridic layers with high optical quality is possible.
- Fig. 1 shows a schematic diagram of a preferred arrangement of substrate, target and plasma source for the oxidation of a layer.
- FIG. 6 shows an example of the optical transmission of a layer as a function of the wavelength with and without rf plasma source as a parameter of the family of curves.
- FIG. 7 shows an example of the optical transmission of a layer as a function of the wavelength with the substrate speed as a parameter of the family of curves.
- Fig. 9 The structure of a multilayer layer with an interface.
- Fig. 10 The influence of the number of interfaces in a multilayer layer on transmission and reflection.
- Fig. 1 1 The effect of minimizing the optical loss for a multilayer layer according to the inventive method.
- FIG. 13 shows transmission and reflection for a multilayer layer with low optical losses, for example for broadband filters.
- 14 Optical losses for a multilayer layer for different thicknesses of an interface.
- A corresponds to a thickness of 2.7 nm
- B corresponds to a thickness of 3.6 nm.
- 16 shows value profiles of various process parameters in the case of reactive cathode sputtering of silicon.
- layers with low optical losses can be produced by reactive sputtering without breaking the vacuum, which layers contain reaction components such as oxygen, carbon or nitrogen.
- reaction components such as oxygen, carbon or nitrogen.
- An oxide production is described below; however, the method is also suitable for carbides or nitrides or mixtures such as oxynitrides or carbonitrides or the like, it also being possible for two or more reactive gases (reactive gases) to be used simultaneously as the reactive component.
- FIG. 1 shows a schematic sketch of a preferred arrangement for depositing a layer according to an embodiment of the invention.
- An oxide layer 1 is deposited in a vacuum chamber 10 with a residual gas on a substrate 2.
- Vacuum chamber 10 is divided into several areas A, B, C. Preferably everyone has
- Area A, B, C has its own gas supply, not shown, as well as its own
- the vacuum is preferably hydrocarbon-free and is generated using a dry-running pump set. There can also be more than three
- Areas may be provided.
- the areas A, B, C are preferably separated from one another
- Process stations namely sputtering devices or a plasma source, are reached in areas A, B, C.
- the process stations are preferably decoupled in terms of plasma.
- the pressures preferably the partial pressures of gases in the residual gas
- (Sputter gas) of the system can be set essentially independently.
- an inert gas such as argon Ar and a reactive gas is preferred.
- Oxygen 0 2 contained in the residual gas Oxygen 0 2 contained in the residual gas.
- a first cathode sputtering source is provided in area A as sputtering device 3, preferably a magnetron source, particularly preferably a known magnetron source system with two adjacent ones Magnetron arrangements, also known as twin mags.
- the power supply can be a supply unit with DC, DC pulse or medium frequency (MF) or high frequency (HF) or a combined DC-HF supply.
- MF medium frequency
- HF high frequency
- Typical voltage ranges of the sputter cathode are 400V to 800V.
- An MF source with 40 kHz is preferably used.
- a sputtering material of a target is atomized by means of reactive sputtering, a sputtering material-oxygen compound being deposited on the walls of the vacuum chamber 1 and on the substrates 2 at a working point-dependent sputtering rate.
- Preferred sputtering materials are metals and metal alloys such as Al, Nb, Hf, Ta, Ti, Zr, TiNb and semiconductors such as Si.
- a plasma source 5 Arranged in region B is a plasma source 5 which generates a plasma which contains excited ions and radicals of the reactive constituent of the residual gas.
- the reactive particles act on the deposited layer and further oxidize it.
- the plasma source 5 can, for example, be a DC, HF, MF or DC pulse or DC + HF microwave plasma source device, in particular a Hall End plasma source, a hot cathode DC plasma source, a high-frequency plasma source, a medium-frequency or a pulsed one DC plasma source.
- the energy of the plasma source 5 is adjustable, preferably in a range from 10 eV to 200 eV or also 400 eV.
- An ECWR plasma source (electron cyclotron wave resonance) is preferably used, in which the energy of the plasma particles can be adjusted largely independently of the plasma density in the plasma source 5.
- a heating device can be arranged, preferably a radiant heater with quartz radiators.
- infrared emitters can also be provided. This allows the substrates to be heated to several hundred degrees, for example to 250 ° C.
- a region C is provided in which a second cathode sputtering source 7 is arranged diametrically opposite one another, which is preferably designed like the first cathode sputtering source 3.
- further sputtering devices and / or plasma sources are provided in the vacuum chamber.
- An optical measuring device (optical monitor) 8 for optical monitoring is arranged spatially between the areas A and C, by means of which the optical properties of the growing layers can be determined.
- transmission and / or reflection of a layer are preferably measured intermittently on at least one of the substrates in order to determine optical properties of the applied layer.
- the growing optical layer thickness can also be checked in this way.
- a preferably planar transport device 6 moves a substrate 2 at least once in succession past at least one cathode sputtering source 3, 7 and at least one station with a plasma source 5.
- the transport device 6 is preferably a substrate turntable with an adjustable speed of, for example, 1 to 500 rpm.
- the acceleration to high target speeds can take place in a few steps and in each case within the same area A, B, C.
- a drum-shaped device known per se for holding and transporting the substrates can also be used. In this case, the sputtering device and the plasma source are assigned to a peripheral surface area of the drum.
- one or more substrates 2 are attached to the turntable 6.
- one of the substrates shown as a circle in FIG. 1 is identified by a reference symbol.
- the substrate 2 is moved by the turntable 6 under the first sputtering source 3.
- the target is sputtered by cathode sputtering, material knocked out of the target being deposited on the substrate.
- an argon-oxygen mixture is used as the sputtering gas, so that the layer 1 growing on the substrate 2 is an oxide.
- the cathode sputtering process is operated in such a way that a connection layer with a predetermined composition is deposited in a targeted manner in the area A or C while adding a reactive component.
- Layer 1 is formed with at least two constituents, reactive component 0 2 forming one of the constituents and, based on component 0 2 , layer 1 produced substoichiometrically. Based on a stoichiometric connection of the constituents, layer 1 is deposited with a predetermined deficit, for example of at most 90, 80, 70, 60, 50, 40, 30, 20 or less atomic percent of the reactive component 0 2 .
- component 0 2 is then increased in situ in region B by means of a plasma action on layer 1 in layer 1 up to the stoichiometric composition and / or the structure of the layer is modified.
- another reactive gas can also be supplied in region B.
- the partial pressure of the component 0 2 in the region of the sputtering source 3 is regulated to a substantially constant value during the coating of the substrate 2.
- the partial pressure of component 0 2 is advantageously set via its gas flow. It is also possible to set the oxygen partial pressure constant via the electrical power of the cathode sputtering source 3, the rate being able to be kept constant to a particularly high degree over the target service life.
- an intensity of a plasma emission line preferably an emission line for the target material, of the reactive constituent or a combination of both can be regulated to a substantial constant value in the area A of the sputtering source 3 during the coating of the substrate 2. This can be set via the gas flow of the component 0 2 and / or the electrical power of the sputtering source 3.
- the layer properties can also be varied by changing the speed at which the substrate 2 is guided past the plasma source 5 and / or the cathode sputtering source 3.
- a layer can also be produced in several intermediate steps by sub-stoichiometric deposition / oxidation.
- multiple layers can be deposited, in which varying refractive indices along a growing total layer are achieved by varying the layer parameters in individual layers.
- Such multiple layers can be deposited in a controlled manner, for example, by adjusting the coating and / or oxidation time and / or the number of rotations and / or by means of the optical measuring device 8 the coating is controlled on the basis of the optical properties of the growing layer or layer sequence.
- a layer having a predetermined layer thickness and having optical losses less than a predetermined minimum value is deposited on the substrate in region A of the sputtering source 3 with the addition of a predetermined amount.
- the generally wavelength-dependent attenuation of a light wave incident on a layer is referred to as optical loss in a manner known per se.
- the optical losses can be determined from measurements of transmission and reflection. Since the scattered light is related to the roughness of a surface due to diffuse scattering, the optical losses of a layer can also be used to draw conclusions about the surface properties. According to the invention, the optical losses are preferably determined by means of the optical measuring device (optical monitor) 8.
- the optical monitor 8 is particularly preferably designed as a single-wavelength or multi-wavelength spectrometer, in particular as a spectrophotometer or egg lipometer, particularly preferably spectral ellipsometer. After a predetermined layer thickness has been deposited, the optical losses are determined, and layer properties are set as a function of a signal from the optical monitor 8. When using a spectrophotometer, transmission, absorption and reflection in a predetermined spectral range and as a function of the Layer thickness can be determined.
- the process control for producing a layer by reactive sputtering with a subsequent modification of the applied layer is described below.
- Other process controls are also encompassed by the invention.
- a magnetron source system with two adjacent magnetron arrangements with two niobium targets is used as the sputtering device.
- the targets are operated alternately in an MF range, for example at a frequency of 40 kHz.
- Both targets are assigned with Shuttera, with which the sputtering device can be isolated from the substrates.
- the plasma source which is also assigned a shutter, is controlled in a radio frequency range.
- the sputtering device is set to an operating point, the shutters being closed to stabilize the process.
- An inert gas and a reactive component are admitted into the area of the sputtering device. There is also an inlet of an inert gas and a reactive component into the area of the plasma source.
- the substrate carrier for example a planar turntable, is accelerated to a target speed.
- the plasma from the plasma source is ignited.
- the sputtering plasma of the cathode sputtering device which is brought to a predetermined target power.
- a partial pressure control is then activated in the area of the sputtering device.
- a predetermined partial pressure setpoint is preferably stabilized via the cathode power.
- the coating of the substrates is started.
- the shutters are opened. It has been shown that only a slight change in the control parameters set in the operating point is necessary by opening the shutter.
- a desired layer thickness can be controlled via a coating time or a number of rotations.
- An in-situ optical layer thickness measurement by the optical monitor 8 is particularly preferred.
- the reactive deposition of a layer takes place in an operating point of a characteristic curve or a characteristic diagram, which is selected depending on sputtering material and reactive component material in order to minimize an optical loss of the deposited layer or of the layer modified by the action of plasma.
- FIG. 2 shows a characteristic curve of the dependence of a reactive gas flow on a partial pressure of the reactive component in a sputtering process in an example with an aluminum target and with oxygen as a reactive component and constant output of the sputtering device (sputtering output).
- the oxygen flow first rises steeply and drops after an apex S in order to rise again after a minimum at higher partial pressure.
- the oxygen partial pressure is very low, a state arises with a largely metallic target surface, metallic layers being deposited on the substrate.
- Oxide or compound mode in which the target surface is completely covered with reaction products and stoichiometric layers with unfavorable layer properties grow on the substrate.
- the arrow labeled O indicates the transition to the oxide or compound mode.
- the dashed curve in FIG. 2 describes the associated deposition rate. It can be seen that this is at a maximum at a low reactive gas partial pressure and drops as the reactive gas partial pressure increases until it reaches a saturation range parallel to the abscissa.
- the transition to the metallic area only takes place at lower oxygen partial pressures, so that the characteristic curve has a hysteresis.
- the area between the vertex and the minimum of the characteristic curve is generally not accessible without complex control measures, but enables the deposition of substoichiometric layers with a high deposition rate.
- the method according to the invention is preferably carried out in a predetermined region of the characteristic curve with an increasing or decreasing gas flow near the apex S, since relatively high sputtering rates can be achieved here.
- the area near the vertex S of the characteristic is particularly preferred, with a gas flow of the first component 0 2 which, when layer 1 is deposited, is at most 50% below the maximum value at the vertex S, particularly preferably at most 20% to 10% below the maximum value is at the apex S.
- a high deposition rate of a substoichiometric layer can be achieved, which is subsequently exposed to plasma.
- TiNb can be worked according to the invention in the transition area to the right of the apex S, while for other materials such.
- B. AI Si the area to the left of the apex S is preferred.
- FIG. 3 shows a characteristic curve with a constant reactive gas flow, in which a desired value of a reactive gas partial pressure is set with the aid of the sputtering power.
- the substoichiometric range is here to the left of the arrow labeled O. This control method is preferred according to the invention, but not sputtered exclusively in an area around the minimum of the characteristic curve.
- a constant reactive gas flow is used in the characteristic curve shown in FIG. 5, a target value of a quotient of a sputter rate and a reactive gas partial pressure being regulated to a predetermined target value with the aid of the electrical power of the sputtering device.
- the solid curve denotes the characteristic curve for oxygen as a reactive gas
- the dashed curve denotes the characteristic curve for nitrogen as a reactive gas.
- the arrows labeled 01 and 02 indicate the transition from a substoichiometric right of the transition to a stoichiometric regime to the left of the transition, each for oxygen or nitrogen as a reactive gas. It can be seen that the position of this transition depends on the reactive gas used.
- the quotient of sputter rate and reactive gas partial pressure can be determined from a quotient of a material and reactive gas partial pressure plasma line intensity.
- Material here means the material of the sputter cathode; in the present case silicon.
- Typical values for the present device are 40 sccm / min for the argon flow and 30 sccm / min for the oxygen flow in the area of the sputtering device.
- An oxygen partial pressure is preferably determined from the signal of a lambda probe arranged in the area of the sputtering device.
- the typical power of such a dual magnetron cathode station in the method according to the invention is in the range of 4 KW.
- the typical oxygen flow is in a range of 20 sccm / min, while the argon flow is in a range of 2 sccm / min.
- the power in an RF operation is in the range of 1 KW.
- a control unit is provided to regulate the sputtering device 3, 7 and the plasma source 5, as well as the movement of the substrates.
- Control takes place in a parameter space in which characteristic curves or characteristic maps are spanned, as has already been explained in more detail.
- a signal from the optical monitor 8 is used to set the operating parameters for optimizing the optical quality, in particular for minimizing the optical losses of the deposited layer. This is preferably done online. Such a regulation is also provided in layers or in the case of a transition from one layer to the next. It is particularly preferred to use the optical signal to carry out a guiding control to take long-term drifts in the layer properties, such as transmission, reflection, and / or optical losses into account.
- the function of the overall device comprising the sputtering device 3, 7 and the plasma source 5 is optimized with regard to the optical properties of the deposited and modified layer or with regard to the speed of the layer production.
- the control device is used to select corresponding operating points on a characteristic curve with subsequent exposure to plasma and to determine an optimization value.
- Optical monitoring can take place immediately after each sputtering by the sputtering device 3, 7 and / or after exposure to plasma by the plasma source 5 on at least one substrate.
- FIG. 6 shows an example of the optical transmission of a layer produced using the method according to the invention as a function of the wavelength (upper curve Si) in comparison with a layer which, after the substoichiometric deposition, was not exposed to the oxygen plasma from the plasma source 5 (lower curve S 2 ).
- the coating parameters of the two layers are the same except for the oxidation in the area of the plasma source 5.
- the substoichiometric layer shows a very low transmission but very high losses, so that it is unusable as an anti-reflective layer or filter or the like. It can clearly be seen that the oxidation by the action of plasma enables a very effective improvement of the layer properties (upper curve S-,).
- FIG. 7 shows an example of an optical transmission of a layer as a function of the wavelength with the substrate speed as a parameter of the family of curves. At a high speed of 180 or 120 rpm, for example, the optical transmission of the layer is higher (upper curve) than only half the speed of 60 rpm (lower curve).
- 8 shows examples of individual layers of different thicknesses which were produced in accordance with the invention.
- Curves A and B denote Nb 2 0 5 layers with a thickness of 1,000 nm and 500 nm, respectively.
- Curve C denotes a Ta 2 0 5 single layer with a thickness of 1,000 nm.
- Curves D and E denote SiO 2 - Layers with a thickness of 1,000 nm or 500 nm. It can be seen that the optical losses depend on the material used, the layer thickness and the wavelength. Overall, the optical losses are very small and only increase in the area of the absorption edge of the material in question.
- a high-index material such as Nb 2 0 5 , Ta 2 0 5 , Ti0 2 , Zr0 2 , Al 2 0 3 require a deposition in the reactive sputtering with only a small oxygen deficit for a small optical loss, the layers thereafter exposed to reactive plasma from the plasma source.
- the energy of the particles of the reactive plasma of the plasma source 5 is preferably less than 50 eV.
- a low optical loss can also be achieved with a greater oxygen deficit in reactive sputtering and subsequent exposure to the reactive plasma from the plasma source.
- the layers which are initially produced substoichiometrically with a defined lack of oxygen and are then oxidized to the stoichiometric oxide by the action of plasma.
- 0.2 to 0.4 nm is deposited per revolution.
- the deposited layer is preferably X-ray amorphous or nanocrystalline with a smooth surface, but at the same time has a dense structure free of voids, so that water is avoided from the atmosphere, which would otherwise lead to undesirable changes in refractive index.
- the improved surface structure is essentially due to the action of plasma, which can replace a bias voltage applied to the substrate in the prior art.
- a change in the structure and / or stoichiometry of the layers is also provided by means of a reaction device.
- the first layer can also be a substrate.
- in a region of the second layer adjoining the first layer is shown in FIG. 9.
- Any reactive coating device can be used as the coating device, in particular devices that operate on the principle of physical vapor deposition, such as vapor deposition or sputtering techniques.
- DC or AC magnetron sources are particularly preferred.
- a plasma source for example a DC, HF, MF or DC pulse or DC plus HF or microwave plasma device, is preferred as the reaction device.
- Multilayer layers of alternating high and low refractive index layers are preferred.
- the multilayer layers can also consist of alternating high, low and middle refractive layers.
- a layer with a refractive index between 1, 3 and 1, 5 is referred to as low refractive index.
- Middle refractive layers have a refractive index between 1.5 and 1.9.
- high-index materials in this sense are, for example, Nb 2 0 5 , Ta 2 0 5 , Ti0 2 or Zr0 2 .
- Layers made of SiO 2 for example, have a low refractive index.
- 79 interfaces for Nb 2 0 5 / Si0 2 .
- Multilayer layers shown depending on the wavelength. It can be seen from the illustration that the optical losses increase as the number of interfaces or the layers of the multilayer layer increases.
- the deposition of the layers and a change in the structure and / or stoichiometry of the layers is preferably carried out by the method described above, but can also be carried out by other methods.
- is built up in a region of the second layer adjacent to the first layer, preferably by means of the coating device and a value of a deficit of the reactive component DEF less than a value DEF
- is built up, the multilayer layer having an optical loss which is below a predetermined minimum value. It is preferred in the method according to the invention if the thickness d of the interface exceeds a minimum value. The rest of the deposited layer can be reactively deposited with a higher DEF deficit.
- the interface is particularly preferably produced by the action of the reaction device with the most complete stoichiometry possible.
- a low-index layer of SiO 2 is preferably deposited on a high-index layer, for example Nb 2 0 5 , Ta 2 0 5 or the like. Carbon or nitrogen can also be used as the reactive component instead of oxygen. A high refractive index can again be deposited on the low refractive index layer.
- a multilayer layer according to the invention can be produced in various ways. It is particularly simple if values of an instantaneous thickness d (t) of the second layer are determined and as soon as d (t) is greater than a value d
- the values of the instantaneous thickness d (t) of the second layer can be determined during the deposition of the second layer, for example as a function of a monitoring signal from the optical monitor device (8).
- FIG. 11 The effect of minimizing the optical loss for a multilayer layer produced by the method according to the invention is illustrated in FIG. 11.
- Curves A, A ' show greater optical losses than curves B, B'.
- optical losses as a function of the wavelength are plotted for further illustration of the method according to the invention for individual layers made of high or low refractive index material and for multilayer layers with alternately high refractive index and low refractive index layers.
- A denotes the values of a multilayer layer with 77 non-optimized interfaces
- B denotes values of an otherwise identical multilayer layer with 21 non-optimized interfaces are.
- the losses of B are less than of A because the number of interfaces is only 21 versus 77.
- the values of a multilayer layer comparable to A, but with optimized interfaces are denoted by XY.
- Curve XY shows extremely reduced losses compared to curve A for the corresponding multilayer layer.
- Curves C, D, E and F denote high- and low-refractive single layers with a thickness of 1,000 nm and 500 nm, respectively.
- Fig. 13 shows transmission and reflection as a function of the wavelength for an Nb 2 0 5 - / Si0 2 multilayer layer, which is produced by the method according to the invention to achieve the lowest optical losses. If you measure the transmission and reflection of a filter as a function of the wavelength, the filter has points of maximum and minimum transmission. Max. Transmission, the reflection is minimal and vice versa. The easiest way to determine the losses is at these points: subtract from 100% Tmax and Rmin or Tmin and Rmax.
- a multilayer layer according to FIG. 13 is preferably provided for broadband filters.
- the critical value lies in a range between 2.5 and 10.0 nm, preferably 2.6 nm, 2.7 nm ... 3.6 nm, 3.7 nm, 3.8 nm.
- the deficit DEF 2 - x of the reactive component should be chosen to be relatively small, corresponding to a value x of the reactive component of SiOx in the region of the interface of greater than 1, 5, 1, 6 ... to 1, 8.
- relatively thin layers are first produced per rotation of the substrate plate with a relatively low sputtering power and a relatively low oxygen deficit. Reaction is preferred in the transition region to the oxide mode sputtered. After reaching a predefinable layer thickness, for example 3.6 nm, the SiOx layer with a larger oxygen deficit is deposited at a higher power and exposed to the reactive plasma of the plasma source. This is preferably constant.
- the energy of the layer-forming particles is preferably between a few eV up to 200 eV. It is preferred if the particles of the reactive plasma have an energy of less than 50 eV.
- FIG. 16 schematically shows the time profiles for important process parameters in reactive sputtering with oxygen as a reactive component, as used in a preferred embodiment of the process.
- the output of the sputtering device is increased at a time T c . From this point in time T c , the oxygen partial pressure in the area of the sputtering device is reduced.
- a predetermined layer thickness of, for example, approximately 3 nm is preferably reached at time T c .
- the layer sputtered up to this point has a relatively small oxygen deficit.
- the parameter values of variables other than those of the sputtering power or the oxygen partial pressure in the area of the sputtering device can vary over time.
- the deposition of relatively thin SiOx layers with a relatively low oxygen deficit can ensure that both the interface layer and the layer below it, for example made of Nb 2 0 5 , by virtue of the effect of the reactive plasma source following the SiOx deposition exist as a stoichiometric layer.
- it can be achieved by such a procedure that any withdrawal of the reactive component, in particular the oxygen, can be compensated for by the reactive SiOx from the layer below (Nb 2 0 5 ) by the action of the plasma source.
- the SiOx becomes too high deposited, it can still be oxidized to a stoichiometric SiO 2 by the action of reactive plasma, but in some cases becomes so dense that sufficient penetration of the effect of the plasma source to ensure a stoichiometry of the layer below to the layer below the SiOx layer not possible.
- SiOx newly applied to the already deposited layer can no longer extract oxygen from the layer below, so that the further deposition of SiOx can take place with a higher oxygen deficit.
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Abstract
Description
Claims
Priority Applications (5)
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DE50311103T DE50311103D1 (de) | 2002-12-04 | 2003-12-03 | Verfahren zur herstellung einer multilayerschicht und vorrichtung zur durchführung des verfahrens |
JP2004556281A JP5697829B2 (ja) | 2002-12-04 | 2003-12-03 | 多層膜を製造する方法および前記方法を実施するための装置 |
US10/537,224 US8956511B2 (en) | 2002-12-04 | 2003-12-03 | Method for producing a multilayer coating and device for carrying out said method |
EP03812171A EP1592821B1 (de) | 2002-12-04 | 2003-12-03 | Verfahren zur herstellung einer multilayerschicht und vorrichtung zur durchführung des verfahrens |
US14/622,597 US10418231B2 (en) | 2002-12-04 | 2015-02-13 | Method for producing a multilayer coating and device for carrying out said method |
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DE10256877.4 | 2002-12-04 | ||
DE10256877 | 2002-12-04 | ||
DE10347521A DE10347521A1 (de) | 2002-12-04 | 2003-10-13 | Verfahren zur Herstellung Multilayerschicht und Vorrichtung zur Durchführung des Verfahrens |
DE10347521.4 | 2003-10-13 |
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US10/537,224 A-371-Of-International US8956511B2 (en) | 2002-12-04 | 2003-12-03 | Method for producing a multilayer coating and device for carrying out said method |
US14/622,597 Division US10418231B2 (en) | 2002-12-04 | 2015-02-13 | Method for producing a multilayer coating and device for carrying out said method |
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Cited By (7)
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EP1870924A2 (de) * | 2006-06-23 | 2007-12-26 | Qimonda AG | Abscheidungsvorrichtung und verfahren mittels Kathodenzerstäubung |
DE102009015737A1 (de) | 2009-03-31 | 2010-10-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Magnetron-Beschichtungsmodul sowie Magnetron-Beschichtungsverfahren |
DE102009018912A1 (de) | 2009-04-28 | 2010-11-18 | Leybold Optics Gmbh | Verfahren zur Erzeugung eines Plasmastrahls sowie Plasmaquelle |
WO2013045111A1 (de) | 2011-09-28 | 2013-04-04 | Leybold Optics Gmbh | Verfahren und vorrichtung zur erzeugung einer reflektionsmindernden schicht auf einem substrat |
WO2013044402A1 (en) | 2011-09-26 | 2013-04-04 | Evatec Ag | Process of coating a substrate with a thin film of metal or semiconductor compound |
US8698400B2 (en) | 2009-04-28 | 2014-04-15 | Leybold Optics Gmbh | Method for producing a plasma beam and plasma source |
BE1030996B1 (fr) * | 2022-10-28 | 2024-06-04 | Kepler Computing Inc | Méthode itérative de développement d'empilements multicouches pour des applications de dispositifs |
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EP2076916B1 (de) * | 2006-10-26 | 2014-12-10 | IHI Hauzer Techno Coating B.V. | Zweifach-magnetron-sputter-stromversorgung und magnetron-sputtervorrichtung |
EP2549521A1 (de) * | 2011-07-21 | 2013-01-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Herstellung partikelarmer Schichten auf Substraten |
DE102012013577A1 (de) * | 2012-07-10 | 2014-01-16 | Oerlikon Trading Ag, Trübbach | Hochleistungsimpulsbeschichtungsmethode |
EP3289113A1 (de) * | 2015-03-31 | 2018-03-07 | Bühler Alzenau GmbH | Verfahren zur herstellung von beschichteten substraten |
DE102021130675A1 (de) | 2021-11-23 | 2023-05-25 | Optics Balzers Ag | Polarisationsstrahlteiler und Verfahren zu dessen Herstellung |
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EP1870924A3 (de) * | 2006-06-23 | 2008-02-13 | Qimonda AG | Abscheidungsvorrichtung und -verfahren mittels Kathodenzerstäubung |
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DE102009015737A1 (de) | 2009-03-31 | 2010-10-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Magnetron-Beschichtungsmodul sowie Magnetron-Beschichtungsverfahren |
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Also Published As
Publication number | Publication date |
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JP5697829B2 (ja) | 2015-04-08 |
JP2006509102A (ja) | 2006-03-16 |
WO2004050944A3 (de) | 2004-12-09 |
EP1592821A2 (de) | 2005-11-09 |
EP1592821B1 (de) | 2009-01-14 |
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