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WO2004023552A1 - Multichp semiconductor device, test method, and system board - Google Patents

Multichp semiconductor device, test method, and system board

Info

Publication number
WO2004023552A1
WO2004023552A1 PCT/JP2002/009052 JP0209052W WO2004023552A1 WO 2004023552 A1 WO2004023552 A1 WO 2004023552A1 JP 0209052 W JP0209052 W JP 0209052W WO 2004023552 A1 WO2004023552 A1 WO 2004023552A1
Authority
WO
Grant status
Application
Patent type
Prior art keywords
semiconductor
package
chips
case
cross
Prior art date
Application number
PCT/JP2002/009052
Other languages
French (fr)
Japanese (ja)
Inventor
Masayuki Sato
Isao Shimizu
Kenichi Tonomura
Original Assignee
Renesas Technology Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3185Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318513Test of Multi-Chip-Moduls
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31723Hardware for routing the test signal within the device under test to the circuits to be tested, e.g. multiplexer for multiple core testing, accessing internal nodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/48Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382Adaptable interconnections, e.g. for engineering changes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having slectively interconnectable sets of X-conductors and Y-conductors in different planes

Abstract

A multichip semiconductor device comprising a package case (100) capable of holding semiconductor chips, semiconductor chips (200) held by the package case, and an insulating board (110) provided with wirings (112, 113) electrically connected to the semiconductor chips and a cross point switch circuit (114) provided at cross points of the wiring and serving as wiring route switching means capable of interconnecting given wirings and made of a low-dielectric constant material joined to the package case.
PCT/JP2002/009052 2002-09-05 2002-09-05 Multichp semiconductor device, test method, and system board WO2004023552A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/009052 WO2004023552A1 (en) 2002-09-05 2002-09-05 Multichp semiconductor device, test method, and system board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004534074A JPWO2004023552A1 (en) 2002-09-05 2002-09-05 Multi-chip semiconductor device and a test method, and a substrate for the system
PCT/JP2002/009052 WO2004023552A1 (en) 2002-09-05 2002-09-05 Multichp semiconductor device, test method, and system board

Publications (1)

Publication Number Publication Date
WO2004023552A1 true true WO2004023552A1 (en) 2004-03-18

Family

ID=31972307

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009052 WO2004023552A1 (en) 2002-09-05 2002-09-05 Multichp semiconductor device, test method, and system board

Country Status (2)

Country Link
JP (1) JPWO2004023552A1 (en)
WO (1) WO2004023552A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932886B2 (en) 2004-06-04 2015-01-13 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204957A (en) * 1990-08-31 1991-09-06 Toshiba Corp Semiconductor integrated circuit
EP0481703A2 (en) * 1990-10-15 1992-04-22 Aptix Corporation Interconnect structure for use with programming elements and test devices
JPH0513662A (en) * 1991-07-03 1993-01-22 Nippondenso Co Ltd Multichip module
EP0541288A2 (en) * 1991-11-05 1993-05-12 Fu-Chieh Hsu Circuit module redundacy architecture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204957A (en) * 1990-08-31 1991-09-06 Toshiba Corp Semiconductor integrated circuit
EP0481703A2 (en) * 1990-10-15 1992-04-22 Aptix Corporation Interconnect structure for use with programming elements and test devices
JPH0513662A (en) * 1991-07-03 1993-01-22 Nippondenso Co Ltd Multichip module
EP0541288A2 (en) * 1991-11-05 1993-05-12 Fu-Chieh Hsu Circuit module redundacy architecture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932886B2 (en) 2004-06-04 2015-01-13 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same

Also Published As

Publication number Publication date Type
JPWO2004023552A1 (en) 2006-01-05 application

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