Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
  • H01L23/3737—Organic materials with or without a thermoconductive filler
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
  • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• the present invention has excellent handling properties at room temperature, is interposed between a heating element and a heat radiating element, and has high flexibility, so that the heat generating element and the heat radiating element can be efficiently adhered to the heat radiating element.
• a heat dissipating member capable of conducting heat generated from the heat dissipating member to the heat dissipating member and maintaining a close contact even when the temperature rises, and connecting the heat dissipating member and the heat dissipating member by the heat dissipating member.
• the present invention relates to a connection structure comprising: Background art
• a heat-dissipating member such as a heat-dissipating sheet is used to dissipate the heat generated from the heat-generating element by interposing the heat-generating element between the heat-generating element and the heat dissipating element.
• the surface of heat generating elements and heat radiators is not smooth, so that the heat radiating members cannot adhere to the heat generating elements and heat radiating elements. If the contact area between them decreases, the efficiency of heat transfer from the heating element to the heat radiating element decreases, and the heat radiating performance of the heat radiating member cannot be sufficiently exhibited.
• thermal resistance The thermal resistance between the heating element and the heat radiator is called thermal resistance.
• heat-dissipating greases containing heat-conducting particles as heat-dissipating members; heat-dissipating sheets in which heat-conducting particles are dispersed in a flexible and resilient resin such as silicone rubber or acrylate-based resin. was used.
• Japanese Patent Publication No. Hei 6-39591 discloses a silicon grease containing heat conductive particles such as zinc white, alumina and aluminum nitride. . Since such a heat radiation grease is a viscous substance having fluidity, a large contact area can be obtained when it is interposed between a heating element and a heat radiation element, so that excellent heat resistance performance can be exhibited. . However, when applying it to a heating element or a heat radiating element, the workability is low due to contamination of the surrounding area, etc. There are problems such as a high possibility that the thermal resistance performance changes due to variations.
• Hei 6-88061 discloses a heat conductive tape in which thermally conductive particles are randomly dispersed in an acrylate ester-based resin. Since such a heat radiating sheet is a fixed sheet, it can be easily attached to a heating element or a heat radiating element, and can be provided with a certain gap when interposed between the heat generating element and the heat radiating element. Stable heat resistance performance can be exhibited. However, because of the lack of fluidity, it was not possible to obtain the same degree of flexibility as thermal grease, and it was difficult to achieve high thermal resistance.
• Japanese Patent Application Laid-Open No. 2000-50992 discloses an ⁇ -olefin thermoplastic component having a melting temperature of about 50 to 60 ° C with respect to an acryl-based pressure-sensitive adhesive component. And a heat dissipating member mixed with a compound such as a paraffinic wax component having a melting temperature of about 60 to 70 ° C. are disclosed.
• a voltage is applied, the temperature of the heat-generating body rises in these heat-radiating members, and when the temperature reaches the melting temperature of the mixed ⁇ -olefin-based thermoplastic component or paraffin-based mouth component, the member rapidly softens, The flexibility is improved and the heat resistance performance is improved.
• the compound having such a melting temperature is a solid that has no adhesive property at a temperature of around 23 ° C, which is used for sticking to a heating element or a heat radiating element, an acrylic pressure-sensitive adhesive component containing it Adhesiveness is impaired, and sticking workability is reduced. Also, when the temperature of the heating element rises and exceeds the melting temperature, it takes some time for all the compounds to melt, so the temperature of the heating element once rises rapidly. Then, when the compound having a melting temperature is melted and the flexibility of the heat dissipating member is improved, and the heat generating member and the heat dissipating member are in close contact with each other and the heat transfer coefficient is improved, the temperature of the heat generating member rapidly drops.
• an object of the present invention is to have excellent handling properties at room temperature, to be interposed between a heating element and a heat radiator, and to be closely attached to the heating element and the heat radiator by having high flexibility.
• a heat-dissipating member that can efficiently conduct heat generated from the heat-emitting element to the heat-dissipating element and maintain a close contact state even when the temperature rises; and
• An object of the present invention is to provide a connection structure formed by connecting a heat radiator.
• the present invention relates to a heat dissipation member comprising a thermoplastic resin composition, which contains a thermoplastic resin and heat conductive fine particles and does not contain a compound having a melting temperature of 40 to 80 ° C.
• the storage elastic modulus at 0.1 Hz is 50,000 Pa or more, and the shape is maintained, and at 50 to 80 ° C, it is 0.1.
• storage modulus at H z is 4 0 0-50000 P a, and a amorphous, in 1 0 0 ° C, 0. 1 H storage modulus at z is 5 0 0 0 P This is a heat-radiating member that is less than or equal to a and is irregular.
• the thermoplastic resin is preferably a styrene block copolymer and a Z or butyl rubber resin.
• the styrene-based block copolymer, styrene one isoprene diblock percentage of Len 5 0 weight 0/0 or more and a styrene content of 2 5 wt 0/0 follows styrene-I Sopu Ren one styrene proc co More preferably, it is a polymer.
• the thermoplastic resin composition preferably contains a solid aromatic thermoplastic resin as a main component at 23 ° C, and further contains a viscous xylene resin at 23 ° C.
• connection structure formed by connecting a heat generator and a heat radiator by the heat radiator member of the present invention, wherein the heat radiator member can have a thickness smaller than before the heat generation due to the heat generated by the heat generator.
• FIG. 1 is a schematic diagram showing a measuring device used for measuring the thermal resistance of a heat radiation member.
• FIG. 2 is a schematic diagram illustrating a method for evaluating high-temperature fluidity in an example.
• 1 represents a cooler
• 2 represents a heat-dissipating member
• 3 represents a bolt
• 4 represents a thermostatic water bath
• 5 represents an aluminum block.
• the heat-dissipating member of the present invention has a storage elastic modulus at 0.1 Hz of not less than 50,000 Pa at 23 ° C. and has a fixed shape. Therefore, it can be used in the form of a regular sheet at a temperature of around 23 ° C, where the work of sticking to a heating element or a heat radiator is performed. 0 of 2 3 ° C. 1 If H Z when the storage modulus is less than 50,000 P a, difficult to handle too soft, sticking work is hard to do.
• the heat-dissipating member of the present invention has a storage elastic modulus of 400 to 50,000 Pa at 0.1 Hz at 50 to 80 ° C. and is indefinite. Therefore, when the temperature of the heating element rises due to the application of voltage, the heat dissipating member rapidly softens, and when it reaches a temperature of 50 ° C to 80 ° C, its flexibility is improved. The contact area with the surface is improved, and excellent heat resistance performance is exhibited. If the storage elastic modulus at 0.1 Hz at 50 to 80 ° C is less than 400 Pa, the heat radiating member becomes too soft and flows out and separates from the heating element and the heat radiating element. If it exceeds 10,000 Pa, the heat-radiating member has low flexibility and cannot adhere to the heat-generating body or the heat-radiating body, so that sufficient heat resistance cannot be obtained.
• the heat-dissipating member of the present invention has a storage elastic modulus of 0.1000 Pa or less at 500 ° C. at a temperature of 500 Pa or less and is indefinite. If the storage modulus at 0.1 Hz at 100 ° C. exceeds 500 Pa, it is difficult to process the sheet.
• the storage elastic modulus can be measured, for example, using a dynamic viscoelasticity measuring device such as a dynamic analyzer RDAII manufactured by Rheometrics.
• the heat-dissipating member of the present invention does not contain a compound having a melting temperature of 40 to 80 ° C, a phase transition phenomenon does not occur in this temperature range. In the present invention, such a rapid change in storage modulus between 40 ° C. and 60 ° C. without a phase transition phenomenon occurs. As the temperature of the heating element rises, the heat dissipating members gradually come into close contact with each other as the temperature of the heating element rises. There is no time delay between the increase in area and the development of excellent thermal resistance performance, so that the temperature of the heating element does not rise sharply and no temperature load is applied to the heating element.
• thermoplastic resin composition that does not involve a phase transition phenomenon can be softened by heating it slightly at room temperature or slightly above room temperature, or the resin surface can become tacky, so it is handled as a heat dissipation member.
• the heat dissipating member of the present invention is excellent in handleability because it can maintain a fixed shape at low temperatures.
• the heat dissipating member of the present invention when the temperature exceeds 60 ° C., the decrease in storage elasticity becomes gentle, and the storage elasticity becomes too soft to flow away from the heat generating element and the heat dissipating element. It keeps in close contact with the body and can efficiently transmit the heat generated by the heating element to the radiator.
• the heat radiation member of the present invention preferably has an adhesive strength to aluminum at 23 ° C of 0.5 NZ cm 2 or more. Thereby, it has high adhesiveness to the heating element and the heat radiating body, and the sticking workability when attaching the heat radiating member to the heating element and the heat radiating body is improved.
• the heat dissipating member of the present invention is not particularly limited, but is preferably processed into a sheet and used. By forming the sheet, the workability of the application is remarkably improved.
• the heat-dissipating member of the present invention When the heat-dissipating member of the present invention is in the form of a sheet, its thickness is preferably from 20 to 400 m. If it is less than 200 im, the handleability may be reduced, and it may be difficult to sufficiently fill the gap when interposed between the heat generating element and the heat radiating element, and may exceed 400 in. , The thermal resistance performance tends to decrease.
• the heat dissipation member of the present invention is made of a thermoplastic resin composition containing a thermoplastic resin and heat conductive fine particles.
• thermoplastic resin examples include (meth) acrylate copolymers; styrene block copolymers such as styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, and ethylene.
• acrylate-based copolymers, styrene-based block copolymers, and butyl rubber-based resins are preferred because they are relatively easy to design to achieve the above storage modulus.
• the thermoplastic resin does not have a melting point near the operating limit temperature on the high temperature side in a heating element such as an electronic component such as an IC.
• a heating element such as an electronic component such as an IC.
• the glass transition temperature measured using a differential calorimeter may not be near the maximum appropriate operating temperature on the high-temperature side of a heating element such as an electronic component such as an IC.
• the melting of these resins and the latent heat absorption due to the glass transition phenomenon may also cause a time delay before the heating element or the heat radiating element and the heat radiating member come into close contact with each other.
• an acrylate copolymer As the thermoplastic resin, it is preferable to use an acrylate copolymer having a weight average molecular weight of 500,000 to 200,000.
• the use of an acrylate copolymer having a weight-average molecular weight within this range allows the storage elastic modulus described above to be easily exhibited.
• the change in the elastic modulus at 23 to 50 ° C can be controlled by the diblock ratio and the styrene content. It can exhibit storage modulus.
• thermoplastic resin composition when using a solid aromatic thermoplastic resin at 23 ° C. such as a styrene block copolymer as the thermoplastic resin, the thermoplastic resin composition is further heated at 23 ° C. It preferably contains a viscous xylene resin.
• a xylene lubricating oil like this causes a more abrupt change in the behavior of the storage elastic modulus between 23 ° C and 50 ° C, and a gradual change above 50 ° C. A change in storage modulus can be realized. This is because, when a mixture of a solid aromatic thermoplastic resin at 23 ° C and a viscous xylene resin at 23 ° C is used, the interaction between the respective aromatic rings results in 23 ° C.
• the solid state is maintained, but as the temperature increases, the interaction weakens, and in a certain temperature range, the interaction rapidly weakens and softens without a phase transition phenomenon, while reaching a certain temperature This is considered to be due to the fact that the pseudo-crosslinking interaction of the aromatic rings remains and further fluidization is suppressed.
• the xylene resin also functions as a tackifier, the addition of the xylene resin improves workability when the heat-dissipating member of the present invention is attached to a heating element and a heat-dissipating element. I do.
• the elastic modulus behavior of the heat-dissipating member of the present invention is determined by thermoplastic resin and xylene. It is necessary to adjust appropriately according to the type and the blending amount.
• the amount of the xylene resin in the thermoplastic resin composition is preferably 10 to 90% by volume. If the content is less than 10% by volume, the flexibility of the heat-radiating member is low, and the heat-radiating member cannot be adhered to the heat-generating body or the heat-radiating body, so that sufficient heat resistance may not be obtained. It may be difficult to obtain a fixed sheet at 3 ° C.
• heat conductive fine particles include, for example, at least one selected from the group consisting of boron nitride, aluminum nitride, aluminum, aluminum, silicon carbide, zinc oxide, copper, metal hydroxide, graphite, magnesium oxide, and silica. Those consisting of seeds are preferred.
• metal hydroxide examples include magnesium hydroxide and aluminum hydroxide.
• the heat conductive fine particles are preferably subjected to a surface treatment so as to be uniformly mixed with the thermoplastic resin at a high mixing ratio.
• the amount of the heat conductive fine particles in the thermoplastic resin composition is, Preferably, the content is up to 90% by volume. 10 volumes. If it is less than / 0 , sufficient thermal conductivity may not be obtained, and if it exceeds 90% by volume, the adhesive strength of the obtained heat-dissipating member to aluminum decreases, and the workability of sticking decreases. There is.
• the thermoplastic resin composition may be, if necessary, a halogen compound, a phosphate compound, a metal hydroxide, a titanium oxide, or the like, as long as the desired elastic modulus and the adhesive strength to aluminum are not impaired.
• Flame retardants such as carbon black and white carbon
• Powder surface modifiers such as silane-based and titanate-based coupling agents
• Dispersants based on glycerin fatty acids Acids such as bisphenol-based and hindered-phenol-based Anti-dangling agent
• a tackifier such as chroman resin, terpene phenol resin, phenol resin, rosin, terpene resin, aliphatic hydrocarbon, alicyclic hydrocarbon and the like may be contained.
• the method for producing the heat-dissipating member of the present invention is not particularly limited.
• a predetermined amount of the above-described thermoplastic resin and thermally conductive particles is prepared by adding two rolls, three rolls, a plast mill, a kneader, and a planetary. Mixing using a mixer, Banbury mixer, etc., and forming the mixture into a sheet having a desired thickness by coating molding, extrusion molding, press molding, or the like.
• the heat-dissipating member of the present invention has a fixed shape at room temperature around 23 ° C., is extremely excellent in handleability, and can efficiently produce a connection structure in which the heat-generating element and the heat-dissipating element are connected.
• the temperature of the heating element of this connection structure is increased, when it reaches a certain temperature or higher, it rapidly softens without a phase transition phenomenon accompanied by latent heat absorption such as glass transition and melting, and the heating element and The contact area with the heat radiator is increased, and the thickness of the heat radiating member is reduced accordingly, so that excellent heat resistance performance can be exhibited.
• connection structure formed by connecting a heat generator and a heat radiator with the heat radiating member of the present invention is also one aspect of the present invention.
• the present invention provides a connection structure formed by connecting a heat generating element and a heat radiating element by the heat radiating member of the present invention, wherein the heat radiating member has a thickness already reduced compared to before the heat generation due to the heat generating element generating heat.
• the connecting structure is also one of the present invention.
• a release PET film was laid on the press plate, a metal frame having a thickness of 100 / zm was placed thereon, and the obtained slurry was poured into the metal frame.
• the release PET film was placed on it and sandwiched by press plates from above and below, and press-formed at room temperature. As a result, a sheet-shaped heat radiation member having a thickness of 100 ⁇ with a release PET film attached to both surfaces was obtained.
• Example 3 Styrene content 2 2 wt 0/0, styrene one Isopuren block copolymer 2 0 parts by weight of the jib-locking ratio 6 6 wt 0/0, xylene resin (Mitsubishi Gas Chemical's trade name "two force Nord KL one 0.55)) and 300 parts by weight of aluminum nitride (trade name: “Grade F”) manufactured by Tokuyama Corporation were mixed by a blast mill to obtain a slurry. The volume ratio of aluminum nitride in this slurry was 50%. Using this slurry, release PET films on both sides in the same manner as in Example 1. A sheet-like heat-dissipating member with a thickness of 100 / m was obtained. (Example 3)
• Example 4 Using this rally-like material, a heat-dissipating sheet-like member having a thickness of 100 m and having a release PET film on both sides was obtained in the same manner as in Example 1. (Example 4)
• a sheet-shaped heat-dissipating member having a thickness of 100 ⁇ was obtained.
• a slurry was obtained by mixing 226 parts by weight with a plastmill. The volume ratio of boron nitride in this slurry was 50%.
• xylene resin manufactured by Mitsubishi Gas Chemical Company, trade
• a commercially available silicone grease manufactured by Dow Corning Co., Ltd., trade name “# 340” was used. To evaluate the thermal resistance, place a 50 ⁇ thick PET film with a 35 mm square center in the center of the heat sink, pour silicon grease into the center, and use a spatula to remove excess silicon. The grease was scraped off to form a 50 ⁇ thick layer of silicon grease.
• Thermal resistance was measured by the measuring device shown in FIG. That is, a heat-dissipating member 2 from which a release PET film was peeled was adhered onto a cooler 1 made of aluminum, and an IC as a heat source was laminated thereon, and tightened with a bolt 3 at a tightening torque of 1 Nm. .
• the cooler 1 is configured such that water at 23 ° C. is supplied and circulated from a constant temperature water tank 4 inside. From the measurement results, the thermal resistance was determined by the following equation.
• the storage elastic modulus of the heat-dissipating member was measured at 23 ° C, 50 ° C, 80 ° C, and 100 ° C under the conditions of 0.1 Hz.
• a heat-dissipating member from which a release PET film was peeled off on one side was attached to the side surface of a cubic block made of aluminum.
• This aluminum block was stored in a constant temperature bath at 80 ° C, and after one week, it was visually observed whether or not the heat-dissipating member flowed off.
• Example 1 0.1 1 8 207000 2380 906 710 None Example 2 0 ⁇ . 098 487000 4560 1050 910 None Example 3 o 87000 2570 684 655 None Example Example 4 0.1 20 97000 2810 1440 362 None Comparative example 1 0.1 1 5 26 200 5600 110 85 Yes Comparative example 2 0.135 37500 12500 200 156 Yes Comparative example 3 0. 365 123400 56800 5900 3280 None Comparative example 4 0 092 14200 321 6 1 Yes Comparative Example 5 0.321 1560000 266000 30500 19000 None Comparative Example 6 0.090 8500 3700 4020 3990 None
• the present invention has excellent handling properties at room temperature, is interposed between the heating element and the heat radiating body, and has high flexibility, so that it is in close contact with the heating element and the heat radiating element and is efficiently heated.
• a heat dissipating member capable of conducting heat generated from the heat dissipating member to the heat dissipating member and maintaining a close contact state even when the temperature rises, and connecting the heat dissipating member and the heat dissipating member by the heat dissipating member. Can be provided.

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• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
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• Compositions Of Macromolecular Compounds (AREA)
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• Central Heating Systems (AREA)

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• 2003
  • 2003-08-08 EP EP03784597A patent/EP1542281A1/en not_active Withdrawn
  • 2003-08-08 CN CNB038186071A patent/CN100339983C/zh not_active Expired - Fee Related
  • 2003-08-08 US US10/523,409 patent/US20050155751A1/en not_active Abandoned
  • 2003-08-08 WO PCT/JP2003/010112 patent/WO2004015768A1/ja active Application Filing

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