WO2003082503A3 - Method and device for machining a workpiece - Google Patents
Method and device for machining a workpiece Download PDFInfo
- Publication number
- WO2003082503A3 WO2003082503A3 PCT/DE2003/000978 DE0300978W WO03082503A3 WO 2003082503 A3 WO2003082503 A3 WO 2003082503A3 DE 0300978 W DE0300978 W DE 0300978W WO 03082503 A3 WO03082503 A3 WO 03082503A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flow channel
- workpiece
- depression
- machining
- method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
- B23H9/14—Making holes
- B23H9/16—Making holes using an electrolytic jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
Abstract
The invention relates to a method for machining a workpiece (12) comprising a first flow channel (14) and a second flow channel (16). The second flow channel (16) opens into the first flow channel (14). A depression (46) is configured around the opening of the second flow channel (16) into the first flow channel (14). Said depression (46) is configured using an electrochemical material machining process. Material is simultaneously removed from the edge formed by the depression (46) and the second flow channel (16) until a predetermined mass flux of the electrolyte solution used for the electrochemical material machining process has been achieved through the second flow channel (16).
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10214617.9 | 2002-04-03 | ||
DE2002114617 DE10214617A1 (en) | 2002-04-03 | 2002-04-03 | Method and apparatus for machining a workpiece |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003082503A2 WO2003082503A2 (en) | 2003-10-09 |
WO2003082503A3 true WO2003082503A3 (en) | 2003-12-04 |
Family
ID=28051052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/000978 WO2003082503A2 (en) | 2002-04-03 | 2003-03-25 | Method and device for machining a workpiece |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10214617A1 (en) |
WO (1) | WO2003082503A2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5865977A (en) * | 1994-10-21 | 1999-02-02 | Frembgen; Fritz-Herbert | Process for the electrochemical treatment of flow channels in metal workpieces |
EP1179379A1 (en) * | 2000-08-09 | 2002-02-13 | Delphi Technologies, Inc. | Electrochemical machining of orificies |
-
2002
- 2002-04-03 DE DE2002114617 patent/DE10214617A1/en not_active Withdrawn
-
2003
- 2003-03-25 WO PCT/DE2003/000978 patent/WO2003082503A2/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5865977A (en) * | 1994-10-21 | 1999-02-02 | Frembgen; Fritz-Herbert | Process for the electrochemical treatment of flow channels in metal workpieces |
EP1179379A1 (en) * | 2000-08-09 | 2002-02-13 | Delphi Technologies, Inc. | Electrochemical machining of orificies |
Also Published As
Publication number | Publication date |
---|---|
DE10214617A1 (en) | 2003-10-16 |
WO2003082503A2 (en) | 2003-10-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2002061119A1 (en) | Compositions for assaying glycoprotein | |
JPS62276840A (en) | Bonding apparatus | |
JPS5936955A (en) | Lead frame | |
JPS6113542A (en) | Ion implantation mask device and method of implantation using this device | |
JPH02112844A (en) | Deburring device | |
JPH0370306A (en) | Manufacture of piezoelectric resonator | |
JPH04171854A (en) | Lead frame for semiconductor device | |
JPS63215368A (en) | Solder feeding method | |
JPH01125963A (en) | Lead frame | |
TWI328164B (en) | Method and apparatus for monitoring tool performance | |
JPS6133838A (en) | Magnet chuck | |
TW548446B (en) | Method and device for connecting display panel substrates | |
JPS5410482A (en) | Method of and material for cutting hole for cast | |
JPH02298486A (en) | Origin setting method for industrial robot | |
TW458882B (en) | Device and method for separating a shaped substrate from a stamping tool | |
JPH0386497A (en) | Punching method for flexible material | |
CA2235021A1 (en) | A method and apparatus for monitoring gas(es) in a dielectric fluid | |
JPH03169056A (en) | Lead cutting metal die | |
WO2004052899A3 (en) | Process for the production of 2'-branched nucleosides | |
GB2356162B (en) | Method and apparatus for concentrating and/or positioning particles or cells | |
GB2393511B (en) | Apparatus and method for focal point control for laser machining | |
TWI224832B (en) | Process for machining a wafer-like workpiece | |
TWI245421B (en) | A device having multiple silicide types and a method for its fabrication | |
TW358978B (en) | Method to etch a destruction-area on a semiconductor substrate-edge as well as an etching equipment | |
TW527621B (en) | Process for making a thin layer entailing the introduction of gaseous species |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): BR CN IN JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase in: |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |