WO2003042072A1 - A bag - Google Patents

A bag Download PDF

Info

Publication number
WO2003042072A1
WO2003042072A1 PCT/SG2001/000223 SG0100223W WO03042072A1 WO 2003042072 A1 WO2003042072 A1 WO 2003042072A1 SG 0100223 W SG0100223 W SG 0100223W WO 03042072 A1 WO03042072 A1 WO 03042072A1
Authority
WO
WIPO (PCT)
Prior art keywords
bag
moisture
transparent material
side wall
transparent
Prior art date
Application number
PCT/SG2001/000223
Other languages
French (fr)
Other versions
WO2003042072A8 (en
Inventor
Najib Khan Surattee
Tak Seng Thang
Chee Ping Benedict Loh
Bee Poh Christine Ng
Wai Lian Jenny Ong
Kok Cheong Bernard Yeong
Ching Yun Tye
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Priority to EP01979213A priority Critical patent/EP1436218B1/en
Priority to KR1020047005653A priority patent/KR100642160B1/en
Priority to DE60122023T priority patent/DE60122023T2/en
Priority to PCT/SG2001/000223 priority patent/WO2003042072A1/en
Priority to JP2003543921A priority patent/JP2005508815A/en
Publication of WO2003042072A1 publication Critical patent/WO2003042072A1/en
Priority to US10/825,987 priority patent/US20050023178A1/en
Publication of WO2003042072A8 publication Critical patent/WO2003042072A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D79/00—Kinds or details of packages, not otherwise provided for
    • B65D79/02—Arrangements or devices for indicating incorrect storage or transport
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
    • B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
    • B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
    • B65D81/267—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants the absorber being in sheet form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Definitions

  • the invention relates to a bag, and especially a bag for an electronics device which is substantially impervious to moisture.
  • the bag material includes a metal foil layer which is normally opaque.
  • the bags usually also contain a desiccant to ensure that the air within the bag remains as dry as possible, and a moisture indicator to enable a user to confirm that the moisture within the bag is below a pre-defined level when the bag is opened.
  • one of the problems with this conventional system is that it is necessary to have two additional components (the desiccant and the moisture indicator), which need to be inserted into the bag with the semiconductor device prior to sealing of the bag. In addition, it is not possible to view the moisture indicator without first opening the bag.
  • a bag comprising side walls which are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent to the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicator material being exposed to air within the bag.
  • the side walls of the bag further comprise a desiccant material which defines at least a portion of an inside wall of the bag.
  • the desiccant material may be a silica gel.
  • the side walls of the bag comprise a laminated material which may comprise a metal foil.
  • the substantially transparent material may be a transparent moisture barrier film, such as DY3008-NM-792-260 moisture barrier film manufactured by Dou Yee Enterprises (S) Pte Ltd.
  • the bag is for containing an electronics device, such as a packaged semiconductor device.
  • Figure 1 shows a bag for a semiconductor device
  • Figure 2 is a cross-sectional view along the line AA in Figure 1.
  • Figures 1 and 2 show a bag 1.
  • the bag 1 is fabricated from two rectangular sheets 3, 4 of flexible material that are joined together by a weld 5 along three edges 20, 21 , 22 so that the each sheet 3, 4 defines a side wall of the bag 1.
  • the sheets 3, 4 each have a respective fourth edge 7, 8 that defines an opening 6 into which a packaged semiconductor device (not shown) may be inserted prior to sealing the opening 6 by sealing together the edges 7, 8, for example by a thermoplastic welding process.
  • the sheets 3, 4 each include a laminated aluminium foil material 9 on the outside and a layer of a desiccant material 10, such as silica gel, on the inside.
  • the desiccant material 10 may be located within a porous inner bag 15 that is attached to the inner wall of the foil material 9.
  • the sheet 3 includes a window portion 11 which is formed from a substantially transparent material 12 which is also substantially impervious to moisture.
  • a suitable material may be DY3008-NM-792-260 moisture barrier film produced by Dou Yee Enterprises (S) Pte Ltd.
  • a moisture indicating material 13 Located adjacent to the transparent material 12 is a moisture indicating material 13, which is located on the inside of the transparent material 12.
  • the moisture indicator 13 may comprise three separate moisture level indicators 16, 17, 18.
  • the indicator 16 may be a first warning that the moisture in the bag 1 is approaching a danger level
  • the indicator 17 may provide an intermediate warning that indicates to a user to put the semiconductor device into a new bag
  • the indicator 18 may be provide a warning that the moisture levels have exceeded the recommended maximum level and that the electronic device within the bag should be inspected before use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Food Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Bag Frames (AREA)

Abstract

A bag (1) has side walls (3, 4) that are substantially impervious to moisture. The bag has an opening (6) at one end that is adapted to be sealed. A portion (11) of a side wall includes a substantially transparent material (12) which is substantially impervious to moisture. A moisture indicating material (13) is mounted within the bag adjacent to the transparent material (12) to enable the moisture indicating material (13) to be viewed through the transparent material, and at least a portion of the moisture indicator material (13) is exposed to air within the bag (1).

Description

A Bag
The invention relates to a bag, and especially a bag for an electronics device which is substantially impervious to moisture.
Semiconductor devices are conventionally stored and transported in bags that are impervious to moisture. Typically, the bag material includes a metal foil layer which is normally opaque. In addition to the semiconductor device, the bags usually also contain a desiccant to ensure that the air within the bag remains as dry as possible, and a moisture indicator to enable a user to confirm that the moisture within the bag is below a pre-defined level when the bag is opened.
However, one of the problems with this conventional system is that it is necessary to have two additional components (the desiccant and the moisture indicator), which need to be inserted into the bag with the semiconductor device prior to sealing of the bag. In addition, it is not possible to view the moisture indicator without first opening the bag.
In accordance with the present invention, there is provided a bag comprising side walls which are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent to the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicator material being exposed to air within the bag.
Preferably, the side walls of the bag further comprise a desiccant material which defines at least a portion of an inside wall of the bag.
Typically, the desiccant material may be a silica gel.
Preferably, the side walls of the bag comprise a laminated material which may comprise a metal foil.
Preferably, the substantially transparent material may be a transparent moisture barrier film, such as DY3008-NM-792-260 moisture barrier film manufactured by Dou Yee Enterprises (S) Pte Ltd.
Typically, the bag is for containing an electronics device, such as a packaged semiconductor device.
An example of a bag in accordance with the invention will now be described with reference to the accompanying drawings, in which:
Figure 1 shows a bag for a semiconductor device; and Figure 2 is a cross-sectional view along the line AA in Figure 1. Figures 1 and 2 show a bag 1. The bag 1 is fabricated from two rectangular sheets 3, 4 of flexible material that are joined together by a weld 5 along three edges 20, 21 , 22 so that the each sheet 3, 4 defines a side wall of the bag 1. The sheets 3, 4 each have a respective fourth edge 7, 8 that defines an opening 6 into which a packaged semiconductor device (not shown) may be inserted prior to sealing the opening 6 by sealing together the edges 7, 8, for example by a thermoplastic welding process.
The sheets 3, 4 each include a laminated aluminium foil material 9 on the outside and a layer of a desiccant material 10, such as silica gel, on the inside. Typically, the desiccant material 10 may be located within a porous inner bag 15 that is attached to the inner wall of the foil material 9. The sheet 3 includes a window portion 11 which is formed from a substantially transparent material 12 which is also substantially impervious to moisture. For example, a suitable material may be DY3008-NM-792-260 moisture barrier film produced by Dou Yee Enterprises (S) Pte Ltd. Located adjacent to the transparent material 12 is a moisture indicating material 13, which is located on the inside of the transparent material 12.
In use, a packaged semiconductor device is placed within the bag 1 and the ends 7, 8 of the sheets 3, 4 are sealed together to seal the semiconductor device within the bag 1. The desiccant 10 on the inside of the side walls 3, 4 absorbs any moisture within the bag 1 after it has been sealed. In addition, after the bag has been sealed, a user can view the moisture indicator 13 through the transparent material 12 to ensure that the moisture within the bag 1 is below a predetermined level. As shown in Figure 1 , the moisture indicator 13 may comprise three separate moisture level indicators 16, 17, 18. For example, the indicator 16 may be a first warning that the moisture in the bag 1 is approaching a danger level, the indicator 17 may provide an intermediate warning that indicates to a user to put the semiconductor device into a new bag, and the indicator 18 may be provide a warning that the moisture levels have exceeded the recommended maximum level and that the electronic device within the bag should be inspected before use.

Claims

1. A bag comprising side walls which are substantially impervious to moisture and having an opening at one end which is adapted to be sealed, a portion of a side wall comprising a substantially transparent material which is substantially impervious to moisture and a moisture indicating material mounted within the bag adjacent to the transparent material to enable the moisture indicating material to be viewed through the transparent material, and at least a portion of the moisture indicator material being exposed to air within the bag.
2. A bag according to claim 1 , wherein a side wall of the bag further comprises a desiccant material which defines at least a portion of an inner surface of the side wall.
3. A bag according to claim 2, wherein the desiccant material comprises a silica gel.
4. A bag according to any of the preceding claims, wherein the side walls of the bag comprise a laminated material.
5. A bag according to claim 4, wherein the laminated material comprises a metal foil.
6. A bag according to any of the preceding claims, wherein the substantially transparent material comprises a transparent moisture barrier film.
7. A bag for an electronics device, the bag being in accordance with any of the preceding claims.
8. A bag for a packaged semiconductor device, the bag being in accordance with any of the preceding claims.
PCT/SG2001/000223 2001-10-19 2001-10-19 A bag WO2003042072A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP01979213A EP1436218B1 (en) 2001-10-19 2001-10-19 A bag
KR1020047005653A KR100642160B1 (en) 2001-10-19 2001-10-19 A bag
DE60122023T DE60122023T2 (en) 2001-10-19 2001-10-19 BAG
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag
JP2003543921A JP2005508815A (en) 2001-10-19 2001-10-19 bag
US10/825,987 US20050023178A1 (en) 2001-10-19 2004-04-16 Bag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/825,987 Continuation US20050023178A1 (en) 2001-10-19 2004-04-16 Bag

Publications (2)

Publication Number Publication Date
WO2003042072A1 true WO2003042072A1 (en) 2003-05-22
WO2003042072A8 WO2003042072A8 (en) 2004-05-27

Family

ID=20429001

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2001/000223 WO2003042072A1 (en) 2001-10-19 2001-10-19 A bag

Country Status (6)

Country Link
US (1) US20050023178A1 (en)
EP (1) EP1436218B1 (en)
JP (1) JP2005508815A (en)
KR (1) KR100642160B1 (en)
DE (1) DE60122023T2 (en)
WO (1) WO2003042072A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1528848A2 (en) * 2003-11-03 2005-05-04 ABB PATENT GmbH Outdoor electrical installation apparatus
WO2006007849A1 (en) * 2004-07-21 2006-01-26 Resq A/S A method of packaging safety and rescue equipment and a package for packaging safety and rescue equipment and use of the method and the package
WO2006069702A1 (en) * 2004-12-22 2006-07-06 Süd-Chemie AG Device for detecting at least one chemical constituent
WO2016020242A1 (en) * 2014-08-05 2016-02-11 Robert Bosch Gmbh Method and device for treating a semiconductor material

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070056870A1 (en) * 2005-07-27 2007-03-15 Alps Electric Co., Ld Elastic reusable wrapping product and system
EP1840046A1 (en) * 2006-03-29 2007-10-03 Mondi Packaging AG Package with temperature indicator
CA2552301C (en) * 2006-07-12 2015-01-27 Genpak Lp Packaging roll stock with windows
CN102362352B (en) * 2009-03-23 2014-04-16 陶氏环球技术有限责任公司 Optoelectronic device
US20100327015A1 (en) * 2009-06-25 2010-12-30 Nihon Kim Co., Ltd. Storage container
CA3047134A1 (en) * 2016-12-30 2018-07-05 Nuscale Power, Llc Combined shipping protection and impingement detection wrap
DE102022109618A1 (en) 2021-04-28 2022-11-03 Dräger Safety AG & Co. KGaA Arrangement comprising a respirator and a bag with a moisture indicator and method for producing such an arrangement

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4971196A (en) * 1986-11-25 1990-11-20 Hitachi, Ltd. Surface package type semiconductor package
US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator

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US2446361A (en) * 1945-07-09 1948-08-03 Herbert B Clibbon Moisture vapor indicator for packaged goods
US2814382A (en) * 1955-09-21 1957-11-26 Frederic H Lassiter Cellophane packaging and method
US3768976A (en) * 1971-05-20 1973-10-30 Us Army Temperature-time integrating indicator
US5295297B1 (en) * 1986-11-25 1996-11-26 Hitachi Ltd Method of producing semiconductor memory
US4813791A (en) * 1987-09-18 1989-03-21 Multiform Desiccants, Inc. Bag with integral material treating packets
US5318181A (en) * 1992-03-31 1994-06-07 Motorola, Inc. Compartmentalized humidity sensing indicator
US5791485A (en) * 1994-10-24 1998-08-11 Raytheon Company Electrostatic discharge protection bag
US6026963A (en) * 1996-02-23 2000-02-22 Memc Electronic Materials, Inc. Moisture barrier bag having window
US6536370B2 (en) * 1998-11-25 2003-03-25 Advanced Micro Devices, Inc. Elapsed time indicator for controlled environments and method of use
US6119853A (en) * 1998-12-18 2000-09-19 Glaxo Wellcome Inc. Method and package for storing a pressurized container containing a drug
US6531197B2 (en) * 1999-04-26 2003-03-11 Illinois Tool Works Desiccant barrier container

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4971196A (en) * 1986-11-25 1990-11-20 Hitachi, Ltd. Surface package type semiconductor package
US5224373A (en) * 1991-05-09 1993-07-06 Williams Christi A Flexible humidity indicator and container
US5293996A (en) * 1992-05-14 1994-03-15 Motorola, Inc. Container having an observation window
US5875892A (en) * 1997-01-10 1999-03-02 Humidial Corporation Packaging container with humidity indicator

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1528848A2 (en) * 2003-11-03 2005-05-04 ABB PATENT GmbH Outdoor electrical installation apparatus
EP1528848A3 (en) * 2003-11-03 2008-08-13 ABB PATENT GmbH Outdoor electrical installation apparatus
WO2006007849A1 (en) * 2004-07-21 2006-01-26 Resq A/S A method of packaging safety and rescue equipment and a package for packaging safety and rescue equipment and use of the method and the package
JP2008506602A (en) * 2004-07-21 2008-03-06 レスキュー・アクティーゼルスカブ Method of packaging a safety rescue device, package for packaging a safety rescue device, method thereof and use of the package
WO2006069702A1 (en) * 2004-12-22 2006-07-06 Süd-Chemie AG Device for detecting at least one chemical constituent
WO2016020242A1 (en) * 2014-08-05 2016-02-11 Robert Bosch Gmbh Method and device for treating a semiconductor material

Also Published As

Publication number Publication date
US20050023178A1 (en) 2005-02-03
KR20040045852A (en) 2004-06-02
KR100642160B1 (en) 2006-11-08
EP1436218B1 (en) 2006-08-02
DE60122023T2 (en) 2007-03-08
WO2003042072A8 (en) 2004-05-27
JP2005508815A (en) 2005-04-07
EP1436218A1 (en) 2004-07-14
DE60122023D1 (en) 2006-09-14

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