WO2003002684A1 - Radiation curable adhesive - Google Patents
Radiation curable adhesive Download PDFInfo
- Publication number
- WO2003002684A1 WO2003002684A1 PCT/US2002/019775 US0219775W WO03002684A1 WO 2003002684 A1 WO2003002684 A1 WO 2003002684A1 US 0219775 W US0219775 W US 0219775W WO 03002684 A1 WO03002684 A1 WO 03002684A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- rosin
- block copolymer
- adhesives
- weight
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
- B65D25/205—Means for the attachment of labels, cards, coupons or the like
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/005—Modified block copolymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/08—Epoxidised polymerised polyenes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/387—Block-copolymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003509049A JP4494775B2 (en) | 2001-06-26 | 2002-06-24 | Radiation curable adhesive |
CA002421045A CA2421045A1 (en) | 2001-06-26 | 2002-06-24 | Radiation curable adhesive |
EP02780954A EP1453931A1 (en) | 2001-06-26 | 2002-06-24 | Radiation curable adhesive |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/891,985 | 2001-06-26 | ||
US09/891,985 US6803081B2 (en) | 2001-06-26 | 2001-06-26 | Radiation curable adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003002684A1 true WO2003002684A1 (en) | 2003-01-09 |
Family
ID=25399171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/019775 WO2003002684A1 (en) | 2001-06-26 | 2002-06-24 | Radiation curable adhesive |
Country Status (5)
Country | Link |
---|---|
US (1) | US6803081B2 (en) |
EP (1) | EP1453931A1 (en) |
JP (1) | JP4494775B2 (en) |
CA (1) | CA2421045A1 (en) |
WO (1) | WO2003002684A1 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006084537A2 (en) * | 2005-02-10 | 2006-08-17 | Henkel Kommanditgesellschaft Auf Aktien | Radiation cross-linkable hot-melt contact adhesives |
WO2007111607A1 (en) * | 2006-03-29 | 2007-10-04 | National Starch And Chemical Investment | Radiation-curable rubber adhesive/sealant |
WO2011018358A1 (en) | 2009-08-12 | 2011-02-17 | Tesa Se | Method for encapsulating an electronic arrangement |
WO2011006593A3 (en) * | 2009-07-14 | 2011-03-17 | Lts Lohmann Therapie-Systeme Ag | Water-vapor permeable adhesive bandages |
WO2012019909A1 (en) | 2010-08-13 | 2012-02-16 | Tesa Se | Method for encapsulating an electronic arrangement |
EP2607439A1 (en) | 2011-12-22 | 2013-06-26 | tesa AG | Liner for the protection of adhesive masses |
DE102011089565A1 (en) | 2011-12-22 | 2013-06-27 | Tesa Se | Liner for the protection of adhesives |
DE102012211335A1 (en) | 2012-06-29 | 2014-01-02 | Tesa Se | Adhesive tape for the encapsulation of an organic electronic device |
DE102012224310A1 (en) | 2012-12-21 | 2014-06-26 | Tesa Se | Gettermaterial containing adhesive tape |
DE102013223451A1 (en) | 2013-11-18 | 2015-05-21 | Tesa Se | Process for drying adhesives |
DE102014207074A1 (en) | 2014-04-11 | 2015-10-15 | Tesa Se | Adhesive tape for the encapsulation of an organic electronic device |
EP3020773A1 (en) * | 2014-11-14 | 2016-05-18 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive |
EP3243886A1 (en) * | 2016-05-13 | 2017-11-15 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive having low voc characteristics |
WO2018019631A1 (en) | 2016-07-27 | 2018-02-01 | Tesa Se | Adhesive tape for encapsulating electronic constructions |
US10294396B2 (en) | 2014-11-14 | 2019-05-21 | 3M Innovative Properties Company | Post-curable rubber-based pressure-sensitive adhesive |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1176994C (en) * | 2000-04-27 | 2004-11-24 | 克拉通聚合物研究有限公司 | Non-aqueous solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
US7700151B2 (en) * | 2003-04-11 | 2010-04-20 | Henkel Ag & Co. Kgaa | Process for making pressure sensitive adhesive tapes from cationic cure adhesives |
US7163968B2 (en) * | 2004-03-16 | 2007-01-16 | Kraton Polymers U.S. Llc | UV curable pressure sensitive adhesives |
KR101165131B1 (en) * | 2004-04-20 | 2012-07-12 | 히다치 가세고교 가부시끼가이샤 | Adhesive sheet, semiconductor device and process for producing semiconductor device |
DE102004031188A1 (en) * | 2004-06-28 | 2006-01-19 | Tesa Ag | Heat-activated adhesive tape for the bonding of electronic components and printed conductors |
DE102004038776A1 (en) * | 2004-08-09 | 2006-02-23 | Certoplast Vorwerk & Sohn Gmbh | Use of crosslinked rubber compound |
US20060251890A1 (en) * | 2005-05-06 | 2006-11-09 | Richard Lane | Pressure sensitive adhesive (PSA) laminates |
US20060263596A1 (en) * | 2005-05-06 | 2006-11-23 | Bamborough Derek W | Pressure sensitive adhesives (PSA) laminates |
US20070231571A1 (en) * | 2006-04-04 | 2007-10-04 | Richard Lane | Pressure sensitive adhesive (PSA) laminates |
US20080118882A1 (en) * | 2006-11-17 | 2008-05-22 | Li-Hung Su | Moisture resistant pressure sensitive adhesives for orthodontic applications |
EP2545132B1 (en) | 2010-03-09 | 2015-11-04 | Henkel IP & Holding GmbH | Cationic uv-crosslinkable acrylic polymers for pressure sensitive adhesives |
US9701850B2 (en) * | 2012-06-19 | 2017-07-11 | 3M Innovative Properties Company | Coating compositions comprising polymerizable non-ionic surfactant exhibiting reduced fingerprint visibility |
JP6297824B2 (en) * | 2013-12-04 | 2018-03-20 | デクセリアルズ株式会社 | Cyclic olefin resin composition film |
CA3153719A1 (en) | 2019-09-16 | 2021-03-25 | Align Technology, Inc. | Durable ornamental indicia carrier |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4135037A (en) * | 1977-06-15 | 1979-01-16 | Phillips Petroleum Company | Adhesives and laminates |
US5641823A (en) * | 1993-04-06 | 1997-06-24 | Shell Oil Company | Solvent-free laminating adhesive composition |
JP2000256637A (en) * | 1999-03-08 | 2000-09-19 | Daicel Chem Ind Ltd | Crosslinkable adhesive composition |
WO2001029134A1 (en) * | 1999-10-18 | 2001-04-26 | Kraton Polymers Research B.V | Formulation for strippable adhesive and coating films and high performance adhesives |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4656213A (en) * | 1984-10-26 | 1987-04-07 | Atlantic Richfield Company | Acrylic hot melt pressure sensitive adhesive compounds |
US5183664A (en) * | 1986-09-20 | 1993-02-02 | Smith And Nephew Associated Companies P.L.C. | Thin film adhesive dressings preparation and use |
US5686535A (en) * | 1991-04-29 | 1997-11-11 | Shell Oil Company | Viscous conjugated diene block copolymers |
US5382604A (en) * | 1991-10-07 | 1995-01-17 | Shell Oil Company | Crosslinked epoxy functionalized polydiene block polymers and adhesives |
US5536772A (en) * | 1993-06-18 | 1996-07-16 | Shell Oil Company | Radiation cured conjugated diene block copolymer compositions |
US5446104A (en) * | 1993-07-12 | 1995-08-29 | Shell Oil Company | Crosslinkable low viscosity star polymer blends |
US5691414A (en) * | 1995-06-16 | 1997-11-25 | Shell Oil Company | Solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
US5776998A (en) * | 1995-06-16 | 1998-07-07 | Shell Oil Company | Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
KR100448562B1 (en) * | 1995-07-03 | 2004-11-16 | 다이셀 가가꾸 고교 가부시끼가이샤 | Epoxidized block copolymer, its production, and its composition |
US6649259B1 (en) * | 2000-02-29 | 2003-11-18 | National Starch And Chemical Investment Holding Corporation | Adhesives for thermally shrinkable films or labels |
-
2001
- 2001-06-26 US US09/891,985 patent/US6803081B2/en not_active Expired - Fee Related
-
2002
- 2002-06-24 EP EP02780954A patent/EP1453931A1/en not_active Ceased
- 2002-06-24 CA CA002421045A patent/CA2421045A1/en not_active Abandoned
- 2002-06-24 WO PCT/US2002/019775 patent/WO2003002684A1/en active Application Filing
- 2002-06-24 JP JP2003509049A patent/JP4494775B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4135037A (en) * | 1977-06-15 | 1979-01-16 | Phillips Petroleum Company | Adhesives and laminates |
US5641823A (en) * | 1993-04-06 | 1997-06-24 | Shell Oil Company | Solvent-free laminating adhesive composition |
JP2000256637A (en) * | 1999-03-08 | 2000-09-19 | Daicel Chem Ind Ltd | Crosslinkable adhesive composition |
WO2001029134A1 (en) * | 1999-10-18 | 2001-04-26 | Kraton Polymers Research B.V | Formulation for strippable adhesive and coating films and high performance adhesives |
Non-Patent Citations (1)
Title |
---|
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; XP002216840, retrieved from STN Database accession no. 133:224002 HCA * |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006084537A3 (en) * | 2005-02-10 | 2007-04-26 | Henkel Kgaa | Radiation cross-linkable hot-melt contact adhesives |
US7682477B2 (en) | 2005-02-10 | 2010-03-23 | Henkel Kommanditgesellschaft Auf Aktien (Henkel Kgaa) | Radiation cross-linkable hot-melt contact adhesives |
WO2006084537A2 (en) * | 2005-02-10 | 2006-08-17 | Henkel Kommanditgesellschaft Auf Aktien | Radiation cross-linkable hot-melt contact adhesives |
WO2007111607A1 (en) * | 2006-03-29 | 2007-10-04 | National Starch And Chemical Investment | Radiation-curable rubber adhesive/sealant |
US20120109033A1 (en) * | 2009-07-14 | 2012-05-03 | Michael Horstmann | Water-vapor permeable adhesive bandages |
US11291745B2 (en) | 2009-07-14 | 2022-04-05 | Lts Lohmann Therapie-Systeme Ag | Water-vapor-permeable adhesive bandages |
WO2011006593A3 (en) * | 2009-07-14 | 2011-03-17 | Lts Lohmann Therapie-Systeme Ag | Water-vapor permeable adhesive bandages |
US8771459B2 (en) | 2009-08-12 | 2014-07-08 | Tesa Se | Method of encapsulating an electronic arrangement |
DE102009036970A1 (en) | 2009-08-12 | 2011-02-17 | Tesa Se | Method for encapsulating an electronic device |
WO2011018358A1 (en) | 2009-08-12 | 2011-02-17 | Tesa Se | Method for encapsulating an electronic arrangement |
WO2012019909A1 (en) | 2010-08-13 | 2012-02-16 | Tesa Se | Method for encapsulating an electronic arrangement |
US9714366B2 (en) | 2011-12-22 | 2017-07-25 | Tesa Se | Liner for protection of adhesives |
DE102011089566A1 (en) | 2011-12-22 | 2013-06-27 | Tesa Se | Liner for the protection of adhesives |
DE102011089565A1 (en) | 2011-12-22 | 2013-06-27 | Tesa Se | Liner for the protection of adhesives |
WO2013091911A1 (en) | 2011-12-22 | 2013-06-27 | Tesa Se | Liner for protecting adhesive compounds |
EP2607439A1 (en) | 2011-12-22 | 2013-06-26 | tesa AG | Liner for the protection of adhesive masses |
US10386209B2 (en) | 2011-12-22 | 2019-08-20 | Tesa Se | Linear for protection of adhesives |
US9593263B2 (en) | 2011-12-22 | 2017-03-14 | Tesa Se | Liner for protecting adhesive compounds |
DE102012211335A1 (en) | 2012-06-29 | 2014-01-02 | Tesa Se | Adhesive tape for the encapsulation of an organic electronic device |
WO2014001005A1 (en) | 2012-06-29 | 2014-01-03 | Tesa Se | Adhesive tape for encapsulating an organic electronic arrangement |
US9543549B2 (en) | 2012-06-29 | 2017-01-10 | Tesa Se | Adhesive tape for encapsulating an organic electronic arrangement |
DE102012224310A1 (en) | 2012-12-21 | 2014-06-26 | Tesa Se | Gettermaterial containing adhesive tape |
US10323163B2 (en) | 2012-12-21 | 2019-06-18 | Tesa Se | Adhesive tape containing getter material |
DE102013223451A1 (en) | 2013-11-18 | 2015-05-21 | Tesa Se | Process for drying adhesives |
US10011742B2 (en) | 2014-04-11 | 2018-07-03 | Tesa Se | Adhesive tape for encapsulating an organic electronic arrangement |
DE102014207074A1 (en) | 2014-04-11 | 2015-10-15 | Tesa Se | Adhesive tape for the encapsulation of an organic electronic device |
WO2016077132A1 (en) * | 2014-11-14 | 2016-05-19 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive |
US10294396B2 (en) | 2014-11-14 | 2019-05-21 | 3M Innovative Properties Company | Post-curable rubber-based pressure-sensitive adhesive |
CN107109171A (en) * | 2014-11-14 | 2017-08-29 | 3M创新有限公司 | Rubber-like contact adhesive |
EP3020773A1 (en) * | 2014-11-14 | 2016-05-18 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive |
WO2017196560A1 (en) * | 2016-05-13 | 2017-11-16 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive having low voc characteristics |
EP3243886A1 (en) * | 2016-05-13 | 2017-11-15 | 3M Innovative Properties Company | Rubber-based pressure-sensitive adhesive having low voc characteristics |
WO2018019631A1 (en) | 2016-07-27 | 2018-02-01 | Tesa Se | Adhesive tape for encapsulating electronic constructions |
DE102016213840A1 (en) | 2016-07-27 | 2018-02-01 | Tesa Se | Adhesive tape for encapsulating electronic structures |
US11242469B2 (en) | 2016-07-27 | 2022-02-08 | Tesa Se | Adhesive tape for encapsulating electronic constructions |
Also Published As
Publication number | Publication date |
---|---|
US6803081B2 (en) | 2004-10-12 |
JP2004521994A (en) | 2004-07-22 |
US20030065048A1 (en) | 2003-04-03 |
EP1453931A1 (en) | 2004-09-08 |
JP4494775B2 (en) | 2010-06-30 |
CA2421045A1 (en) | 2003-01-09 |
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